公开(公告)号：US08652935B2

公开(公告)日：2014-02-18

申请号：US12970529

申请日：2010-12-16

申请人： Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell ,  Vage Oganesian ,  Belgacem Haba

发明人： Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell ,  Vage Oganesian ,  Belgacem Haba

IPC分类号： H01L21/30

CPC分类号： H01L23/562 ,  B81C1/00269 ,  B81C1/00357 ,  H01L21/2007 ,  H01L21/561 ,  H01L21/563 ,  H01L21/568 ,  H01L23/13 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/29186 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/83051 ,  H01L2224/83191 ,  H01L2224/83345 ,  H01L2224/83385 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/1027 ,  H01L2924/1032 ,  H01L2924/1037 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/3511 ,  H01L2224/83 ,  H01L2924/00

摘要： A method of bonding first and second microelectronic elements includes pressing together a first substrate containing active circuit elements therein with a second substrate, with a flowable dielectric material between confronting surfaces of the respective substrates, each of the first and second substrates having a coefficient of thermal expansion less than 10 parts per million/° C., at least one of the confronting surfaces having a plurality of channels extending from an edge of such surface, such that the dielectric material between planes defined by the confronting surfaces is at least substantially free of voids and has a thickness over one micron, and at least some of the dielectric material flows into at least some of the channels.

摘要翻译： 接合第一和第二微电子元件的方法包括将含有有源电路元件的第一衬底与第二衬底压在一起，在相应衬底的相对表面之间具有可流动介电材料，第一和第二衬底中的每一个具有热系数 膨胀小于10ppm /℃，至少一个相对表面具有从该表面的边缘延伸的多个通道，使得由相对表面限定的平面之间的电介质材料至少基本上不含 空隙并且具有超过一微米的厚度，并且至少一些介电材料流入至少一些通道。

公开(公告)号：US08610260B2

公开(公告)日：2013-12-17

申请号：US13439299

申请日：2012-04-04

申请人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

发明人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

IPC分类号： H01L23/48

CPC分类号： H01L23/49838 ,  G11C5/04 ,  G11C5/063 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/3171 ,  H01L23/48 ,  H01L23/4824 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/52 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L27/108 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05554 ,  H01L2224/05569 ,  H01L2224/0557 ,  H01L2224/06156 ,  H01L2224/06164 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81447 ,  H01L2224/81805 ,  H01L2224/9202 ,  H01L2225/06506 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1064 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/3011 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package can include a substrate and a microelectronic element having a face and one or more columns of contacts thereon which face and are joined to corresponding contacts on a surface of the substrate. An axial plane may intersect the face along a line in the first direction and centered relative to the columns of element contacts. Columns of package terminals can extend in the first direction. First terminals in a central region of the second surface can be configured to carry address information usable to determine an addressable memory location within the microelectronic element. The central region may have a width not more than three and one-half times a minimum pitch between the columns of package terminals. The axial plane can intersect the central region.

摘要翻译： 微电子封装可以包括衬底和微电子元件，其具有面和在其上的一个或多个接触柱，其面对并连接到衬底的表面上的对应接触。 轴向平面可以沿着第一方向的线与面相交，并且相对于元件触点的列居中。 封装端子的列可以沿第一方向延伸。 可以将第二表面的中心区域中的第一端子配置为携带可用于确定微电子元件内的可寻址存储器位置的地址信息。 中心区域可以具有不大于封装端子列之间的最小间距的三倍和五倍的宽度。 轴向平面可以与中心区域相交。

公开(公告)号：US08610259B2

公开(公告)日：2013-12-17

申请号：US12884695

申请日：2010-09-17

申请人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Piyush Savalia

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Piyush Savalia

IPC分类号： H01L23/48

CPC分类号： H01L23/49827 ,  H01L21/6835 ,  H01L23/481 ,  H01L23/49838 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2223/6622 ,  H01L2224/05009 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/0557 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/06181 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00

摘要： A microelectronic unit includes a semiconductor element consisting essentially of semiconductor material and having a front surface, a rear surface, a plurality of active semiconductor devices adjacent the front surface, a plurality of conductive pads exposed at the front surface, and an opening extending through the semiconductor element. At least one of the conductive pads can at least partially overlie the opening and can be electrically connected with at least one of the active semiconductor devices. The microelectronic unit can also include a first conductive element exposed at the rear surface for connection with an external component, the first conductive element extending through the opening and electrically connected with the at least one conductive pad, and a second conductive element extending through the opening and insulated from the first conductive element. The at least one conductive pad can overlie a peripheral edge of the second conductive element.

