公开(公告)号：US20170034916A1

公开(公告)日：2017-02-02

申请号：US15180854

申请日：2016-06-13

Applicant: ROHM CO., LTD.

Inventor： Mamoru YAMAGAMI ,  Yasuhiro FUWA ,  Hideaki YANAGIDA ,  Takafumi OKADA

IPC: H05K1/18 ,  H05K3/00 ,  H05K3/46 ,  H05K1/02 ,  H05K3/30

Abstract: A multi-chip module includes a plurality of chip parts with each chip part having an electrode, a sealing resin for sealing the plurality of chip parts, and an external connection terminal secured to the sealing resin so as to be exposed from the outer surface of the sealing resin and electrically connected to the electrode of at least one of the chip parts.

Abstract translation: 多芯片模块包括多个芯片部件，每个芯片部分具有电极，用于密封多个芯片部件的密封树脂，以及固定到密封树脂的外部连接端子，以从外部表面露出 密封树脂并且电连接到至少一个芯片部分的电极。

公开(公告)号：US20150091164A1

公开(公告)日：2015-04-02

申请号：US14503148

申请日：2014-09-30

Applicant: ROHM CO., LTD.

Inventor： Mamoru YAMAGAMI ,  Kenji FUJII

IPC: H01L23/31 ,  H01L23/492 ,  H01L23/00 ,  H01L23/29

CPC classification number: H01L24/49 ,  H01L23/3107 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/525 ,  H01L23/53223 ,  H01L23/53238 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/36 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/02375 ,  H01L2224/0346 ,  H01L2224/0347 ,  H01L2224/0391 ,  H01L2224/03914 ,  H01L2224/0401 ,  H01L2224/04034 ,  H01L2224/04042 ,  H01L2224/05008 ,  H01L2224/05009 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05147 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05548 ,  H01L2224/05554 ,  H01L2224/05557 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/05583 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/08245 ,  H01L2224/13024 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13582 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2224/1411 ,  H01L2224/16245 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/40479 ,  H01L2224/40491 ,  H01L2224/40499 ,  H01L2224/40993 ,  H01L2224/4112 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48177 ,  H01L2224/48247 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/4912 ,  H01L2224/49177 ,  H01L2224/73221 ,  H01L2224/8485 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/20754 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/2075 ,  H01L2924/20757 ,  H01L2924/20756 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/20755 ,  H01L2924/014 ,  H01L2224/051

Abstract: An inventive semiconductor device includes: a semiconductor chip including an integrated circuit; a plurality of electrode pads provided on the semiconductor chip and connected to the integrated circuit; a rewiring to which the electrode pads are electrically connected together, the rewiring being exposed on an outermost surface of the semiconductor chip and having an exposed surface area greater than the total area of the electrode pads; and a resin package which seals the semiconductor chip.

Abstract translation: 本发明的半导体器件包括：包括集成电路的半导体芯片; 设置在半导体芯片上并连接到集成电路的多个电极焊盘; 重新布线，其中电极焊盘电连接在一起，重新布线暴露在半导体芯片的最外表面上，并具有大于电极焊盘总面积的暴露表面积; 以及密封半导体芯片的树脂封装。

公开(公告)号：US20220293496A1

公开(公告)日：2022-09-15

申请号：US17826975

申请日：2022-05-27

Applicant: ROHM CO., LTD.

Inventor： Mamoru YAMAGAMI

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/52 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31

Abstract: A semiconductor device includes a semiconductor chip, a plurality of leads that each includes a lead body portion which has a mounting portion which includes an upper surface whereon a semiconductor chip is bonded, and a lead connecting portion for external connection which projects downward from a lower surface of the lead body portion, a first sealing resin that seals a space that is defined by each lead body portion and each lead connecting portion of the plurality of leads in a region below the upper surface of each lead body portion of the plurality of leads, and a second sealing resin that seals the semiconductor chip in a region above the upper surface of each lead body portion of the plurality of leads.

公开(公告)号：US20200176428A1

公开(公告)日：2020-06-04

申请号：US16695549

申请日：2019-11-26

Applicant: ROHM CO., LTD.

Inventor： Isamu NISHIMURA ,  Mamoru YAMAGAMI

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L49/02

Abstract: A semiconductor device includes a substrate having a main surface, a plurality of first wirings, each having a first embedded part embedded in the substrate and exposed from the main surface, and a mounted part which is in contact with the main surface and is connected to the first embedded part, a semiconductor element having an element rear surface and a plurality of electrodes bonded to the mounted parts, a plurality of second wirings, each having a second embedded part embedded in the substrate and exposed from the main surface and a columnar part protruding from the second embedded part in the thickness direction, and being located outward from the semiconductor element as viewed in the thickness direction; and a passive element located on the side facing the main surface in the thickness direction more than the semiconductor element, and electrically connected to the plurality of second wirings.

公开(公告)号：US20180020549A1

公开(公告)日：2018-01-18

申请号：US15646086

申请日：2017-07-10

Applicant: ROHM CO., LTD.

