公开(公告)号：US20180151788A1

公开(公告)日：2018-05-31

申请号：US15826455

申请日：2017-11-29

Applicant: NICHIA CORPORATION

Inventor： Seiji NAGAHARA ,  Kazuma KOZURU

IPC: H01L33/62 ,  H05K1/02 ,  F21V19/00 ,  H05K1/18 ,  H01L25/075 ,  H01L33/32 ,  H01L33/40

CPC classification number: H01L33/62 ,  F21K9/238 ,  F21V19/0025 ,  F21V23/004 ,  F21Y2113/13 ,  F21Y2115/10 ,  H01L25/0655 ,  H01L25/0753 ,  H01L27/153 ,  H01L27/156 ,  H01L33/32 ,  H01L33/40 ,  H05K1/0296 ,  H05K1/11 ,  H05K1/181 ,  H05K3/222 ,  H05K2201/10106 ,  H05K2201/10287 ,  Y02P70/611

Abstract: A substrate for a light emitting device includes: a plurality of wiring patterns, each including: a first conductive pattern including: a light emitting element mounting region defined by a first, second, third, and fourth sides in a plan view, and a contact region; and a second conductive pattern surrounding a portion of the first side where the contact region is not present, an entirety of the second side, and a portion of or an entirety of the third side, wherein a first end portion of the second conductive pattern at the third side is positioned nearer to the fourth side than a second end portion of the second conductive pattern at the first side is to the fourth side. The third side of a second wiring pattern faces the first side of a first wiring pattern.

公开(公告)号：US09970597B2

公开(公告)日：2018-05-15

申请号：US14602989

申请日：2015-01-22

Applicant: OMRON Corporation

Inventor： Kensuke Nambu

IPC: F21K9/20 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34

CPC classification number: F21K9/20 ,  H05K1/114 ,  H05K1/189 ,  H05K3/3442 ,  H05K2201/09254 ,  H05K2201/10106 ,  H05K2201/10136 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10522 ,  H05K2203/046 ,  Y02P70/613

Abstract: A flexible printed circuit board on which a first electronic component and a second electronic component are to be mounted adjacent to each other has a first land for soldering a terminal of the first electronic component on a side adjacent to the second electronic component, and a second land for soldering a terminal of the second electronic component on a side adjacent to the first electronic component. The first land and the second land are connected by a wire extending outside of an inter-land region that is an approximately belt-shaped region formed by connecting end portions in a width direction or end portions in a thickness direction of the first land and the second land in a straight line.

公开(公告)号：US09966340B2

公开(公告)日：2018-05-08

申请号：US15319565

申请日：2016-02-16

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Bo Zhang ,  Wenbo Li

IPC: H01L23/06 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/5387 ,  G09F9/301 ,  H01L23/5386 ,  H01L23/562 ,  H01L25/0655 ,  H01L27/12 ,  H05K1/028 ,  H05K2201/09263 ,  H05K2201/10287

Abstract: The present invention provides a flexible substrate for packaging and a package. The flexible substrate for packaging includes a bendable region provided in a central region of the flexible substrate; chips provided at both sides of the bendable region and at both ends of the flexible substrate, respectively; and a wire provided to be connected between the chips and to pass through the bendable region. A portion of the wire corresponding to the bendable region is provided with an anti-stress structure, and the anti-stress structure is configured to release a tensile resistance and a compressive resistance when the bendable region is bent.

公开(公告)号：US09927379B2

公开(公告)日：2018-03-27

申请号：US14660328

申请日：2015-03-17

Applicant: Mettler-Toledo AG

Inventor： Paul Wettstein ,  Markus Bendler

IPC: G01N25/48 ,  H05K1/11 ,  G01K17/00 ,  H05K3/40

CPC classification number: G01N25/4833 ,  G01K17/00 ,  H05K1/11 ,  H05K3/4046 ,  H05K2201/10151 ,  H05K2201/10287 ,  Y10T29/4913

Abstract: A thermoanalytical sensor has a substrate, a measurement position, a temperature sensor unit, and an electrical contact pad. The temperature sensor unit senses the temperature at the measurement position. It is connected via the electrical contact pad to a metallic wire and thereby tied into an electronic circuit. The substrate is prepared with at least one measurement position, at least one temperature sensor unit and at least one electrical contact pad on a top side of the substrate. A passage in the substrate allows connection to the electrical contact pad. A metallic wire is inserted into the passage from the bottom side of the substrate and melted into a small ball on the upper end of the wire. A materially integral connection as a bonded joint between the upper end of the metallic wire and the electrical contact pad is made by applying pressure and heat to the metal ball.

