公开(公告)号：US20090032293A1

公开(公告)日：2009-02-05

申请号：US11886722

申请日：2006-03-22

申请人： Hidenori Miyakawa ,  Shigeaki Sakatani ,  Kumiko Sugiyama ,  Takayuki Higuchi ,  Atsushi Yamaguchi

发明人： Hidenori Miyakawa ,  Shigeaki Sakatani ,  Kumiko Sugiyama ,  Takayuki Higuchi ,  Atsushi Yamaguchi

IPC分类号： H05K1/09 ,  H01B1/22 ,  B05D5/12

CPC分类号： H05K1/095 ,  C08G59/66 ,  C08G59/687 ,  C08K5/37 ,  C09J163/00 ,  H01B1/22 ,  H05K3/321 ,  H05K3/4069 ,  H05K2201/0224 ,  H05K2203/122

摘要： A conductive bonding material having an improved preservation stability, and hardens when desired, preferably immediately hardens at a low temperature is provided. In one invention, the conductive bonding material comprises a conductive particle ingredient, an epoxy resin ingredient, and a hardening agent ingredient for said epoxy resin and the hardening agent ingredient for said epoxy resin further comprise a reforming agent having a thiol group. In another invention, a conductive bonding material comprising an epoxy resin hardening ingredient, wherein said epoxy resin hardening ingredient contains a sulfur-containing compound having an end group which can coordinate with a surface of the metallic particles, and the sulfur-containing compound comes to perform as a hardening agent for the epoxy resin by dissociating from the surface of the metallic particles. The conductive bonding material may contain fragrance.

摘要翻译： 提供具有改善的保存稳定性并且当需要时硬化的导电粘合材料优选在低温下立即硬化。 在一个发明中，导电接合材料包括导电颗粒成分，环氧树脂成分和用于所述环氧树脂的硬化剂成分和用于所述环氧树脂的硬化剂成分，还包含具有硫醇基的重整剂。 在另一发明中，包含环氧树脂硬化成分的导电性接合材料，其中所述环氧树脂硬化成分含有具有可与金属粒子表面配位的端基的含硫化合物，含硫化合物进入 通过从金属颗粒的表面离解，作为环氧树脂的硬化剂。 导电接合材料可能含有香料。

公开(公告)号：US08410377B2

公开(公告)日：2013-04-02

申请号：US12260219

申请日：2008-10-29

申请人： Atsushi Yamaguchi ,  Hidenori Miyakawa ,  Shigeaki Sakatani ,  Koso Matsuno

发明人： Atsushi Yamaguchi ,  Hidenori Miyakawa ,  Shigeaki Sakatani ,  Koso Matsuno

IPC分类号： H01L23/28

CPC分类号： H05K3/3484 ,  B23K35/264 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K3/284 ,  H05K3/321 ,  H05K3/3463 ,  H01L2924/3512 ,  H01L2924/00

摘要： A plurality of semiconductor elements is adjacently mounted on a substrate by a solder with a melting point of 200° C. or lower, an electronic part other than the semiconductor elements is mounted on the substrate between the adjacently mounted semiconductor elements by a solder with a melting point of 200° C. or lower, and spaces between the plurality of semiconductor elements and the substrate, spaces between the electronic part and the substrate, and spaces between the plurality of semiconductor elements and the electronic part are integrally molded with a molding resin.

摘要翻译： 多个半导体元件通过熔点为200℃以下的焊料相邻地安装在基板上，除了半导体元件之外的电子部件通过焊料与相邻安装的半导体元件之间的基板安装在基板上 熔点为200℃以下，多个半导体元件与基板之间的空间，电子部件与基板之间的空间以及多个半导体元件与电子部件之间的空间与成形树脂一体成型 。

公开(公告)号：US20100224398A1

公开(公告)日：2010-09-09

申请号：US12738430

申请日：2008-10-16

申请人： Koso Matsuno ,  Atsushi Yamaguchi ,  Shigeaki Sakatani ,  Hidenori Miyakawa ,  Mikiya Ueda

发明人： Koso Matsuno ,  Atsushi Yamaguchi ,  Shigeaki Sakatani ,  Hidenori Miyakawa ,  Mikiya Ueda

IPC分类号： H05K1/18

CPC分类号： H01L21/563 ,  H01L23/13 ,  H01L23/3121 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/83102 ,  H01L2224/83855 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/15311 ,  H01L2924/15313 ,  H05K1/0224 ,  H05K3/28 ,  H05K3/3452 ,  H05K2201/0969 ,  H05K2201/0989 ,  H05K2201/10977

摘要： In order to easily inject underfill resin and perform molding with reliability, groove sections are formed on a surface of a circuit board such that the ends of the groove sections extend to semiconductor elements. Low-viscosity underfill resin applied dropwise is guided by the groove sections and flows between the circuit board and the semiconductor elements. The underfill resin hardly expands to regions outside the semiconductor elements.

