公开(公告)号：US07901995B2

公开(公告)日：2011-03-08

申请号：US11689558

申请日：2007-03-22

Applicant: Gabe Cherian

Inventor： Gabe Cherian

IPC: H01L21/60

CPC classification number: H05K3/3426 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/49555 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/73 ,  H01L24/742 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1012 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13184 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/13655 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/1601 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45599 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73203 ,  H01L2224/73251 ,  H01L2224/73257 ,  H01L2224/81903 ,  H01L2224/85 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15331 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K3/308 ,  H05K2201/09418 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10825 ,  H05K2201/10871 ,  H05K2201/10946 ,  H05K2201/10977 ,  H05K2203/0769 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/72

Abstract: The present invention relates generally to permanent interconnections between electronic devices, such as integrated circuit packages, chips, wafers and printed circuit boards or substrates, or similar electronic devices. More particularly it relates to high-density electronic devices.The invention describes means and methods that can be used to counteract the undesirable effects of thermal cycling, shock and vibrations and severe environment conditions in general.For leaded devices, the leads are oriented to face the thermal center of the devices and the system they interact with.For leadless devices, the mounting elements are treated or prepared to control the migration of solder along the length of the elements, to ensure that those elements retain their desired flexibility.

Abstract translation: 本发明一般涉及电子设备之间的永久互连，例如集成电路封装，芯片，晶片和印刷电路板或基板或类似的电子设备。 更具体地说，涉及高密度电子设备。 本发明描述了可用于抵消热循环，冲击和振动以及恶劣环境条件的不良影响的手段和方法。 对于有铅器件，引线面向设备的热中心及其与之相互作用的系统。 对于无引线器件，安装元件被处理或准备好以控制沿着元件长度的焊料的迁移，以确保这些元件保持其期望的柔性。

公开(公告)号：US07875973B2

公开(公告)日：2011-01-25

申请号：US11851547

申请日：2007-09-07

Applicant: Chia-Pin Chiu

Inventor： Chia-Pin Chiu

IPC: H01L23/48

CPC classification number: H01L23/49805 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/16251 ,  H01L2924/19106 ,  H05K1/0231 ,  H05K1/184 ,  H05K3/3405 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/10325 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10719 ,  Y02P70/611

Abstract: A microelectronic combination and a method of making the combination. The combination includes a package substrate including a substrate body having a peripheral surface and contacts disposed at the peripheral surface; and a surface mount component electrically and mechanically bonded to the contacts.

Abstract translation: 微电子组合和组合方法。 该组合包括：封装基板，包括具有外围表面的基板主体和设置在周边表面的触点; 以及表面安装部件电接触和机械地接合到触头。

公开(公告)号：US20100319974A1

公开(公告)日：2010-12-23

申请号：US12865203

申请日：2009-02-12

Applicant: Naomi Ishizuka

Inventor： Naomi Ishizuka

IPC: H05K1/16 ,  H05K1/11 ,  B32B37/02

CPC classification number: H05K1/0271 ,  H01L24/13 ,  H01L24/16 ,  H01L24/37 ,  H01L24/40 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/37599 ,  H01L2224/81191 ,  H01L2224/8159 ,  H01L2224/816 ,  H01L2224/90 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/00 ,  H05K3/321 ,  H05K3/3421 ,  H05K3/3436 ,  H05K3/3452 ,  H05K13/0465 ,  H05K2201/09845 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2203/0594 ,  Y10T156/10 ,  H01L2224/83851 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/37099 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An electronic device comprises: a printed wiring board that comprises a substrate, pads formed on the substrate, and an insulating film layer covering a surface of the substrate on which the pads are formed; and an electronic element that comprises external terminals electrically connected to the pads and that is mounted on the printed wiring board. The insulating film layer comprises at least one connecting opening section each exposing at least part of one of the pads. At least part of an inner wall of the connecting opening section comprises at least one step section.

