公开(公告)号：US20140138818A1

公开(公告)日：2014-05-22

申请号：US13977663

申请日：2011-12-31

申请人： Alexsandar Aleksov ,  Tony Dambrauskas ,  Danish Faruqui ,  Mark S. Hlad ,  Edward R. Prack

发明人： Alexsandar Aleksov ,  Tony Dambrauskas ,  Danish Faruqui ,  Mark S. Hlad ,  Edward R. Prack

IPC分类号： H01L21/02 ,  H01L23/498 ,  H01L21/56

CPC分类号： H01L24/11 ,  H01L21/02118 ,  H01L21/02263 ,  H01L21/0234 ,  H01L21/0271 ,  H01L21/0273 ,  H01L21/31144 ,  H01L21/3205 ,  H01L21/563 ,  H01L21/6835 ,  H01L21/76883 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/3142 ,  H01L23/49894 ,  H01L24/05 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68304 ,  H01L2221/68327 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/05647 ,  H01L2224/1147 ,  H01L2224/11474 ,  H01L2224/1148 ,  H01L2224/1162 ,  H01L2224/11849 ,  H01L2224/1191 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16057 ,  H01L2224/16058 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/73204 ,  H01L2224/81011 ,  H01L2224/81024 ,  H01L2224/81026 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81207 ,  H01L2224/81375 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/81913 ,  H01L2224/831 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/3841 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/05552

摘要： Electronic assemblies and their manufacture are described. One embodiment relates to a method including depositing an organic thin film layer on metal bumps on a semiconductor wafer, the organic thin film layer also being formed on a surface adjacent to the metal bumps on the wafer. The wafer is diced into a plurality of semiconductor die structures, the die structures including the organic thin film layer. The semiconductor die structures are attached to substrates, wherein the attaching includes forming a solder bond between the metal bumps on a die structure and bonding pads on a substrate, and wherein the solder bond extends through the organic thin film layer. The organic thin film layer is then exposed to a plasma. Other embodiments are described and claimed.

摘要翻译： 描述了电子组件及其制造。 一个实施例涉及一种方法，包括在半导体晶片上的金属凸块上沉积有机薄膜层，该有机薄膜层也形成在与晶片上的金属凸块相邻的表面上。 将晶片切割成多个半导体管芯结构，该管芯结构包括有机薄膜层。 半导体管芯结构附着到基板上，其中，附接包括在管芯结构上的金属凸块和衬底上的焊盘之间形成焊料接合，并且其中焊料接合延伸穿过有机薄膜层。 然后将有机薄膜层暴露于等离子体。 描述和要求保护其他实施例。

公开(公告)号：US20190103377A1

公开(公告)日：2019-04-04

申请号：US15720480

申请日：2017-09-29

申请人： Lilia May ,  Edward R. Prack

发明人： Lilia May ,  Edward R. Prack

IPC分类号： H01L23/00 ,  H01L21/48 ,  H01L21/50 ,  H01L23/538

摘要： Methods/structures of joining package structures are described. Those methods/structures may include forming a metal formate on a surface of a first solder interconnect structure disposed on a first package substrate at a first temperature, and attaching a second solder interconnect structure disposed on a second package substrate to the first solder interconnect structure at a second temperature. The second temperature decomposes at least a portion of the metal formate and generates a hydrogen gas. The generated hydrogen gas removes an oxide from the second solder interconnect structure during joint formation at the second temperature.

公开(公告)号：US20150255415A1

公开(公告)日：2015-09-10

申请号：US14198479

申请日：2014-03-05

申请人： Thomas J. De Bonis ,  Lilia May ,  Rajen S. Sidhu ,  Mukul P. Renavikar ,  Ashay A. Dani ,  Edward R. Prack ,  Carl L. Deppisch ,  Anna M. Prakash ,  James C. Matayabas, JR. ,  Jason Jieping Zhang ,  Srinivasa R. Aravamudhan ,  Chang Lin

发明人： Thomas J. De Bonis ,  Lilia May ,  Rajen S. Sidhu ,  Mukul P. Renavikar ,  Ashay A. Dani ,  Edward R. Prack ,  Carl L. Deppisch ,  Anna M. Prakash ,  James C. Matayabas, JR. ,  Jason Jieping Zhang ,  Srinivasa R. Aravamudhan ,  Chang Lin

