公开(公告)号：US06996902B2

公开(公告)日：2006-02-14

申请号：US10389515

申请日：2003-03-14

申请人： Takeshi Suzuki ,  Toshihiro Nishii ,  Satoru Tomekawa ,  Fumio Echigo

发明人： Takeshi Suzuki ,  Toshihiro Nishii ,  Satoru Tomekawa ,  Fumio Echigo

IPC分类号： H01K3/10

CPC分类号： H05K3/4069 ,  H05K1/0366 ,  H05K1/115 ,  H05K3/0032 ,  H05K3/0047 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0287 ,  H05K2201/029 ,  H05K2201/0355 ,  H05K2201/094 ,  H05K2203/1461 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24322 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/249953

摘要： A circuit board includes an electrical insulator layer formed of a reinforcer sheet with density distribution in its in-plane direction, an electrical conductor filled in a plurality of inner via holes provided in the electrical insulator layer in its thickness direction, and a wiring layer connected to the electrical conductor. The inner via holes provided in a high-density portion of the reinforcer sheet are formed to have a smaller cross-section than the inner via holes provided in a low-density portion of the reinforcer sheet. In this manner, it is possible to provide a circuit board that can achieve a high-density wiring and an inner via connection resistance with less variation, when a base material including a reinforcer sheet with density distribution in its in-plane direction such as a glass-epoxy base material is used for an insulator layer.

摘要翻译： 电路板包括由其面内方向具有密度分布的增强片形成的电绝缘体层，填充在电绝缘体层的厚度方向上的多个内部通孔中的电导体和连接到电绝缘体层的布线层 到电导体。 设置在加强片的高密度部分中的内通孔形成为具有比设置在加强片的低密度部分中的内通孔更小的横截面。 以这种方式，可以提供一种电路板，其可以实现高密度布线和具有较小变化的内部通孔连接电阻，当包括在其面内方向上具有密度分布的增强片的基底材料 玻璃 - 环氧树脂基材用于绝缘体层。

公开(公告)号：US20050281555A1

公开(公告)日：2005-12-22

申请号：US11149291

申请日：2005-06-10

申请人： Yoshihiro Tomita ,  Yasushi Nakagiri ,  Tsuguhiro Korenaga ,  Kunio Hibino ,  Seiji Karashima ,  Satoru Tomekawa

发明人： Yoshihiro Tomita ,  Yasushi Nakagiri ,  Tsuguhiro Korenaga ,  Kunio Hibino ,  Seiji Karashima ,  Satoru Tomekawa

IPC分类号： G06F1/16 ,  G06F1/32 ,  H04B1/40 ,  H04J14/00 ,  H04M1/02 ,  H04M1/73

CPC分类号： G06F1/1616 ,  G06F1/1684 ,  G06F1/1698 ,  G06F1/3203 ,  G09G5/006 ,  G09G2330/021 ,  G09G2370/18 ,  G09G2370/20 ,  H04M1/0216 ,  H04W52/0229 ,  Y02D70/00

摘要： Based on information indicating the signal transmission amount between the first and second circuit blocks, a switching device switches an optical signal communication form which uses a first and second optical signal transmitting/receiving devices and an electric signal communication form which uses a first and second electric signal transmitting/receiving devices. Thereby, in a portable information terminal apparatus with a separate main body operation unit and a separate screen display unit, power consumed by the optical signal communication can be suppressed.

