公开(公告)号：US20100164061A1

公开(公告)日：2010-07-01

申请号：US12377076

申请日：2007-08-24

申请人： Koichi Hirano ,  Tetsuyoshi Ogura ,  Seiichi Nakatani

发明人： Koichi Hirano ,  Tetsuyoshi Ogura ,  Seiichi Nakatani

IPC分类号： H01L29/92 ,  H01L21/02

CPC分类号： H01L24/13 ,  H01G4/008 ,  H01G4/33 ,  H01G9/045 ,  H01G9/07 ,  H01G9/15 ,  H01L23/5223 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05548 ,  H01L2224/05647 ,  H01L2224/05671 ,  H01L2224/1131 ,  H01L2224/11831 ,  H01L2224/11901 ,  H01L2224/13022 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13155 ,  H01L2224/1358 ,  H01L2224/13624 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/1379 ,  H01L2224/138 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2224/13099

摘要： A semiconductor chip comprising a capacitor capable of effectively controlling the voltage drop of an LSI is provided. A semiconductor substrate is provided with an element electrode having at least its surface constituted of an aluminum electrode. The surface of the aluminum electrode is roughened. An oxide film is provided on the aluminum electrode. A conductive film is provided on the oxide film. The aluminum electrode, oxide film and conductive film form a capacitor.

摘要翻译： 提供了包括能够有效地控制LSI的电压降的电容器的半导体芯片。 半导体衬底设置有至少其表面由铝电极构成的元件电极。 铝电极的表面被粗糙化。 在铝电极上设置氧化膜。 在氧化膜上设置导电膜。 铝电极，氧化膜和导电膜形成电容器。

公开(公告)号：US20090085227A1

公开(公告)日：2009-04-02

申请号：US11914581

申请日：2006-05-09

申请人： Tsukasa Shiraishi ,  Seiichi Nakatani ,  Seiji Karashima ,  Koichi Hirano ,  Takashi Kitae ,  Yoshihisa Yamashita ,  Takashi Ichiryu

发明人： Tsukasa Shiraishi ,  Seiichi Nakatani ,  Seiji Karashima ,  Koichi Hirano ,  Takashi Kitae ,  Yoshihisa Yamashita ,  Takashi Ichiryu

IPC分类号： H01L23/488 ,  H01L21/60

CPC分类号： H01L21/563 ,  H01L23/552 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/06505 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/14505 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/83007 ,  H01L2224/83051 ,  H01L2224/83101 ,  H01L2224/83136 ,  H01L2224/83139 ,  H01L2224/83205 ,  H01L2224/83801 ,  H01L2224/83888 ,  H01L2224/9201 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K3/303 ,  H05K3/323 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/10568 ,  H05K2201/10977 ,  H05K2201/2036 ,  H05K2203/083 ,  H05K2203/087 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2224/13111

摘要： A flip chip mounting body in which a circuit substrate having a plurality of connection terminals and an electronic part (semiconductor chip) having a plurality of electrode terminals are aligned face to face with each other, with a resin composition composed of solder powder, a resin and a convection additive being sandwiched in between, while a means such as spacers is interposed in between so as to provide a uniform gap between the two parts, or the electronic part (semiconductor chip) is placed inside a plate-shaped member having two or more protruding portions, so that the solder powder is allowed to move through boiling of the convection additive and to be self-aggregated to form a solder layer, thereby electrically connecting the connection terminals and the electrode terminals; and a mounting method for such a mounting body.

摘要翻译： 一种倒装芯片安装体，其中具有多个连接端子的电路基板和具有多个电极端子的电子部件（半导体芯片）彼此面对面地对准，其中树脂组合物由焊料粉末，树脂 并且夹在其间的对流添加剂，同时诸如间隔物的装置插入其间，以便在两个部件之间提供均匀的间隙，或者将电子部件（半导体芯片）放置在具有两个或 更多的突出部分，使得焊料粉末能够通过对流添加剂的沸腾而移动并且自聚集形成焊料层，从而电连接连接端子和电极端子; 以及这种安装体的安装方法。

公开(公告)号：US07400512B2

公开(公告)日：2008-07-15

申请号：US11945552

申请日：2007-11-27

申请人： Koichi Hirano ,  Tsunenori Yoshida ,  Seiichi Nakatani

发明人： Koichi Hirano ,  Tsunenori Yoshida ,  Seiichi Nakatani

IPC分类号： H05K1/18

CPC分类号： H05K1/186 ,  H01G4/40 ,  H05K1/165 ,  H05K3/4614 ,  H05K2201/086 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49155

摘要： A module incorporating a capacitor, the module including a circuit board and a layer incorporating a capacitor, wherein the circuit board includes a wiring layer and a via contact for providing electrical conductivity to a cathode and an anode of the capacitor. The layer incorporating the capacitor includes a ferromagnetic layer integrated with at least a portion of a surface of the capacitor, and in the circuit board or the layer incorporating the capacitor a coil is wound around the capacitor, or an inductor component is disposed in parallel with the capacitor. Accordingly, a module incorporating a capacitor in which miniaturization, a higher density and a reduced thickness have been achieved, as well as a method for producing the module and a capacitor used for the module, are provided.

