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公开(公告)号：US20110163152A1
公开(公告)日：2011-07-07
申请号：US12974576
申请日：2010-12-21
IPC分类号： B23K1/20
CPC分类号： B23K1/0016 , B23K1/20 , B23K2101/38
摘要： A method of forming a solder dam on a lead of an electronic component includes forming the looped solder dam surrounding a target lead, to which the solder dam is to be formed, of a plurality of leads connected to the electronic component, by fitting a C-shaped fitted member to the target lead at a predetermined location.
摘要翻译： 在电子部件的引线上形成焊料坝的方法包括：通过安装C电极，形成围绕要连接到电子部件的多个引线围绕要形成焊锡的目标引线的环形焊料坝 形状的装配构件在预定位置处到目标引线。
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公开(公告)号：US20110165338A1
公开(公告)日：2011-07-07
申请号：US12977641
申请日：2010-12-23
CPC分类号： C23C14/042 , B23K1/0016 , B23K1/20 , B23K2101/38 , C23C14/562 , H01L23/49555 , H01L23/49586 , H01L2924/0002 , H05K3/308 , H05K3/3426 , H01L2924/00
摘要： An apparatus for forming a solder dam on each lead of an electronic device includes a mask having one or more slits; and forming means that forms the solder dam made of non-metal material on the lead of the electronic device through the slits of the mask.
摘要翻译： 一种用于在电子设备的每个引线上形成焊料坝的设备包括具有一个或多个狭缝的掩模; 以及形成装置，其通过掩模的狭缝在电子装置的引线上形成由非金属材料制成的焊料坝。
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公开(公告)号：US20110165319A1
公开(公告)日：2011-07-07
申请号：US12974558
申请日：2010-12-21
CPC分类号： B23K1/20 , B23K1/0016 , B23K2101/38 , H01L2924/0002 , H05K3/3426 , H05K3/3447 , H05K2201/2081 , H01L2924/00
摘要： An apparatus for forming a solder dam on a lead of an electronic component is disclosed. The apparatus for forming a solder dam includes a wire material that transfers an ink that prevents adhesion of a solder to the lead; a wire material conveying device that conveys the wire material along a surface of the lead; and an ink supply device that supplies the ink to the wire material.
摘要翻译： 公开了一种用于在电子部件的引线上形成焊料坝的装置。 用于形成焊料坝的装置包括：转移墨水的线材，其防止焊料粘附到引线上; 线材输送装置，其沿导线的表面输送线材; 以及将墨水供给到线材的供墨装置。
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公开(公告)号：US20120024475A1
公开(公告)日：2012-02-02
申请号：US13186798
申请日：2011-07-20
CPC分类号： B29C65/4825 , B29C65/5057 , B29C66/342 , B29C66/345 , B29C66/3452 , B29C66/5346 , B29C66/7465 , B29C66/81422 , B29C66/8163 , B29C66/82263 , B29C66/8322 , B29C66/8324 , B29C66/836 , B29L2012/00 , B29L2031/3437
摘要： A display bonding device includes a stage configured to place an adhesive tape and an adherend thereon, a pressure head configured to press the adhesive tape onto the adherend with a pressure surface having a tapered shape or a curved shape which is tilted with respect to the stage, and a movement mechanism configured to move the pressure head toward the adhesive tape through a pressure rod which is coupled to the pressure head. The pressure head is configured to rotate around the pressure rod.
摘要翻译： 显示接合装置包括：配置成将粘合带和被粘物放置在其上的台阶，压头，其构造成将压带面压制在被粘物上，所述压力面具有相对于台阶倾斜的锥形或弯曲形状 以及移动机构，其构造成通过联接到所述压力头的压力杆将所述压力头朝向所述粘合带移动。 压头构造成围绕压力杆旋转。
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公开(公告)号：US20100006325A1
公开(公告)日：2010-01-14
申请号：US12495860
申请日：2009-07-01
CPC分类号： H05K3/249 , H05K1/118 , H05K2201/0272 , H05K2201/035 , H05K2201/0769 , H05K2203/1105
摘要： A printed wiring board includes a first conductive paste forming a wiring pattern, and a second conductive paste including kneaded first conductive material and second conductive material whose particles are finer than those of the first conductive material.