摘要翻译： 基于指示第一和第二电路块之间的信号传输量的信息，切换设备切换使用第一和第二光信号发送/接收设备的光信号通信形式，以及使用第一和第二电 信号发射/接收装置。 因此，在具有单独的主体操作单元和单独的屏幕显示单元的便携式信息终端设备中，可以抑制由光信号通信消耗的功率。

公开(公告)号：US06930395B2

公开(公告)日：2005-08-16

申请号：US09998327

申请日：2001-12-03

申请人： Satoru Tomekawa ,  Yoshihisa Yamashita ,  Takeshi Suzuki ,  Yoshihiro Kawakita ,  Tadashi Nakamura

发明人： Satoru Tomekawa ,  Yoshihisa Yamashita ,  Takeshi Suzuki ,  Yoshihiro Kawakita ,  Tadashi Nakamura

IPC分类号： H05K1/02 ,  H05K3/00 ,  H05K3/20 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K3/4069 ,  H05K1/0271 ,  H05K3/0035 ,  H05K3/20 ,  H05K3/384 ,  H05K3/386 ,  H05K3/4614 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0355 ,  H05K2201/09109 ,  H05K2203/0361 ,  H05K2203/1461 ,  Y10T428/24

摘要： A connecting strength at a bonding site between a wiring layer 1c and a conductor 1d is enhanced by comparing a bonding strength between a wiring layer 14 provided by covering the conductor 1d on an insulating base 1a and the conductor 1d with a bonding strength between the wiring layer 1c and the insulating base 1a in an adjacency of the conductor to set the latter relatively lower.

摘要翻译： 通过将在绝缘基体1a上覆盖导体1d的导体层14与导体1d之间的接合强度与导体1d之间的接合强度进行比较来提高布线层1c和导体1d之间的接合位置的连接强度 在布线层1c和绝缘基底1a之间的接合强度在导体的邻近处，以使后者相对较低。

公开(公告)号：US20050014035A1

公开(公告)日：2005-01-20

申请号：US10890329

申请日：2004-07-12

申请人： Yasushi Nakagiri ,  Shinobu Masuda ,  Shozo Ochi ,  Satoru Tomekawa

发明人： Yasushi Nakagiri ,  Shinobu Masuda ,  Shozo Ochi ,  Satoru Tomekawa

IPC分类号： C08J5/04 ,  D04H1/42 ,  D04H13/00 ,  H05K1/03 ,  H05K3/40 ,  H05K3/46 ,  C04B35/64 ,  B28B1/00 ,  B28B3/00 ,  B28B5/00 ,  B32B3/00 ,  B32B5/02 ,  B32B9/00 ,  C04B33/32 ,  C04B33/36 ,  D04H1/00 ,  D04H3/00 ,  D04H5/00 ,  H01R12/04 ,  H05K1/11

CPC分类号： H05K1/0366 ,  C08J5/046 ,  D04H1/4318 ,  D04H1/64 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/015 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T442/20

摘要： A prepreg for a printed wiring board includes fluorocarbon fibers as a reinforcing material, and the reinforcing material is impregnated with a resin. The fluorocarbon fibers include short fibers having a branch structure. The reinforcing material includes a nonwoven fabric formed by interlacing the fluorocarbon fibers in the thickness direction. The proportion of the fluorocarbon fibers among the fibers constituting the nonwoven fabric ranges from 50 wt % to 100 wt %, and the remaining fibers are synthetic fibers or inorganic fibers. The nonwoven fabric is heat-treated at 330° C. to 390° C., then annealed at 200° C. to 270° C., and impregnated with the resin. This prepreg can used to provide a printed wiring board with low Interstitial Via Hole connection resistance and high connection stability and a method for manufacturing the printed wiring board.

摘要翻译： 用于印刷线路板的预浸料包括作为增强材料的氟碳纤维，并且增强材料用树脂浸渍。 氟碳纤维包括具有分支结构的短纤维。 增强材料包括通过使碳氟化合物纤维沿厚度方向交织而形成的无纺布。 构成无纺布的纤维中的氟碳纤维的比例为50重量％〜100重量％，剩余的纤维为合成纤维或无机纤维。 无纺布在330℃至390℃下热处理，然后在200℃下退火至270℃，并用树脂浸渍。 该预浸料可用于提供具有低间隙通孔连接电阻和高连接稳定性的印刷线路板以及印刷线路板的制造方法。

