公开(公告)号：US07095054B2

公开(公告)日：2006-08-22

申请号：US10948898

申请日：2004-09-24

申请人： Joseph Fjelstad

发明人： Joseph Fjelstad

IPC分类号： H01L31/12

CPC分类号： H01L21/568 ,  H01L21/4832 ,  H01L21/56 ,  H01L21/561 ,  H01L24/32 ,  H01L24/73 ,  H01L24/97 ,  H01L31/0203 ,  H01L2221/68377 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48475 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： A microelectronic package includes a light sensitive microelectronic element having a front face including one or more contacts and a rear surface, and conductive leads having first ends connected to the one or more contacts and second ends connected to one or more conductive pads adjacent the light sensitive microelectronic element. The package also includes an at least partially transparent encapsulant covering the light sensitive microelectronic element, the conductive leads and the one or more conductive pads, whereby the one or more conductive pads are exposed on a surface of the encapsulant.

摘要翻译： 微电子封装包括具有包括一个或多个触点和后表面的前表面的光敏微电子元件，以及导电引线，其具有连接到一个或多个触点的第一端和连接到与光敏感相邻的一个或多个导电焊盘的第二端 微电子元件。 封装还包括覆盖光敏微电子元件，导电引线和一个或多个导电焊盘的至少部分透明的密封剂，由此一个或多个导电焊盘暴露在密封剂的表面上。

公开(公告)号：US07061121B2

公开(公告)日：2006-06-13

申请号：US10988160

申请日：2004-11-12

申请人： Belgacem Haba

发明人： Belgacem Haba

IPC分类号： H01L23/48

CPC分类号： H01L23/48 ,  H01L25/0652 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/4824 ,  H01L2225/06562 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/15311

摘要： A stacked microelectronic assembly includes a dielectric element and a first and second microelectronic element stacked one on top of the other with the first microelectronic element underlying at least a portion of the second microelectronic element. The first microelectronic element and the second microelectronic element have front surfaces on which exposed on a central region of the front surface are contacts. A spacer layer may be provided under a portion of the second microelectronic element opposite a portion of the second microelectronic element overlying the first microelectronic element. Additionally, a third microelectronic element may be substituted in for the spacer layer so that the first microelectronic element and the third microelectronic element are underlying opposing sides of the second microelectronic element.

公开(公告)号：US20060113645A1

公开(公告)日：2006-06-01

申请号：US11327057

申请日：2006-01-06

申请人： Michael Warner ,  Belgacem Haba ,  Masud Beroz

发明人： Michael Warner ,  Belgacem Haba ,  Masud Beroz

IPC分类号： H01L23/495

摘要： Inductors are provided in chip assemblies such as in packaged semiconductor chips. The inductors may be incorporated in a chip carrier which forms part of the package, and may include, for example, spiral or serpentine inductors formed from traces on the chip carrier. The chip carrier may include a flap bearing the inductive element, and this flap may be bent to tilt the inductive element out of the plane of the chip carrier to reduce electromagnetic interaction between the inductive element and surrounding electrical components. Other inductors include solenoids formed in part by leads on the chip carrier as, for example, by displacing leads out of the plane of the chip carrier to form loops in vertically-extensive planes transverse to the plane of the chip carrier. Additional features provide trimming of the inductor to a desired inductance value during by breaking or connecting leads during assembly.

公开(公告)号：US20060084250A1

公开(公告)日：2006-04-20

申请号：US11289743

申请日：2005-11-29

申请人： Joseph Fjelstad

发明人： Joseph Fjelstad

IPC分类号： H01L21/22

CPC分类号： H01L24/12 ,  H01L21/563 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/8319 ,  H01L2224/83856 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method of making a microelectronic assembly includes providing a first microelectronic element having a first surface and a plurality of contacts exposed at the first surface; providing a second microelectronic element having a top surface and a plurality of contacts exposed at the top surface, forming a plurality of conductive elastomeric posts that connect at least some of the contacts of the first microelectronic element to at least some of the contacts of the second microelectronic element, and injecting a compliant material between the first surface of the first microelectronic element and the top surface of the second microelectronic element to form a compliant layer.

