公开(公告)号：US4001049A

公开(公告)日：1977-01-04

申请号：US585924

申请日：1975-06-11

申请人： John E. Baglin ,  Thomas H. DiStefano ,  King-Ning Tu

发明人： John E. Baglin ,  Thomas H. DiStefano ,  King-Ning Tu

IPC分类号： H01L21/265 ,  C03C23/00 ,  H01L21/28 ,  H01L21/3115 ,  H01L21/316 ,  H01L29/51

CPC分类号： H01L21/28185 ,  C03C23/0055 ,  H01L21/31155 ,  H01L29/51 ,  Y10S438/91

摘要： It has been discovered for the practice of this disclosure that a particular ion radiation treatment of amorphous SiO.sub.2 thin film, with a subsequent annealing procedure, improves the dielectric breakdown property of the film. The treated SiO.sub.2 film is found to be substantially more dense than a comparable untreated SiO.sub.2 film. It is theorized for the practice of this disclosure that the physical mechanism which produces the densification of the SiO.sub.2 film may be responsible for the enhanced dielectric properties of the film. Such an improved film is especially useful as the gate insulator layer in an insulated-gate electrode field-effect transistor device, and as an insulating layer for electrically separating two metallic films in a thin film integrated circuit. Such SiO.sub.2 thin films are useful in integrated circuit technology because the electrical insulation property thereof is considerably improved, e.g., in metal-oxide-semiconductor field effect devices in which the gate insulation is relatively thin, e.g. less than 500A, and in metallic magnetic-bubble devices in which a thin SiO.sub.2 layer is used to separate the sense element from the conductive magnetic film.

公开(公告)号：US07271481B2

公开(公告)日：2007-09-18

申请号：US11441976

申请日：2006-05-26

申请人： Igor Y. Khandros ,  Thomas H. DiStefano

发明人： Igor Y. Khandros ,  Thomas H. DiStefano

IPC分类号： H01L23/48 ,  H01L23/04

CPC分类号： H01L22/32 ,  H01L21/6836 ,  H01L21/822 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3164 ,  H01L23/485 ,  H01L23/49805 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49861 ,  H01L24/27 ,  H01L24/48 ,  H01L24/81 ,  H01L25/16 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/05599 ,  H01L2224/16145 ,  H01L2224/274 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/81801 ,  H01L2224/8547 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06579 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic component comprising a dielectric layer having an opening and leads extending across the opening is disclosed. The leads have an offset portion. A method of making a microelectronic assembly comprises connecting each of the leads to a contact on a microelectronic element. A semiconductor chip assembly has a microelectronic component with an opening and leads extending across the opening. The leads are connected to contacts on a semiconductor chip and have at least one twisted portion.

摘要翻译： 公开了一种微电子部件，其包括具有开口的介电层和延伸穿过开口的引线。 导线具有偏移部分。 制造微电子组件的方法包括将每个引线连接到微电子元件上的触点。 半导体芯片组件具有具有开口的微电子部件，并且穿过开口延伸引线。 引线连接到半导体芯片上的触点，并具有至少一个扭绞部分。

公开(公告)号：US07152311B2

公开(公告)日：2006-12-26

申请号：US10032886

申请日：2001-12-26

申请人： Masud Beroz ,  Thomas H. DiStefano ,  Matthew T. Hendrickson ,  David Light ,  John W. Smith

发明人： Masud Beroz ,  Thomas H. DiStefano ,  Matthew T. Hendrickson ,  David Light ,  John W. Smith

IPC分类号： B23P19/04

CPC分类号： H01L24/86 ,  B29C2043/5825 ,  H01L21/67144 ,  H01L2224/7965 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/30105 ,  Y10S269/909 ,  Y10T29/53265 ,  Y10T29/53435 ,  Y10T428/23 ,  Y10T428/239 ,  H01L2924/00

摘要： A flexible sheet used in manufacture of microelectronic components is held on a frame formed from a rigid material so that the frame maintains the sheet under tension during processing and thereby stabilizes the dimensions of the sheet. The frame may be formed from a rigid, light-transmissive material such as a glass, and the bond between the frame and sheet may be made or released by light transmitted through the frame. Preferred features of the framed sheet minimize entrapment of processing liquids such as etch solutions, thereby minimizing carryover of processing solutions between steps. The frame may have contact openings which permit engagement of a metallic layer on the sheet by an electrode carrying electroplating or etching current without disturbing the main portion of the sheet where features are to be formed or treated.

