公开(公告)号：US20140252577A1

公开(公告)日：2014-09-11

申请号：US13784923

申请日：2013-03-05

申请人： Ralf Otremba ,  Josef Hoeglauer ,  Juergen Schredl ,  Xaver Schloegel ,  Klaus Schiess

发明人： Ralf Otremba ,  Josef Hoeglauer ,  Juergen Schredl ,  Xaver Schloegel ,  Klaus Schiess

IPC分类号： H01L23/495 ,  H01L23/00

CPC分类号： H01L23/49575 ,  H01L21/561 ,  H01L23/4334 ,  H01L23/49558 ,  H01L23/49562 ,  H01L23/49586 ,  H01L23/49861 ,  H01L24/19 ,  H01L24/20 ,  H01L24/89 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2224/73267 ,  H01L2924/07802 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/181 ,  Y10T29/49002 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00015

摘要： Various embodiments provide a chip carrier structure. The chip carrier structure may include a structured metallic chip carrier; encapsulating material at least partially filling the structure; wherein the main surfaces of the metallic chip carrier are free from the encapsulating material.

摘要翻译： 各种实施例提供了芯片载体结构。 芯片载体结构可以包括结构化的金属芯片载体; 封装材料至少部分地填充该结构; 其中金属芯片载体的主表面没有封装材料。

公开(公告)号：US20140008702A1

公开(公告)日：2014-01-09

申请号：US13544834

申请日：2012-07-09

申请人： Ralf Otremba ,  Josef Hoeglauer ,  Juergen Schredl ,  Xaver Schloegel ,  Klaus Schiess

发明人： Ralf Otremba ,  Josef Hoeglauer ,  Juergen Schredl ,  Xaver Schloegel ,  Klaus Schiess

IPC分类号： H01L23/495 ,  H01L29/772

CPC分类号： H01L23/49562 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49568 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L29/2003 ,  H01L29/78 ,  H01L2224/05552 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/40245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85207 ,  H01L2224/85801 ,  H01L2224/8585 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/12031 ,  H01L2924/12032 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/00012

摘要： In accordance with an embodiment of the present invention, a semiconductor package includes a first lead frame having a first die paddle, and a second lead frame, which has a second die paddle and a plurality of leads. The second die paddle is disposed over the first die paddle. A semiconductor chip is disposed over the second die paddle. The semiconductor chip has a plurality of contact regions on a first side facing the second lead frame. The plurality of contact regions is coupled to the plurality of leads.

摘要翻译： 根据本发明的实施例，半导体封装包括具有第一管芯焊盘的第一引线框架和具有第二管芯焊盘和多个引线的第二引线框架。 第二模板设置在第一模板上。 半导体芯片设置在第二裸片上。 半导体芯片在面向第二引线框架的第一面上具有多个接触区域。 多个接触区域耦合到多个引线。

公开(公告)号：US20090174056A1

公开(公告)日：2009-07-09

申请号：US12403000

申请日：2009-03-12

申请人： Ralf Otremba ,  Josef Hoeglauer ,  Klaus Schiess

发明人： Ralf Otremba ,  Josef Hoeglauer ,  Klaus Schiess

IPC分类号： H01L23/48

CPC分类号： H01L23/3107 ,  H01L21/561 ,  H01L21/6835 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L25/072 ,  H01L25/16 ,  H01L25/18 ,  H01L2221/68359 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/76155 ,  H01L2224/82005 ,  H01L2224/82102 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12032 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/82 ,  H01L2924/00

摘要： A semiconductor module is disclosed. One embodiment provides a first semiconductor chip having a first contact pad on a first main surface and a second contact pad on a second main surface, a first electrically conductive layer applied to the first main surface, a second electrically conductive layer applied to the second main surface, and an electrically insulating material covering the first electrically conductive layer, wherein a surface of the second electrically conductive layer forms an external contact pad and the second electrically conductive layer has a thickness of less than 200 μm.

公开(公告)号：US08084816B2

公开(公告)日：2011-12-27

申请号：US12403000

申请日：2009-03-12

申请人： Ralf Otremba ,  Josef Hoeglauer ,  Klaus Schiess

发明人： Ralf Otremba ,  Josef Hoeglauer ,  Klaus Schiess

IPC分类号： H01L23/48 ,  H01L29/78

CPC分类号： H01L23/3107 ,  H01L21/561 ,  H01L21/6835 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L25/072 ,  H01L25/16 ,  H01L25/18 ,  H01L2221/68359 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/76155 ,  H01L2224/82005 ,  H01L2224/82102 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12032 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/82 ,  H01L2924/00

摘要： A semiconductor module is disclosed. One embodiment provides a first semiconductor chip having a first contact pad on a first main surface and a second contact pad on a second main surface, a first electrically conductive layer applied to the first main surface, a second electrically conductive layer applied to the second main surface, and an electrically insulating material covering the first electrically conductive layer, wherein a surface of the second electrically conductive layer forms an external contact pad and the second electrically conductive layer has a thickness of less than 200 μm.