摘要翻译： 印刷布线板包括形成布线图案的第一导电浆料和包含捏合的第一导电材料的第二导电浆料和其颗粒比第一导电材料的颗粒更细的第二导电材料。
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6.发明申请CONDUCTIVE BONDING MATERIAL, CONDUCTOR BONDING METHOD, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD 审中-公开导电粘合材料，导体接合方法和半导体器件生产方法公开(公告)号：US20130087605A1
公开(公告)日：2013-04-11
申请号：US13596511
申请日：2012-08-28
CPC分类号： B23K35/262 , B23K1/0016 , B23K35/0244 , B23K35/025 , B23K35/24 , B23K35/286 , B23K35/3006 , B23K35/302 , B23K35/36 , B23K35/3613 , B23K2101/40 , C22C12/00 , C22C13/00 , C22C13/02 , H01B1/22 , H01L24/24 , H01L24/82 , H01L2924/01322 , H01L2924/12042 , H01L2924/1301 , H01L2924/15788 , H01L2924/19105 , H05K1/0269 , H05K3/3463 , H05K2201/0272 , H01L2924/00
摘要： A conductive bonding material comprising: a first metal particle; a second metal particle having an average particle diameter larger than an average particle diameter of the first metal particle; and a third metal particle having an average particle diameter larger than the average particle diameter of the first metal particle, a relative density larger than a relative density of the first metal particle, and a melting point higher than a melting point of the second metal particle.
摘要翻译： 一种导电接合材料，包括：第一金属颗粒; 平均粒径大于第一金属颗粒的平均粒径的第二金属颗粒; 和平均粒径大于第一金属粒子的平均粒径的第三金属粒子，比第一金属粒子的相对密度大的相对密度，高于第二金属粒子的熔点的熔点 。
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公开(公告)号：US20110304059A1
公开(公告)日：2011-12-15
申请号：US13044608
申请日：2011-03-10
IPC分类号： H01L23/498 , H05K1/00
CPC分类号： H05K3/3436 , H01L2224/16225 , H05K1/0271 , H05K2201/09036 , H05K2201/10734 , H05K2203/041 , Y02P70/613
摘要： A disclosed circuit board includes a substrate, a plurality of electrode pads formed on the substrate, and a groove formed between adjacent electrode pads on the substrate. Further, the electrode pads are surrounded by the groove to have an air space between the adjacent electrode pads.
摘要翻译： 所公开的电路板包括衬底，形成在衬底上的多个电极焊盘以及形成在衬底上的相邻电极焊盘之间的凹槽。 此外，电极焊盘被沟槽包围，以在相邻的电极焊盘之间具有空气空间。
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8.发明申请MOUNT STRUCTURE, ELECTRONIC APPARATUS, STRESS RELIEVING UNIT, AND METHOD OF MANUFACTURING STRESS RELIEVING UNIT 审中-公开安装结构，电子设备，应力消除单元和制造应力消除单元的方法公开(公告)号：US20110303443A1
公开(公告)日：2011-12-15
申请号：US13046821
申请日：2011-03-14
CPC分类号： H05K3/3436 , H01L24/10 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/1012 , H01L2224/13 , H01L2224/131 , H01L2224/16225 , H01L2224/81815 , H01L2924/01029 , H01L2924/351 , H05K1/0271 , H05K2201/10242 , H05K2201/1031 , H05K2201/10674 , Y02P70/611 , Y02P70/613 , Y10T29/49124 , H01L2924/014 , H01L2924/00
摘要： A mount structure for mounting an electronic component on a circuit board includes a stress relieving unit including a center portion having a smaller cross section than a cross section of ends of the stress relieving unit; a first joint portion configured to join one end of the stress relieving unit onto an electrode pad of the electronic component; a second joint portion configured to join the other end of the stress relieving unit onto a connecting pad of the circuit board. Hollow spaces are provided between plural joint structures each of which includes the first joint portion, the stress relieving unit, and the second joint portion.
