公开(公告)号：US20060125105A1

公开(公告)日：2006-06-15

申请号：US11084204

申请日：2005-03-21

Applicant: Masayuki Kitajima ,  Tadaaki Shono ,  Ryoji Matsuyama

Inventor： Masayuki Kitajima ,  Tadaaki Shono ,  Ryoji Matsuyama

IPC: H01L23/48

CPC classification number: H01L21/76898 ,  H01L21/76877 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/3463 ,  H05K3/4038 ,  H01L2924/00

Abstract: A high melting point solder alloy superior in oxidation resistance, in particular a solder alloy provided with both a high oxidation resistance and high melting point suitable for filling fine through holes of tens of microns in diameter and high aspect ratios and forming through hole filling materials, comprising a zinc-aluminum solder alloy containing 0.001 wt % to 1 wt % of aluminum and the balance of zinc and unavoidable impurities.

Abstract translation: 耐氧化性优异的高熔点焊料合金，特别是具有高抗氧化性和高熔点的焊料合金，适用于填充直径为几十微米，高纵横比的精细通孔，形成通孔填充材料， 其包含含有0.001重量％至1重量％的铝的锌 - 铝焊料合金，余量为锌和不可避免的杂质。

公开(公告)号：US06893512B2

公开(公告)日：2005-05-17

申请号：US10356546

申请日：2003-02-03

Applicant: Masayuki Kitajima ,  Tadaaki Shono ,  Masakazu Takesue ,  Yutaka Noda

Inventor： Masayuki Kitajima ,  Tadaaki Shono ,  Masakazu Takesue ,  Yutaka Noda

IPC: B23K35/02 ,  B23K35/26 ,  C22C13/00 ,  H05K3/34

CPC classification number: B23K35/262 ,  B23K35/025 ,  B23K2101/36 ,  H05K3/3463

Abstract: A solder alloy having a solderability comparable to that of a conventional Pb—Sn solder alloy without having a detrimental effect on the environment and a soldered bond using the same. A solder alloy consisting of Zn: 4.0-10.0 wt %, In: 1.0 to 15.0 wt %, Al: 0.0020 to 0.0100 wt %, and the balance of Sn and unavoidable impurities. A soldered bond of an electric or electronic device composed of the above solder alloy.

Abstract translation: 具有与常规Pb-Sn焊料合金相当的可焊性的焊料合金，而不会对环境产生不利影响，并且使用焊料合金。 由Zn：4.0〜10.0重量％，In：1.0〜15.0重量％，Al：0.0020〜0.0100重量％，Sn和不可避免的杂质构成的焊料合金。 由上述焊料合金构成的电气或电子设备的焊接结合体。

公开(公告)号：US06653761B2

公开(公告)日：2003-11-25

申请号：US09822621

申请日：2001-03-30

Applicant: Masanao Fujii ,  Toru Okada ,  Masayuki Kitajima ,  Hidehiko Kobayashi ,  Seiichi Shimoura

Inventor： Masanao Fujii ,  Toru Okada ,  Masayuki Kitajima ,  Hidehiko Kobayashi ,  Seiichi Shimoura

IPC: H01L4108

CPC classification number: G11B5/5552 ,  H01L41/0993 ,  H01L41/313 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913

Abstract: In a method of producing a micro-actuator, a first adhesive is applied to a movable plate, and a movable electrode is placed on the first adhesive. The movable plate and the movable electrode are clamped between a first stage and a first head, followed by heating for a first predetermined period of time while exerting a first predetermined press load onto the first head to semi-cure the first adhesive. A second adhesive is applied to the movable electrode, and a piezoelectric element is placed on the second adhesive. The movable plate, the movable electrode and the piezoelectric element are clamped between the first stage and a second head, followed by heating for a second predetermined period of time while exerting a second predetermined press load onto the second head to semi-cure the second adhesive. Next, a third adhesive is applied to an actuator base, a base electrode is placed on the third adhesive, and the third adhesive is semi-cured in the same manner as above. A fourth adhesive is applied to the base electrode, the piezoelectric element is placed on the fourth adhesive, and the fourth adhesive is semi-cured in the same manner as above. Finally, the adhered laminate thus obtained is placed into a heating furnace and heated at a predetermined temperature for a predetermined period of time to thereby fully cure the adhesives.

