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公开(公告)号：US08604347B2
公开(公告)日：2013-12-10
申请号：US13075895
申请日：2011-03-30
Applicant: Hiroshi Kobayashi , Satoshi Emoto , Masayuki Kitajima , Toru Okada
Inventor： Hiroshi Kobayashi , Satoshi Emoto , Masayuki Kitajima , Toru Okada
CPC classification number: H05K3/3436 , H01L23/562 , H01L2224/16225 , H01L2924/19105 , H05K1/0271 , H05K2201/10674 , H05K2201/10734 , H05K2201/2009 , Y02P70/613
Abstract: Disclosed is a board reinforcing structure for reinforcing a circuit board in which an electronic component is mounted on a first surface, the electronic component having an electrode arranged in a rectangular-shaped region on the first surface. The board reinforcing structure includes a reinforcing member bonded to positions corresponding to corner parts of four corners of the rectangular-shaped region on a second surface provided on a side opposite to the first surface of the circuit board. In the board reinforcing structure, corresponding one of notches is formed in the reinforcing member at a position corresponding to one of the corner parts of the four corners of the rectangular-shaped region, and at least two apexes of the reinforcing member directed to an outside are formed to shape a contour thereof with the one of the notches.
Abstract translation: 公开了一种用于加强其中电子部件安装在第一表面上的电路板的电路板加强结构，该电子部件具有布置在第一表面上的矩形区域中的电极。 板加强结构包括加强构件，该加强构件在设置在与电路板的第一表面相对的一侧上的第二表面上接合到与矩形区域的四个角的角部相对应的位置。 在板加强结构中，在加强构件中，在与矩形区域的四个角的一个角部相对应的位置处形成相应的一个切口，并且加强构件的至少两个顶点指向外部 形成为与其中一个凹口成形其轮廓。
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公开(公告)号：US20120248616A1
公开(公告)日：2012-10-04
申请号：US13361344
申请日：2012-01-30
Applicant: Masayuki KITAJIMA , Takatoyo Yamakami , Takashi Kubota , Kuniko Ishikawa
Inventor： Masayuki KITAJIMA , Takatoyo Yamakami , Takashi Kubota , Kuniko Ishikawa
CPC classification number: H05K3/3442 , B23K1/0016 , B23K1/206 , B23K35/0244 , B23K35/025 , B23K35/0255 , B23K35/262 , B23K35/302 , B23K35/3613 , B23K2101/42 , C22C13/00 , H01L2924/0002 , H05K3/284 , H05K3/3484 , H05K2201/0323 , H05K2201/10977 , H05K2203/1476 , Y02P70/613 , H01L2924/00
Abstract: To provide an electronic component, containing: a wiring board containing electrode pads; a component including a plurality of electrodes, the component being mounted on the wiring board; a sealing resin covering the component; and a plurality of terminals configured to connect a wiring provided within the wiring board to an external substrate, wherein the plurality of electrodes and the electrode pads are connected with solder, and wherein a first resin layer and a second resin layer are provided between the solder and the sealing resin in this order from the side of the solder, where the first resin layer has a first Young's modulus and the second resin layer has a second Young's modulus larger than the first Young's modulus.
Abstract translation: 提供一种电子部件，其包含：包含电极焊盘的布线板; 包括多个电极的部件，所述部件安装在所述布线板上; 覆盖该部件的密封树脂; 以及多个端子，其被配置为将布线板内设置的布线与外部基板连接，其中所述多个电极和所述电极焊盘与焊料连接，并且其中在所述焊料之间设置有第一树脂层和第二树脂层 和密封树脂，其中第一树脂层具有第一杨氏模量，第二树脂层的第二杨氏模量大于第一杨氏模量。
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13.发明申请公开(公告)号：US20110303449A1
公开(公告)日：2011-12-15
申请号：US13044876
申请日：2011-03-10
Applicant: Hiroshi KOBAYASHI , Toru OKADA , Satoshi EMOTO , Masayuki KITAJIMA
Inventor： Hiroshi KOBAYASHI , Toru OKADA , Satoshi EMOTO , Masayuki KITAJIMA
CPC classification number: H05K3/3436 , H01L2224/16225 , H05K2201/09063 , H05K2201/10393 , H05K2201/10734 , Y02P70/613 , Y10T29/4913
Abstract: A packaging structure for mounting an electronic component on a printed circuit board is provided, which includes an external connecting terminal of the electronic component connected to an electrode pad of the printed circuit board; a through-hole penetrating through the printed circuit board, the through-hole formed in a periphery of an electronic component mounting area; and a clamping member including a middle portion extending through the through-hole, and a first end portion and a second end portion extending from the middle portion. The first end portion and the second end portion are bent such that the electronic component and the printed circuit board are sandwiched and clamped by the first end portion and the second end portion.