摘要翻译： 制造微电子组件的方法包括提供第一微电子元件，其具有在第一表面处暴露的第一表面和多个触点; 提供第二微电子元件，其具有在顶表面处暴露的顶表面和多个触点，形成多个导电弹性体柱，其将第一微电子元件的至少一些触点连接到第二微电子元件的至少一些触点 微电子元件，以及在所述第一微电子元件的第一表面和所述第二微电子元件的顶表面之间注入柔性材料以形成柔顺层。

公开(公告)号：US20060040488A1

公开(公告)日：2006-02-23

申请号：US11257296

申请日：2005-10-24

申请人： Joseph Fjelstad

发明人： Joseph Fjelstad

IPC分类号： H01L21/44

CPC分类号： H01L23/49811 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/72 ,  H01L2224/11 ,  H01L2224/11003 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/351 ,  Y10T29/49126 ,  H01L2224/29099 ,  H01L2924/00

摘要： A method of electrically connecting a microelectronic component having a first surface bearing a plurality of contacts. The method including the steps of forming a subassembly by juxtaposing a connection component having a support structure and a plurality of elongated posts extending substantially parallel to one another from a first surface of the support structure with the microelectronic component so that the support structure overlies the surface of the component with the posts extending away from the component and electrically connecting the posts to the contacts of the microelectronic component.

公开(公告)号：US20060033216A1

公开(公告)日：2006-02-16

申请号：US11252305

申请日：2005-10-17

申请人： L. Pflughaupt ,  David Gibson ,  Young-Gon Kim ,  Craig Mitchell ,  Wael Zohni ,  Ilyas Mohammed

发明人： L. Pflughaupt ,  David Gibson ,  Young-Gon Kim ,  Craig Mitchell ,  Wael Zohni ,  Ilyas Mohammed

IPC分类号： H01L23/52

CPC分类号： H01L23/528 ,  H01L23/50 ,  H01L23/66 ,  H01L24/10 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/06505 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/14 ,  H01L2224/1403 ,  H01L2224/14505 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/78301 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/023 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/00014

摘要： A stacked chip assembly includes individual units having chips mounted on dielectric layers and traces on the dielectric layers interconnecting the contacts of the chips with terminals disposed in peripheral regions of the dielectric layers. At least some of the traces are multi-branched traces which connect chip select contacts to chip select terminals. The units are stacked one above the other with corresponding terminals of the different units being connected to one another by solder balls or other conductive elements so as to form vertical buses. Prior to stacking, the multi-branched traces of the individual units are selectively connected, as by forming solder bridges, so as to leave chip select contacts of chips in different units connected to different chip select terminals and thereby connect these chips to different vertical buses. The individual units desirably are thin and directly abut one another so as to provide a low-height assembly with good heat transfer from chips within the stack.

摘要翻译： 堆叠式芯片组件包括具有安装在电介质层上的芯片的单独单元和在将芯片的触点与布置在电介质层的周边区域中的端子互连的电介质层上的迹线。 至少一些迹线是将分片选择触点连接到芯片选择端子的多分支迹线。 这些单元彼此堆叠，不同单元的相应端子通过焊球或其它导电元件彼此连接，以形成垂直总线。 在堆叠之前，通过形成焊接桥，各个单元的多分支迹线被选择性地连接，以便在连接到不同的芯片选择端子的不同单元中留下芯片的芯片选择触点，从而将这些芯片连接到不同的垂直总线 。 各个单元期望地是薄的并且直接地彼此邻接，以便提供具有来自堆叠内的芯片的良好热传递的低高度组件。

公开(公告)号：US20060030140A1

公开(公告)日：2006-02-09

申请号：US11211308

申请日：2005-08-25

申请人： Mitchell Koblis

发明人： Mitchell Koblis

IPC分类号： H01L21/44

CPC分类号： H05K3/243 ,  H01L21/4853 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H05K3/064 ,  H05K2201/0338 ,  H05K2203/0505

摘要： A microelectronic component having a plurality of leads are formed at their tip end with bondable material using a process including a mask of positive photoresist material. The leads can be rendered peelable from the substrate by, for example, plasma undercutting the leads. The tip ends of the leads can be bonded to contacts on an opposing microelectronic component, and separated therefrom in horizontal direction by virtue of the peelable leads to form S-shaped leads. The space between the microelectronic components can be filled with a compliant layer to form a microelectronic package.

公开(公告)号：US06978538B2

公开(公告)日：2005-12-27

申请号：US10658941

申请日：2003-09-10

申请人： Thomas H. DiStefano ,  Joseph Fjelstad

发明人： Thomas H. DiStefano ,  Joseph Fjelstad

IPC分类号： H01L23/498 ,  H01L23/538 ,  H01R12/51 ,  H05K1/03 ,  H05K1/11 ,  H05K3/46 ,  H05K3/36

CPC分类号： H05K3/462 ,  H01L23/49827 ,  H01L23/5385 ,  H01L2924/0002 ,  H01R12/523 ,  H01R12/714 ,  H01R13/2414 ,  H01R43/0256 ,  H05K1/0272 ,  H05K1/036 ,  H05K1/056 ,  H05K1/116 ,  H05K3/0032 ,  H05K3/326 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0195 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0554 ,  H05K2203/0582 ,  H05K2203/135 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1744 ,  H01L2924/00

摘要： A microelectronic interposer is made by providing a sacrificial layer over the surface of a planar body. Apertures are formed passing through the body and the sacrificial layer. A layer of an electrically conductive structural material is deposited in each of the apertures and over the sacrificial layer, proximate to each aperture to thereby form contacts. The sacrificial layer is removed leaving the contacts with outwardly flaring peripheral portions spaced vertically above the surface of the planar body.