公开(公告)号：US06521176B2

公开(公告)日：2003-02-18

申请号：US09728120

申请日：2000-12-04

Applicant: Masayuki Kitajima ,  Masakazu Takesue ,  Yasuo Moriya ,  Yoshinori Nemoto ,  Yumiko Fukushima

Inventor： Masayuki Kitajima ,  Masakazu Takesue ,  Yasuo Moriya ,  Yoshinori Nemoto ,  Yumiko Fukushima

IPC: C22C1302

CPC classification number: B23K35/025 ,  B23K35/262 ,  B23K35/264 ,  B23K35/3613 ,  B23K35/3615 ,  B23K35/3616 ,  B23K35/3618 ,  H05K3/3463

Abstract: A lead-free solder alloy composition containing Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.

Abstract translation: 含有Sn，Ag和Bi的无铅焊料合金组合物，各自的浓度设定为使得无铅焊料合金的熔融温度低于要焊接的工件的预定耐热温度。

公开(公告)号：US06432806B1

公开(公告)日：2002-08-13

申请号：US09417770

申请日：1999-10-14

Applicant: Masayuki Kitajima ,  Yutaka Noda ,  Yoshitaka Muraoka

Inventor： Masayuki Kitajima ,  Yutaka Noda ,  Yoshitaka Muraoka

IPC: H01L2144

CPC classification number: B23K26/10 ,  B23K26/382 ,  B23K26/40 ,  B23K2103/16 ,  B23K2103/30 ,  B23K2103/42 ,  B23K2103/50 ,  C03C15/00 ,  C03C23/0025 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75743 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15311 ,  H05K3/002 ,  H05K3/0029 ,  H05K3/0055 ,  H05K3/3478 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0525 ,  H05K2203/082 ,  H05K2203/107 ,  Y10S438/963 ,  Y10T29/49144 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A method of manufacturing a template having through-holes for attracting and supporting electrically conductive balls by vacuum suction is disclosed. The through-holes are formed by etching and the side walls of the through-holes are smoothed by irradiation, with laser beams, of the side walls of the through-holes. A template and metallic bumps can be formed using this method. Alternatively, the template can be formed in a two-layered structure.

Abstract translation: 公开了一种制造具有通过真空抽吸吸引和支撑导电球的通孔的模板的方法。 通过蚀刻形成通孔，并且通过激光束使通孔的侧壁平滑通孔的侧壁。 可以使用该方法形成模板和金属凸块。 或者，模板可以形成为两层结构。

公开(公告)号：US06361626B1

公开(公告)日：2002-03-26

申请号：US09839371

申请日：2001-04-23

Applicant: Masayuki Kitajima ,  Hitoshi Homma ,  Masakazu Takesue ,  Tadaaki Shono ,  Yutaka Noda

Inventor： Masayuki Kitajima ,  Hitoshi Homma ,  Masakazu Takesue ,  Tadaaki Shono ,  Yutaka Noda

IPC: C22C1300

CPC classification number: C22C13/00 ,  B23K35/262 ,  C22C13/02

Abstract: A Pb-free solder alloy and a soldered bond using the same, in which the solder alloy has no harmful environmental effect but has a solderability comparable to that of the conventional Pb—Sn solder alloy. The solder alloy of the present invention either consists of Zn: 3.0-14.0 wt %, Al: 0.0020-0.0080 wt %, and the balance of Sn and unavoidable impurities or consists of Zn: 3.0-14.0 wt %, Bi: 3.0-6.0 wt %, Al: 0.0020-0.0100 wt %, and the balance of Sn and unavoidable impurities. The soldered bond of the present invention consists of either of the present inventive solder alloys.