摘要翻译： 微电子单元包括基本上由半导体材料组成的半导体元件，其具有前表面，后表面，与前表面相邻的多个有源半导体器件，在前表面暴露的多个导电焊盘，以及延伸穿过 半导体元件。 至少一个导电焊盘可以至少部分地覆盖开口并且可以与至少一个有源半导体器件电连接。 微电子单元还可以包括暴露在后表面处以与外部部件连接的第一导电元件，第一导电元件延伸穿过开口并与至少一个导电焊盘电连接，第二导电元件延伸穿过开口 并与第一导电元件绝缘。 至少一个导电焊盘可以覆盖在第二导电元件的周边边缘上。

公开(公告)号：US20130328186A1

公开(公告)日：2013-12-12

申请号：US13492064

申请日：2012-06-08

申请人： Cyprian Emeka Uzoh ,  Charles G. Woychik ,  Terrence Caskey ,  Kishor V. Desai ,  Huailiang Wei ,  Craig Mitchell ,  Belgacem Haba

发明人： Cyprian Emeka Uzoh ,  Charles G. Woychik ,  Terrence Caskey ,  Kishor V. Desai ,  Huailiang Wei ,  Craig Mitchell ,  Belgacem Haba

IPC分类号： H01L23/48 ,  H01L21/28 ,  H01L23/498

CPC分类号： H01L23/34 ,  H01L21/76841 ,  H01L21/76883 ,  H01L21/76885 ,  H01L21/76898 ,  H01L23/147 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05558 ,  H01L2224/05567 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13184 ,  H01L2224/13565 ,  H01L2224/32105 ,  H01L2924/00011 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/81805

摘要： A component can include a substrate and a conductive via extending within an opening in the substrate. The substrate can have first and second opposing surfaces. The opening can extend from the first surface towards the second surface and can have an inner wall extending away from the first surface. A dielectric material can be exposed at the inner wall. The conductive via can define a relief channel within the opening adjacent the first surface. The relief channel can have an edge within a first distance from the inner wall in a direction of a plane parallel to and within five microns below the first surface, the first distance being the lesser of one micron and five percent of a maximum width of the opening in the plane. The edge can extend along the inner wall to span at least five percent of a circumference of the inner wall.

摘要翻译： 部件可以包括在基板的开口内延伸的基板和导电通孔。 基底可以具有第一和第二相对表面。 开口可以从第一表面延伸到第二表面，并且可以具有远离第一表面延伸的内壁。 电介质材料可以在内壁暴露。 导电通孔可以在邻近第一表面的开口内限定释放通道。 释放通道可以具有在与第一表面平行且在五微米以内的平面的方向上离内壁的第一距离内的边缘，第一距离是最小宽度的一微米和百分之五的最小宽度 在飞机上开了 边缘可以沿着内壁延伸以跨越内壁的圆周的至少百分之五。

公开(公告)号：US08604348B2

公开(公告)日：2013-12-10

申请号：US13155825

申请日：2011-06-08

申请人： Yoichi Kubota ,  Teck-Gyu Kang ,  Jae M. Park ,  Belgacem Haba

发明人： Yoichi Kubota ,  Teck-Gyu Kang ,  Jae M. Park ,  Belgacem Haba

IPC分类号： H05K1/00 ,  H05K1/16

CPC分类号： H05K1/0366 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/49175 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/1532 ,  H05K3/06 ,  H05K3/4007 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2203/063 ,  H05K2203/0733 ,  Y10T29/49126 ,  Y10T29/49156 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of the dielectric layer, the pads being connected to the posts by the traces. The dielectric element overlies the front surface of a microelectronic element, and contacts (74) exposed on the front surface of the microelectronic element are connected to the pads by elongated leads (76) such as wire bonds. Methods of making the connection component are also disclosed.