公开(公告)号：US06978538B2

公开(公告)日：2005-12-27

申请号：US10658941

申请日：2003-09-10

申请人： Thomas H. DiStefano ,  Joseph Fjelstad

发明人： Thomas H. DiStefano ,  Joseph Fjelstad

IPC分类号： H01L23/498 ,  H01L23/538 ,  H01R12/51 ,  H05K1/03 ,  H05K1/11 ,  H05K3/46 ,  H05K3/36

CPC分类号： H05K3/462 ,  H01L23/49827 ,  H01L23/5385 ,  H01L2924/0002 ,  H01R12/523 ,  H01R12/714 ,  H01R13/2414 ,  H01R43/0256 ,  H05K1/0272 ,  H05K1/036 ,  H05K1/056 ,  H05K1/116 ,  H05K3/0032 ,  H05K3/326 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0195 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0554 ,  H05K2203/0582 ,  H05K2203/135 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1744 ,  H01L2924/00

摘要： A microelectronic interposer is made by providing a sacrificial layer over the surface of a planar body. Apertures are formed passing through the body and the sacrificial layer. A layer of an electrically conductive structural material is deposited in each of the apertures and over the sacrificial layer, proximate to each aperture to thereby form contacts. The sacrificial layer is removed leaving the contacts with outwardly flaring peripheral portions spaced vertically above the surface of the planar body.

摘要翻译： 通过在平面体的表面上设置牺牲层来制造微电子插入器。 形成穿过身体和牺牲层的孔。 一层导电结构材料沉积在每个孔中并在牺牲层上方，靠近每个孔，从而形成接触。 去除牺牲层，留下接触件，其外部扩张的外围部分在平面体的表面上方垂直地间隔开。

公开(公告)号：US06897090B2

公开(公告)日：2005-05-24

申请号：US10430986

申请日：2003-05-07

申请人： Thomas H. DiStefano ,  Konstantine Karavakis ,  Craig Mitchell ,  John W. Smith

发明人： Thomas H. DiStefano ,  Konstantine Karavakis ,  Craig Mitchell ,  John W. Smith

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L21/44

CPC分类号： H01L24/50 ,  H01L21/565 ,  H01L23/3121 ,  H01L2224/50 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y10T29/49146 ,  H01L2924/00 ,  H01L2924/00012

摘要： A component incorporating a dielectric element such as a polymeric film with leads and terminals thereon is assembled with a semiconductor chip and bond regions of the leads are connected to contacts of the chip. At least one lead incorporates a plural set of connecting regions connecting the bond region of that lead to a plurality of terminals. One or more of the connecting regions in each such plural set are severed so as to leave less than all of the terminals associated with each such plural set connected to the contacts of the chip.

摘要翻译： 将包含诸如其上具有引线和端子的聚合物膜的电介质元件的部件与半导体芯片组装，并且引线的接合区域连接到芯片的触点。 至少一个引线包括将该引线的键合区域连接到多个端子的多组连接区域。 每个这样的多个组中的一个或多个连接区域被切断，以便留下少于与连接到芯片的触点的每个这样的多个组相关联的所有终端。

公开(公告)号：US06888229B2

公开(公告)日：2005-05-03

申请号：US10872105

申请日：2004-06-18

申请人： Thomas H. DiStefano ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan Mathieu ,  Jason Sweis ,  Laurie Union ,  David Gibson

发明人： Thomas H. DiStefano ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan Mathieu ,  Jason Sweis ,  Laurie Union ,  David Gibson

IPC分类号： H01L21/60 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H05K3/36 ,  H05K3/40

CPC分类号： H01L24/86 ,  H01L23/3107 ,  H01L23/49572 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49861 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K3/361 ,  H05K3/4084 ,  H01L2924/00

摘要： A semiconductor chip mounting component includes a support structure adapted to engage a semiconductor chip. The support structure has a top surface, a bottom surface, and a gap extending through the support structure for defining first and second portions of the support structure on opposite sides of the gap. The support structure includes at least one elongated bus disposed alongside the gap, on the second portion of the support structure. The support structure includes a plurality of electrically conductive leads, each lead having a connection section extending across the gap, the connection section having a first end disposed on the first portion of the support structure, and a second end secured to the bus. Each lead includes a frangible section disposed between the first and second ends of the connection section, the frangible section having a cross-sectional area that is smaller than a cross-sectional area of the connection section. The gap is open at the bottom surface of the support structure. A semiconductor chip is disposed beneath the bottom surface of the support structure. The leads are adapted to be bonded to contacts on the semiconductor chip by breaking the frangible sections of the leads so as to disconnect the second ends of the leads from the bus and engage the leads with the contacts of the semiconductor chip.