摘要翻译： 为了容易地注入底部填充树脂并且可靠地进行模制，在电路板的表面上形成槽部，使得槽部的端部延伸到半导体元件。 滴下的低粘度底部填充树脂由槽部引导，在电路基板与半导体元件之间流动。 底部填充树脂几乎不扩展到半导体元件外部的区域。

公开(公告)号：US07935892B2

公开(公告)日：2011-05-03

申请号：US11909886

申请日：2006-04-14

申请人： Kazuhiro Nishikawa ,  Hidenori Miyakawa ,  Norihito Tsukahara ,  Shigeaki Sakatani

发明人： Kazuhiro Nishikawa ,  Hidenori Miyakawa ,  Norihito Tsukahara ,  Shigeaki Sakatani

IPC分类号： H05K1/16

CPC分类号： H01L24/29 ,  C09J9/02 ,  H01L21/6835 ,  H01L24/83 ,  H01L24/95 ,  H01L2221/68354 ,  H01L2224/2919 ,  H01L2224/29499 ,  H01L2224/83101 ,  H01L2224/83136 ,  H01L2224/83192 ,  H01L2224/83859 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K3/284 ,  H05K3/323 ,  H05K2201/0108 ,  H05K2201/0281 ,  H05K2201/0373 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/1476 ,  Y02P70/611 ,  Y10T29/49147 ,  Y10T428/24372 ,  Y10T428/254 ,  H01L2924/00

摘要： Circuit board having conductor wiring and connection terminal; anisotropic conductive resin layer provided on one surface of circuit board; and plurality of electronic components respectively provided with electrode terminals in positions facing the connection terminal are included. The anisotropic conductive resin layer includes at least one kind of conductive particles selected from coiled conductive particles, fiber fluff conductive particles and conductive particles provided with a plurality of conductive protrusions, and resin binder; electrically couples electrode terminals of plurality of electronic components to connection terminals to each other with conductive particles; mechanically fixes electronic components and circuit board to each other; and protects conductor wiring.

摘要翻译： 具有导线和连接端子的电路板; 设置在电路板的一个表面上的各向异性导电树脂层; 并且包括分别在面向连接端子的位置设置有电极端子的多个电子部件。 各向异性导电性树脂层包括选自线圈状导电性粒子，纤维绒毛状导电性粒子和设置有多个导电性突起的导电性粒子和树脂粘合剂中的至少一种导电性粒子， 将多个电子部件的电极端子与导电颗粒彼此连接到连接端子; 将电子元件和电路板彼此机械固定; 并保护导线。

公开(公告)号：US20090133900A1

公开(公告)日：2009-05-28

申请号：US11909886

申请日：2006-04-14

申请人： Kazuhiro Nishikawa ,  Hidenori Miyakawa ,  Norihito Tsukahara ,  Shigeaki Sakatani

发明人： Kazuhiro Nishikawa ,  Hidenori Miyakawa ,  Norihito Tsukahara ,  Shigeaki Sakatani

IPC分类号： H05K1/02 ,  H01R9/00

CPC分类号： H01L24/29 ,  C09J9/02 ,  H01L21/6835 ,  H01L24/83 ,  H01L24/95 ,  H01L2221/68354 ,  H01L2224/2919 ,  H01L2224/29499 ,  H01L2224/83101 ,  H01L2224/83136 ,  H01L2224/83192 ,  H01L2224/83859 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K3/284 ,  H05K3/323 ,  H05K2201/0108 ,  H05K2201/0281 ,  H05K2201/0373 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/1476 ,  Y02P70/611 ,  Y10T29/49147 ,  Y10T428/24372 ,  Y10T428/254 ,  H01L2924/00

摘要： Circuit board having conductor wiring and connection terminal; anisotropic conductive resin layer provided on one surface of circuit board; and plurality of electronic components respectively provided with electrode terminals in positions facing the connection terminal are included. The anisotropic conductive resin layer includes at least one kind of conductive particles selected from coiled conductive particles, fiber fluff conductive particles and conductive particles provided with a plurality of conductive protrusions, and resin binder; electrically couples electrode terminals of plurality of electronic components to connection terminals to each other with conductive particles; mechanically fixes electronic components and circuit board to each other; and protects conductor wiring.