IPC分类号： H01L23/00 ,  H01L25/065 ,  H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H01L21/768

CPC分类号： H01L23/49816 ,  H01L21/4853 ,  H01L21/565 ,  H01L21/76802 ,  H01L23/3128 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/17 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/13023 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/37001 ,  H01L2924/00

摘要： An apparatus is described that includes a substrate and a mold compound disposed on the substrate. The semiconductor die is embedded within the mold compound and is electrically coupled to lands on the substrate. Solder balls are disposed around the semiconductor die on the substrate. Each of the solder balls have a solid coating thereon. The solid coating contains a cleaning agent to promote its solder ball's coalescence with another solder ball. Respective vias are formed in the mold compound that expose the solder balls and their respective solid coatings. In combined or alternate embodiments outer edges of the mold compound have smaller thickness than regions of the mold compound between the vias and the semiconductor die. In combined or alternate embodiments micro-channels exist between the solder balls and the mold compound.

摘要翻译： 描述了一种包括设置在基板上的基板和模具化合物的装置。 半导体管芯被嵌入在模具化合物内并且电耦合到衬底上的焊盘。 焊球围绕半导体管芯设置在基板上。 每个焊球上都有一个固体涂层。 固体涂层含有一种清洁剂，以促进其焊球与另一种焊球的聚结。 在模具化合物中形成了暴露焊球及其各自固体涂层的通孔。 在组合或替代实施例中，模具化合物的外边缘具有比通孔和半导体管芯之间的模具化合物区域更小的厚度。 在组合或替代实施例中，焊料球与模具化合物之间存在微通道。

公开(公告)号：US20150187622A1

公开(公告)日：2015-07-02

申请号：US14142761

申请日：2013-12-28

申请人： John C. JOHNSON ,  Sandeep B. SANE ,  Sandeep RAZDAN ,  Edward R. PRACK ,  Leonel R. ARANA ,  Peter A. DAVISON ,  Eric J. MORET ,  Lawrence M. PALANUK ,  Gregory A. STONE

发明人： John C. JOHNSON ,  Sandeep B. SANE ,  Sandeep RAZDAN ,  Edward R. PRACK ,  Leonel R. ARANA ,  Peter A. DAVISON ,  Eric J. MORET ,  Lawrence M. PALANUK ,  Gregory A. STONE

IPC分类号： H01L21/677 ,  H05K13/00 ,  H01L21/687 ,  H01L21/78 ,  H01L21/683

CPC分类号： H01L21/67333 ,  H01L21/67265 ,  H01L21/67309 ,  H01L21/67356 ,  H01L21/67363 ,  H01L21/67383 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67778 ,  H01L21/68 ,  H01L21/6833 ,  H01L21/68764 ,  H01L21/68771 ,  H01L21/78 ,  H05K13/0084

摘要： A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.

摘要翻译： 一种方法包括识别晶片上的多个管芯的晶片位置，将多个管芯中的每个管芯的晶片位置存储在数据库中，将晶片切割成多个单个管芯，将每个单模管芯定位在管芯中 在托盘上的位置位置，并将模具位置存储在数据库中的每个单个模具的托盘上。 数据库包括包括与每个模具位置相关联的晶片位置的信息。 托盘被运送到处理工具，并且多个分割模具中的至少一个从托盘上的模具位置移除并在处理工具中进行处理。 在处理之前，单独模具位于托盘上的相同的限定位置处理被处理的单个模具。 描述和要求保护其他实施例。

公开(公告)号：US20150072479A1

公开(公告)日：2015-03-12

申请号：US14021938

申请日：2013-09-09

申请人： Rajendra C. Dias ,  Lars D. Skoglund ,  Anil R. Indluru ,  Edward R. Prack ,  Danish Faruqui ,  Tyler N. Osborn ,  Amram Eitan ,  Timothy A. Gosselin

发明人： Rajendra C. Dias ,  Lars D. Skoglund ,  Anil R. Indluru ,  Edward R. Prack ,  Danish Faruqui ,  Tyler N. Osborn ,  Amram Eitan ,  Timothy A. Gosselin

