公开(公告)号：US20150235881A1

公开(公告)日：2015-08-20

申请号：US14183631

申请日：2014-02-19

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Shawn A. Adderly ,  Samantha D. DiStefano ,  Jeffrey P. Gambino ,  Max G. Levy ,  Max L. Lifson ,  Matthew D. Moon ,  Timothy D. Sullivan

IPC: H01L21/67 ,  H01L21/68 ,  H01L21/683

CPC classification number: H01L21/67259 ,  G01B17/00 ,  G01S15/42 ,  H01L21/68 ,  Y10T29/49764 ,  Y10T279/21

Abstract: An apparatus and method for centering substrates determining on a chuck. The apparatus includes a chuck in a process chamber, the chuck configured to removeably hold a substrate for processing; an array of two or more ultrasonic sensors arranged in the process chamber, each ultrasonic sensor arranged relative to the chuck so as to send a respective ultrasonic sound wave to a respective preselected region of the substrate and receive a respective return ultrasonic sound wave from the preselected region of the substrate; and a controller connected to each ultrasonic sensor and configured to compare a measured position of the substrate on the chuck to a specified placement of the substrate on the chuck based on a measured elapsed time between sending the ultrasonic sound wave and receiving the return ultrasonic sound wave from each ultrasonic sensor.

Abstract translation: 一种用于使确定在卡盘上的基板居中的装置和方法。 该装置包括处理室中的卡盘，卡盘构造成可移除地保持用于处理的基板; 布置在处理室中的两个或更多个超声波传感器的阵列，每个超声波传感器相对于卡盘布置，以便将相应的超声波发送到基板的各个预选区域，并从预选的接收相应的返回超声波 基底区域; 以及控制器，其连接到每个超声波传感器，并且被配置为基于在发送所述超声波和接收所述返回超声波之间的测量的经过时间来比较所述卡盘上的所述基板的测量位置与所述基板在所述卡盘上的指定布置 从每个超声波传感器。

公开(公告)号：US20150219479A1

公开(公告)日：2015-08-06

申请号：US14171874

申请日：2014-02-04

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Shawn A. Adderly ,  Samantha D. DiStefano ,  Jeffrey P. Gambino ,  Max G. Levy ,  Max L. Lifson ,  Jed H. Rankin ,  Timothy D. Sullivan

IPC: G01F1/00 ,  G01F15/06 ,  H01L21/683

CPC classification number: H01L21/67288 ,  G01F1/76 ,  H01L21/00 ,  H01L21/67109

Abstract: An apparatus and method for leak detection of coolant gas from a chuck. The apparatus includes a chuck having a top surface and configured to clamp a substrate to the top surface, the chuck having one or more recessed regions in the top surface, the recessed regions configured to allow a cooling gas to contact a backside of the substrate; a cooling gas inlet and a cooling gas outlet connected to the one or more recessed regions; a first measurement device connected to the cooling gas inlet and configured to measure a first amount of cooling gas entering the cooling gas inlet and a second measurement device connected to the cooling gas outlet and configured to measure a second amount of cooling gas exiting from the cooling gas outlet; and a controller configured to determine a difference between the first amount of cooling gas and the second amount of cooling gas.

Abstract translation: 一种用于从卡盘泄漏检测冷却剂气体的设备和方法。 该装置包括具有顶表面并被配置为将基板夹持到顶表面的卡盘，卡盘在顶表面中具有一个或多个凹陷区域，凹陷区域被配置为允许冷却气体接触基板的背面; 连接到所述一个或多个凹陷区域的冷却气体入口和冷却气体出口; 连接到冷却气体入口并被配置成测量进入冷却气体入口的第一量的冷却气体的第一测量装置和连接到冷却气体出口的第二测量装置，其被配置成测量从冷却出口排出的第二量的冷却气体 气体出口; 以及控制器，被配置为确定所述第一冷却气体量与所述第二冷却气体量之间的差。

公开(公告)号：US09018760B2

公开(公告)日：2015-04-28

申请号：US14083610

申请日：2013-11-19

Applicant: International Business Machines Corporation

Inventor： Charles L. Arvin ,  Raschid J. Bezama ,  Timothy H. Daubenspeck ,  Jeffrey P. Gambino ,  Christopher D. Muzzy ,  David L. Questad ,  Wolfgang Sauter ,  Timothy D. Sullivan ,  Brian R. Sundlof

IPC: H01L29/41 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L24/13 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/10126 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/1182 ,  H01L2224/119 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/13101 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13565 ,  H01L2224/1357 ,  H01L2224/13687 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2924/01024 ,  H01L2924/01026 ,  H01L2924/01032 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A solder interconnect structure is provided with non-wettable sidewalls and methods of manufacturing the same. The method includes forming a nickel or nickel alloy pillar on an underlying surface. The method further includes modifying the sidewall of the nickel or nickel alloy pillar to prevent solder wetting on the sidewall.

