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公开(公告)号：US09024438B2
公开(公告)日：2015-05-05
申请号：US13192756
申请日：2011-07-28
申请人： Cheng-Lin Huang , I-Ting Chen , Ying Ching Shih , Po-Hao Tsai , Szu Wei Lu , Jing-Cheng Lin , Shin-Puu Jeng , Chen-Hua Yu
发明人： Cheng-Lin Huang , I-Ting Chen , Ying Ching Shih , Po-Hao Tsai , Szu Wei Lu , Jing-Cheng Lin , Shin-Puu Jeng , Chen-Hua Yu
IPC分类号： H01L23/498 , H01L21/60 , H01L23/00
CPC分类号： H01L24/14 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L24/17 , H01L24/81 , H01L2224/0346 , H01L2224/03912 , H01L2224/0401 , H01L2224/1146 , H01L2224/11462 , H01L2224/11472 , H01L2224/1161 , H01L2224/11622 , H01L2224/13011 , H01L2224/13014 , H01L2224/13078 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/1403 , H01L2224/1405 , H01L2224/14051 , H01L2224/145 , H01L2224/16238 , H01L2224/17107 , H01L2224/81141 , H01L2224/81193 , H01L2224/81815 , H01L2224/81897 , H01L2924/1305 , H01L2924/1306 , H01L2924/00014 , H01L2924/01047 , H01L2924/01082 , H01L2924/01029 , H01L2924/0103 , H01L2924/01083 , H01L2924/01053 , H01L2924/01079 , H01L2924/01051 , H01L2924/014 , H01L2924/00012 , H01L2924/00
摘要： A conductive bump structure of a semiconductor device comprises a substrate comprising a major surface and conductive bumps distributed over the major surface of the substrate. Each of a first subset of the conductive bumps comprises a regular body, and each of a second subset of the conductive bumps comprises a ring-shaped body.
摘要翻译： 半导体器件的导电凸块结构包括包括主表面的衬底和分布在衬底的主表面上的导电凸块。 导电凸块的第一子集中的每一个包括规则体，并且导电凸块的第二子集中的每一个包括环形体。
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公开(公告)号：US20120306080A1
公开(公告)日：2012-12-06
申请号：US13298046
申请日：2011-11-16
申请人： Chen-Hua Yu , Shin-Puu Jeng , Shang-Yun Hou , Kuo-Ching Hsu , Cheng-Chieh Hsieh , Ying-Ching Shih , Po-Hao Tsai , Cheng-Lin Huang , Jing-Cheng Lin
发明人： Chen-Hua Yu , Shin-Puu Jeng , Shang-Yun Hou , Kuo-Ching Hsu , Cheng-Chieh Hsieh , Ying-Ching Shih , Po-Hao Tsai , Cheng-Lin Huang , Jing-Cheng Lin
IPC分类号： H01L23/52
CPC分类号： H01L24/11 , H01L23/147 , H01L23/49827 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/04 , H01L25/50 , H01L2224/0361 , H01L2224/03912 , H01L2224/0401 , H01L2224/05022 , H01L2224/05027 , H01L2224/05073 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05184 , H01L2224/05666 , H01L2224/05681 , H01L2224/05686 , H01L2224/10145 , H01L2224/10156 , H01L2224/1146 , H01L2224/1147 , H01L2224/1182 , H01L2224/11831 , H01L2224/13017 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13565 , H01L2224/13578 , H01L2224/13686 , H01L2224/16058 , H01L2224/16145 , H01L2224/81193 , H01L2224/81815 , H01L2924/01322 , H01L2924/01327 , H01L2924/3651 , H01L2924/3841 , H01L2924/00014 , H01L2924/01029 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/01047 , H01L2924/049 , H01L2924/053 , H01L2924/00
摘要： A package component is free from active devices therein. The package component includes a substrate, a through-via in the substrate, a top dielectric layer over the substrate, and a metal pillar having a top surface over a top surface of the top dielectric layer. The metal pillar is electrically coupled to the through-via. A diffusion barrier is over the top surface of the metal pillar. A solder cap is disposed over the diffusion barrier.
