公开(公告)号：US4517238A

公开(公告)日：1985-05-14

申请号：US477206

申请日：1983-03-21

申请人： Katsutoshi Mine ,  Toshio Suzuki ,  Tsuneo Hanada

发明人： Katsutoshi Mine ,  Toshio Suzuki ,  Tsuneo Hanada

IPC分类号： C09K3/00 ,  B32B25/20 ,  B32B27/00 ,  C08J3/24 ,  C08L83/04 ,  C09D183/04 ,  H01B3/46 ,  H01L21/31 ,  H01L21/312 ,  B05D3/02 ,  B32B7/02

CPC分类号： C08J3/245 ,  C08L83/04 ,  C09D183/04 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C08J2383/04 ,  Y10T428/24942 ,  Y10T428/31536 ,  Y10T428/31612 ,  Y10T428/31663

摘要： Integral silicone molded products comprising a unitary structure of a substrate with different phases is made by coating a substrate with a mixture of an alkenyl containing polyorganosiloxane, a polyorganohydrogensiloxane, and an addition-reaction catalyst where at least one component is applied to the substrate and then additional components are applied and diffuse to result in a coating with a polyorganosiloxane phase whose degree of crosslinking is low and a polyorganosiloxane phase whose degree of crosslinking is high and the phase having the low degree of crosslinking is next to the substrate. Such molded products are coated hybrid IC transistors, solar battery modules, and optical fibers.

摘要翻译： 通过用含有聚有机硅氧烷，聚有机氢硅氧烷和加成反应催化剂的混合物涂覆基材，制成包含具有不同相的基板的整体结构的整体硅酮模制产品，其中至少一种组分施加到基材上，然后 另外的组分被施加和扩散以导致其交联度低的聚有机硅氧烷相的涂层和交联度高的交联度低的交联的相关的聚有机硅氧烷相与基板相邻。 这种模制产品是涂覆的混合IC晶体管，太阳能电池模块和光纤。

公开(公告)号：US07700678B2

公开(公告)日：2010-04-20

申请号：US10536669

申请日：2003-11-17

申请人： Kazumi Nakayoshi ,  Hiroki Ishikawa ,  Ryoto Shima ,  Katsutoshi Mine

发明人： Kazumi Nakayoshi ,  Hiroki Ishikawa ,  Ryoto Shima ,  Katsutoshi Mine

IPC分类号： C08K3/22 ,  C08G77/00

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08K9/04 ,  C09J183/04 ,  H05K3/321

摘要： A silver-based powder is surface-treated with an oxidation inhibitor by means of a mechanochemical reaction. A method of preparation of the silver-based powder includes using an organic solution of the oxidation inhibitor as a lubricating agent, applying mechanical energy to the silver-based powder, and subjecting the silver-based powder to surface treatment with said oxidation inhibitor by means of a mechanochemical reaction.

摘要翻译： 通过机械化学反应用氧化抑制剂对银基粉末进行表面处理。 制备银基粉末的方法包括使用氧化抑制剂的有机溶液作为润滑剂，向银基粉末施加机械能，并用所述氧化抑制剂对银基粉末进行表面处理 的机械化学反应。

公开(公告)号：US20070176317A1

公开(公告)日：2007-08-02

申请号：US10550839

申请日：2004-03-25

申请人： Yoshitsugu Morita ,  Katsutoshi Mine ,  Fumio Mitajima

发明人： Yoshitsugu Morita ,  Katsutoshi Mine ,  Fumio Mitajima

IPC分类号： B29C70/70 ,  B29C70/88

CPC分类号： B29C43/18 ,  B29C43/36 ,  B29C43/50 ,  B29C2043/5825 ,  H01L21/565 ,  H01L21/566 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2224/0401 ,  H01L2924/00012

摘要： A method of manufacturing a semiconductor device sealed with silicone rubber, characterized by 1) placing an unsealed semiconductor device into a mold, 2) thereafter filling in spaces between the mold and the semiconductor device with a sealing silicone rubber composition, and 3) subjecting the composition to compression molding. By the utilization of this method, a sealed semiconductor device is free of voids, and a thickness of a sealing silicone rubber can be controlled.