Abstract translation: 无铅焊料合金和使用其的焊接焊料，其中焊料合金没有有害的环境效应，但具有与常规Pb-Sn焊料合金相当的可焊性。 本发明的焊料合金由Zn：3.0〜14.0重量％，Al：0.0020〜0.0080重量％，余量由Sn和不可避免的杂质构成，Zn：3.0〜14.0重量％，Bi：3.0-6.0 wt％，Al：0.0020-0.0100wt％，余量为Sn和不可避免的杂质。 本发明的焊接键由本发明的焊料合金中的任一种组成。

公开(公告)号：US06344690B1

公开(公告)日：2002-02-05

申请号：US09691142

申请日：2000-10-19

Applicant: Masayuki Kitajima ,  Masakazu Takesue ,  Yoshitaka Muraoka

Inventor： Masayuki Kitajima ,  Masakazu Takesue ,  Yoshitaka Muraoka

IPC: H01L2348

CPC classification number: H01L24/13 ,  B23K1/0016 ,  B23K35/26 ,  B23K35/262 ,  B23K35/3013 ,  B23K2101/36 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/16 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/0558 ,  H01L2224/056 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/11822 ,  H01L2224/1184 ,  H01L2224/11901 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1358 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/13605 ,  H01L2224/13609 ,  H01L2224/13613 ,  H01L2224/13618 ,  H01L2224/13655 ,  H01L2224/13671 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/742 ,  H01L2224/75 ,  H01L2224/7501 ,  H01L2224/7515 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/81011 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3436 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/29099

Abstract: A semiconductor device comprises a semiconductor element having electrodes and metal bumps are attached to the electrodes. The metal bumps include copper cores and gold surface layers covering the cores. In addition, the metal bumps may include gold bump elements and solder bump elements connected together.

Abstract translation: 半导体器件包括具有电极的半导体元件和附接到电极的金属凸块。 金属凸块包括铜芯和覆盖芯的金表面层。 此外，金属凸块可以包括连接在一起的金突起元件和焊料凸块元件。

公开(公告)号：US06320158B1

公开(公告)日：2001-11-20

申请号：US09231485

申请日：1999-01-14

Applicant: Masayuki Kitajima ,  Yutaka Noda ,  Yoshitaka Muraoka ,  Fumihiko Tokura

Inventor： Masayuki Kitajima ,  Yutaka Noda ,  Yoshitaka Muraoka ,  Fumihiko Tokura

IPC: B23K2638

CPC classification number: B23K26/382 ,  B23K26/10 ,  B23K26/40 ,  B23K2103/16 ,  B23K2103/30 ,  B23K2103/42 ,  B23K2103/50 ,  C03C15/00 ,  C03C23/0025 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/742 ,  H01L2224/75 ,  H01L2224/75745 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/07802 ,  H05K3/0029 ,  H05K3/3478 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/082 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A method of forming bumps onto a chip having electrodes. The method includes the use of a template having through-holes arranged in correspondence to the electrodes of the chip. The template holds conductive balls to be formed into bumps to the template at the through-holes by vacuum suction. The through-holes of the template are formed by a laser, by supporting a glass plate on a support table having cavities and irradiating the plate with laser beams at the position of the cavities.