摘要翻译： 封装组件不含其中的有源器件。 封装部件包括衬底，衬底中的通孔，衬底上的顶部电介质层和在顶部电介质层的顶表面上方具有顶表面的金属柱。 金属柱电连接到通孔。 扩散阻挡层在金属支柱的上表面之上。 焊料帽设置在扩散阻挡层上。
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公开(公告)号：US08664760B2
公开(公告)日：2014-03-04
申请号：US13343582
申请日：2012-01-04
申请人： Chen-Hua Yu , Shin-Puu Jeng , Shang-Yun Hou , Cheng-Chieh Hsieh , Kuo-Ching Hsu , Ying-Ching Shih , Po-Hao Tsai , Chin-Fu Kao , Cheng-Lin Huang , Jing-Cheng Lin
发明人： Chen-Hua Yu , Shin-Puu Jeng , Shang-Yun Hou , Cheng-Chieh Hsieh , Kuo-Ching Hsu , Ying-Ching Shih , Po-Hao Tsai , Chin-Fu Kao , Cheng-Lin Huang , Jing-Cheng Lin
CPC分类号： H01L24/11 , H01L23/147 , H01L23/49827 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/04 , H01L25/50 , H01L2224/0361 , H01L2224/03912 , H01L2224/0401 , H01L2224/05022 , H01L2224/05027 , H01L2224/05073 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05184 , H01L2224/05666 , H01L2224/05681 , H01L2224/05686 , H01L2224/10145 , H01L2224/10156 , H01L2224/1146 , H01L2224/1147 , H01L2224/1182 , H01L2224/11831 , H01L2224/13017 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13565 , H01L2224/13578 , H01L2224/13686 , H01L2224/16058 , H01L2224/16145 , H01L2224/81193 , H01L2224/81815 , H01L2924/01322 , H01L2924/01327 , H01L2924/3651 , H01L2924/3841 , H01L2924/00014 , H01L2924/01029 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/01047 , H01L2924/049 , H01L2924/053 , H01L2924/00
摘要： A device includes a top dielectric layer having a top surface. A metal pillar has a portion over the top surface of the top dielectric layer. A non-wetting layer is formed on a sidewall of the metal pillar, wherein the non-wetting layer is not wettable to the molten solder. A solder region is disposed over and electrically coupled to the metal pillar.
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公开(公告)号：US08610285B2
公开(公告)日：2013-12-17
申请号：US13298046
申请日：2011-11-16
申请人： Chen-Hua Yu , Shin-Puu Jeng , Shang-Yun Hou , Kuo-Ching Hsu , Cheng-Chieh Hsieh , Ying-Ching Shih , Po-Hao Tsai , Cheng-Lin Huang , Jing-Cheng Lin
发明人： Chen-Hua Yu , Shin-Puu Jeng , Shang-Yun Hou , Kuo-Ching Hsu , Cheng-Chieh Hsieh , Ying-Ching Shih , Po-Hao Tsai , Cheng-Lin Huang , Jing-Cheng Lin
IPC分类号： H01L23/498 , H01L21/768 , H01L23/48 , H01L29/40
CPC分类号： H01L24/11 , H01L23/147 , H01L23/49827 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/04 , H01L25/50 , H01L2224/0361 , H01L2224/03912 , H01L2224/0401 , H01L2224/05022 , H01L2224/05027 , H01L2224/05073 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05184 , H01L2224/05666 , H01L2224/05681 , H01L2224/05686 , H01L2224/10145 , H01L2224/10156 , H01L2224/1146 , H01L2224/1147 , H01L2224/1182 , H01L2224/11831 , H01L2224/13017 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13565 , H01L2224/13578 , H01L2224/13686 , H01L2224/16058 , H01L2224/16145 , H01L2224/81193 , H01L2224/81815 , H01L2924/01322 , H01L2924/01327 , H01L2924/3651 , H01L2924/3841 , H01L2924/00014 , H01L2924/01029 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/01047 , H01L2924/049 , H01L2924/053 , H01L2924/00
摘要： A package component is free from active devices therein. The package component includes a substrate, a through-via in the substrate, a top dielectric layer over the substrate, and a metal pillar having a top surface over a top surface of the top dielectric layer. The metal pillar is electrically coupled to the through-via. A diffusion barrier is over the top surface of the metal pillar. A solder cap is disposed over the diffusion barrier.
