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    Semiconductor device and radiation detector employing it
    94.
    发明授权
    Semiconductor device and radiation detector employing it 失效
    采用它的半导体器件和辐射探测器

    公开(公告)号：US07838994B2

    公开(公告)日：2010-11-23

    申请号：US10546604

    申请日：2004-02-24

    Applicant: Katsumi Shibayama ,  Yutaka Kusuyama ,  Masahiro Hayashi

    Inventor： Katsumi Shibayama ,  Yutaka Kusuyama ,  Masahiro Hayashi

    IPC: H01L23/29

    CPC classification number: H05K3/3436 ,  G01T1/2018 ,  H01L23/13 ,  H01L27/14618 ,  H01L27/14634 ,  H01L27/14663 ,  H01L2224/1403 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15312 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K2201/09827 ,  H05K2203/0455 ,  Y02P70/613

    Abstract: A wiring substrate 20, comprising a glass substrate, which is provided with through holes 20c, each having a tapered part 20d that becomes large in opening area at the side of an input surface 20a, and conductive members 21, formed on the inner walls of through holes 20c, is used. A semiconductor device 5 is arranged by connecting bump electrodes 17, provided on an output surface 15b of a PD array 15 in correspondence with conductive members 21, to input portions 21a of conductive members 21 formed on input surface 20a of wiring substrate 20. A radiation detector is arranged by connecting a scintillator 10 via an optical adhesive agent 11 to a light-incident surface 15a of PD array 15 and connecting a signal processing element 30 via bump electrodes 31 to output surface 20b of wiring substrate 20. A semiconductor device, with which the semiconductor elements and the corresponding conductive paths of the wiring substrate are connected satisfactorily, and a radiation detector using this semiconductor device are thus provided.

    Abstract translation: 布线基板20包括设置有通孔20c的玻璃基板，每个通孔20c具有在输入表面20a侧的开口面积变大的锥形部分20d，以及形成在输入表面20a的内壁上的导电部件21 使用通孔20c。 通过将设置在与导电构件21对应的PD阵列15的输出表面15b上的凸块电极17连接到形成在布线基板20的输入表面20a上的导电构件21的输入部21a来布置半导体器件5。 通过光学粘合剂11将闪烁体10连接到PD阵列15的光入射表面15a并将信号处理元件30经由凸起电极31连接到布线基板20的输出表面20b来布置检测器。半导体器件具有 使得半导体元件和布线基板的对应的导电路径令人满意地连接，从而提供使用该半导体器件的放射线检测器。

    MULTILAYER PRINTED WIRING BOARD
    95.
    发明申请
    MULTILAYER PRINTED WIRING BOARD 有权
    多层印刷接线板

    公开(公告)号：US20100252318A1

    公开(公告)日：2010-10-07

    申请号：US12819805

    申请日：2010-06-21

    Applicant: Michimasa TAKAHASHI ,  Yukinobu Mikado ,  Takenobu Nakamura ,  Masakazu Aoyama

    Inventor： Michimasa TAKAHASHI ,  Yukinobu Mikado ,  Takenobu Nakamura ,  Masakazu Aoyama

    IPC: H05K1/02

    CPC classification number: H01L23/48 ,  H01L2924/0002 ,  H05K1/115 ,  H05K3/00 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0352 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09709 ,  H05K2201/09827 ,  Y10T29/49124 ,  H01L2924/00

    Abstract: A multilayer printed wiring board including insulating layers, conductor layers stacked alternately over the insulating layers, respectively, and viaholes formed in the insulation layers and electrically connecting the conductor layers through the insulation layers. The viaholes include a first group of viaholes and a second group of viaholes. The viaholes in the first group are tapered toward the viaholes in the second group, and the viaholes in the second group are tapered toward the viaholes in the first group. The viaholes in the first group and the the viaholes in the second group are formed in the insulating layers, respectively, and the viaholes are formed by plating openings formed after lamination of respective ones of the insulating layers, and each of the insulating layers is about 100 μm or less in thickness.

    Abstract translation: 一种多层印刷布线板，分别包括绝缘层，交替地层叠在绝缘层上的导体层和形成在绝缘层中的通孔，并通过绝缘层电连接导体层。 通孔包括第一组通孔和第二组通孔。 第一组中的通孔朝向第二组中的通孔逐渐变细，第二组中的通孔在第一组中朝向通孔逐渐变细。 第一组中的通孔和第二组中的通孔分别形成在绝缘层中，并且通孔由叠层各绝缘层之后形成的电镀开口形成，并且每个绝缘层为约 厚度为100μm以下。

    SUBSTRATE WITH METAL FILM AND METHOD FOR MANUFACTURING THE SAME
    96.
    发明申请
    SUBSTRATE WITH METAL FILM AND METHOD FOR MANUFACTURING THE SAME 有权
    具有金属膜的基板及其制造方法

    公开(公告)号：US20100243305A1

    公开(公告)日：2010-09-30

    申请号：US12732635

    申请日：2010-03-26

    Applicant: Ayao NIKI ,  Atsushi Ishida ,  Ryojiro Tominaga

    Inventor： Ayao NIKI ,  Atsushi Ishida ,  Ryojiro Tominaga

    IPC: H05K1/00 ,  C08F2/48 ,  B05D3/06

    CPC classification number: H05K3/0032 ,  C25D5/02 ,  C25D7/12 ,  C25D7/123 ,  H05K3/387 ,  H05K3/422 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/09581 ,  H05K2201/09827 ,  H05K2203/095 ,  H05K2203/1572 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165

