公开(公告)号：US20030122568A1

公开(公告)日：2003-07-03

申请号：US10035364

申请日：2001-12-28

Applicant: FormFactor, Inc.

Inventor： Benjamin N. Eldridge ,  Stefan Jan Juergen Zschiegner

IPC: G01R031/26

CPC classification number: G01R31/2831

Abstract: A method and apparatus for detecting an arc condition in a semiconductor test system is disclosed. While probes in a semiconductor test system are being moved into or out of contact with a semiconductor wafer, the voltage level of power supplied to selected ones of the probes is monitored. If the voltage level of the power exceeds a level that could cause an arc between the probes and the semiconductor wafer while the wafer is being moved, an indication is generated that an arc condition has been detected.

Abstract translation: 公开了一种用于检测半导体测试系统中的电弧状态的方法和装置。 当半导体测试系统中的探针被移入或接触半导体晶片时，监测提供给所选探针的电压的电压电平。 如果电源的电压水平超过在晶片被移动时在探针与半导体晶片之间可能引起电弧的电平，则产生已经检测到电弧条件的指示。

公开(公告)号：US20030115749A1

公开(公告)日：2003-06-26

申请号：US10027476

申请日：2001-12-21

Applicant: FormFactor, Inc.

Inventor： Jimmy Kuo Chen

IPC: H01K003/22

CPC classification number: H01L24/81 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13655 ,  H01L2224/45144 ,  H01L2224/81801 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/30105 ,  H01L2924/3011 ,  H05K3/22 ,  H05K3/4092 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49158 ,  Y10T29/49179 ,  Y10T29/49204 ,  Y10T29/49213 ,  Y10T29/49222 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for heat-treating a plurality of microelectronic structures attached to a non-metallic substrate is disclosed. Each of the plurality of microelectronic structures is comprised of a metallic material, and ones of the plurality of metallic microelectronic structures are insulated from other ones of the plurality of microelectronic structures. An application of the method is for heat-treatment of resilient microstructures. The method comprises the steps of: (a) placing the non-metallic substrate and the plurality of microelectronic structures in an oscillating electromagnetic field, whereby the plurality of microelectronic structures are heated by the oscillating electromagnetic field and the non-metallic substrate is essentially not heated by the oscillating electromagnetic field; (b) maintaining the non-metallic substrate and the plurality of microelectronic structures in the oscillating electromagnetic field until each of the plurality of microelectronic structures obtains a defined heat-treatment temperature substantially greater than an ambient temperature; (c) removing the non-metallic substrate and the plurality of microelectronic structures from the oscillating electromagnetic field; and (d) cooling the plurality of microelectronic structures to the ambient temperature.

Abstract translation: 公开了一种用于热处理附着在非金属基底上的多个微电子结构的方法。 多个微电子结构中的每一个由金属材料构成，并且多个金属微电子结构中的一个与多个微电子结构中的其它微电子结构绝缘。 该方法的应用是用于热处理弹性微结构。 该方法包括以下步骤：（a）将非金属基底和多个微电子结构放置在振荡电磁场中，由此多个微电子结构被振荡电磁场加热，非金属基底基本上不是 由振荡电磁场加热; （b）将所述非金属基底和所述多个微电子结构保持在所述振荡电磁场中，直到所述多个微电子结构中的每一个获得明显大于环境温度的限定的热处理温度; （c）从振荡电磁场中去除非金属基底和多个微电子结构; 和（d）将多个微电子结构冷却至环境温度。

公开(公告)号：US20030067080A1

公开(公告)日：2003-04-10

申请号：US10299131

申请日：2002-11-19

Applicant: FormFactor, Inc.

Inventor： Thomas H. Dozier II ,  Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu ,  David V. Pedersen ,  Michael A. Stadt

IPC: H01L023/48

CPC classification number: G01R1/0408 ,  B23K3/087 ,  G01R1/0416 ,  G01R1/0466 ,  G01R31/2886 ,  H01L23/04 ,  H01L23/13 ,  H01L23/32 ,  H01L23/5385 ,  H01L24/72 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2224/73251 ,  H01L2224/8114 ,  H01L2224/81901 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/119 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/09472 ,  H05K2201/09827 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/4914 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49208 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  H01L2924/00014 ,  H01L2224/72

Abstract: Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.