Abstract translation: 焊接互连结构设置有不可润湿的侧壁及其制造方法。 该方法包括在下面的表面上形成镍或镍合金支柱。 该方法还包括修改镍或镍合金柱的侧壁以防止焊料在侧壁上润湿。

公开(公告)号：US20140239457A1

公开(公告)日：2014-08-28

申请号：US13780033

申请日：2013-02-28

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Timothy H. Daubenspeck ,  Jeffrey P. Gambino ,  Michael J. Hauser ,  Christopher D. Muzzy ,  Wolfgang Sauter ,  Timothy D. Sullivan

IPC: H01L23/34 ,  H01L25/00

CPC classification number: H01L23/34 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/481 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06589

Abstract: A three dimensional integrated circuit (3D-IC) structure, method of manufacturing the same and design structure thereof are provided. The 3D-IC structure includes two chips having a dielectric layer, through substrate vias (TSVs) and pads formed on the dielectric layer. The dielectric layer is formed on a bottom surface of each chip. Pads are electrically connected to the corresponding TSVs. The chips are disposed vertically adjacent to each other. The bottom surface of a second chip faces the bottom surface of a first chip. The pads of the first chip are electrically connected to the pads of the second chip through a plurality of conductive bumps. The 3D-IC structure further includes a thermal via structure vertically disposed between the first chip and the second chip and laterally disposed between the corresponding conductive bumps. The thermal via structure has an upper portion and a lower portion.

Abstract translation: 提供三维集成电路（3D-IC）结构，其制造方法及其设计结构。 3D-IC结构包括具有介电层的两个芯片，通过衬底通孔（TSV）和形成在电介质层上的焊盘。 电介质层形成在每个芯片的底表面上。 垫片电连接到相应的TSV。 芯片垂直相邻配置。 第二芯片的底表面面向第一芯片的底表面。 第一芯片的焊盘通过多个导电凸块电连接到第二芯片的焊盘。 3D-IC结构还包括垂直设置在第一芯片和第二芯片之间并横向设置在相应的导电凸块之间的热通孔结构。 热通孔结构具有上部和下部。

公开(公告)号：US20140117535A1

公开(公告)日：2014-05-01

申请号：US13664812

申请日：2012-10-31

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Timothy H. Daubenspeck ,  Jeffrey P. Gambino ,  Christopher D. Muzzy ,  Wolfgang Sauter ,  Timothy D. Sullivan

IPC: H01L23/498 ,  H01L21/50

CPC classification number: H01L23/3114 ,  H01L23/3192 ,  H01L23/525 ,  H01L23/562 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L2224/02125 ,  H01L2224/0231 ,  H01L2224/02331 ,  H01L2224/0236 ,  H01L2224/02381 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/05575 ,  H01L2224/05618 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05671 ,  H01L2224/06102 ,  H01L2224/11848 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/07025 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/1531 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2224/05552 ,  H01L2924/00

Abstract: Structures and methods of making a flip chip package that employ polyimide pads of varying heights at a radial distance from a center of an integrated circuit (IC) chip for a flip chip package. The polyimide pads may be formed under electrical connectors, which connect the IC chip to a chip carrier of the flip chip package, so that electrical connectors formed on polyimide pads of greater height are disposed at a greater radial distance from the center of the IC chip, while electrical connectors formed on polyimide pads of a lesser height are disposed more proximately to the center of the IC chip. Electrical connectors of a greater relative height to the IC chip's surface may compensate for a gap, produced by heat-induced warpage during the making of the flip chip package, that separates the electrical connectors on the IC chip from flip chip attaches on the chip carrier.

Abstract translation: 制造倒装芯片封装的结构和方法，其采用距离用于倒装芯片封装的集成电路（IC）芯片的中心的径向距离的不同高度的聚酰亚胺焊盘。 聚酰亚胺焊盘可以形成在电连接器下面，电连接器将IC芯片连接到倒装芯片封装的芯片载体，使得形成在更高高度的聚酰亚胺焊盘上的电连接器设置在离IC芯片中心更大的径向距离处 而形成在较低高度的聚酰亚胺焊盘上的电连接器更靠近IC芯片的中心设置。 与IC芯片表面相对高的电连接器可以补偿在制造倒装芯片封装期间由热引起的翘曲产生的间隙，其将IC芯片上的电连接器与芯片载体上的倒装芯片分离 。

公开(公告)号：US20140077367A1

公开(公告)日：2014-03-20

申请号：US14083610

申请日：2013-11-19

Applicant: International Business Machines Corporation

Inventor： Charles L. Arvin ,  Raschid J. Bezama ,  Timothy H. Daubenspeck ,  Jeffrey P. Gambino ,  Christopher D. Muzzy ,  David L. Questad ,  Wolfgang Sauter ,  Timothy D. Sullivan ,  Brian R. Sundlof

IPC: H01L23/00

CPC classification number: H01L24/13 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/10126 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/1182 ,  H01L2224/119 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/13101 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13565 ,  H01L2224/1357 ,  H01L2224/13687 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2924/01024 ,  H01L2924/01026 ,  H01L2924/01032 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A solder interconnect structure is provided with non-wettable sidewalls and methods of manufacturing the same. The method includes forming a nickel or nickel alloy pillar on an underlying surface. The method further includes modifying the sidewall of the nickel or nickel alloy pillar to prevent solder wetting on the sidewall.