Abstract translation: 提供了一种用于将电子部件安装在印刷电路板上的封装结构，其包括连接到印刷电路板的电极焊盘的电子部件的外部连接端子; 穿过印刷电路板的通孔，形成在电子部件安装区域的周边的通孔; 以及夹持构件，其包括延伸穿过所述通孔的中间部分，以及从所述中间部分延伸的第一端部部分和第二端部部分。 第一端部和第二端部弯曲，使得电子部件和印刷电路板被第一端部和第二端部夹持并夹持。
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14.发明申请公开(公告)号：US20110165319A1
公开(公告)日：2011-07-07
申请号：US12974558
申请日：2010-12-21
Applicant: Masayuki KITAJIMA , Yutaka NODA , Hidehiko KOBAYASHI , Toshihiro KUSAGAYA , Kazuhiro MIZUKAMI
Inventor： Masayuki KITAJIMA , Yutaka NODA , Hidehiko KOBAYASHI , Toshihiro KUSAGAYA , Kazuhiro MIZUKAMI
CPC classification number: B23K1/20 , B23K1/0016 , B23K2101/38 , H01L2924/0002 , H05K3/3426 , H05K3/3447 , H05K2201/2081 , H01L2924/00
Abstract: An apparatus for forming a solder dam on a lead of an electronic component is disclosed. The apparatus for forming a solder dam includes a wire material that transfers an ink that prevents adhesion of a solder to the lead; a wire material conveying device that conveys the wire material along a surface of the lead; and an ink supply device that supplies the ink to the wire material.
Abstract translation: 公开了一种用于在电子部件的引线上形成焊料坝的装置。 用于形成焊料坝的装置包括：转移墨水的线材，其防止焊料粘附到引线上; 线材输送装置，其沿导线的表面输送线材; 以及将墨水供给到线材的供墨装置。
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公开(公告)号：US20090236934A1
公开(公告)日：2009-09-24
申请号：US12410131
申请日：2009-03-24
Applicant: Shunichi AIKAWA , Masayuki Kitajima , Keiji Tsuda
Inventor： Shunichi AIKAWA , Masayuki Kitajima , Keiji Tsuda
CPC classification number: H03H3/02 , H03H9/02929 , H03H9/02937 , H03H9/02992 , Y10T29/42
Abstract: A surface acoustic wave device includes a piezoelectric substrate, an interdigital transducer (IDT) formed on the piezoelectric substrate, an interconnection electrode that is provided on the piezoelectric substrate and is connected to the IDT, the IDT being made of a metal identical to that of the IDT, an inorganic insulation layer that is provided on the piezoelectric substrate so that at least the interconnection electrode is exposed, an insulative resin layer that is located on an interface between the inorganic insulation layer and a portion of the interconnection electrode exposed from the inorganic insulation layer and is formed so as to cover a side surface of the interconnection electrode, and a metal layer that is provided on the interconnection electrode and the insulative resin layer.
Abstract translation: 表面声波装置包括压电基板，形成在压电基板上的叉指式换能器（IDT），配置在压电基板上并与IDT连接的互连电极，IDT由与IDT相同的金属制成 IDT是设置在压电基板上至少使互连电极露出的无机绝缘层，位于无机绝缘层与互连电极的从无机物露出的部分的界面上的绝缘性树脂层 形成为覆盖互连电极的侧面的金属层和设置在配线电极和绝缘性树脂层上的金属层。
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Patent Agency Ranking
公开(公告)号：US20080125662A1
公开(公告)日：2008-05-29
申请号：US11987173
申请日：2007-11-28
Applicant: Shunichi Aikawa , Takumi Kooriike , Jyouji Kimura , Keiji Tsuda , Masayuki Kitajima , Kazunori Inoue , Takashi Matsuda
Inventor： Shunichi Aikawa , Takumi Kooriike , Jyouji Kimura , Keiji Tsuda , Masayuki Kitajima , Kazunori Inoue , Takashi Matsuda
CPC classification number: H03H3/08 , Y10T29/42 , Y10T29/49005 , Y10T29/49007 , Y10T29/4908
Abstract: A method of manufacturing an acoustic wave device includes forming a first sealing portion on a substrate having an acoustic wave element thereon so that a functional region, in which an acoustic wave oscillates, of the acoustic wave element acts as a first non-covered portion and a cutting region for individuating acts as a second non-covered portion, forming a second sealing portion on the first sealing portion so as to cover the first non-covered portion and the second non-covered portion, and cutting off the substrate and the second sealing portion so that the second non-covered portion is divided.