摘要翻译： 一种制造用硅橡胶密封的半导体器件的方法，其特征在于1）将未密封的半导体器件放置在模具中，2）之后用密封硅橡胶组合物填充模具和半导体器件之间的空间，以及3） 组合成压缩成型。 通过利用该方法，密封的半导体器件没有空隙，并且可以控制密封硅橡胶的厚度。

公开(公告)号：US07056129B2

公开(公告)日：2006-06-06

申请号：US10496558

申请日：2002-11-21

申请人： Akihiko Kobayashi ,  Kazumi Nakayoshi ,  Ryoto Shima ,  Yoshito Ushio ,  Katsutoshi Mine

发明人： Akihiko Kobayashi ,  Kazumi Nakayoshi ,  Ryoto Shima ,  Yoshito Ushio ,  Katsutoshi Mine

IPC分类号： H01R9/09

CPC分类号： H01L24/83 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/602 ,  C09J2483/00 ,  H01L21/486 ,  H01L23/49827 ,  H01L24/29 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/0107 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K3/321 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/10378 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599

摘要： An anisotropically electroconductive adhesive film is characterized by containing an electroconductive elastomer that traverses the thickness of the adhesive film and is insulated in the plane of the adhesive film comprising electrically insulating elastomer, and both the electroconductive elastomer and the electrically insulating elastomer have a modulus of elasticity at 150° C. that is no greater than 100 MPa. A method for producing the anisotropically electroconductive adhesive film is characterized by forming through holes across the thickness of the adhesive film comprising electrically insulating elastomer, thereafter filling the through holes with an electroconductive elastomer composition, and curing the electroconductive elastomer composition to form the electroconductive elastomer after filling the through holes. A semiconductor device characterized by the electrical connection of the terminals of a semiconductor chip to the interconnect pads of an interconnect substrate by the aforementioned anisotropically electroconductive adhesive film.

摘要翻译： 各向异性导电粘合剂膜的特征在于含有穿过粘合剂膜的厚度并在包含电绝缘弹性体的粘合剂膜的平面中绝缘的导电弹性体，并且导电弹性体和电绝缘弹性体都具有弹性模量 在150℃下不大于100MPa。 制造各向异性导电粘合膜的方法的特征在于，在包括电绝缘弹性体的粘合剂膜的厚度上形成通孔，然后用导电弹性体组合物填充通孔，并且固化导电弹性体组合物以形成导电弹性体 填充通孔。 一种半导体器件，其特征在于通过上述各向异性导电粘合剂膜将半导体芯片的端子与互连衬底的互连焊盘电连接。

公开(公告)号：US20050181213A1

公开(公告)日：2005-08-18

申请号：US10511659

申请日：2003-05-29

申请人： Hiroki Ishikawa ,  Katsutoshi Mine ,  Kimio Yamakawa ,  Kazumi Nakayoshi

发明人： Hiroki Ishikawa ,  Katsutoshi Mine ,  Kimio Yamakawa ,  Kazumi Nakayoshi

IPC分类号： C08K3/08 ,  C08K3/22 ,  C08L83/04 ,  C09K5/14 ,  H01L23/373 ,  B32B27/38 ,  B32B9/04 ,  C08L63/00

CPC分类号： C08K3/08 ,  C08G77/12 ,  C08G77/20 ,  C08K3/10 ,  C08K3/22 ,  C08K2003/2227 ,  C08L83/04 ,  C09K5/14 ,  H01L23/3736 ,  H01L23/3737 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2924/12044 ,  H01L2924/1301 ,  Y10T428/31511 ,  Y10T428/31663 ,  C08L2666/54 ,  C08L83/00 ,  H01L2924/00014 ,  H01L2924/00

摘要： A thermoconductive curable liquid polymer composition including (A) a curable liquid polymer, (B) a filler made from a thermally-elongatable shape-memory alloy, and (C) a thermoconductive filler other than (B). A semiconductor device having a semiconductor element glued or coated with the thermoconductive curable liquid polymer composition.