摘要翻译： 一种包含电容器的模块，所述模块包括电路板和包含电容器的层，其中所述电路板包括用于向所述电容器的阴极和阳极提供导电性的布线层和通孔接触。 结合电容器的层包括与电容器的表面的至少一部分集成的铁磁层，并且在电路板或包含电容器的层中，线圈缠绕在电容器上，或者电感器部件与 电容器。 因此，提供了一种包括其中实现了小型化，更高密度和更小厚度的电容器的模块以及用于该模块的模块和电容器的制造方法。

公开(公告)号：US07394663B2

公开(公告)日：2008-07-01

申请号：US10775656

申请日：2004-02-09

申请人： Yoshihisa Yamashita ,  Koichi Hirano ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Seiichi Nakatani

发明人： Yoshihisa Yamashita ,  Koichi Hirano ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Seiichi Nakatani

IPC分类号： H05K1/16

CPC分类号： H05K1/187 ,  H01L23/49894 ,  H01L23/5389 ,  H01L25/162 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/82047 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/19105 ,  H05K1/186 ,  H05K3/4614 ,  H01L2924/00012 ,  H01L2224/0401

摘要： An electronic component built-in module according to the present invention includes a pair of opposed circuit substrates, each of which includes a wiring pattern and an insulating base material containing a resin, an insulating layer that is placed between the pair of circuit substrates and contains an inorganic filler and a resin composition containing a thermosetting resin, an electronic component that is embedded in the insulating layer, and an inner via that is provided in the insulating layer so as to make an electrical connection between wiring patterns provided on different circuit substrates. A glass transition temperature Tg1 of the resin composition contained in the insulating layer and a glass transition temperature Tg2 of the insulating base material included in each of the circuit substrates satisfy a relationship Tg1>Tg2.

摘要翻译： 根据本发明的电子部件内置模块包括一对相对的电路基板，每个电路基板包括布线图案和包含树脂的绝缘基材，绝缘层位于该对电路基板之间并且包含 无机填料和包含热固性树脂的树脂组合物，嵌入在绝缘层中的电子部件和设置在绝缘层中的内部通孔，以便在设置在不同电路基板上的布线图案之间形成电连接。 包含在绝缘层中的树脂组合物的玻璃化转变温度Tg1和包含在每个电路基板中的绝缘基材的玻璃化转变温度Tg2满足Tg1> Tg2。

公开(公告)号：US20080047137A1

公开(公告)日：2008-02-28

申请号：US11826758

申请日：2007-07-18

申请人： Toshiyuki Asahi ,  Seiji Karashima ,  Takashi Ichiryu ,  Seiichi Nakatani ,  Tousaku Nishiyama ,  Koichi Hirano ,  Osamu Shibata ,  Takeshi Nakayama ,  Yoshiyuki Saito

发明人： Toshiyuki Asahi ,  Seiji Karashima ,  Takashi Ichiryu ,  Seiichi Nakatani ,  Tousaku Nishiyama ,  Koichi Hirano ,  Osamu Shibata ,  Takeshi Nakayama ,  Yoshiyuki Saito

IPC分类号： H01R43/20 ,  H01R12/00 ,  H01R13/24

CPC分类号： H05K3/403 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01R12/52 ,  H01R13/2414 ,  H05K1/0218 ,  H05K1/0284 ,  H05K1/141 ,  H05K1/145 ,  H05K1/182 ,  H05K3/20 ,  H05K3/3442 ,  H05K3/361 ,  H05K3/366 ,  H05K3/368 ,  H05K2201/043 ,  H05K2201/048 ,  H05K2201/049 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/09036 ,  H05K2201/10515 ,  H05K2201/10689 ,  H05K2203/302 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49208 ,  H01L2924/00

摘要： A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surface to the lower surface through the side surface.