Abstract translation: 一种制造声波器件的方法包括在其上具有声波元件的衬底上形成第一密封部分，使得声波元件的声波振荡的功能区域用作第一非覆盖部分， 用于个体化作为第二非覆盖部分的切割区域，在所述第一密封部分上形成第二密封部分以覆盖所述第一非覆盖部分和所述第二未覆盖部分，并且切断所述基板，并且所述第二密封部分 密封部分，使得第二未覆盖部分被分割。
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公开(公告)号：US06541898B2
公开(公告)日：2003-04-01
申请号：US09822636
申请日：2001-03-30
Applicant: Masayuki Kitajima , Yutaka Noda , Seiichi Shimoura , Toru Okada , Masanao Fujii , Kenji Iketaki , Hidehiko Kobayashi , Masakazu Takesue , Keiichi Yamamoto , Hisao Tanaka
Inventor： Masayuki Kitajima , Yutaka Noda , Seiichi Shimoura , Toru Okada , Masanao Fujii , Kenji Iketaki , Hidehiko Kobayashi , Masakazu Takesue , Keiichi Yamamoto , Hisao Tanaka
IPC: H01L41047
CPC classification number: H01L41/29 , G11B5/5552 , G11B5/5556 , H01L41/0993 , H01L2224/48091 , H01L2224/73265 , H01L2924/01327 , Y10T29/42 , H01L2924/00014 , H01L2924/00
Abstract: A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.
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18.发明申请ELECTROCONDUCTIVE BONDING MATERIAL, METHOD FOR BONDING CONDUCTOR, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 失效电磁接合材料，接合导体的方法和制造半导体器件的方法公开(公告)号：US20120211549A1
公开(公告)日：2012-08-23
申请号：US13367509
申请日：2012-02-07
Applicant: Takatoyo YAMAKAMI , Takashi KUBOTA , Kuniko ISHIKAWA , Masayuki KITAJIMA
Inventor： Takatoyo YAMAKAMI , Takashi KUBOTA , Kuniko ISHIKAWA , Masayuki KITAJIMA
CPC classification number: H01L24/13 , B22F1/0014 , B22F1/025 , B23K35/262 , B23K35/30 , B23K35/3006 , B23K35/3013 , B23K35/302 , C22C9/00 , C23C24/106 , H01L23/49811 , H01L23/49883 , H01L24/11 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05671 , H01L2224/0568 , H01L2224/05686 , H01L2224/1131 , H01L2224/1132 , H01L2224/11502 , H01L2224/13017 , H01L2224/13144 , H01L2224/13599 , H01L2224/13609 , H01L2224/13611 , H01L2224/13613 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13709 , H01L2224/13711 , H01L2224/13713 , H01L2224/13809 , H01L2224/13811 , H01L2224/13813 , H01L2224/13839 , H01L2224/13844 , H01L2224/13847 , H01L2224/13899 , H01L2224/13913 , H01L2224/13939 , H01L2224/13944 , H01L2224/13947 , H01L2224/16058 , H01L2224/16148 , H01L2224/16225 , H01L2224/16507 , H01L2224/32225 , H01L2224/73204 , H01L2224/81024 , H01L2224/81055 , H01L2224/81075 , H01L2224/81191 , H01L2224/81193 , H01L2224/812 , H01L2224/8121 , H01L2224/8123 , H01L2224/81509 , H01L2224/81511 , H01L2224/81513 , H01L2224/81639 , H01L2224/81644 , H01L2224/81647 , H01L2224/81699 , H01L2224/81711 , H01L2224/81713 , H01L2224/81739 , H01L2224/81744 , H01L2224/8181 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/13091 , H01L2924/15738 , H01L2924/15788 , H01L2924/1579 , H01L2924/01007 , H01L2924/01008 , H01L2924/01018 , H01L2924/01083 , H01L2924/01031 , H01L2924/0103 , H01L2924/053 , H01L2224/13099 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
Abstract: An electro-conductive bonding material includes: metal components of a high-melting-point metal particle that have a first melting point or higher; a middle-melting-point metal particle that has a second melting point which is first temperature or higher, and second temperature or lower, the second temperature is lower than the first melting point and higher than the first temperature; and a low-melting-point metal particle that has a third melting point or lower, the third melting point is lower than the first temperature.