    Abstract: A method for manufacturing a substrate with a metal film includes preparing an insulative substrate having the first surface and the second surface on the opposite side of the first surface, forming in the insulative substrate a penetrating hole having the inner wall tapering from the first surface of the insulative substrate toward the second surface, forming a layer of a composition containing a polymerization initiator and a polymerizable compound on the inner wall of the penetrating hole, irradiating the layer of the composition with energy such that a polymer is formed on the inner wall of the penetrating hole, applying a plating catalyst on the polymer, and forming a plated-metal film on the inner wall of the penetrating hole.

    Abstract translation: 一种用金属膜制造衬底的方法包括制备在第一表面的相对侧具有第一表面和第二表面的绝缘衬底，在绝缘衬底中形成具有从第一表面的第一表面逐渐变细的内壁的穿透孔 所述绝缘基板朝向所述第二表面，在所述穿透孔的内壁上形成含有聚合引发剂和可聚合化合物的组合物层，用能量照射所述组合物层，使得聚合物形成在所述聚合物的内壁上 穿孔，在聚合物上涂布电镀催化剂，在贯通孔的内壁上形成电镀金属膜。

    Disk drive suspension via formation using a tie layer and product
    98.
    发明授权
    Disk drive suspension via formation using a tie layer and product 有权
    通过使用连接层和产品的形成的磁盘驱动器悬架

    公开(公告)号：US07781679B1

    公开(公告)日：2010-08-24

    申请号：US11340298

    申请日：2006-01-26

    Applicant: Christopher Schreiber ,  Christopher Dunn

    Inventor： Christopher Schreiber ,  Christopher Dunn

    IPC: H05K1/00

    CPC classification number: H05K3/44 ,  H05K1/056 ,  H05K3/16 ,  H05K3/4076 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09827 ,  Y10T428/30 ,  Y10T428/31678

    Abstract: A disk drive suspension interconnect, and method therefor. The interconnect has a metal grounding layer, a metal conductive layer and an insulative layer between the metal grounding layer and the conductive metal layer. A circuit component such as a slider is electrically connected to the conductive layer along a grounding path from the circuit component and the conductive layer to the metal grounding layer through an aperture in the insulative layer. For improved electrical connection a tie layer is provided through the insulative layer onto the grounding layer in bonding relation with the ground layer. A conductor is deposited onto both the conductive metal layer and the tie layer in conductive metal layer and tie layer bonding relation, and the circuit component is thus bonded to the grounding layer by the conductor.

    Abstract translation: 磁盘驱动器悬挂互连及其方法。 互连在金属接地层和导电金属层之间具有金属接地层，金属导电层和绝缘层。 诸如滑块的电路部件沿着从电路部件和导电层到金属接地层的通过绝缘层的孔的接地路径电连接到导电层。 为了改善电连接，通过绝缘层将接合层提供到与接地层结合的接地层上。 导电体以导电金属层和连接层结合关系沉积在导电金属层和连接层两者上，并且电路部件因此被导体结合到接地层。

    PRINTED WIRING BOARD AND A METHOD OF PRODUCTION THEREOF
    100.
    发明申请
    PRINTED WIRING BOARD AND A METHOD OF PRODUCTION THEREOF 有权
    印刷电路板及其生产方法

    公开(公告)号：US20100089632A1

    公开(公告)日：2010-04-15

    申请号：US12641498

    申请日：2009-12-18

    Applicant: Tomoyuki Ikeda

    Inventor： Tomoyuki Ikeda

    IPC: H05K1/11

    CPC classification number: H05K3/0026 ,  C25D5/02 ,  H05K1/119 ,  H05K3/0032 ,  H05K3/0094 ,  H05K3/422 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2203/1572 ,  Y10T29/49124 ,  Y10T29/49126

    Abstract: A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a first conductor formed on the first surface of the insulating resin substrate, a second conductor formed on the second surface of the insulating resin substrate, and a through-hole conductor structure formed in the penetrating-hole of the insulating resin substrate and electrically connecting the first conductor and the second conductor. The penetrating-hole has a first portion having an opening on the first surface and a second portion having an opening on the second surface. The first portion and the second portion are connected such that the first portion and the second portion are set off from each other.

    Abstract translation: 印刷电路板具有具有第一表面和第二表面的绝缘树脂基板，所述绝缘树脂基板具有从所述第一表面到所述第二表面穿过所述绝缘树脂基板的一个或多个贯穿孔，形成在所述绝缘树脂基板上的第一导体 绝缘树脂基板的第一表面，形成在绝缘树脂基板的第二表面上的第二导体和形成在绝缘树脂基板的穿透孔中的通孔导体结构，并将第一导体和第二导体 。 所述贯穿孔具有在所述第一表面上具有开口的第一部分和在所述第二表面上具有开口的第二部分。 第一部分和第二部分被连接成使得第一部分和第二部分彼此脱离。

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