摘要翻译： 封装的微电子元件包括连接部件，其包括承载远离外表面（26）的迹线（58）的介电层（22），从该迹线延伸并突出超过电介质外表面的柱（48） ）暴露在介电层的外表面处，焊盘通过迹线连接到柱。 电介质元件覆盖在微电子元件的前表面上，暴露在微电子元件的前表面上的触点（74）通过诸如引线键的细长引线（76）连接到焊盘。 还公开了制造连接部件的方法。

公开(公告)号：US08581377B2

公开(公告)日：2013-11-12

申请号：US12883556

申请日：2010-09-16

申请人： Belgacem Haba ,  Brian Marcucci

发明人： Belgacem Haba ,  Brian Marcucci

IPC分类号： H01L23/495

CPC分类号： H01L24/89 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49555 ,  H01L23/49589 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/4826 ,  H01L2224/49109 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A semiconductor device of an illustrative embodiment includes a die, a lead frame including a plurality of leads having substantial portions arranged in a lead plane and electrically connected to the die. Most preferably, the package includes at least a substantial portion of one conductive element arranged in a plane positioned adjacent the lead frame and substantially parallel to the lead plane, the conductive element being capacitively coupled to the leads such that the conductive element and at least one of the leads cooperatively define a controlled-impedance conduction path, and an encapsulant which encapsulates the leads and the conductive element. The leads and, desirably, the conductive element have respective connection regions which are not covered by the encapsulant.

摘要翻译： 示例性实施例的半导体器件包括管芯，引线框架，其包括多个引线，其具有布置在引线平面中并且电连接到管芯的实质部分。 最优选地，封装包括布置在邻近引线框架并且基本上平行于引线平面的平面中的一个导电元件的至少大部分，导电元件电容耦合到引线，使得导电元件和至少一个 引线协调地限定受控阻抗传导路径，以及密封剂，其封装引线和导电元件。 引线和理想的导电元件具有不被密封剂覆盖的各自的连接区域。

公开(公告)号：US08525327B2

公开(公告)日：2013-09-03

申请号：US13439286

申请日：2012-04-04

申请人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

发明人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

IPC分类号： H01L23/34 ,  H01L23/498

CPC分类号： H01L23/49838 ,  G11C5/04 ,  G11C5/063 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/3171 ,  H01L23/48 ,  H01L23/4824 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/52 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L27/108 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05554 ,  H01L2224/05569 ,  H01L2224/0557 ,  H01L2224/06156 ,  H01L2224/06164 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81447 ,  H01L2224/81805 ,  H01L2224/9202 ,  H01L2225/06506 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1064 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/3011 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package can include a substrate and a microelectronic element having a face and one or more columns of contacts thereon which face and are joined to corresponding contacts on a surface of the substrate. An axial plane may intersect the face along a line in the first direction and centered relative to the columns of element contacts. Columns of package terminals can extend in the first direction. First terminals in a central region of the second surface can be configured to carry address information usable to determine an addressable memory location within the microelectronic element. The central region may have a width not more than three and one-half times a minimum pitch between the columns of package terminals. The axial plane can intersect the central region.

公开(公告)号：US08512491B2

公开(公告)日：2013-08-20

申请号：US12974611

申请日：2010-12-21

申请人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

IPC分类号： B32B41/00

CPC分类号： H01L22/12 ,  H01L21/67092

摘要： A method of bonding a first substrate and a second substrate includes the steps of rotating first substrate with an adhesive mass thereon, and second substrate contacting the mass and overlying the first substrate, controlling a vertical height of a heated control platen spaced apart from and not contacting the second substrate so as to control a temperature of the adhesive mass, so as to at least one of bond the first and second substrates in alignment with one another, or achieve a sufficiently planar adhesive interface between the first and second substrates.