公开(公告)号：US07807504B2

公开(公告)日：2010-10-05

申请号：US12408129

申请日：2009-03-20

申请人： Ralf Otremba ,  Josef Hoeglauer ,  Klaus Schiess

发明人： Ralf Otremba ,  Josef Hoeglauer ,  Klaus Schiess

IPC分类号： H01L21/00

CPC分类号： H01L23/3107 ,  H01L21/561 ,  H01L21/6835 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L25/072 ,  H01L25/16 ,  H01L25/18 ,  H01L2221/68359 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/76155 ,  H01L2224/82005 ,  H01L2224/82102 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12032 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/82 ,  H01L2924/00

摘要： A semiconductor module is disclosed. One embodiment provides a first semiconductor chip having a first contact pad on a first main surface and a second contact pad on a second main surface, a first electrically conductive layer applied to the first main surface, a second electrically conductive layer applied to the second main surface, and an electrically insulating material covering the first electrically conductive layer, wherein a surface of the second electrically conductive layer forms an external contact pad and the second electrically conductive layer has a thickness of less than 200 μm.

摘要翻译： 公开了一种半导体模块。 一个实施例提供了第一半导体芯片，其具有在第一主表面上的第一接触焊盘和在第二主表面上的第二接触焊盘，施加到第一主表面的第一导电层，施加到第二主表面的第二导电层 表面和覆盖第一导电层的电绝缘材料，其中第二导电层的表面形成外部接触焊盘，第二导电层具有小于200μm的厚度。

公开(公告)号：US20090181495A1

公开(公告)日：2009-07-16

申请号：US12408129

申请日：2009-03-20

申请人： Ralf Otremba ,  Josef Hoeglauer ,  Klaus Schiess

发明人： Ralf Otremba ,  Josef Hoeglauer ,  Klaus Schiess

IPC分类号： H01L21/98

CPC分类号： H01L23/3107 ,  H01L21/561 ,  H01L21/6835 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L25/072 ,  H01L25/16 ,  H01L25/18 ,  H01L2221/68359 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/76155 ,  H01L2224/82005 ,  H01L2224/82102 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12032 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/82 ,  H01L2924/00

摘要： A semiconductor module is disclosed. One embodiment provides a first semiconductor chip having a first contact pad on a first main surface and a second contact pad on a second main surface, a first electrically conductive layer applied to the first main surface, a second electrically conductive layer applied to the second main surface, and an electrically insulating material covering the first electrically conductive layer, wherein a surface of the second electrically conductive layer forms an external contact pad and the second electrically conductive layer has a thickness of less than 200 μm.

公开(公告)号：US07879652B2

公开(公告)日：2011-02-01

申请号：US11828858

申请日：2007-07-26

申请人： Ralf Otremba ,  Josef Hoeglauer ,  Klaus Schiess

发明人： Ralf Otremba ,  Josef Hoeglauer ,  Klaus Schiess

IPC分类号： H01L21/00

CPC分类号： H01L23/3107 ,  H01L21/561 ,  H01L21/6835 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L25/072 ,  H01L25/16 ,  H01L25/18 ,  H01L2221/68359 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/76155 ,  H01L2224/82005 ,  H01L2224/82102 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12032 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/82 ,  H01L2924/00

摘要： A semiconductor module is disclosed. One embodiment provides a first semiconductor chip having a first contact pad on a first main surface and a second contact pad on a second main surface, a first electrically conductive layer applied to the first main surface, a second electrically conductive layer applied to the second main surface, and an electrically insulating material covering the first electrically conductive layer, wherein a surface of the second electrically conductive layer forms an external contact pad and the second electrically conductive layer has a thickness of less than 200 μm.

摘要翻译： 公开了一种半导体模块。 一个实施例提供了第一半导体芯片，其具有在第一主表面上的第一接触焊盘和在第二主表面上的第二接触焊盘，施加到第一主表面的第一导电层，施加到第二主表面的第二导电层 表面和覆盖第一导电层的电绝缘材料，其中第二导电层的表面形成外部接触焊盘，第二导电层具有小于200μm的厚度。

公开(公告)号：US09786584B2

公开(公告)日：2017-10-10

申请号：US13602597

申请日：2012-09-04

申请人： Ralf Otremba ,  Josef Hoeglauer ,  Juergen Schredl ,  Xaver Schloegel ,  Klaus Schiess

发明人： Ralf Otremba ,  Josef Hoeglauer ,  Juergen Schredl ,  Xaver Schloegel ,  Klaus Schiess

IPC分类号： H05K7/00 ,  H01L23/495 ,  H05K1/18 ,  H01L23/31 ,  H01L23/373 ,  H01L23/467 ,  H05K1/02

CPC分类号： H01L23/49568 ,  H01L23/3121 ,  H01L23/3735 ,  H01L23/467 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/1301 ,  H01L2924/181 ,  H05K1/0209 ,  H05K1/0256 ,  H05K1/181 ,  H05K2201/2072 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： Representative implementations of devices and techniques provide isolation between a carrier and a component mounted to the carrier. A multi-layer device having lateral elements provides electrical isolation at a preset isolation voltage while maintaining a preselected thermal conductivity between the component and the carrier.