摘要翻译： 可以在没有通孔形成步骤的情况下制造连接构件。 连接构件包括绝缘基板，其具有上表面，与上表面相对的下表面和连接这些表面的侧表面; 以及至少一个通过侧面从上表面延伸到下表面的布线。

公开(公告)号：US07258549B2

公开(公告)日：2007-08-21

申请号：US11060550

申请日：2005-02-18

申请人： Toshiyuki Asahi ,  Seiji Karashima ,  Takashi Ichiryu ,  Seiichi Nakatani ,  Tousaku Nishiyama ,  Koichi Hirano ,  Osamu Shibata ,  Takeshi Nakayama ,  Yoshiyuki Saito

发明人： Toshiyuki Asahi ,  Seiji Karashima ,  Takashi Ichiryu ,  Seiichi Nakatani ,  Tousaku Nishiyama ,  Koichi Hirano ,  Osamu Shibata ,  Takeshi Nakayama ,  Yoshiyuki Saito

IPC分类号： H01R12/00

CPC分类号： H05K3/403 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01R12/52 ,  H01R13/2414 ,  H05K1/0218 ,  H05K1/0284 ,  H05K1/141 ,  H05K1/145 ,  H05K1/182 ,  H05K3/20 ,  H05K3/3442 ,  H05K3/361 ,  H05K3/366 ,  H05K3/368 ,  H05K2201/043 ,  H05K2201/048 ,  H05K2201/049 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/09036 ,  H05K2201/10515 ,  H05K2201/10689 ,  H05K2203/302 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49208 ,  H01L2924/00

摘要： A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surface to the lower surface through the side surface.

摘要翻译： 可以在没有通孔形成步骤的情况下制造连接构件。 连接构件包括绝缘基板，其具有上表面，与上表面相对的下表面和连接这些表面的侧表面; 以及至少一个通过侧面从上表面延伸到下表面的布线。

公开(公告)号：US07157789B2

公开(公告)日：2007-01-02

申请号：US11136110

申请日：2005-05-24

申请人： Koichi Hirano ,  Yoshiyuki Yamamoto ,  Seiichi Nakatani ,  Toshiyuki Kojima ,  Shingo Komatsu

发明人： Koichi Hirano ,  Yoshiyuki Yamamoto ,  Seiichi Nakatani ,  Toshiyuki Kojima ,  Shingo Komatsu

IPC分类号： H01L23/552

CPC分类号： H01L25/0657 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/50 ,  H01L24/82 ,  H01L24/86 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/16225 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24145 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01064 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/05599

摘要： An example of a semiconductor device of the present invention includes a first semiconductor element including a first element body portion and a first element electrode that is provided on a first face of the first element body portion; a wiring board including an insulating substrate and a first wiring layer that is formed on one principal face of the insulating substrate, the wiring board being disposed such that the one principal face of the wiring board is opposed to a second face of the first element body portion; a first film that covers at least a portion of a face of the first semiconductor element that includes the surface of the first element electrode and at least a portion of a face on the first semiconductor element side of the wiring board; and a second wiring layer that is formed on a face on the wiring board side of the first film and that includes a first conductor having first and second ends. The first end of the first conductor is bonded to the first element electrode, and the second end of the first conductor is bonded to a portion of the first wiring layer.

摘要翻译： 本发明的半导体器件的一个例子包括：第一半导体元件，包括第一元件主体部分和设置在第一元件主体部分的第一面上的第一元件电极; 布线板，包括绝缘基板和形成在所述绝缘基板的一个主面上的第一布线层，所述布线板布置成使得所述布线板的所述一个主面与所述第一元件体的第二面相对 一部分; 第一膜，其覆盖包括第一元件电极的表面和布线板的第一半导体元件侧的面的至少一部分的第一半导体元件的表面的至少一部分; 以及第二布线层，其形成在第一膜的布线板侧的面上，并且包括具有第一端和第二端的第一导体。 第一导体的第一端接合到第一元件电极，第一导体的第二端接合到第一布线层的一部分。

公开(公告)号：US07140104B2

公开(公告)日：2006-11-28

申请号：US10902523

申请日：2004-07-29

申请人： Koichi Hirano ,  Seiichi Nakatani ,  Hiroyuki Handa ,  Tsunenori Yoshida ,  Yoshihisa Yamashita ,  Hiroyuki Ishitomi

发明人： Koichi Hirano ,  Seiichi Nakatani ,  Hiroyuki Handa ,  Tsunenori Yoshida ,  Yoshihisa Yamashita ,  Hiroyuki Ishitomi