Abstract translation: 电子装置包括：印刷布线板，其包括基板，形成在基板上的焊盘和覆盖其上形成焊盘的基板的表面的绝缘膜层; 以及电子元件，其包括电连接到所述焊盘并且安装在所述印刷线路板上的外部端子。 绝缘膜层包括至少一个连接开口部分，每个连接开口部分暴露其中一个焊盘的至少一部分。 连接开口部分的内壁的至少一部分包括至少一个台阶部分。

公开(公告)号：US20100246149A1

公开(公告)日：2010-09-30

申请号：US12718348

申请日：2010-03-05

Applicant: Tomokazu Nakashima ,  Kiyokazu Moriizumi ,  Masayuki Itoh

Inventor： Tomokazu Nakashima ,  Kiyokazu Moriizumi ,  Masayuki Itoh

IPC: H05K7/02 ,  H01R12/02

CPC classification number: H01L23/50 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/642 ,  H01L23/645 ,  H01L24/16 ,  H01L2224/16 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K1/023 ,  H05K1/145 ,  H05K2201/10378 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10719 ,  Y02P70/611

Abstract: A connection member is disposed between a semiconductor package and a printed wiring board. The connection member includes: a base member formed of an insulating material; a plurality of through-holes provided in the base member at corresponding positions between a plurality of first terminal pads of the semiconductor package and a plurality of second terminal pads of the printed wiring board; and an electronic component inserted in the plurality of through-holes, the electronic component having a first electrode and a second electrode at ends thereof, the first electrode connected to one of the first terminal pads, the second electrode connected to one of the second terminal pads.

Abstract translation: 连接构件设置在半导体封装和印刷线路板之间。 连接构件包括：由绝缘材料形成的基底构件; 多个通孔，其设置在所述基底构件中，在所述半导体封装的多个第一端子焊盘与所述印刷电路板的多个第二端子焊盘之间的对应位置处; 以及插入到所述多个通孔中的电子部件，所述电子部件在其端部具有第一电极和第二电极，所述第一电极与所述第一端子焊盘中的一个连接，所述第二电极连接到所述第二端子 垫

公开(公告)号：US07791194B2

公开(公告)日：2010-09-07

申请号：US12101077

申请日：2008-04-10

Applicant: Vadim Gektin ,  David W. Copeland

Inventor： Vadim Gektin ,  David W. Copeland

IPC: H01L23/488

CPC classification number: H05K3/325 ,  B82Y10/00 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/06515 ,  H01L2224/10135 ,  H01L2224/13193 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14505 ,  H01L2224/14515 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/32225 ,  H01L2224/731 ,  H01L2224/73103 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81139 ,  H01L2224/81815 ,  H01L2224/81906 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H05K3/3436 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/10659 ,  H05K2201/10719 ,  H05K2201/2036 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A composite interconnect system includes a plurality of carbon nanotubes, a plurality of solder balls and standoff balls disposed on a first device to provide a connection to a second device. A die-attached substrate includes a substrate and one or more die disposed on the substrate by a die-attach composite interconnect. The die-attach composite interconnect includes a plurality of carbon nanotubes, solder bumps, and standoff balls disposed on the die to provide one or more connections to the substrate. A PCB-attached substrate package includes a substrate package and one or more die disposed on the substrate package. The substrate package is disposed on a PCB by a PCB-attach composite interconnect. The PCB-attach composite interconnect includes a plurality of carbon nanotubes, solder balls, and standoff balls disposed on the substrate package to provide one or more connections to the PCB.

Abstract translation: 复合互连系统包括多个碳纳米管，多个焊球和支撑球，其设置在第一装置上以提供到第二装置的连接。 芯片连接的基板包括基板和通过管芯附着复合互连件设置在基板上的一个或多个管芯。 管芯附着复合互连件包括多个碳纳米管，焊料凸块和设置在管芯上的间隙球，以提供与衬底的一个或多个连接。 附着有PCB的衬底封装包括衬底封装和设置在衬底封装上的一个或多个管芯。 衬底封装通过PCB连接复合互连布置在PCB上。 PCB附着复合互连件包括多个碳纳米管，焊球和设置在衬底封装上的间隙球，以提供与PCB的一个或多个连接。

公开(公告)号：US20100216320A1

公开(公告)日：2010-08-26

申请号：US12799712

申请日：2010-04-30

Applicant: James V. Russell

Inventor： James V. Russell

IPC: H01R13/22

CPC classification number: H01R13/2414 ,  H01R4/58 ,  H01R13/03 ,  H05K3/245 ,  H05K3/326 ,  H05K2201/0314 ,  H05K2201/10719

Abstract: An electrical connector using an isotropic conductive elastomer as the interconnect medium.