公开(公告)号：US09147628B2

公开(公告)日：2015-09-29

申请号：US13535052

申请日：2012-06-27

申请人： Ralf Otremba ,  Josef Hoeglauer ,  Juergen Schredl ,  Xaver Schloegel ,  Klaus Schiess

发明人： Ralf Otremba ,  Josef Hoeglauer ,  Juergen Schredl ,  Xaver Schloegel ,  Klaus Schiess

IPC分类号： H01L23/495 ,  H01L21/60 ,  H01L23/31 ,  H01L23/538 ,  H01L21/56 ,  H01L23/00

CPC分类号： H01L23/3135 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/25 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/82 ,  H01L24/83 ,  H01L24/85 ,  H01L24/96 ,  H01L2224/04026 ,  H01L2224/04034 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05184 ,  H01L2224/05187 ,  H01L2224/05611 ,  H01L2224/05618 ,  H01L2224/05624 ,  H01L2224/05638 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05684 ,  H01L2224/211 ,  H01L2224/24011 ,  H01L2224/24137 ,  H01L2224/245 ,  H01L2224/2518 ,  H01L2224/27318 ,  H01L2224/291 ,  H01L2224/29116 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/40095 ,  H01L2224/40105 ,  H01L2224/40227 ,  H01L2224/40247 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45499 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48472 ,  H01L2224/48476 ,  H01L2224/48499 ,  H01L2224/48611 ,  H01L2224/48618 ,  H01L2224/48624 ,  H01L2224/48638 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48684 ,  H01L2224/48711 ,  H01L2224/48718 ,  H01L2224/48724 ,  H01L2224/48738 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48755 ,  H01L2224/48764 ,  H01L2224/48784 ,  H01L2224/48811 ,  H01L2224/48818 ,  H01L2224/48824 ,  H01L2224/48838 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/48884 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/82101 ,  H01L2224/82104 ,  H01L2224/82106 ,  H01L2224/83815 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85815 ,  H01L2224/92136 ,  H01L2224/92137 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12032 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/01022 ,  H01L2924/01073 ,  H01L2924/01044 ,  H01L2924/01074 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/0498 ,  H01L2924/0496 ,  H01L2924/0474 ,  H01L2924/0475 ,  H01L2924/0478 ,  H01L2924/0476 ,  H01L2924/0454 ,  H01L2924/0455 ,  H01L2924/0458 ,  H01L2924/0456 ,  H01L2924/00012 ,  H01L2924/01013 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01042 ,  H01L2924/01015 ,  H01L2924/0105 ,  H01L2924/0509 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/0103 ,  H01L2924/01078 ,  H01L2924/0665 ,  H01L2924/01082 ,  H01L2924/01049 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/2075 ,  H01L2924/20754 ,  H01L2224/83205

摘要： In accordance with an embodiment of the present invention, a semiconductor device includes a leadframe having a plurality of leads and a die paddle and a semiconductor module attached to the die paddle of the leadframe. The semiconductor module includes a first semiconductor chip disposed in a first encapsulant. The semiconductor module has a plurality of contact pads coupled to the first semiconductor chip. The semiconductor device further includes a plurality of interconnects coupling the plurality of contact pads with the plurality of leads, and a second encapsulant disposed at the semiconductor module and the leadframe.

摘要翻译： 根据本发明的实施例，半导体器件包括具有多个引线和管芯焊盘的引线框架和连接到引线框架的管芯焊盘的半导体模块。 半导体模块包括设置在第一密封剂中的第一半导体芯片。 半导体模块具有耦合到第一半导体芯片的多个接触焊盘。 半导体器件还包括将多个接触焊盘与多个引线耦合的多个互连以及设置在半导体模块和引线框架处的第二密封剂。

公开(公告)号：US08896106B2

公开(公告)日：2014-11-25

申请号：US13544834

申请日：2012-07-09

申请人： Ralf Otremba ,  Josef Hoeglauer ,  Juergen Schredl ,  Xaver Schloegel ,  Klaus Schiess

发明人： Ralf Otremba ,  Josef Hoeglauer ,  Juergen Schredl ,  Xaver Schloegel ,  Klaus Schiess

IPC分类号： H01L29/76

CPC分类号： H01L23/49562 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49568 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L29/2003 ,  H01L29/78 ,  H01L2224/05552 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/40245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85207 ,  H01L2224/85801 ,  H01L2224/8585 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/12031 ,  H01L2924/12032 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/00012

摘要： In accordance with an embodiment of the present invention, a semiconductor package includes a first lead frame having a first die paddle, and a second lead frame, which has a second die paddle and a plurality of leads. The second die paddle is disposed over the first die paddle. A semiconductor chip is disposed over the second die paddle. The semiconductor chip has a plurality of contact regions on a first side facing the second lead frame. The plurality of contact regions is coupled to the plurality of leads.

摘要翻译： 根据本发明的实施例，半导体封装包括具有第一管芯焊盘的第一引线框架和具有第二管芯焊盘和多个引线的第二引线框架。 第二模板设置在第一模板上。 半导体芯片设置在第二裸片上。 半导体芯片在面向第二引线框架的第一面上具有多个接触区域。 多个接触区域耦合到多个引线。