摘要翻译： 一种导热固化液体聚合物组合物，其包含（A）可固化液体聚合物，（B）由热可伸长形状记忆合金制成的填料，和（C）除（B）之外的导热填料。 一种半导体器件，其具有胶合或涂覆有导热可固化液体聚合物组合物的半导体元件。

公开(公告)号：US06551676B1

公开(公告)日：2003-04-22

申请号：US09384152

申请日：1999-08-27

申请人： Kimio Yamakawa ,  Minoru Isshiki ,  Yoshiko Otani ,  Katsutoshi Mine

发明人： Kimio Yamakawa ,  Minoru Isshiki ,  Yoshiko Otani ,  Katsutoshi Mine

IPC分类号： B32B904

CPC分类号： H01L24/83 ,  C09J7/10 ,  C09J183/04 ,  C09J2203/326 ,  C09J2483/00 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/29386 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/85424 ,  H01L2224/85444 ,  H01L2224/8547 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  Y10S428/914 ,  Y10T428/14 ,  Y10T428/1452 ,  Y10T428/1457 ,  Y10T428/1462 ,  Y10T428/1471 ,  Y10T428/1476 ,  Y10T428/31663 ,  Y10T428/31786 ,  H01L2924/0715 ,  H01L2924/00 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A silicone-based adhesive sheet prepared by a process comprising (i) curing a silicone composition to form a substantially cured product while the composition lies between backing materials, wherein at least one of the backing materials has a surface comprising oxygen atoms and/or sulfur atoms in contact with the silicone composition and the backing materials are releasable from the cured product, and (ii) separating the cured product from the backing materials. A method of manufacturing a silicone-based adhesive sheet comprising (i) curing a silicone composition to form a cured product while the composition lies between backing materials, wherein at least one of the backing materials has a surface comprising oxygen atoms and/or sulfur atoms in contact with the silicone composition and the backing materials are releasable from the cured product, and (ii) separating the cured product from the backing materials. A semiconductor device comprising a semiconductor chip, a chip attachment component, and the above-mentioned silicone-based adhesive sheet, wherein the semiconductor chip is bonded to the chip attachment component with the silicone-based adhesive sheet.

摘要翻译： 一种通过包括（i）固化硅氧烷组合物以形成基本固化的产品同时组合物位于背衬材料之间的硅氧烷基粘合片，其中至少一种背衬材料具有包含氧原子和/或硫的表面 与硅氧烷组合物和背衬材料接触的原子可从固化产物中释放，和（ii）将固化产物与背衬材料分离。 一种制造硅氧烷基粘合片的方法，包括（i）固化硅氧烷组合物以形成固化产物，同时组合物位于背衬材料之间，其中至少一种背衬材料具有包含氧原子和/或硫原子的表面 与硅氧烷组合物接触并且背衬材料可从固化产物中释放，和（ii）将固化产物与背衬材料分离。 一种半导体器件，包括半导体芯片，芯片附着部件和上述硅氧烷基粘合片，其中半导体芯片与硅氧烷基粘合片结合到芯片附接部件。

公开(公告)号：US06214748B1

公开(公告)日：2001-04-10

申请号：US09086031

申请日：1998-05-28

申请人： Akihiko Kobayashi ,  Katsutoshi Mine ,  Takashi Nakamura ,  Motoshi Sasaki ,  Kiyotaka Sawa

发明人： Akihiko Kobayashi ,  Katsutoshi Mine ,  Takashi Nakamura ,  Motoshi Sasaki ,  Kiyotaka Sawa