Abstract translation: 导电接合材料包括：具有第一熔点或更高熔点的高熔点金属颗粒的金属组分; 中间熔点金属粒子，其具有第一温度以上的第二熔点，第二温度以下，第二温度低于第一熔点且高于第一温度; 和具有第三熔点或更低熔点的低熔点金属颗粒，第三熔点低于第一温度。
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19.发明申请MOUNTING STRUCTURE, ELECTRONIC COMPONENT, CIRCUIT BOARD, BOARD ASSEMBLY, ELECTRONIC DEVICE, AND STRESS RELAXATION MEMBER 审中-公开安装结构，电子元件，电路板，板组件，电子设备和应力松弛元件公开(公告)号：US20110303450A1
公开(公告)日：2011-12-15
申请号：US13071641
申请日：2011-03-25
Applicant: Toru OKADA , Hiroshi KOBAYASHI , Satoshi EMOTO , Masayuki KITAJIMA
Inventor： Toru OKADA , Hiroshi KOBAYASHI , Satoshi EMOTO , Masayuki KITAJIMA
CPC classification number: H05K3/3436 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L23/562 , H01L24/05 , H01L24/13 , H01L24/16 , H01L2224/0401 , H01L2224/05647 , H01L2224/05655 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2924/3512 , H05K1/0271 , H05K1/111 , H05K1/113 , H05K2201/09436 , H05K2201/10378 , H05K2201/10674 , H05K2201/10734 , Y02P70/611 , Y02P70/613 , H01L2924/014
Abstract: Disclosed is a mounting structure for mounting an electronic component on a circuit board. The mounting structure includes an interposer provided between the electronic component and the circuit board; and a plurality of spiral conductors formed in the interposer. The plurality of spiral conductors have one end thereof bonded to corresponding one of external connection terminals of the electronic component and the other end thereof bonded to corresponding one of electrodes of the electronic component.
Abstract translation: 公开了一种用于将电子部件安装在电路板上的安装结构。 安装结构包括设置在电子部件和电路板之间的插入器; 以及形成在插入件中的多个螺旋形导体。 多个螺旋导体的一端接合到电子部件的对应的一个外部连接端子，另一端接合到电子部件的对应的一个电极。
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公开(公告)号：US20110303441A1
公开(公告)日：2011-12-15
申请号：US13075895
申请日：2011-03-30
Applicant: Hiroshi KOBAYASHI , Satoshi EMOTO , Masayuki KITAJIMA , Toru OKADA
Inventor： Hiroshi KOBAYASHI , Satoshi EMOTO , Masayuki KITAJIMA , Toru OKADA
IPC: H05K1/03
CPC classification number: H05K3/3436 , H01L23/562 , H01L2224/16225 , H01L2924/19105 , H05K1/0271 , H05K2201/10674 , H05K2201/10734 , H05K2201/2009 , Y02P70/613
Abstract: Disclosed is a board reinforcing structure for reinforcing a circuit board in which an electronic component is mounted on a first surface, the electronic component having an electrode arranged in a rectangular-shaped region on the first surface. The board reinforcing structure includes a reinforcing member bonded to positions corresponding to corner parts of four corners of the rectangular-shaped region on a second surface provided on a side opposite to the first surface of the circuit board. In the board reinforcing structure, corresponding one of notches is formed in the reinforcing member at a position corresponding to one of the corner parts of the four corners of the rectangular-shaped region, and at least two apexes of the reinforcing member directed to an outside are formed to shape a contour thereof with the one of the notches.
Abstract translation: 公开了一种用于加强其中电子部件安装在第一表面上的电路板的电路板加强结构，该电子部件具有布置在第一表面上的矩形区域中的电极。 板加强结构包括加强构件，该加强构件在设置在与电路板的第一表面相对的一侧上的第二表面上接合到与矩形区域的四个角的角部相对应的位置。 在板加强结构中，在加强构件中，在与矩形区域的四个角的一个角部相对应的位置处形成相应的一个切口，并且加强构件的至少两个顶点指向外部 形成为与其中一个凹口成形其轮廓。
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