IPC分类号： H01L21/56

CPC分类号： H01L21/56 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/563 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/13 ,  H01L2021/60022 ,  H01L2224/0391 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/05647 ,  H01L2224/11332 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1146 ,  H01L2224/1148 ,  H01L2224/11849 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/94 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2224/11 ,  H01L2924/00012 ,  H01L2924/014

摘要： Introducing an underfill material over contact pads on a surface of an integrated circuit substrate; and ablating the introduced underfill material to expose an area of the contact pads using temporally coherent electromagnetic radiation. A method including first ablating an underfill material to expose an area of contact pads on a substrate using temporally coherent electromagnetic radiation; introducing a solder to the exposed area of the contact pads; and second ablating the underfill material using temporally coherent electromagnetic radiation. A method including introducing an underfill material over contact pads on a surface of an integrated circuit substrate; defining an opening in the underfill material to expose an area of the contact pads using temporally coherent electromagnetic radiation; introducing a solder material to the exposed area of the contact pads; and after introducing the solder, removing the sacrificial material.

摘要翻译： 在集成电路基板的表面上的接触焊盘上引入底部填充材料; 并且消融所引入的底部填充材料以使用时间相干的电磁辐射来暴露接触焊盘的区域。 一种方法，包括首先使用时间相干电磁辐射烧蚀底部填充材料以暴露衬底上接触焊盘的区域; 向焊盘的暴露区域引入焊料; 并且使用时间相干的电磁辐射第二次消融底部填充材料。 一种方法，包括在集成电路基板的表面上的接触焊盘上引入底部填充材料; 在底部填充材料中限定开口以使用时间上相干的电磁辐射暴露接触垫的区域; 将焊料材料引入到接触焊盘的暴露区域; 并且在引入焊料之后，去除牺牲材料。

公开(公告)号：US08466559B2

公开(公告)日：2013-06-18

申请号：US12972161

申请日：2010-12-17

申请人： Rahul N. Manepalli ,  Mohit Mamodia ,  Dingying Xu ,  Javier S. Gonzalez ,  Edward R. Prack

发明人： Rahul N. Manepalli ,  Mohit Mamodia ,  Dingying Xu ,  Javier S. Gonzalez ,  Edward R. Prack

IPC分类号： H01L23/48

CPC分类号： H01L25/50 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/24 ,  H01L25/0657 ,  H01L2225/06527 ,  H01L2924/10253 ,  H01L2924/10523 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

摘要： Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a patterned die backside film (DBF) on a backside of a die, wherein the patterned DBF comprises an opening surrounding at least one through silicon via (TSV) pad disposed on the backside of the die.

公开(公告)号：US07462551B2

公开(公告)日：2008-12-09

申请号：US11241499

申请日：2005-09-30

申请人： Sudhakar N. Kulkarni ,  Leonel R. Arana ,  Edward R. Prack

发明人： Sudhakar N. Kulkarni ,  Leonel R. Arana ,  Edward R. Prack

IPC分类号： H01L21/30 ,  H01L21/46

CPC分类号： H01L21/78 ,  H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

摘要： In some embodiments, an adhesive system for supporting thin silicon wafer is presented. In this regard, a method is introduced to bond a silicon wafer to a translucent carrier through the use of an adhesive. Other embodiments are also disclosed and claimed.

摘要翻译： 在一些实施例中，呈现用于支撑薄硅晶片的粘合系统。 在这方面，引入了通过使用粘合剂将硅晶片粘合到半透明载体上的方法。 还公开并要求保护其他实施例。

公开(公告)号：US06646347B2

公开(公告)日：2003-11-11

申请号：US09998507

申请日：2001-11-30

申请人： Lei L. Mercado ,  Vijay Sarihan ,  Young Sir Chung ,  James Jen-Ho Wang ,  Edward R. Prack

发明人： Lei L. Mercado ,  Vijay Sarihan ,  Young Sir Chung ,  James Jen-Ho Wang ,  Edward R. Prack