摘要翻译： 封装组件不含其中的有源器件。 封装部件包括衬底，衬底中的通孔，衬底上的顶部电介质层，以及在顶部电介质层的顶表面上方具有顶表面的金属柱。 金属柱电连接到通孔。 扩散阻挡层在金属支柱的上表面之上。 焊料帽设置在扩散阻挡层上。
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公开(公告)号：US08816498B2
公开(公告)日：2014-08-26
申请号：US13189127
申请日：2011-07-22
申请人： Cheng-Chieh Hsieh , Cheng-Lin Huang , Po-Hao Tsai , Shang-Yun Hou , Jing-Cheng Lin , Shin-Puu Jeng
发明人： Cheng-Chieh Hsieh , Cheng-Lin Huang , Po-Hao Tsai , Shang-Yun Hou , Jing-Cheng Lin , Shin-Puu Jeng
IPC分类号： H01L23/485 , H01L21/768
摘要： A system and method for conductive pillars is provided. An embodiment comprises a conductive pillar having trenches located around its outer edge. The trenches are used to channel conductive material such as solder when a conductive bump is formed onto the conductive pillar. The conductive pillar may then be electrically connected to another contact through the conductive material.
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公开(公告)号：US20130020698A1
公开(公告)日：2013-01-24
申请号：US13189127
申请日：2011-07-22
申请人： Cheng-Chieh Hsieh , Cheng-Lin Huang , Po-Hao Tsai , Shang-Yun Hou , Jing-Cheng Lin , Shin-Puu Jeng
发明人： Cheng-Chieh Hsieh , Cheng-Lin Huang , Po-Hao Tsai , Shang-Yun Hou , Jing-Cheng Lin , Shin-Puu Jeng
IPC分类号： H01L23/485 , H01L21/768
CPC分类号： H01L24/81 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L25/0657 , H01L25/50 , H01L2224/1132 , H01L2224/1145 , H01L2224/11462 , H01L2224/11464 , H01L2224/11474 , H01L2224/1148 , H01L2224/11616 , H01L2224/11825 , H01L2224/11849 , H01L2224/1191 , H01L2224/13013 , H01L2224/13015 , H01L2224/13018 , H01L2224/13019 , H01L2224/13022 , H01L2224/13023 , H01L2224/13025 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1362 , H01L2224/13655 , H01L2224/13671 , H01L2224/13672 , H01L2224/16056 , H01L2224/16148 , H01L2224/16225 , H01L2224/16227 , H01L2224/81121 , H01L2224/81143 , H01L2224/81193 , H01L2224/81815 , H01L2225/06513 , H01L2225/06555 , H01L2225/06565 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/0105 , H01L2924/01079 , H01L2924/12 , H01L2924/14 , H01L2924/3512 , H01L2924/35121 , H01L2924/384 , H01L2924/3841 , H01L2924/00014
摘要： A system and method for conductive pillars is provided. An embodiment comprises a conductive pillar having trenches located around its outer edge. The trenches are used to channel conductive material such as solder when a conductive bump is formed onto the conductive pillar. The conductive pillar may then be electrically connected to another contact through the conductive material.