Abstract translation: 在具有电极的芯片上形成凸块的方法。 该方法包括使用具有对应于芯片的电极布置的通孔的模板。 该模板通过真空抽吸保持在通孔处形成与模板的凸起的导电球。 模板的通孔由激光器形成，通过将玻璃板支撑在具有空腔的支撑台上，并且在空腔的位置处用激光束照射该板。

公开(公告)号：US08418910B2

公开(公告)日：2013-04-16

申请号：US13367509

申请日：2012-02-07

Applicant: Takatoyo Yamakami ,  Takashi Kubota ,  Kuniko Ishikawa ,  Masayuki Kitajima

Inventor： Takatoyo Yamakami ,  Takashi Kubota ,  Kuniko Ishikawa ,  Masayuki Kitajima

IPC: B23K35/14 ,  B23K35/34 ,  B23K31/02

CPC classification number: H01L24/13 ,  B22F1/0014 ,  B22F1/025 ,  B23K35/262 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  C22C9/00 ,  C23C24/106 ,  H01L23/49811 ,  H01L23/49883 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05671 ,  H01L2224/0568 ,  H01L2224/05686 ,  H01L2224/1131 ,  H01L2224/1132 ,  H01L2224/11502 ,  H01L2224/13017 ,  H01L2224/13144 ,  H01L2224/13599 ,  H01L2224/13609 ,  H01L2224/13611 ,  H01L2224/13613 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13709 ,  H01L2224/13711 ,  H01L2224/13713 ,  H01L2224/13809 ,  H01L2224/13811 ,  H01L2224/13813 ,  H01L2224/13839 ,  H01L2224/13844 ,  H01L2224/13847 ,  H01L2224/13899 ,  H01L2224/13913 ,  H01L2224/13939 ,  H01L2224/13944 ,  H01L2224/13947 ,  H01L2224/16058 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16507 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81024 ,  H01L2224/81055 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/812 ,  H01L2224/8121 ,  H01L2224/8123 ,  H01L2224/81509 ,  H01L2224/81511 ,  H01L2224/81513 ,  H01L2224/81639 ,  H01L2224/81644 ,  H01L2224/81647 ,  H01L2224/81699 ,  H01L2224/81711 ,  H01L2224/81713 ,  H01L2224/81739 ,  H01L2224/81744 ,  H01L2224/8181 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/15738 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/01007 ,  H01L2924/01008 ,  H01L2924/01018 ,  H01L2924/01083 ,  H01L2924/01031 ,  H01L2924/0103 ,  H01L2924/053 ,  H01L2224/13099 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

Abstract: An electro-conductive bonding material includes: metal components of a high-melting-point metal particle that have a first melting point or higher; a middle-melting-point metal particle that has a second melting point which is first temperature or higher, and second temperature or lower, the second temperature is lower than the first melting point and higher than the first temperature; and a low-melting-point metal particle that has a third melting point or lower, the third melting point is lower than the first temperature.

Abstract translation: 导电接合材料包括：具有第一熔点或更高熔点的高熔点金属颗粒的金属组分; 中间熔点金属颗粒，其具有第一温度或更高的第二熔点，第二温度或更低，第二温度低于第一熔点并高于第一温度; 和具有第三熔点或更低熔点的低熔点金属颗粒，第三熔点低于第一温度。

公开(公告)号：US20110163152A1

公开(公告)日：2011-07-07

申请号：US12974576

申请日：2010-12-21

Applicant: Masayuki KITAJIMA ,  Yutaka NODA ,  Hidehiko KOBAYASHI ,  Toshihiro KUSAGAYA ,  Kazuhiro MIZUKAMI

Inventor： Masayuki KITAJIMA ,  Yutaka NODA ,  Hidehiko KOBAYASHI ,  Toshihiro KUSAGAYA ,  Kazuhiro MIZUKAMI

IPC: B23K1/20

CPC classification number: B23K1/0016 ,  B23K1/20 ,  B23K2101/38

Abstract: A method of forming a solder dam on a lead of an electronic component includes forming the looped solder dam surrounding a target lead, to which the solder dam is to be formed, of a plurality of leads connected to the electronic component, by fitting a C-shaped fitted member to the target lead at a predetermined location.

Abstract translation: 在电子部件的引线上形成焊料坝的方法包括：通过安装C电极，形成围绕要连接到电子部件的多个引线围绕要形成焊锡的目标引线的环形焊料坝 形状的装配构件在预定位置处到目标引线。