公开(公告)号：US06686029B2

公开(公告)日：2004-02-03

申请号：US10373520

申请日：2003-02-24

申请人： Takeshi Suzuki ,  Toshihiro Nishii ,  Satoru Tomekawa ,  Fumio Echigo

发明人： Takeshi Suzuki ,  Toshihiro Nishii ,  Satoru Tomekawa ,  Fumio Echigo

IPC分类号： B32B300

CPC分类号： H05K3/4069 ,  H05K1/0366 ,  H05K1/115 ,  H05K3/0032 ,  H05K3/0047 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0287 ,  H05K2201/029 ,  H05K2201/0355 ,  H05K2201/094 ,  H05K2203/1461 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24322 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/249953

摘要： A circuit board includes an electrical insulator layer formed of a reinforcer sheet with density distribution in its in-plane direction, an electrical conductor filled in a plurality of inner via holes provided in the electrical insulator layer in its thickness direction, and a wiring layer connected to the electrical conductor. The inner via holes provided in a high-density portion of the reinforcer sheet are formed to have a smaller cross-section than the inner via holes provided in a low-density portion of the reinforcer sheet. In this manner, it is possible to provide a circuit board that can achieve a high-density wiring and an inner via connection resistance with less variation, when a base material including a reinforcer sheet with density distribution in its in-plane direction such as a glass-epoxy base material is used for an insulator layer.

摘要翻译： 电路板包括由其面内方向具有密度分布的增强片形成的电绝缘体层，填充在电绝缘体层的厚度方向上的多个内部通孔中的电导体和连接到电绝缘体层的布线层 到电导体。 设置在加强片的高密度部分中的内通孔形成为具有比设置在加强片的低密度部分中的内通孔更小的横截面。 以这种方式，可以提供一种电路板，其可以实现高密度布线和具有较小变化的内部通孔连接电阻，当包括在其面内方向上具有密度分布的增强片的基底材料 玻璃 - 环氧树脂基材用于绝缘体层。

公开(公告)号：US06518514B2

公开(公告)日：2003-02-11

申请号：US09928869

申请日：2001-08-13

申请人： Takeshi Suzuki ,  Tatsuo Ogawa ,  Yoshihiro Bessho ,  Satoru Tomekawa ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Susumu Matsuoka ,  Daizo Andoh ,  Fumio Echigo

发明人： Takeshi Suzuki ,  Tatsuo Ogawa ,  Yoshihiro Bessho ,  Satoru Tomekawa ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Susumu Matsuoka ,  Daizo Andoh ,  Fumio Echigo

IPC分类号： H01R1204

CPC分类号： H05K1/0373 ,  H05K1/036 ,  H05K3/20 ,  H05K3/202 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2203/1461 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

摘要： A circuit board is configured so as to include not less than two wiring layers, an insulator layer for electric insulation between the wiring layers, and an inner-via-hole conductive member provided in the insulator layer in a thickness direction of the insulator layer, for electric connection between the wiring layers. The insulator layer is made of a composite material containing an organic resin and a material having a smaller thermal expansion coefficient than that of the organic resin, and includes a surface part, a core part, and a surface part laminated in the stated order, the surface part having a high content of the organic resin, the core part having a low content of the organic resin. The wiring layers have a land portion that is connected with the inner-via-hole conductive member, the land portion being embedded so as to be substantially in contact with the core part, and the inner-via-hole conductive member has a thickness substantially equal to a thickness of the core part. According to this configuration, a part of the metal foil is embedded in the insulator layer so as to be in contact with the core layer. Therefore, this makes it possible to provide a circuit board in which portions of the conductive material can be selectively compressed, and which hence is capable of ensuring stable connection between layers.