公开(公告)号：US20090277677A1

公开(公告)日：2009-11-12

申请号：US12429988

申请日：2009-04-24

Applicant: Joseph C. Fjelstad ,  Nader Gamini ,  David Tichane

Inventor： Joseph C. Fjelstad ,  Nader Gamini ,  David Tichane

IPC: H05K1/18 ,  H05K13/00

CPC classification number: H05K1/185 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24227 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H05K3/1241 ,  H05K2201/10515 ,  H05K2201/10628 ,  H05K2201/10689 ,  H05K2201/10719 ,  H05K2203/0173 ,  H05K2203/1469 ,  Y10T29/49117

Abstract: A system for prototyping electrical circuits, as well as creating production circuits, without using solder. Stand-in electrical components 110a are placed on a carrier 100a and scanned 310. From the resulting data, a machine tool or laser ablation system 410 then creates a negative master 420a with aperture(s) 530 into which production components 810 are placed and secured. Component leads 820 or packages are encapsulated with electrically insulating material 910 with vias 1030a exposing the leads. Traces 1040 connect appropriate leads forming a circuit sub-assembly 1000 which can serve as a basis for a circuit assembly formed through a reverse-interconnection process.

Abstract translation: 用于原型电路的系统，以及创建生产电路，而不使用焊料。 待机电气元件110a被放置在载体100a上并扫描310.根据所得数据，机床或激光烧蚀系统410然后创建具有孔530的负主体420a，生产部件810被放置并固定到其中 。 元件引线820或封装被电绝缘材料910封装，通孔1030a暴露引线。 迹线1040连接形成电路子组件1000的适当导线，其可以用作通过反向互连工艺形成的电路组件的基础。

公开(公告)号：US20090256255A1

公开(公告)日：2009-10-15

申请号：US12101077

申请日：2008-04-10

Applicant: Vadim Gektin ,  David W. Copeland

Inventor： Vadim Gektin ,  David W. Copeland

IPC: H01L23/488

CPC classification number: H05K3/325 ,  B82Y10/00 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/06515 ,  H01L2224/10135 ,  H01L2224/13193 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14505 ,  H01L2224/14515 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/32225 ,  H01L2224/731 ,  H01L2224/73103 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81139 ,  H01L2224/81815 ,  H01L2224/81906 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H05K3/3436 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/10659 ,  H05K2201/10719 ,  H05K2201/2036 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A composite interconnect system includes a plurality of carbon nanotubes, a plurality of solder balls and standoff balls disposed on a first device to provide a connection to a second device. A die-attached substrate includes a substrate and one or more die disposed on the substrate by a die-attach composite interconnect. The die-attach composite interconnect includes a plurality of carbon nanotubes, solder bumps, and standoff balls disposed on the die to provide one or more connections to the substrate. A PCB-attached substrate package includes a substrate package and one or more die disposed on the substrate package. The substrate package is disposed on a PCB by a PCB-attach composite interconnect. The PCB-attach composite interconnect includes a plurality of carbon nanotubes, solder balls, and standoff balls disposed on the substrate package to provide one or more connections to the PCB.