摘要翻译： 提供了一种用于导电柱的系统和方法。 一个实施例包括具有位于其外边缘周围的沟槽的导电柱。 当在导电柱上形成导电凸块时，沟槽用于引导诸如焊料的导电材料。 导电柱然后可以通过导电材料电连接到另一接触件。
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公开(公告)号：US20110254160A1
公开(公告)日：2011-10-20
申请号：US12762085
申请日：2010-04-16
申请人： Po-Hao Tsai , Jing-Cheng Lin , Chen-Hua Yu
发明人： Po-Hao Tsai , Jing-Cheng Lin , Chen-Hua Yu
IPC分类号： H01L23/538
CPC分类号： H01L23/3121 , H01L21/486 , H01L21/568 , H01L21/6835 , H01L21/6836 , H01L21/76898 , H01L23/13 , H01L23/147 , H01L23/481 , H01L23/49822 , H01L23/49827 , H01L24/13 , H01L24/16 , H01L24/73 , H01L24/81 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/50 , H01L2221/68327 , H01L2221/68381 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13184 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/73204 , H01L2224/81411 , H01L2224/81444 , H01L2224/81455 , H01L2224/81464 , H01L2225/06517 , H01L2225/06548 , H01L2924/00011 , H01L2924/01322 , H01L2924/14 , H01L2924/15153 , H01L2924/15192 , H01L2924/15311 , H01L2924/15321 , H01L2924/00 , H01L2224/81805
摘要： A device includes an interposer including a substrate having a top surface and a bottom surface. A plurality of through-substrate vias (TSVs) penetrates through the substrate. The plurality of TSVs includes a first TSV having a first length and a first horizontal dimension, and a second TSV having a second length different from the first length, and a second horizontal dimension different from the first horizontal dimension. An interconnect structure is formed overlying the top surface of the substrate and electrically coupled to the plurality of TSVs.
摘要翻译： 一种器件包括具有顶表面和底表面的衬底的插入器。 多个穿通基板通孔（TSV）穿过基板。 多个TSV包括具有第一长度和第一水平尺寸的第一TSV和具有不同于第一长度的第二长度的第二TSV和与第一水平尺寸不同的第二水平尺寸。 互连结构形成在衬底的顶表面上并电耦合到多个TSV。
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公开(公告)号：US08455995B2
公开(公告)日：2013-06-04
申请号：US12762085
申请日：2010-04-16
申请人： Po-Hao Tsai , Jing-Cheng Lin , Chen-Hua Yu
发明人： Po-Hao Tsai , Jing-Cheng Lin , Chen-Hua Yu
IPC分类号： H01L23/04
CPC分类号： H01L23/3121 , H01L21/486 , H01L21/568 , H01L21/6835 , H01L21/6836 , H01L21/76898 , H01L23/13 , H01L23/147 , H01L23/481 , H01L23/49822 , H01L23/49827 , H01L24/13 , H01L24/16 , H01L24/73 , H01L24/81 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/50 , H01L2221/68327 , H01L2221/68381 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13184 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/73204 , H01L2224/81411 , H01L2224/81444 , H01L2224/81455 , H01L2224/81464 , H01L2225/06517 , H01L2225/06548 , H01L2924/00011 , H01L2924/01322 , H01L2924/14 , H01L2924/15153 , H01L2924/15192 , H01L2924/15311 , H01L2924/15321 , H01L2924/00 , H01L2224/81805
摘要： A device includes an interposer including a substrate having a top surface and a bottom surface. A plurality of through-substrate vias (TSVs) penetrates through the substrate. The plurality of TSVs includes a first TSV having a first length and a first horizontal dimension, and a second TSV having a second length different from the first length, and a second horizontal dimension different from the first horizontal dimension. An interconnect structure is formed overlying the top surface of the substrate and electrically coupled to the plurality of TSVs.