IPC分类号： H01K3/10

CPC分类号： H01G2/065 ,  H01L25/0652 ,  H01L29/0657 ,  H01L2224/16225 ,  H01L2924/09701 ,  H01L2924/10157 ,  H01L2924/10158 ,  H01L2924/3011 ,  H05K1/185 ,  H05K3/3442 ,  H05K2201/09154 ,  H05K2201/10568 ,  H05K2201/10636 ,  H05K2201/2036 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/49082 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/53174 ,  Y10T29/53178

摘要： A circuit component built-in module can be produced by filling a conducting material in through holes of a sheet-like member, stacking the sheet-like member and a metal foil on a circuit component package, and applying heat and pressure to embed the circuit component in the sheet-like member, and patterning the metal foil. The circuit component package includes a mounting member with substrate and wiring pattern and a circuit component. The circuit component includes a component body and external electrode, with the component body being thinner at a portion on which the external electrode is provided. The external electrode is provided on a surface of the circuit component that is opposed to the mounting member, and the component body is in contact with the mounting member.

摘要翻译： 可以通过在板状构件的通孔中填充导电材料，将片状构件和金属箔堆叠在电路构件封装上，并施加热和压力以嵌入电路来制造电路部件内置模块 并且对金属箔进行图案化。 电路部件封装包括具有衬底和布线图案的安装构件和电路部件。 电路部件包括部件主体和外部电极，其中部件主体在设置有外部电极的部分处更薄。 外部电极设置在与安装部件相对的电路部件的表面上，并且部件主体与安装部件接触。

公开(公告)号：US07126811B2

公开(公告)日：2006-10-24

申请号：US10726675

申请日：2003-12-04

申请人： Koichi Hirano ,  Tsunenori Yoshida ,  Hiroyuki Handa ,  Yoshihisa Yamashita ,  Seiichi Nakatani

发明人： Koichi Hirano ,  Tsunenori Yoshida ,  Hiroyuki Handa ,  Yoshihisa Yamashita ,  Seiichi Nakatani

IPC分类号： H01G9/00

CPC分类号： H01G9/012 ,  H01G4/26 ,  H05K1/186 ,  H05K3/321 ,  H05K3/4614 ,  Y10T29/417

摘要： A miniature solid electrolytic capacitor is provided, which is suitable for being disposed within an electrically insulating layer, and is connected to a component using an electrically conductive adhesive with a connection resistance at an anode being low and with connection reliability being improved. Specifically, the electrolytic capacitor includes a valve metal element for an anode having a capacitor forming part and an electrode lead part, a dielectric oxide film formed on the valve element, a solid electrolyte layer formed on the dielectric oxide film and a charge collecting element for a cathode formed on the solid electrolyte layer, wherein at least one through hole is formed in the electrode lead part so as to expose a core of the valve metal element, and wherein an exposed portion of the core is used as a connecting portion.

摘要翻译： 提供了一种微型固体电解电容器，其适用于设置在电绝缘层中，并且使用导电粘合剂连接到组件，其中阳极处的连接电阻低，并且连接可靠性得到改善。 具体地说，电解电容器包括用于阳极的阀金属元件，具有电容器形成部分和电极引线部分，形成在阀元件上的电介质氧化膜，形成在电介质氧化物膜上的固体电解质层和用于 形成在所述固体电解质层上的阴极，其中，在所述电极引线部中形成有至少一个通孔，以露出所述阀金属元件的芯，并且其中所述芯的暴露部分用作连接部。

公开(公告)号：US07041535B2

公开(公告)日：2006-05-09

申请号：US10758517

申请日：2004-01-14

申请人： Yoshihisa Yamashita ,  Koichi Hirano ,  Seiichi Nakatani

发明人： Yoshihisa Yamashita ,  Koichi Hirano ,  Seiichi Nakatani

IPC分类号： H01L21/44

CPC分类号： H01L23/3737 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/73253 ,  H01L2924/01322 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0203 ,  H05K3/284 ,  H01L2924/00

摘要： In a power module, a wiring substrate to which a heat generating component is connected electrically and a heat sink are connected through the medium of a thermally conductive and electrically insulating member. The thermally conductive and electrically insulating member is a curable composition containing (A) a thermosetting resin, (B) a thermoplastic resin, (C) a latent curing agent, and (D) an inorganic filler. The thermally conductive and electrically insulating member is bonded to the heat generating component in such a manner as to be deformed complementarily to unevenness in shape and height of the heat generating component. Heat generated from the heat generating component is radiated by means of the heat sink. Thus, a power module that allows heat generated from an electronic component to be radiated evenly and efficiently and achieves high-density mounting, and a method of manufacturing the power module are provided.