Abstract translation: 复合互连系统包括多个碳纳米管，多个焊球和支撑球，其设置在第一装置上以提供到第二装置的连接。 芯片连接的基板包括基板和通过管芯附着复合互连件设置在基板上的一个或多个管芯。 管芯附着复合互连件包括多个碳纳米管，焊料凸块和设置在管芯上的间隙球，以提供与衬底的一个或多个连接。 附着有PCB的衬底封装包括衬底封装和设置在衬底封装上的一个或多个管芯。 衬底封装通过PCB连接复合互连布置在PCB上。 PCB附着复合互连件包括多个碳纳米管，焊球和设置在衬底封装上的间隙球，以提供与PCB的一个或多个连接。

公开(公告)号：US07569474B2

公开(公告)日：2009-08-04

申请号：US11483015

申请日：2006-07-07

Applicant: Keng Lee Teo ,  Wey Ngee Desmond Chin

Inventor： Keng Lee Teo ,  Wey Ngee Desmond Chin

IPC: H01L21/00 ,  H01L21/44

CPC classification number: H05K3/3478 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K2201/10689 ,  H05K2201/10719 ,  H05K2201/10727 ,  H05K2201/10984 ,  H05K2203/0156 ,  H05K2203/0338 ,  H05K2203/0415 ,  H05K2203/0485 ,  Y10T29/49149 ,  H01L2924/00014

Abstract: A method and apparatus for attaching a module such as a semiconductor device, having an array of contacts arranged thereon in a given pattern to a substrate such as a printed circuit board comprises applying an array of solder blocks to the array of contacts on the module. The module is then positioned on the substrate so that the array of solder blocks contacts the array of contact pads on the substrate. Heat is then applied to reflow the solder blocks to provide mechanical and electrical connection of the module to the substrate.

Abstract translation: 用于将具有以给定图案布置在其上的触点阵列的诸如半导体器件的模块附接到诸如印刷电路板的基板的方法和装置包括将焊料块阵列施加到模块上的触点阵列。 然后将该模块定位在衬底上，使得焊料块阵列接触衬底上的接触焊盘阵列。 然后施加热量以回流焊料块以提供模块与基板的机械和电连接。

公开(公告)号：US07517230B2

公开(公告)日：2009-04-14

申请号：US12131176

申请日：2008-06-02

Applicant: John Lee Colbert ,  Mark Kenneth Hoffmeyer

Inventor： John Lee Colbert ,  Mark Kenneth Hoffmeyer

IPC: H01R12/00

CPC classification number: H01L23/4006 ,  H01L25/0655 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/0058 ,  H05K3/325 ,  H05K7/1061 ,  H05K2201/09036 ,  H05K2201/10409 ,  H05K2201/10719 ,  H05K2201/2009 ,  H01L2924/00

Abstract: An electrical contact assembly includes a first module (21a, 21b, 22) having a first set of electrical contacts, a second module (10) having a second set of electrical contacts, a shape generating module (32, 34, 36), and a clamping arrangement (24, 25, 26, 27, 28, 29) for clamping the first, second and shape generating modules together. The shape generating module (32, 34, 36) imparts a desired shape to the second module (10) for urging the second set of electrical contacts toward the first set of electrical contacts, such that clamping the modules together results in a positive contact force between the first and second sets of electrical contacts that is substantially uniform across the sets of electrical contacts. The shape generating module includes a first insulating layer (34), a second insulating layer (32) and a shape producing layer (36) disposed between the first and second insulating layers. The shape producing layer (36) includes an adhesive that flows and cures upon application of a heat treatment to produce the desired shape.

Abstract translation: 电触头组件包括具有第一组电触点的第一模块（21a，21b，22），具有第二组电触点的第二模块（10），形状产生模块（32,34,36），以及 用于将第一，第二和形状发生模块夹紧在一起的夹紧装置（24,25,26,27,28,29）。 形状产生模块（32,34,36）向第二模块（10）施加期望的形状，用于将第二组电触头推向第一组电触头，使得将模块夹在一起导致正接触力 在第一组和第二组电触点之间，在电接触组之间基本均匀。 形状产生模块包括设置在第一和第二绝缘层之间的第一绝缘层（34），第二绝缘层（32）和形状产生层（36）。 形状产生层（36）包括在施加热处理以产生所需形状时流动和固化的粘合剂。