IPC分类号： H01L2131

CPC分类号： H01L21/02134 ,  H01L21/0212 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02282 ,  H01L21/02337 ,  H01L21/02351 ,  H01L21/312 ,  H01L21/31695 ,  H01L21/76801 ,  H01L21/76825 ,  H01L21/76828 ,  H01L23/5329 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： This invention pertains to a method for forming thin films on substrates wherein the films are produced by applying a solution of an electrically insulating, heat-curing resin onto the substrate, evaporating the solvent and exposing the resin to high energy radiation to cure the resin. The resin solution contains a substance selected from solvents and gas generating additives that causes the dedensification of the film during the cure of the resin. This results in a film having a dielectric constant of below 2.7. This invention also pertains to a semiconductor device having an interconnect structure comprising at least one electrically conductive layer with an interposed insulating layer having a dielectric constant of less than 2.7 wherein the insulating layer is produced by the method of this invention.

摘要翻译： 本发明涉及在基板上形成薄膜的方法，其中通过将电绝缘的热固化树脂的溶液施加到基底上，蒸发溶剂并使树脂暴露于高能量辐射以固化树脂来制备薄膜。 树脂溶液含有选自溶剂和气体发生添加剂的物质，其在树脂固化期间引起薄膜的强化。 这导致介电常数低于2.7的膜。 本发明还涉及具有互连结构的半导体器件，该互连结构包括至少一个具有介电常数小于2.7的中间绝缘层的导电层，其中通过本发明的方法制造绝缘层。

公开(公告)号：US6040395A

公开(公告)日：2000-03-21

申请号：US316217

申请日：1999-05-21

申请人： Minoru Isshiki ,  Katsutoshi Mine ,  Kimio Yamakawa

发明人： Minoru Isshiki ,  Katsutoshi Mine ,  Kimio Yamakawa

IPC分类号： C09D5/00 ,  C09D163/00 ,  C09D183/04 ,  C09D183/06 ,  H01G13/00 ,  H01L23/29 ,  H01L23/31 ,  C08F283/12

CPC分类号： H01L23/3142 ,  C09D183/04 ,  C09D183/06 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/73 ,  H01L2924/14 ,  H01L2924/19041

摘要： This invention relates to a primer that improves adherence of a cured resin sealant to a cured silicone coating on an electrical element, wherein said primer is selected from the group consisting of:(i) a mixture of components (a) and (b),(ii) a reaction mixture of components (a) and (b),(iii) component (c),(iv) component (c) and a mixture of components (a) and (b), and(v) component (c) and a reaction mixture of components (a) and (b),where component (a) is silanol-functional organopolysiloxane; component (b) is epoxy-functional organoalkoxysilane; and component (c) is organopolysiloxane with the average unit formula: (R.sup.1 SiO.sub.3/2).sub.a (R.sup.2.sub.2 SiO.sub.2/2).sub.b (R.sup.2.sub.3 SiO.sub.1/2).sub.c (R.sup.3 O.sub.1/2).sub.dwhere R.sup.1 is an epoxy-functional monovalent organic group; each R.sup.2 is independently a monovalent hydrocarbon group, R.sup.3 is selected from the group consisting of hydrogen and alkyl groups of 1 to 4 carbon atoms; a, b, and d are each a positive number; and c is 0 or a positive number.

摘要翻译： 本发明涉及改善固化树脂密封剂对电气元件上固化的硅氧烷涂层的粘附性的底漆，其中所述底漆选自：（i）组分（a）和（b）的混合物， （ⅱ）组分（a）和（b），（ⅲ）组分（c），（ⅳ）组分（c）和组分（a）和（b）的混合物和（ⅴ） c）和组分（a）和（b）的反应混合物，其中组分（a）是硅烷醇官能的有机聚硅氧烷; 组分（b）是环氧官能的有机烷氧基硅烷; 组分（c）是平均单元式为（R1SiO3 / 2）a（R22SiO2 / 2）b（R23SiO1 / 2）c（R3O1 / 2）d的有机聚硅氧烷，其中R1为环氧官能单价有机基团; 每个R 2独立地为一价烃基，R 3选自氢和1至4个碳原子的烷基; a，b和d分别为正数; c为0或正数。