摘要翻译： 用于将电子部件安装在电路板上的安装结构包括：应力消除单元，包括具有比所述应力消除单元的端部的横截面小的横截面的中心部分; 第一接合部，其构造成将所述应力消除单元的一端接合到所述电子部件的电极焊盘上; 第二接合部，其构造成将所述应力消除单元的另一端接合到所述电路板的连接焊盘上。 在多个接头结构之间设置有空心空间，每个接头结构包括第一接头部分，应力消除单元和第二接头部分。
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9.发明申请ELECTROCONDUCTIVE BONDING MATERIAL, METHOD FOR BONDING CONDUCTOR, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 失效电磁接合材料，接合导体的方法和制造半导体器件的方法公开(公告)号：US20120211549A1
公开(公告)日：2012-08-23
申请号：US13367509
申请日：2012-02-07
CPC分类号： H01L24/13 , B22F1/0014 , B22F1/025 , B23K35/262 , B23K35/30 , B23K35/3006 , B23K35/3013 , B23K35/302 , C22C9/00 , C23C24/106 , H01L23/49811 , H01L23/49883 , H01L24/11 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05671 , H01L2224/0568 , H01L2224/05686 , H01L2224/1131 , H01L2224/1132 , H01L2224/11502 , H01L2224/13017 , H01L2224/13144 , H01L2224/13599 , H01L2224/13609 , H01L2224/13611 , H01L2224/13613 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13709 , H01L2224/13711 , H01L2224/13713 , H01L2224/13809 , H01L2224/13811 , H01L2224/13813 , H01L2224/13839 , H01L2224/13844 , H01L2224/13847 , H01L2224/13899 , H01L2224/13913 , H01L2224/13939 , H01L2224/13944 , H01L2224/13947 , H01L2224/16058 , H01L2224/16148 , H01L2224/16225 , H01L2224/16507 , H01L2224/32225 , H01L2224/73204 , H01L2224/81024 , H01L2224/81055 , H01L2224/81075 , H01L2224/81191 , H01L2224/81193 , H01L2224/812 , H01L2224/8121 , H01L2224/8123 , H01L2224/81509 , H01L2224/81511 , H01L2224/81513 , H01L2224/81639 , H01L2224/81644 , H01L2224/81647 , H01L2224/81699 , H01L2224/81711 , H01L2224/81713 , H01L2224/81739 , H01L2224/81744 , H01L2224/8181 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/13091 , H01L2924/15738 , H01L2924/15788 , H01L2924/1579 , H01L2924/01007 , H01L2924/01008 , H01L2924/01018 , H01L2924/01083 , H01L2924/01031 , H01L2924/0103 , H01L2924/053 , H01L2224/13099 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： An electro-conductive bonding material includes: metal components of a high-melting-point metal particle that have a first melting point or higher; a middle-melting-point metal particle that has a second melting point which is first temperature or higher, and second temperature or lower, the second temperature is lower than the first melting point and higher than the first temperature; and a low-melting-point metal particle that has a third melting point or lower, the third melting point is lower than the first temperature.
摘要翻译： 导电接合材料包括：具有第一熔点或更高熔点的高熔点金属颗粒的金属组分; 中间熔点金属粒子，其具有第一温度以上的第二熔点，第二温度以下，第二温度低于第一熔点且高于第一温度; 和具有第三熔点或更低熔点的低熔点金属颗粒，第三熔点低于第一温度。
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10.发明申请MOUNTING STRUCTURE, ELECTRONIC COMPONENT, CIRCUIT BOARD, BOARD ASSEMBLY, ELECTRONIC DEVICE, AND STRESS RELAXATION MEMBER 审中-公开安装结构，电子元件，电路板，板组件，电子设备和应力松弛元件公开(公告)号：US20110303450A1
公开(公告)日：2011-12-15
申请号：US13071641
申请日：2011-03-25
CPC分类号： H05K3/3436 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L23/562 , H01L24/05 , H01L24/13 , H01L24/16 , H01L2224/0401 , H01L2224/05647 , H01L2224/05655 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2924/3512 , H05K1/0271 , H05K1/111 , H05K1/113 , H05K2201/09436 , H05K2201/10378 , H05K2201/10674 , H05K2201/10734 , Y02P70/611 , Y02P70/613 , H01L2924/014
摘要： Disclosed is a mounting structure for mounting an electronic component on a circuit board. The mounting structure includes an interposer provided between the electronic component and the circuit board; and a plurality of spiral conductors formed in the interposer. The plurality of spiral conductors have one end thereof bonded to corresponding one of external connection terminals of the electronic component and the other end thereof bonded to corresponding one of electrodes of the electronic component.
摘要翻译： 公开了一种用于将电子部件安装在电路板上的安装结构。 安装结构包括设置在电子部件和电路板之间的插入器; 以及形成在插入件中的多个螺旋形导体。 多个螺旋导体的一端接合到电子部件的对应的一个外部连接端子，另一端接合到电子部件的对应的一个电极。
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