摘要翻译： 具有导线和连接端子的电路板; 设置在电路板的一个表面上的各向异性导电树脂层; 并且包括分别在面向连接端子的位置设置有电极端子的多个电子部件。 各向异性导电性树脂层包括选自线圈状导电性粒子，纤维绒毛状导电性粒子和设置有多个导电性突起的导电性粒子和树脂粘合剂中的至少一种导电性粒子， 将多个电子部件的电极端子与导电颗粒彼此连接到连接端子; 将电子元件和电路板彼此机械固定; 并保护导线。

公开(公告)号：US08138426B2

公开(公告)日：2012-03-20

申请号：US12261368

申请日：2008-10-30

申请人： Koso Matsuno ,  Hidenori Miyakawa ,  Shigeaki Sakatani

发明人： Koso Matsuno ,  Hidenori Miyakawa ,  Shigeaki Sakatani

IPC分类号： H05K1/11

CPC分类号： H05K3/3436 ,  H01L24/16 ,  H01L2224/10175 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/30105 ,  H05K1/111 ,  H05K3/3452 ,  H05K3/3489 ,  H05K2201/09036 ,  H05K2201/09781 ,  H05K2201/09809 ,  H05K2201/0989 ,  H05K2201/10977 ,  Y02P70/611 ,  Y02P70/613

摘要： A mounting structure is provided that can suppress flux from spreading, secure a connecting strength between a circuit board and an electronic component with underfill, and achieve a stable electrical connection between lands and terminals. The mounting structure is configured with a flat electronic component and a circuit board, and a plurality of lands provided on the undersurface of the electronic component and a plurality of terminals provided on the mounting surface of the circuit board so as to correspond to the plurality of lands are bonded with solder. The circuit board includes a means for holding flux separated from the solder in the proximity of at least one of the plurality of terminals.

摘要翻译： 提供了一种可以抑制磁通扩散的安装结构，通过底部填充确保电路板和电子部件之间的连接强度，并实现焊盘和端子之间的稳定的电连接。 安装结构具有扁平的电子部件和电路板，以及设置在电子部件的下表面上的多个焊盘以及设置在电路基板的安装面上的多个端子，以对应于多个 焊盘用焊料粘合。 电路板包括用于保持在焊料分离的焊剂在至少一个端子附近的装置。

公开(公告)号：US20110284278A1

公开(公告)日：2011-11-24

申请号：US13110136

申请日：2011-05-18

申请人： Kiyohiro Hine ,  Shigeaki Sakatani ,  Akio Furusawa

发明人： Kiyohiro Hine ,  Shigeaki Sakatani ,  Akio Furusawa

IPC分类号： H05K1/18

CPC分类号： H05K1/111 ,  H05K3/3442 ,  H05K3/3484 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09663 ,  H05K2201/09745 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

摘要： A mounting structure includes an insulating substrate having a substrate electrode on which at least one electrode notch is provided and a resist, an electronic component having an electronic component electrode to be electrically connected to the substrate electrode, and solder paste printed on a surface of the substrate electrode. The substrate electrode has a following relation, 0

摘要翻译： 安装结构包括绝缘基板，其具有设置有至少一个电极切口的基板电极和抗蚀剂，具有电连接到基板电极的电子部件电极的电子部件和印刷在基板电极的表面上的焊膏 基板电极。 基板电极具有以下关系：0

公开(公告)号：US20130241069A1

公开(公告)日：2013-09-19

申请号：US13823463

申请日：2011-10-17

申请人： Taichi Nakamura ,  Akio Furusawa ,  Shigeaki Sakatani ,  Hidetoshi Kitaura ,  Yukihiro Ishimaru

发明人： Taichi Nakamura ,  Akio Furusawa ,  Shigeaki Sakatani ,  Hidetoshi Kitaura ,  Yukihiro Ishimaru

IPC分类号： H01L23/00

CPC分类号： H01L24/30 ,  B22F2999/00 ,  B23K1/0016 ,  B23K35/0238 ,  B23K35/26 ,  B23K35/262 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K2101/40 ,  B32B15/018 ,  C22C1/0483 ,  C22C5/02 ,  C22C5/06 ,  C22C9/00 ,  C22C9/02 ,  C22C13/00 ,  H01L21/563 ,  H01L23/4827 ,  H01L23/562 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/05147 ,  H01L2224/05639 ,  H01L2224/05647 ,  H01L2224/2733 ,  H01L2224/29 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/32245 ,  H01L2224/32503 ,  H01L2224/32507 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/83065 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/8381 ,  H01L2224/83815 ,  H01L2924/00015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/00014 ,  B22F1/0003 ,  H01L2924/0105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/01028 ,  H01L2224/45099