公开(公告)号：US6017587A

公开(公告)日：2000-01-25

申请号：US112392

申请日：1998-07-09

申请人： Don Lee Kleyer ,  Michael Andrew Lutz ,  Katsutoshi Mine ,  Osamu Mitani ,  Kazumi Nakayoshi ,  Bernard Vanwert

发明人： Don Lee Kleyer ,  Michael Andrew Lutz ,  Katsutoshi Mine ,  Osamu Mitani ,  Kazumi Nakayoshi ,  Bernard Vanwert

IPC分类号： C08L83/05 ,  C08K3/08 ,  C08L83/04 ,  C08L83/07 ,  H01B1/22 ,  B05D3/02

CPC分类号： H01B1/22 ,  C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08G77/44 ,  C08G77/60 ,  C08G77/70 ,  C08G77/80 ,  Y10T428/31663

摘要： The present invention relates to electrically conductive silicone compositions comprising an organopolysiloxane containing at least two alkenyl groups per molecule, an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms per molecule, a platinum group metal containing catalyst, a conductive metal particulate, a precrosslinked elastomeric silicone particle, and a non-reactive volatile diluent. The electrically conductive silicone compositions of this invention are useful as electrically conductive adhesives and coatings for electrical and electronic devices. The cured electrically conductive silicone compositions of this invention have high electroconductivity and rubbery elasticity.

摘要翻译： 本发明涉及导电硅氧烷组合物，其包含每分子含有至少两个烯基的有机聚硅氧烷，每分子具有至少两个与硅键合的氢原子的有机氢聚硅氧烷，含铂族金属的催化剂，导电金属颗粒，预交联弹性体 硅氧烷颗粒和非反应性挥发性稀释剂。 本发明的导电硅氧烷组合物可用作电气和电子设备的导电粘合剂和涂层。 本发明固化的导电硅氧烷组合物具有高导电性和橡胶弹性。

公开(公告)号：US5989942A

公开(公告)日：1999-11-23

申请号：US237610

申请日：1999-01-25

申请人： Takae Ishikawa ,  Katsutoshi Mine ,  Hiroyosi Naito ,  Kimio Yamakawa

发明人： Takae Ishikawa ,  Katsutoshi Mine ,  Hiroyosi Naito ,  Kimio Yamakawa

IPC分类号： H01L23/29 ,  H01L23/31 ,  H01L21/44

CPC分类号： H01L23/24 ,  H01L23/295 ,  H01L23/3121 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181

摘要： A method for fabricating a semiconductor device, comprising the steps of coating the surface of a semiconductor element with a curable silicone composition comprising a curable silicone polymer and a filler having an average particle diameter of 0.01 to 500 micrometers and a specific gravity of 0.01 to 0.95, wherein the filler is selected from the group consisting of powders of organic resins, hollow forms of organic resin powders, hollow inorganic powders, intrinsically electrically conductive fillers, and fillers having a surface that is electrically conductive; allowing sufficient time to elapse for the filler in the part of the curable silicone composition adjoining the element to migrate into the part of the curable silicone composition remote from the element; and curing the curable silicone composition.

摘要翻译： 一种制造半导体器件的方法，包括以下步骤：用可固化的聚硅氧烷聚合物和平均粒径为0.01至500微米，比重为0.01至0.95的填料的可固化硅氧烷组合物涂覆半导体元件的表面 其中填料选自有机树脂粉末，中空形式的有机树脂粉末，中空无机粉末，固有导电填料和具有导电表面的填料; 允许足够的时间在邻近元件的可固化硅氧烷组合物的部分中填充物迁移到远离元件的可固化硅氧烷组合物的一部分中; 并固化可固化的有机硅组合物。