Inventor： Motohiro TOYONAGA ,  Yasuhiro FUWA ,  Mamoru YAMAGAMI ,  Isamu NISHIMURA

IPC: H05K1/18 ,  H01L23/13 ,  H01L23/31 ,  H05K1/11 ,  H05K3/00 ,  H01L23/00 ,  H05K1/02 ,  H05K3/28 ,  H01L21/48 ,  H01L23/498

CPC classification number: H05K1/186 ,  H01L21/481 ,  H01L21/4853 ,  H01L21/561 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/562 ,  H01L24/16 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/97 ,  H01L2924/15153 ,  H01L2924/15156 ,  H05K1/0271 ,  H05K1/111 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/09018 ,  H05K2201/10636 ,  H05K2203/1316 ,  H01L2224/81 ,  H01L2924/014

Abstract: An electronic component includes a substrate including a first principal surface, a second principal surface positioned on a side opposite to the first principal surface, a first side surface that connects the first principal surface and the second principal surface and that extends along a first direction, a second side surface that connects the first principal surface and the second principal surface and that extends along a second direction intersecting the first direction, and a corner portion that connects the first side surface and the second side surface and that has a curved surface curved outwardly, and a chip arranged at the first principal surface of the substrate.

公开(公告)号：US20170236772A1

公开(公告)日：2017-08-17

申请号：US15428421

申请日：2017-02-09

Applicant: ROHM CO., LTD.

Inventor： Mamoru YAMAGAMI

IPC: H01L23/495 ,  H01L21/78 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L21/52

CPC classification number: H01L23/49513 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/52 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/3142 ,  H01L23/4951 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49582 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor device includes a semiconductor chip, a plurality of leads that each includes a lead body portion which has amounting portion which includes an upper surface whereon a semiconductor chip is bonded, and a lead connecting portion for external connection which projects downward from a lower surface of the lead body portion, a first sealing resin that seals a space that is defined by each lead body portion and each lead connecting portion of the plurality of leads in a region below the upper surface of each lead body portion of the plurality of leads, and a second sealing resin that seals the semiconductor chip in a region above the upper surface of each lead body portion of the plurality of leads.

公开(公告)号：US20170194234A1

公开(公告)日：2017-07-06

申请号：US15465427

申请日：2017-03-21

Applicant: ROHM CO., LTD.

Inventor： Kenji FUJII ,  Yasumasa KASUYA ,  Mamoru YAMAGAMI ,  Naoki KINOSHITA ,  Motoharu HAGA

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49527 ,  H01L23/291 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3142 ,  H01L23/3171 ,  H01L23/3675 ,  H01L23/4334 ,  H01L23/4822 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49568 ,  H01L23/49572 ,  H01L23/525 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/33 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/02311 ,  H01L2224/02331 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0346 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05084 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05181 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05583 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/1145 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/1161 ,  H01L2224/11825 ,  H01L2224/13008 ,  H01L2224/13011 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13024 ,  H01L2224/13147 ,  H01L2224/13561 ,  H01L2224/13582 ,  H01L2224/13624 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2224/13666 ,  H01L2224/16014 ,  H01L2224/16245 ,  H01L2224/16258 ,  H01L2224/17107 ,  H01L2224/29008 ,  H01L2224/29082 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29164 ,  H01L2224/29166 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/753 ,  H01L2224/75301 ,  H01L2224/75981 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81201 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/8146 ,  H01L2224/81464 ,  H01L2224/81466 ,  H01L2224/8183 ,  H01L2224/83191 ,  H01L2224/83201 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/8346 ,  H01L2224/83464 ,  H01L2224/83466 ,  H01L2224/8383 ,  H01L2224/92225 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/05042 ,  H01L2924/07025 ,  H01L2924/17724 ,  H01L2924/17747 ,  H01L2924/181 ,  H01L2924/182 ,  H01L2924/186 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/05166 ,  H01L2924/01028 ,  H01L2924/0665

Abstract: A semiconductor device has a semiconductor element provided with a functional surface on which a functional circuit is formed and with a back surface facing in the opposite direction to the functional surface, while also having a lead supporting the semiconductor element and electrically connected to the semiconductor element, and a resin package covering at least a portion of the semiconductor element and the lead. The semiconductor element has a functional surface side electrode formed on the functional surface and equipped with a functional surface side raised part that projects in the direction in which the functional surface faces. The functional surface side raised part of the functional surface side electrode is joined to the lead by solid state bonding.

公开(公告)号：US20160240450A1

公开(公告)日：2016-08-18

申请号：US15096792

申请日：2016-04-12

Applicant: ROHM CO., LTD.