摘要翻译： 通过在平面体的表面上设置牺牲层来制造微电子插入器。 形成穿过身体和牺牲层的孔。 一层导电结构材料沉积在每个孔中并在牺牲层上方，靠近每个孔，从而形成接触。 去除牺牲层，留下接触件，其外部扩张的外围部分在平面体的表面上方垂直地间隔开。

公开(公告)号：US20050272182A1

公开(公告)日：2005-12-08

申请号：US11197247

申请日：2005-08-04

申请人： John Smith

发明人： John Smith

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/60 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538

CPC分类号： H01L24/73 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/25 ,  H01L24/48 ,  H01L24/49 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/49112 ,  H01L2224/73227 ,  H01L2224/73267 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19107 ,  Y10T29/49121 ,  H01L2224/82 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of making a microelectronic package includes providing a first substrate having a top surface, providing a second substrate having a top surface including a plurality of conductive pads, a bottom surface remote therefrom and an opening extending between the top and bottom surfaces, and securing the second substrate over the first substrate so that the bottom surface of the second substrate confronts the top surface of the first substrate, wherein the first and second substrates have coefficients of thermal expansion that are substantially similar to one another. The method also includes placing a microelectronic element having a front face with contacts and a back face remote therefrom in the opening of the second substrate and securing the microelectronic element over the first substrate so that the back face of the microelectronic element confronts the top surface of the first substrate, and electrically interconnecting the contacts of the microelectronic element with the conductive pads of the second substrate.

摘要翻译： 制造微电子封装的方法包括提供具有顶表面的第一衬底，提供第二衬底，其具有包括多个导电焊盘的顶表面，远离其的底表面和在顶表面和底表面之间延伸的开口，并且固定 所述第二基板在所述第一基板上方，使得所述第二基板的底表面面对所述第一基板的顶表面，其中所述第一和第二基板具有基本上彼此相似的热膨胀系数。 该方法还包括将具有触点的前表面和远离其的背面的微电子元件放置在第二基板的开口中，并将微电子元件固定在第一基板上，使得微电子元件的背面面对 并且将微电子元件的触点与第二基板的导电焊盘电连接。

公开(公告)号：US20050243529A1

公开(公告)日：2005-11-03

申请号：US11111145

申请日：2005-04-21

申请人： Masud Beroz ,  Jae Park ,  Belgacem Haba ,  Fion Tan ,  Philip Osborn

发明人： Masud Beroz ,  Jae Park ,  Belgacem Haba ,  Fion Tan ,  Philip Osborn

IPC分类号： H01L21/60 ,  H01L23/13 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01R9/00 ,  H01R12/04 ,  H05K1/11

CPC分类号： H01L23/13 ,  H01L23/3114 ,  H01L23/4951 ,  H01L23/4952 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/05647 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/4824 ,  H01L2224/48463 ,  H01L2224/48471 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2924/00

摘要： A connection component for a semiconductor chip includes a substrate having a gap over which extends a plurality of parallel spaced apart leads. The ends of the leads are adhered to the substrate either by being bonded to contacts or being embedded in the substrate. The connection component can be formed, in one embodiment, by stitch bonding wire leads across the gap. In another embodiment, a prefabricated lead assembly supporting spaced apart parallel leads is juxtaposed and transferred to the substrate. The connection component is juxtaposed overlying a semiconductor chip whereby leads extending over the gap may have one end detached and bonded to an underlying chip contact.

摘要翻译： 用于半导体芯片的连接部件包括具有间隙的基板，多个平行间隔开的​​引线延伸。 引线的端部通过结合到触点或嵌入基板中而粘附到基板上。 在一个实施例中，连接部件可以通过将导线穿过间隙缝合而形成。 在另一个实施例中，支撑间隔开的平行引线的预制引线组件并置并转移到衬底。 连接部件并置在半导体芯片上，由此在间隙上延伸的引线可以具有一端分离并结合到下面的芯片触点。