IPC分类号： H01L2348

CPC分类号： H01L24/12 ,  H01L23/3171 ,  H01L23/3192 ,  H01L23/5329 ,  H01L24/05 ,  H01L24/11 ,  H01L24/48 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05082 ,  H01L2224/05599 ,  H01L2224/05609 ,  H01L2224/05611 ,  H01L2224/05618 ,  H01L2224/05623 ,  H01L2224/05644 ,  H01L2224/0566 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/0567 ,  H01L2224/05671 ,  H01L2224/05679 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/1411 ,  H01L2224/48091 ,  H01L2224/48463 ,  H01L2224/85207 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/05042 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2224/45099 ,  H01L2924/00

摘要： In accordance with one embodiment, a stress buffer (40) is formed between a power metal structure (90) and passivation layer (30). The stress buffer (40) reduces the effects of stress imparted upon the passivation layer (30) by the power metal structure (90). In accordance with an alternative embodiment, a power metal structure (130A) is partitioned into segments (1091), whereby electrical continuity is maintained between the segments (1090) by remaining portions of a seed layer (1052) and adhesion/barrier layer (1050). The individual segments (1090) impart a lower peak stress than a comparably sized continuous power metal structure (9).

公开(公告)号：US20150270235A1

公开(公告)日：2015-09-24

申请号：US14218767

申请日：2014-03-18

申请人： Mihir A. Oka ,  Edward R. Prack ,  Dingying Xu ,  Saikumar Jayaraman

发明人： Mihir A. Oka ,  Edward R. Prack ,  Dingying Xu ,  Saikumar Jayaraman

IPC分类号： H01L23/00 ,  C09D179/04 ,  C08K11/00 ,  C09D181/04 ,  C09D179/08 ,  H01L21/02 ,  C09D125/02

CPC分类号： H01L24/11 ,  C08G73/22 ,  C09D5/20 ,  C09D7/63 ,  C09D179/04 ,  C09D179/08 ,  C09D181/04 ,  H01L21/02112 ,  H01L21/02118 ,  H01L21/02282 ,  H01L21/02318 ,  H01L21/31127 ,  H01L24/13 ,  H01L2224/05568 ,  H01L2224/11009 ,  H01L2224/11332 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/11849 ,  H01L2224/13023 ,  H01L2924/095 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00 ,  C08L83/04

摘要： Techniques are disclosed for protecting a surface using a dry-removable protective coating that does not require chemical solutions to be removed. In an embodiment, a protective layer is disposed on a surface. The protective layer is composed of one layer that adheres to the surface. The surface is then processed while the protective coating is on the surface. Thereafter, the protective layer is removed from the surface by separating the protective layer away from the surface without the use of chemical solutions.

摘要翻译： 公开了用于使用不需要除去化学溶液的可干燥去除的保护涂层来保护表面的技术。 在一个实施例中，保护层设置在表面上。 保护层由附着在表面上的一层组成。 然后在表面上保护表面进行处理。 此后，通过将保护层从表面分离而不使用化学溶液，从表面除去保护层。

公开(公告)号：US08674519B2

公开(公告)日：2014-03-18

申请号：US12971765

申请日：2010-12-17

申请人： Leonel R. Arana ,  Edward R. Prack ,  Robert M. Nickerson

发明人： Leonel R. Arana ,  Edward R. Prack ,  Robert M. Nickerson

IPC分类号： H01L23/48

CPC分类号： H01L24/49 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4911 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/1517 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/15153 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/0401

摘要： A microelectronic package includes a substrate (110, 210), an interposer (120, 220) having a first surface (121) and an opposing second surface (122), a microelectronic die (130, 230) attached to the substrate, and a mold compound (140) over the substrate. The interposer is electrically connected to the substrate using a wirebond (150). The first surface of the interposer is physically connected to the substrate with an adhesive (160), and the second surface has an electrically conductive contact (126) formed therein. The mold compound completely encapsulates the wirebond and partially encapsulates the interposer such that the electrically conductive contact in the second surface of the interposer remains uncovered by the mold compound.

摘要翻译： 微电子封装包括衬底（110,210），具有第一表面（121）和相对的第二表面（122）的中介层（120,220），附接到衬底的微电子管芯（130,230），以及 模制化合物（140）。 插入器使用引线键（150）与衬底电连接。 插入器的第一表面用粘合剂（160）物理连接到基板，并且第二表面具有形成在其中的导电触点（126）。 模具化合物完全包封引线键并部分地封装插入件，使得插入件的第二表面中的导电接触件保持未被模具化合物覆盖。