摘要： A bonding structure body in which a semiconductor element and an electrode are bonded via a solder material, wherein a part that allows bonding has a first intermetallic compound layer that has been formed on the electrode side, a second intermetallic compound layer that has been formed on the semiconductor element side, and a third layer that is constituted by a phase containing Sn and a sticks-like intermetallic compound part, which is sandwiched between the two layers of the first intermetallic compound layer and the second intermetallic compound layer, and the sticks-like intermetallic compound part is interlayer-bonded to both of the first intermetallic compound layer and the second intermetallic compound layer.

摘要翻译： 一种接合结构体，其中半导体元件和电极通过焊料材料接合，其中允许接合的部分具有形成在电极侧的第一金属间化合物层，形成在第二金属间化合物层上的第二金属间化合物层 半导体元件侧和由夹在第一金属间化合物层和第二金属间化合物层的两层之间的含有Sn和棒状金属间化合物部分的相位构成的第三层， 类似金属间化合物部分被层间接合到第一金属间化合物层和第二金属间化合物层上。

公开(公告)号：US08421246B2

公开(公告)日：2013-04-16

申请号：US12864826

申请日：2009-05-22

申请人： Akio Furusawa ,  Shigeaki Sakatani ,  Taichi Nakamura ,  Takahiro Matsuo

发明人： Akio Furusawa ,  Shigeaki Sakatani ,  Taichi Nakamura ,  Takahiro Matsuo

IPC分类号： H01L29/43

CPC分类号： B23K1/0016 ,  B23K35/0233 ,  B23K35/0238 ,  B23K35/264 ,  B23K2101/40 ,  C22C12/00 ,  C22C19/03 ,  H01L23/488 ,  H01L23/49503 ,  H01L23/49513 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/29101 ,  H01L2224/29113 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48699 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/838 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10162 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00012

摘要： A joint structure joins an electronic element 12 included in an electronic component to an electrode 14 included in that electronic component. The joint structure includes a solder layer, which contains 0.2 to 6% by weight of copper, 0.02 to 0.2% by weight of germanium and 93.8 to 99.78% by weight of bismuth, a nickel layer provided between the solder layer and the electrode, and a barrier layer provided between the nickel layer and the solder layer. Here, the barrier layer is formed so as to have an average thickness of from 0.5 to 4.5 μm after the electronic element and the electrode are joined by the solder layer.

摘要翻译： 接合结构将包括在电子部件中的电子元件12与包括在该电子部件中的电极14连接。 接头结构包括焊料层，其含有0.2〜6重量％的铜，0.02〜0.2重量％的锗和93.8〜99.78重量％的铋，设置在焊料层和电极之间的镍层，以及 设置在镍层和焊料层之间的阻挡层。 这里，在电子元件和电极通过焊料层接合之后，阻挡层形成为具有0.5至4.5μm的平均厚度。

公开(公告)号：US20100148367A1

公开(公告)日：2010-06-17

申请号：US12711628

申请日：2010-02-24

申请人： Takahiro MATSUO ,  Akio Furusawa ,  Shigeaki Sakatani

发明人： Takahiro MATSUO ,  Akio Furusawa ,  Shigeaki Sakatani

IPC分类号： H01L23/488 ,  H01L21/603

CPC分类号： C22C1/002 ,  H01L23/49513 ,  H01L23/49562 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/05554 ,  H01L2224/0558 ,  H01L2224/05639 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48247 ,  H01L2224/48739 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2224/85439 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01022 ,  H01L2924/00012

摘要： A semiconductor device includes a die pad having a surface on which a first solder bonding layer is formed, and made of metal; and a semiconductor element fixed on the first solder bonding layer on the die pad by a solder material made mostly of bismuth. The first solder bonding layer is made of a softer material than the solder material, a recess is formed in a part of the first solder bonding layer by pressing the solder material against the first solder bonding layer, and the solder material partially fills the recess.

摘要翻译： 半导体器件包括具有表面的芯片焊盘，其上形成有第一焊料接合层，并由金属制成; 以及半导体元件，其通过主要由铋制成的焊料固定在芯片焊盘上的第一焊料接合层上。 第一焊料接合层由比焊料材料更软的材料制成，通过将焊料材料压靠在第一焊料接合层上而在第一焊料接合层的一部分中形成凹部，并且焊料材料部分地填充凹部。