公开(公告)号：US20030038850A1

公开(公告)日：2003-02-27

申请号：US09938895

申请日：2001-08-24

Applicant: FormFactor, Inc.

Inventor： Mac Stevens

IPC: G06F009/45

CPC classification number: G06F17/5077

Abstract: Traces routed through a computer depiction of a routing area of an electronics system comprise a plurality of connected nodes. Forces are assigned to the nodes, and the nodes are moved in accordance with the forces. The forces may be based on such things as the proximity of the nodes to each other and to obstacles in the routing area. This tends to smooth, straighten and/or shorten the traces, and may also tend to correct design rule violations.

Abstract translation: 通过电子系统的路由区域的计算机描绘路由的跟踪包括多个连接的节点。 力被分配给节点，并且节点根据力被移动。 力可以基于诸如节点彼此接近以及路由区域中的障碍物等事情。 这倾向于平滑，拉直和/或缩短痕迹，并且还可能倾向于纠正设计规则违规。

公开(公告)号：US20020023773A1

公开(公告)日：2002-02-28

申请号：US09848854

申请日：2001-05-04

Applicant: FormFactor, Inc.

Inventor： Igor Yan Khandros

IPC: H05K001/09

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K2101/40 ,  C23C18/161 ,  C25D7/12 ,  G01R1/0466 ,  G01R1/06711 ,  G01R1/06761 ,  G01R1/07307 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6715 ,  H01L21/76897 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/10126 ,  H01L2224/10145 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45109 ,  H01L2224/45111 ,  H01L2224/45116 ,  H01L2224/45117 ,  H01L2224/4512 ,  H01L2224/45123 ,  H01L2224/45124 ,  H01L2224/45138 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45163 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/45176 ,  H01L2224/4554 ,  H01L2224/4556 ,  H01L2224/456 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/49204 ,  Y10T29/49222 ,  Y10T29/49224 ,  Y10T29/49609 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/0102

Abstract: An interposer includes a substrate having opposing surfaces. Conductive terminals are disposed on both surfaces, and conductive terminals on one surface are electrically connected to conductive terminals on the opposing surface. Elongate, springable, conducive interconnect elements are fixed to conductive terminals on both surfaces.

Abstract translation: 插入器包括具有相对表面的基板。 导电端子设置在两个表面上，一个表面上的导电端子电连接到相对表面上的导电端子。 细长的，弹性的，有利的互连元件固定在两个表面的导电端子上。

公开(公告)号：US20010035800A1

公开(公告)日：2001-11-01

申请号：US09805668

申请日：2001-03-13

Applicant: FORMFACTOR, INC.

Inventor： Charles A. Miller

IPC: H03H007/38

CPC classification number: G01R1/073 ,  G01R1/06766 ,  G01R1/06772

Abstract: Described herein is a probe card assembly providing signal paths for conveying high frequency signals between bond pads of an integrated circuit (IC) and an IC tester. The frequency response of the probe card assembly is optimized by appropriately distributing, adjusting and impedance matching resistive, capacitive and inductive impedance values along the signal paths so that the interconnect system behaves as an appropriately tuned Butterworth or Chebyshev filter.

Abstract translation: 这里描述的是提供用于在集成电路（IC）和IC测试仪的接合焊盘之间传送高频信号的信号路径的探针卡组件。 通过沿着信号路径适当地分布，调整和阻抗匹配电阻，电容和电感阻抗值来优化探针卡组件的频率响应，使得互连系统作为适当调节的巴特沃斯或切比雪夫滤波器。