摘要翻译： 一种器件包括具有顶表面和底表面的衬底的插入器。 多个穿通基板通孔（TSV）穿过基板。 多个TSV包括具有第一长度和第一水平尺寸的第一TSV和具有不同于第一长度的第二长度的第二TSV和与第一水平尺寸不同的第二水平尺寸。 互连结构形成在衬底的顶表面上并电耦合到多个TSV。
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公开(公告)号：US20110304042A1
公开(公告)日：2011-12-15
申请号：US12846260
申请日：2010-07-29
申请人： Jing-Cheng Lin , Ya-Hsi Hwung , Hsin-Yu Chen , Po-Hao Tsai , Yan-Fu Lin , Cheng-Lin Huang , Fang Wen Tsai , Wen-Chih Chiou
发明人： Jing-Cheng Lin , Ya-Hsi Hwung , Hsin-Yu Chen , Po-Hao Tsai , Yan-Fu Lin , Cheng-Lin Huang , Fang Wen Tsai , Wen-Chih Chiou
IPC分类号： H01L23/498 , H01L21/768
CPC分类号： H01L24/11 , H01L23/488 , H01L24/13 , H01L24/16 , H01L24/73 , H01L24/81 , H01L24/92 , H01L24/94 , H01L25/0657 , H01L2224/0401 , H01L2224/05099 , H01L2224/05571 , H01L2224/05599 , H01L2224/10126 , H01L2224/10145 , H01L2224/1182 , H01L2224/11823 , H01L2224/1191 , H01L2224/13017 , H01L2224/13022 , H01L2224/13083 , H01L2224/13111 , H01L2224/13113 , H01L2224/13118 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13157 , H01L2224/13164 , H01L2224/13564 , H01L2224/13565 , H01L2224/1357 , H01L2224/13578 , H01L2224/13583 , H01L2224/13644 , H01L2224/13655 , H01L2224/13664 , H01L2224/1369 , H01L2224/16058 , H01L2224/16148 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/81193 , H01L2224/81801 , H01L2224/81815 , H01L2224/92125 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2225/06541 , H01L2924/00011 , H01L2924/0002 , H01L2924/01029 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/37001 , H01L2924/00 , H01L2224/81 , H01L2224/16225 , H01L2924/00012 , H01L2224/16145 , H01L2924/00014 , H01L2924/01047 , H01L2224/05552 , H01L2224/81805
摘要： A work piece includes a copper bump having a top surface and sidewalls. A protection layer is formed on the sidewalls, and not on the top surface, of the copper bump. The protection layer includes a compound of copper and a polymer, and is a dielectric layer.
摘要翻译： 工件包括具有顶表面和侧壁的铜凸块。 在铜凸块的侧壁而不是顶表面上形成保护层。 保护层包括铜和聚合物的化合物，并且是介电层。
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公开(公告)号：US08922004B2
公开(公告)日：2014-12-30
申请号：US12846260
申请日：2010-07-29
申请人： Jing-Cheng Lin , Ya-Hsi Hwung , Hsin-Yu Chen , Po-Hao Tsai , Yan-Fu Lin , Cheng-Lin Huang , Fang Wen Tsai , Wen-Chih Chiou
发明人： Jing-Cheng Lin , Ya-Hsi Hwung , Hsin-Yu Chen , Po-Hao Tsai , Yan-Fu Lin , Cheng-Lin Huang , Fang Wen Tsai , Wen-Chih Chiou
IPC分类号： H01L23/48 , H01L23/488 , H01L23/00 , H01L25/065
CPC分类号： H01L24/11 , H01L23/488 , H01L24/13 , H01L24/16 , H01L24/73 , H01L24/81 , H01L24/92 , H01L24/94 , H01L25/0657 , H01L2224/0401 , H01L2224/05099 , H01L2224/05571 , H01L2224/05599 , H01L2224/10126 , H01L2224/10145 , H01L2224/1182 , H01L2224/11823 , H01L2224/1191 , H01L2224/13017 , H01L2224/13022 , H01L2224/13083 , H01L2224/13111 , H01L2224/13113 , H01L2224/13118 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13157 , H01L2224/13164 , H01L2224/13564 , H01L2224/13565 , H01L2224/1357 , H01L2224/13578 , H01L2224/13583 , H01L2224/13644 , H01L2224/13655 , H01L2224/13664 , H01L2224/1369 , H01L2224/16058 , H01L2224/16148 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/81193 , H01L2224/81801 , H01L2224/81815 , H01L2224/92125 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2225/06541 , H01L2924/00011 , H01L2924/0002 , H01L2924/01029 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/37001 , H01L2924/00 , H01L2224/81 , H01L2224/16225 , H01L2924/00012 , H01L2224/16145 , H01L2924/00014 , H01L2924/01047 , H01L2224/05552 , H01L2224/81805
摘要： A work piece includes a copper bump having a top surface and sidewalls. A protection layer is formed on the sidewalls, and not on the top surface, of the copper bump. The protection layer includes a compound of copper and a polymer, and is a dielectric layer.
摘要翻译： 工件包括具有顶表面和侧壁的铜凸块。 在铜凸块的侧壁而不是顶表面上形成保护层。 保护层包括铜和聚合物的化合物，并且是介电层。
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