公开(公告)号：US20110290549A1

公开(公告)日：2011-12-01

申请号：US13145271

申请日：2011-02-22

申请人： Shogo Hirai ,  Hiroyuki Ishitomi ,  Tsuyoshi Himori ,  Satoru Tomekawa ,  Yutaka Nakayama

发明人： Shogo Hirai ,  Hiroyuki Ishitomi ,  Tsuyoshi Himori ,  Satoru Tomekawa ,  Yutaka Nakayama

IPC分类号： H05K1/11 ,  H01K3/10

CPC分类号： H05K3/4069 ,  H05K3/4652 ,  H05K2201/0272 ,  H05K2201/0355 ,  H05K2203/0425

摘要： A wiring board includes a plurality of wirings laid via an insulating resin layer, and a via-hole conductor provided for electrically connecting the wirings. The via-hole conductor includes metal and resin portions. The metal portion includes a region made of copper particles, a first metal region mainly composed of tin, a tin-copper alloy, or a tin-copper intermetallic compound, and a second metal region mainly composed of bismuth, and has Cu/Sn of from 1.59 to 21.43. The copper particles are in contact with one another, thereby electrically connecting the wirings, and at least part of the first metal region covers around and extends over the portions where the copper particles are in plane contact with one another.

摘要翻译： 布线板包括通过绝缘树脂层铺设的多条布线，以及用于电连接布线的通孔导体。 通孔导体包括金属和树脂部分。 金属部分包括由铜颗粒制成的区域，主要由锡，锡 - 铜合金或锡 - 铜金属间化合物构成的第一金属区域和主要由铋组成的第二金属区域，并且具有Cu / Sn 从1.59到21.43。 铜颗粒彼此接触，从而电连接布线，并且第一金属区域的至少一部分围绕并延伸到铜颗粒彼此平面接触的部分上。

公开(公告)号：US07799607B2

公开(公告)日：2010-09-21

申请号：US11661821

申请日：2005-08-30

申请人： Seiji Karashima ,  Yoshihisa Yamashita ,  Satoru Tomekawa ,  Takashi Kitae ,  Seiichi Nakatani

发明人： Seiji Karashima ,  Yoshihisa Yamashita ,  Satoru Tomekawa ,  Takashi Kitae ,  Seiichi Nakatani

IPC分类号： H01L21/44

CPC分类号： H05K3/3484 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/1152 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/83874 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/1579 ,  H05K3/323 ,  H05K2201/10977 ,  H05K2203/0278 ,  H05K2203/043 ,  H05K2203/083 ,  H05K2203/087 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2924/00014

摘要： A process for forming bumps wherein a plurality of fine bumps are uniformly formed with high productivity. In this process, a resin (13) including solder powder and a convection additive (12) is supplied onto a substrate (10) having a plurality of electrodes (11) thereon. And subsequently the substrate (10) is heated to a temperature that enables the solder powder to melt while keeping a flat plate (14) in contact with a surface of the supplied resin (13). During this heating step, the molten solder powder is allowed to self-assemble onto the electrodes (11) so that a plurality of solder balls, resulting from the grown molten solder powder, are concurrently formed on the electrodes (11) in self-alignment manner. Finally, the flat plate (14) is moved away from the surface of the supplied resin (13), and then the resin (13) is removed to provide a substrate (10) having bumps (16) formed on the plurality of the electrodes.

摘要翻译： 一种用于形成凸块的方法，其中以高生产率均匀地形成多个细小凸块。 在该工序中，将具有焊料粉末和对流添加剂（12）的树脂（13）供给到其上具有多个电极（11）的基板（10）上。 然后将衬底（10）加热到使焊料粉末熔化同时保持平板（14）与所供应的树脂（13）的表面接触的温度。 在该加热步骤期间，允许熔融焊料粉末自组装在电极（11）上，使得由生长的熔融焊料粉末产生的多个焊球同时以自对准的方式形成在电极（11）上 方式。 最后，将平板（14）从所提供的树脂（13）的表面移开，然后除去树脂（13），以提供在多个电极上形成有凸点（16）的基板（10） 。

公开(公告)号：US07773386B2

公开(公告)日：2010-08-10

申请号：US11976848

申请日：2007-10-29

申请人： Yoshihisa Yamashita ,  Toshio Fujii ,  Seiichi Nakatani ,  Takashi Ichiryu ,  Satoru Tomekawa ,  Hiroki Yabe