摘要翻译： 接合第一基板和第二基板的方法包括以下步骤：使第一基板与其上的粘合剂质量物质旋转，第二基板接触物料并覆盖第一基板，控制加热的控制台板的垂直高度， 使所述第二基板接触以控制所述粘合剂物料的温度，以便使所述第一和第二基板彼此对准的至少一个接合，或在所述第一和第二基板之间实现足够平坦的粘合界面。

公开(公告)号：US08476774B2

公开(公告)日：2013-07-02

申请号：US13316890

申请日：2011-12-12

申请人： Belgacem Haba ,  Ilyas Mohammed ,  Vage Oganesian ,  David Ovrutsky ,  Laura Wills Mirkarimi

发明人： Belgacem Haba ,  Ilyas Mohammed ,  Vage Oganesian ,  David Ovrutsky ,  Laura Wills Mirkarimi

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L21/78 ,  H01L21/6835 ,  H01L23/5382 ,  H01L24/24 ,  H01L24/48 ,  H01L24/82 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68377 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/9202 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A microelectronic assembly includes first and second stacked microelectronic elements, each having spaced apart traces extending along a front face and beyond at least a first edge thereof. An insulating region can contact the edges of each microelectronic element and at least portions of the traces of each microelectronic element extending beyond the respective first edges. The insulating region can define first and second side surfaces adjacent the first and second edges of the microelectronic elements. A plurality of spaced apart openings can extend along a side surface of the microelectronic assembly. Electrical conductors connected with respective traces can have portions disposed in respective openings and extending along the respective openings. The electrical conductors may extend to pads or solder balls overlying a face of one of the microelectronic elements.

摘要翻译： 微电子组件包括第一和第二堆叠的微电子元件，每个微电子元件具有沿前表面延伸并且至少其第一边缘延伸的间隔开的迹线。 绝缘区域可以接触每个微电子元件的边缘，并且每个微电子元件的迹线的至少部分延伸超过相应的第一边缘。 绝缘区域可以限定与微电子元件的第一和第二边缘相邻的第一和第二侧表面。 多个间隔开的开口可以沿着微电子组件的侧表面延伸。 与相应迹线连接的电导体可以具有设置在相应开口中并沿相应开口延伸的部分。 电导体可以延伸到覆盖在微电子元件中的一个的表面上的焊盘或焊球。

公开(公告)号：US08466542B2

公开(公告)日：2013-06-18

申请号：US12723039

申请日：2010-03-12

申请人： Moshe Kriman ,  Osher Avsian ,  Belgacem Haba ,  Giles Humpston ,  Dmitri Burshtyn

发明人： Moshe Kriman ,  Osher Avsian ,  Belgacem Haba ,  Giles Humpston ,  Dmitri Burshtyn

IPC分类号： H01L23/48 ,  H01L23/02 ,  H01L29/40

CPC分类号： H01L25/0657 ,  H01L21/76805 ,  H01L23/481 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/0401 ,  H01L2224/13024 ,  H01L2224/24145 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2924/1461 ,  H01L2924/00

摘要： A stacked microelectronic assembly is provided which includes first and second stacked microelectronic elements. Each of the first and second microelectronic elements can include a conductive layer extending along a face of such microelectronic element. At least one of the first and second microelectronic elements can include a recess extending from the rear surface towards the front surface, and a conductive via extending from the recess through the bond pad and electrically connected to the bond pad, with a conductive layer connected to the via and extending along a rear face of the microelectronic element towards an edge of the microelectronic element. A plurality of leads can extend from the conductive layers of the first and second microelectronic elements and a plurality of terminals of the assembly can be electrically connected with the leads.

摘要翻译： 提供堆叠的微电子组件，其包括第一和第二堆叠的微电子元件。 第一和第二微电子元件中的每一个可以包括沿着这种微电子元件的表面延伸的导电层。 第一和第二微电子元件中的至少一个可以包括从后表面朝向前表面延伸的凹部，以及从凹槽穿过接合焊盘延伸并电连接到接合焊盘的导电通孔，导电层连接到 所述通孔沿着所述微电子元件的后表面朝向所述微电子元件的边缘延伸。 多个引线可以从第一和第二微电子元件的导电层延伸，并且组件的多个端子可以与引线电连接。