公开(公告)号：US09849297B2

公开(公告)日：2017-12-26

申请号：US15356466

申请日：2016-11-18

Applicant: SECOND SIGHT MEDICAL PRODUCTS, INC.

Inventor： Robert J Greenberg ,  Neil Talbot ,  Jerry Ok ,  Jordan Neysmith ,  David Zhou

IPC: A61N1/36 ,  A61N1/375 ,  A61N1/05 ,  H05K1/11 ,  H01L23/498 ,  H05K1/18 ,  H01L23/00 ,  H05K3/32 ,  H05K3/34 ,  H05K3/18

CPC classification number: A61N1/3758 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/375 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/81 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13169 ,  H01L2224/13178 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81469 ,  H01L2224/81478 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1461 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/111 ,  H05K1/113 ,  H05K1/115 ,  H05K1/189 ,  H05K3/10 ,  H05K3/188 ,  H05K3/305 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/4038 ,  H05K3/4084 ,  H05K3/423 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4691 ,  H05K13/0469 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/05 ,  H05K2203/06 ,  H05K2203/0733 ,  H05K2203/09 ,  H05K2203/107 ,  H05K2203/1446 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a studbump connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

公开(公告)号：US20170285666A1

公开(公告)日：2017-10-05

申请号：US15462417

申请日：2017-03-17

Applicant: HORIBA STEC, Co., Ltd.

Inventor： Katsuya Ohtani

IPC: G05D7/06 ,  H01R12/71 ,  H05K1/14 ,  H01R12/75 ,  H05K5/00 ,  H05K1/18

CPC classification number: H05K1/141 ,  H01R12/712 ,  H01R12/716 ,  H01R12/732 ,  H01R23/68 ,  H05K1/117 ,  H05K1/14 ,  H05K1/142 ,  H05K1/145 ,  H05K1/181 ,  H05K3/368 ,  H05K2201/041 ,  H05K2201/043 ,  H05K2201/048 ,  H05K2201/049 ,  H05K2201/09072 ,  H05K2201/09181 ,  H05K2201/10189 ,  H05K2201/10287 ,  Y02P70/611

Abstract: A fluid control apparatus is provided which makes it possible to effortlessly perform cable connection even when a plurality of the fluid control apparatuses are disposed adjacent to each other. The fluid control apparatus includes fluid control units to control a flow rate or pressure of a fluid, an electric circuit board to send and receive a signal to and from the fluid control units, a casing to accommodate therein the fluid control units and the electric circuit board, and an apparatus-side connector interposed between the electric circuit board and a cable electrically connected thereto. The fluid control apparatus further includes a connector board configured to mount thereon the apparatus-side connector. The connector board is secured to the electric circuit board with at least a part of the connector board in surface contact with the electric circuit board, or overlapping the electric circuit board with a clearance therebetween.

公开(公告)号：US09699907B2

公开(公告)日：2017-07-04

申请号：US14813359

申请日：2015-07-30

Applicant: SK hynix Inc.

Inventor： Jung Tae Jeong

IPC: H05K7/10 ,  H05K9/00 ,  H05K1/18 ,  H05K3/34 ,  H01L23/498

CPC classification number: H05K1/181 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/73204 ,  H01L2924/15174 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K3/3436 ,  H05K2201/10287 ,  H05K2201/10719 ,  H05K2201/10727 ,  H05K2203/049 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A semiconductor package module may include a first substrate, and a second substrate disposed to face the first substrate. The semiconductor package module may include an interconnection member electrically connecting the first substrate to the second substrate and including a plurality of wires. Portions of the plurality of wires may be twisted and wound together and may be bent to extend in a predetermined direction.

公开(公告)号：US20170095671A1

公开(公告)日：2017-04-06

申请号：US15356466

申请日：2016-11-18

Applicant: SECOND SIGHT MEDICAL PRODUCTS, INC.