Abstract translation: 焊接互连结构设置有不可润湿的侧壁及其制造方法。 该方法包括在下面的表面上形成镍或镍合金支柱。 该方法还包括修改镍或镍合金柱的侧壁以防止在侧壁上的焊料润湿。

公开(公告)号：US10571490B2

公开(公告)日：2020-02-25

申请号：US15794552

申请日：2017-10-26

Applicant: International Business Machines Corporation

Inventor： David M. Audette ,  Dennis M. Bronson, Jr. ,  Joseph K. V. Comeau ,  Dustin M. Fregeau ,  David L. Gardell ,  Frederick H. Roy, III ,  James R. Salimeno, III ,  Timothy D. Sullivan

IPC: G01R3/00 ,  G01R1/073 ,  G01R31/28 ,  G01R1/067

Abstract: A probe tip structure that decreases the accumulation rate of Sn particles to the probe tip and enables considerably more efficient and complete laser cleaning is disclosed. In an embodiment, the probe structure includes an array of probe tips, each probe tip having an inner core; an interfacial layer bonded to the inner core; and an outer layer bonded to the interfacial layer, wherein the outer layer is resistant to adherence of the solder of the ball grid array package.

公开(公告)号：US20180074110A1

公开(公告)日：2018-03-15

申请号：US15805377

申请日：2017-11-07

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Fen Chen ,  Mukta G. Farooq ,  John A. Griesemer ,  Chandrasekaran Kothandaraman ,  John M. Safran ,  Timothy D. Sullivan ,  Ping-Chuan Wang ,  Lijuan Zhang

IPC: G01R31/08 ,  H01L21/66 ,  H01L23/48

CPC classification number: G01R31/08 ,  G01R31/2856 ,  G01R31/2858 ,  H01L22/14 ,  H01L22/34 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An EM testing method includes forcing electrical current through EM monitor wiring arranged in close proximity to the perimeter of the TSV and measuring an electrical resistance drop across the EM monitor wiring. The method may further include determining if an electrical short exists between the EM monitor wiring and the TSV from the measured electrical resistance. The method may further include determining if an early electrical open or resistance increase exists within the EM monitoring wiring due to TSV induced proximity effect.

公开(公告)号：US20180059141A1

公开(公告)日：2018-03-01

申请号：US15794552

申请日：2017-10-26

Applicant: International Business Machines Corporation

Inventor： David M. Audette ,  Dennis M. Bronson, Jr. ,  Joseph K. V. Comeau ,  Dustin M. Fregeau ,  David L. Gardell ,  Frederick H. Roy, III ,  James R. Salimeno, III ,  Timothy D. Sullivan

IPC: G01R3/00 ,  G01R1/073 ,  G01R31/28 ,  G01R1/067

CPC classification number: G01R3/00 ,  G01R1/06738 ,  G01R1/07314 ,  G01R1/07342 ,  G01R31/2886

Abstract: A probe tip structure that decreases the accumulation rate of Sn particles to the probe tip and enables considerably more efficient and complete laser cleaning is disclosed. In an embodiment, the probe structure includes an array of probe tips, each probe tip having an inner core; an interfacial layer bonded to the inner core; and an outer layer bonded to the interfacial layer, wherein the outer layer is resistant to adherence of the solder of the ball grid array package.

公开(公告)号：US09613921B2

公开(公告)日：2017-04-04

申请号：US14057649

申请日：2013-10-18

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Timothy H. Daubenspeck ,  Jeffrey P. Gambino ,  Christopher D. Muzzy ,  Wolfgang Sauter ,  Timothy D. Sullivan

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L24/11 ,  H01L21/563 ,  H01L23/3114 ,  H01L23/3142 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0345 ,  H01L2224/0361 ,  H01L2224/03614 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/05022 ,  H01L2224/051 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05572 ,  H01L2224/0558 ,  H01L2224/05647 ,  H01L2224/10126 ,  H01L2224/1134 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/11827 ,  H01L2224/11831 ,  H01L2224/11849 ,  H01L2224/13017 ,  H01L2224/13022 ,  H01L2224/13111 ,  H01L2224/13565 ,  H01L2224/13686 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83104 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/05442 ,  H01L2924/05042 ,  H01L2924/01074 ,  H01L2924/00

Abstract: A spacer structure formed adjacent a solder connection which prevents solder extrusion and methods of manufacture are disclosed. The method includes forming a solder preform connection on a bond pad of a chip. The method further includes forming a spacer structure on sidewalls of the solder preform connection. The method further includes subjecting the solder preform connection to a predetermined temperature to form a solder connection with the spacer structure remaining thereabout.