Inventor： Kenji FUJII ,  Yasumasa KASUYA ,  Mamoru YAMAGAMI ,  Naoki KINOSHITA ,  Motoharu HAGA

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/00 ,  H01L23/367

CPC classification number: H01L23/49527 ,  H01L23/291 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3142 ,  H01L23/3171 ,  H01L23/3675 ,  H01L23/4334 ,  H01L23/4822 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49568 ,  H01L23/49572 ,  H01L23/525 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/33 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/02311 ,  H01L2224/02331 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0346 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05084 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05181 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05583 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/1145 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/1161 ,  H01L2224/11825 ,  H01L2224/13008 ,  H01L2224/13011 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13024 ,  H01L2224/13147 ,  H01L2224/13561 ,  H01L2224/13582 ,  H01L2224/13624 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2224/13666 ,  H01L2224/16014 ,  H01L2224/16245 ,  H01L2224/16258 ,  H01L2224/17107 ,  H01L2224/29008 ,  H01L2224/29082 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29164 ,  H01L2224/29166 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/753 ,  H01L2224/75301 ,  H01L2224/75981 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81201 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/8146 ,  H01L2224/81464 ,  H01L2224/81466 ,  H01L2224/8183 ,  H01L2224/83191 ,  H01L2224/83201 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/8346 ,  H01L2224/83464 ,  H01L2224/83466 ,  H01L2224/8383 ,  H01L2224/92225 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/05042 ,  H01L2924/07025 ,  H01L2924/17724 ,  H01L2924/17747 ,  H01L2924/181 ,  H01L2924/182 ,  H01L2924/186 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/05166 ,  H01L2924/01028 ,  H01L2924/0665

Abstract: A semiconductor device has a semiconductor element provided with a functional surface on which a functional circuit is formed and with a back surface facing in the opposite direction to the functional surface, while also having a lead supporting the semiconductor element and electrically connected to the semiconductor element, and a resin package covering at least a portion of the semiconductor element and the lead. The semiconductor element has a functional surface side electrode formed on the functional surface and equipped with a functional surface side raised part that projects in the direction in which the functional surface faces. The functional surface side raised part of the functional surface side electrode is joined to the lead by solid state bonding.

公开(公告)号：US20160211198A1

公开(公告)日：2016-07-21

申请号：US14993857

申请日：2016-01-12

Applicant: ROHM CO., LTD.

Inventor： Mamoru YAMAGAMI ,  Yasuhiro FUWA

IPC: H01L23/495 ,  H01L21/56 ,  H01L21/78 ,  H01L21/48

CPC classification number: H01L21/568 ,  H01L21/4825 ,  H01L21/561 ,  H01L21/78 ,  H01L23/4951 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49582 ,  H01L23/544 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/18 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The present invention provides a semiconductor device and a method for manufacturing a semiconductor device. The method comprises: Preparing a semiconductor chip 6 with a first electrode layer 21 formed on an element-forming surface 7. Prepared a support member 30 having a conductor 31 formed on a pattern-forming surface 33. The first electrode layer 21 is bonded to the conductor 31 by a solder, and thus the semiconductor chip 6 is fixed on the support member 30. While the semiconductor chip 6 is fixed on the support member 30, the semiconductor chip 6 is coated by the sealing resin 3 to form a sealing structure 46. By removing the support member 30 from the sealing structure 46, the conductor 31 formed on the support member 30 is transferred to the sealing structure 46. The conductor 31 transferred to the sealing structure 46 is an external electrode exposed from the sealing structure 46.

Abstract translation: 本发明提供半导体器件和半导体器件的制造方法。 该方法包括：准备具有形成在元件形成表面7上的第一电极层21的半导体芯片6.制备具有形成在图案形成表面33上的导体31的支撑构件30.第一电极层21与 导体31通过焊料，从而半导体芯片6固定在支撑构件30上。半导体芯片6固定在支撑构件30上时，半导体芯片6被密封树脂​​3涂覆以形成密封结构 通过从密封结构46移除支撑构件30，形成在支撑构件30上的导体31被传递到密封结构46.转移到密封结构46的导体31是从密封结构46暴露的外部电极 。

公开(公告)号：US20230207444A1

公开(公告)日：2023-06-29

申请号：US18171156

申请日：2023-02-17

Applicant: Rohm Co., Ltd.

Inventor： Yusuke HARADA ,  Mamoru YAMAGAMI

IPC: H01L23/498 ,  H01L21/56 ,  H01L21/48 ,  H01L23/31

CPC classification number: H01L23/49861 ,  H01L21/568 ,  H01L21/4857 ,  H01L23/3107

Abstract: A semiconductor device includes a semiconductor element, an internal electrode connected to the semiconductor element, a sealing resin covering the semiconductor element and a portion of the internal electrode, and an external electrode exposed from the sealing resin and connected to the internal electrode. The internal electrode includes a wiring layer and a columnar portion, where the wiring layer has a wiring layer front surface facing the back surface of the semiconductor element and a wiring layer back surface facing opposite from the wiring layer front surface in the thickness direction. The columnar portion protrudes in the thickness direction from the wiring layer front surface. The columnar portion has an exposed side surface facing in a direction perpendicular to the thickness direction. The external electrode includes a first cover portion covering the exposed side surface.