发明人： Yoshihisa Yamashita ,  Toshio Fujii ,  Seiichi Nakatani ,  Takashi Ichiryu ,  Satoru Tomekawa ,  Hiroki Yabe

IPC分类号： H05K1/00

CPC分类号： H05K3/386 ,  H01L51/424 ,  H01L2924/0002 ,  H05K1/16 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0191 ,  H05K2201/0376 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49165 ,  H01L2924/00

摘要： A flexible substrate includes: (i) a film; (ii) an insulating resin layer formed on each of a front face of the film and a rear face of the film, which rear face is opposite to the front face; (iii) a front-sided wiring pattern embedded in the insulating resin layer formed on the front face of the film, and a rear-sided wiring pattern embedded in the insulating resin layer formed on the rear face of the film; and (iv) a via which is located between the front-sided wiring pattern and the rear-sided wiring pattern and serves to electrically interconnect the front-sided wiring pattern and the rear-sided wiring pattern, wherein the insulating resin layer formed on each of the front face and the rear face of the film is thicker than the film.

摘要翻译： 柔性基板包括：（i）膜; （ii）形成在所述膜的前表面和所述膜的后表面中的每一个上的绝缘树脂层，所述后表面与所述前表面相对; （iii）嵌入到形成在所述膜前表面上的所述绝缘树脂层中的正面布线图案和嵌入在所述膜背面形成的所述绝缘树脂层中的背面布线图案; 以及（iv）位于前侧布线图案和背面布线图案之间的通孔，用于将前侧布线图案和背面布线图案电连接，其中形成在每个布线图案上的绝缘树脂层 的膜的前表面和后表面比膜厚。

公开(公告)号：US20090049687A1

公开(公告)日：2009-02-26

申请号：US11886533

申请日：2006-03-17

申请人： Tsukasa Shiraishi ,  Yukihiro Ishimaru ,  Shinobu Masuda ,  Satoru Tomekawa

发明人： Tsukasa Shiraishi ,  Yukihiro Ishimaru ,  Shinobu Masuda ,  Satoru Tomekawa

IPC分类号： H05K3/34

CPC分类号： H01L24/81 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75822 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/83886 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/3436 ,  H05K2203/0195 ,  H05K2203/048 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49139 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/49149 ,  H01L2924/00 ,  H01L2224/05599

摘要： [Problem] To improve productivity and reliability in mounting an electronic component.[Means for Solving Problems] At least one of an electrode terminal of an electronic component and a connecting terminal of a wiring substrate is provided with solder beforehand, one of the wiring substrate and the electronic component is secured, and the electrode terminal of the electronic component and the connecting terminal of the wiring substrate are made to abut each other in a state where one of the wiring substrate and the electronic component, whichever is not secured, is held. Then, the electronic component is heated so that the solder is melted, and the solder is solidified while the electronic component is held, so that the electrode terminal and the connecting terminal are bonded to each other by means of the solder. Further, while an interval formed between the wiring substrate and the electronic component by the melted solder is being held, the electrode terminal and the connecting terminal are finely moved relative to each other with reference to a surface of the wiring substrate in an XYθ direction.

摘要翻译： [问题]提高安装电子元件的生产力和可靠性。 解决问题的手段电子部件的电极端子和布线基板的连接端子中的至少一个预先设置有焊料，布线基板和电子部件中的一个被固定，电子端子 使布线基板的连接端子与布线基板和电子部件中的一方（以未固定的方式）保持的状态相互抵接。 然后，电子部件被加热使得焊料熔化，并且在保持电子部件的同时使焊料​​固化，使得电极端子和连接端子通过焊料彼此接合。 此外，在通过熔化的焊料在布线基板和电子部件之间形成的间隔被保持的同时，电极端子和连接端子相对于布线基板的表面在XYθ方向上相对于彼此微细移动。