公开(公告)号：US20010002340A1

公开(公告)日：2001-05-31

申请号：US09752853

申请日：2000-12-29

Applicant: FormFactor, Inc., a Delaware corporation

Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: H01R012/00

CPC classification number: G01R3/00 ,  B23K20/004 ,  B23K2101/38 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D7/123 ,  C25D21/02 ,  G01R1/06727 ,  G01R1/06744 ,  G01R31/2884 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/6835 ,  H01L22/20 ,  H01L23/4951 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05548 ,  H01L2224/1134 ,  H01L2224/16145 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85043 ,  H01L2224/851 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R12/57 ,  H05K1/141 ,  H05K3/24 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/4015 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined on a sacrificial substrate. The openings may be within the surface of the substrate, or in one or more layers deposited on the surface of the sacrificial substrate. Each spring contact element has a base end portion, a contact end portion, and a central body portion. The contact end portion is offset in the z-axis (at a different height) than the central body portion. The base end portion is preferably offset in an opposite direction along the z-axis from the central body portion. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the sacrificial substrate. The spring contact elements are suitably mounted by their base end portions to corresponding terminals on an electronic component, such as a space transformer or a semiconductor device, whereupon the sacrificial substrate is removed so that the contact ends of the spring contact elements extend above the surface of the electronic component. In an exemplary use, the spring contact elements are thereby disposed on a space transformer component of a probe card assembly so that their contact ends effect pressure connections to corresponding terminals on another electronic component, for the purpose of probing the electronic component.

Abstract translation: 通过将至少一层金属材料沉积到限定在牺牲衬底上的开口中来制造弹簧接触元件。 开口可以在衬底的表面内，或者在沉积在牺牲衬底的表面上的一个或多个层中。 每个弹簧接触元件具有基端部分，接触端部分和中心体部分。 接触端部在与中心体部分相同的z轴（不同高度）偏移。 基端部优选地沿着与中心主体部分的z轴相反的方向偏移。 以这种方式，在牺牲基板上以规定的空间关系制造多个弹簧接触元件。 弹簧接触元件通过它们的基端部适当地安装在诸如空间变压器或半导体器件的电子部件上的对应端子上，从而去除牺牲基板，使得弹簧接触元件的接触端部在表面上方延伸 的电子元件。 在示例性用途中，弹簧接触元件因此被布置在探针卡组件的空间变换器部件上，使得它们的接触端在另一电子部件上实现与相应端子的压力连接，以便探测电子部件。

公开(公告)号：US20250067799A1

公开(公告)日：2025-02-27

申请号：US18948055

申请日：2024-11-14

Applicant: FormFactor, Inc.

Inventor： Jörg Hertwig ,  Benedikt Marx

IPC: G01R31/28 ,  G01R1/067

Abstract: Probe systems and methods of operating probe systems. The probe systems include a chuck that defines a support surface. The probe systems also include a cover plate. The probe systems further include a probe positioner that includes a positioner base, a manipulator that extends from the positioner base, and a probe arm that extends from the manipulator. The probe systems also include a probe operatively attached to the probe arm and a positioner attachment structure that separably attaches the positioner base to the cover plate. The positioner attachment structure includes an attachment structure body that defines a positioner base-facing side and a cover plate-facing side. The positioner attachment structure also includes an adhesive material that adheres the positioner base-facing side to the positioner base. The cover plate-facing side of the attachment structure body defines a micropatterned dry adhesive that separably attaches the attachment structure body to the cover plate.

公开(公告)号：US20240345133A1

公开(公告)日：2024-10-17

申请号：US18634655

申请日：2024-04-12

Applicant: FormFactor, Inc.

Inventor： Sterling Tadashi Collins ,  Vinh-Lam Olivier Buu ,  Kevin John Hughes

IPC: G01R1/073

CPC classification number: G01R1/07314

Abstract: A roller mechanism with controlled height is used for probe tap-down in arrays of vertical probes for device testing. The height can be controlled using features of the roller, or external shims. This approach overcomes issues related to guide plate flexure during plate tap down by reducing forces on guide plates. It also avoids issues of probe damage from manual tap down.

公开(公告)号：US20230393174A1

公开(公告)日：2023-12-07

申请号：US18205735

申请日：2023-06-05

Applicant: FormFactor, Inc.

Inventor： Ernest Gammon McReynolds ,  Jerry Martyniuk ,  Tim Lesher ,  Tomoe Yokoyama ,  David Raschko ,  Uyen Nguyen ,  Pratik Bakul Ghate

IPC: G01R1/073 ,  G01R31/28

CPC classification number: G01R1/07378 ,  G01R31/2889

Abstract: Improved performance for attenuated testing when probing a device under test with a probe array is provided. By moving the attenuation components from their conventional location on the printed circuit board of the probe head to the space transformer of the probe head, electrical path lengths can be decreased, thereby improving performance. This is particularly helpful in connection with loopback testing.