Inventor： Robert J. Greenberg ,  Neil Talbot ,  Jerry Ok ,  Jordan Neysmith ,  David Zhou

IPC: A61N1/375 ,  A61N1/36 ,  H05K1/11 ,  H05K3/18 ,  H05K1/18 ,  H01L23/00 ,  H05K3/32 ,  H05K3/34 ,  A61N1/05 ,  H01L23/498

CPC classification number: A61N1/3758 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/375 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/81 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13169 ,  H01L2224/13178 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81469 ,  H01L2224/81478 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1461 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/111 ,  H05K1/113 ,  H05K1/115 ,  H05K1/189 ,  H05K3/10 ,  H05K3/188 ,  H05K3/305 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/4038 ,  H05K3/4084 ,  H05K3/423 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4691 ,  H05K13/0469 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/05 ,  H05K2203/06 ,  H05K2203/0733 ,  H05K2203/09 ,  H05K2203/107 ,  H05K2203/1446 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a studbump connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

公开(公告)号：US09591758B2

公开(公告)日：2017-03-07

申请号：US14227805

申请日：2014-03-27

Applicant: Intel Corporation

Inventor： Aleksandar Aleks Aleksov ,  Mauro Kobrinsky ,  Johanna Swan ,  Rajendra C. Dias

IPC: H05K1/00 ,  H05K1/14 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/46 ,  H01L23/00

CPC classification number: H01L25/50 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/85399 ,  H01L2924/00014 ,  H05K1/0284 ,  H05K1/0393 ,  H05K1/117 ,  H05K1/142 ,  H05K1/148 ,  H05K3/4691 ,  H05K2201/10287 ,  Y10T29/49126 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Generally discussed herein are systems and apparatuses that can include apparatuses, systems, or method for a flexible, wire bonded device. According to an example an apparatus can include (1) a first rigid circuit comprising a first plurality of bond pads proximate to a first edge of the first rigid circuit, (2) a second rigid circuit comprising a second plurality of bond pads proximate to a first edge of the second rigid circuit, the second rigid circuit adjacent the first rigid circuit and the first edge of the second rigid circuit facing the first edge of the first rigid circuit, or (3) a first plurality of wire bonded wires, each wire bonded wire of the first plurality of wire bonded wires electrically and mechanically connected to a bond pad of the first plurality of bond pads and a bond pad of the second plurality of bond pads.

Abstract translation: 这里通常讨论的是可以包括用于柔性线接合装置的装置，系统或方法的系统和装置。 根据一个实例，设备可以包括（1）第一刚性电路，其包括靠近第一刚性电路的第一边缘的第一多个接合焊盘，（2）第二刚性电路，其包括接近于第一刚性电路的第二多个接合焊盘 第二刚性电路的第一边缘，与第一刚性电路相邻的第二刚性电路和面向第一刚性电路的第一边缘的第二刚性电路的第一边缘，或（3）第一多个引线接合线， 所述第一多个引线接合线的接合线电和机械地连接到所述第一多个接合焊盘的接合焊盘和所述第二多个接合焊盘的接合焊盘。

公开(公告)号：US09585246B2

公开(公告)日：2017-02-28

申请号：US15062480

申请日：2016-03-07

Applicant: FUJITSU LIMITED

Inventor： Teru Nakanishi ,  Nobuyuki Hayashi ,  Masaru Morita ,  Yasuhiro Yoneda

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/02 ,  H01L23/13 ,  H01L23/498 ,  H05K3/34 ,  H05K1/18 ,  H01L23/00

CPC classification number: H05K1/0296 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/4985 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/1379 ,  H01L2224/13839 ,  H01L2224/13847 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15311 ,  H05K1/181 ,  H05K3/3436 ,  H05K2201/10287 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10719 ,  Y02P70/613 ,  H01L2924/00

Abstract: A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection.

Abstract translation: 半导体器件包括：布线板，其表面上包括第一电极焊盘; 电路板，被布置成站立在所述布线板上，并且包括连接到所述第一电极焊盘的互连; 以及半导体封装，其设置成与所述布线板面对所述电路板，并且在其表面上包括第二电极焊盘，所述第二电极焊盘连接到所述互连。