摘要翻译： 半导体芯片安装部件包括适于接合半导体芯片的支撑结构。 支撑结构具有顶表面，底表面和延伸穿过支撑结构的间隙，用于限定支撑结构在间隙的相对侧上的第一和第二部分。 支撑结构包括在支撑结构的第二部分上沿着间隙布置的至少一个细长总线。 支撑结构包括多个导电引线，每个引线具有跨越间隙延伸的连接部分，连接部分具有设置在支撑结构的第一部分上的第一端和固定到总线的第二端。 每个引线包括设置在连接部分的第一和第二端之间的易碎部分，该易碎部分的横截面积小于连接部分的横截面面积。 间隙在支撑结构的底部表面开口。 半导体芯片设置在支撑结构的底表面下方。 引线适于通过断开引线的易碎部分而与半导体芯片上的触点接合，从而将引线的第二端与母线断开，并与半导体芯片的触点接合引线。

公开(公告)号：US06460245B1

公开(公告)日：2002-10-08

申请号：US08987720

申请日：1997-12-09

申请人： Thomas H. DiStefano

发明人： Thomas H. DiStefano

IPC分类号： H05K334

CPC分类号： H01L21/568 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/16 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3157 ,  H01L23/495 ,  H01L23/49572 ,  H01L23/4985 ,  H01L24/32 ,  H01L24/50 ,  H01L24/83 ,  H01L24/86 ,  H01L24/97 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01009 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  Y10T29/49004 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49169 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/49821 ,  H01L2224/83 ,  H01L2224/05599

摘要： A method of making a microelectronic package includes providing a first microelectronic element having electrically conductive parts and including first and second surfaces and providing a compliant element including a releasable adhesive over the first surface of the first microelectronic element. A second microelectronic element having electrically conductive parts is abutted against the releasable adhesive so that the second microelectronic element is releasably assembled to the first microelectronic element and the electrically conductive parts of the first and second microelectronic elements are connected to one another. The releasably assembled package is tested to determine whether the package has been properly assembled. A curable liquid is then introduced between the first and second microelectronic elements of a properly assembled package and the curable liquid is cured to permanently assemble the first and second microelectronic elements together.

公开(公告)号：US06370032B1

公开(公告)日：2002-04-09

申请号：US09399209

申请日：1999-09-17

申请人： Thomas H. DiStefano ,  John W. Smith ,  Zlata Kovac ,  Konstantine Karavakis

发明人： Thomas H. DiStefano ,  John W. Smith ,  Zlata Kovac ,  Konstantine Karavakis

IPC分类号： H05K118

CPC分类号： H01L24/81 ,  H01L21/4839 ,  H01L21/563 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/642 ,  H01L24/72 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/3025 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49149

摘要： The present invention provides an interconnection scheme having complaint contacts arranged in an array to connect conductive surfaces on a microelectronic device and a supporting substrate, such as a printed circuit board. This invention accommodates for the difference in thermal coefficients of expansion between the device and the supporting substrate. Typically, an area array of conductive contact pads are connected into rows by conductive leads on a flexible, intermediate substrate. Each of the conductive leads bridges a bonding hole in the intermediate substrate which is situated between successive contact pads. Each of the conductive leads further has a frangible portion within or near each bonding hole. A stand-off between the intermediate substrate and the device is create by compliant dielectric pads, typically composed of an elastomer material, positioned under each contact pad. The frangible portions allow the leads to be cleanly broken, bent and secured into electrical contact with chip contacts on the device. Each of these connections may be supported by a compliant layer, typically an uncured elastomer which fills the area around the compliant dielectric pads and is then cured.

摘要翻译： 本发明提供了一种具有布置成阵列中的投诉触点的互连方案，以连接微电子装置上的导电表面和诸如印刷电路板的支撑基板。 本发明适用于器件和支撑衬底之间的热膨胀系数的差异。 通常，导电接触焊盘的区域阵列通过柔性中间衬底上的导电引线连接成行。 每个导电引线桥接位于连续接触焊盘之间的中间衬底中的结合孔。 每个导电引线还在每个结合孔内或附近还具有易碎部分。 中间基板和器件之间的间隔是通过位于每个接触垫下方的通常由弹性体材料组成的柔性介电垫产生的。 易碎部分允许引线被干净地折断，弯曲并固定成与设备上的芯片触点电接触。 这些连接中的每一个可以由柔性层（通常为填充柔性介电垫周围区域的未固化的弹性体）支撑，然后固化。

公开(公告)号：US06261863B1

公开(公告)日：2001-07-17

申请号：US09471973

申请日：1999-12-23

申请人： Masud Beroz ,  Thomas H. DiStefano ,  Anthony B. Faraci ,  Joseph Fjelstad ,  Belgacem Haba

发明人： Masud Beroz ,  Thomas H. DiStefano ,  Anthony B. Faraci ,  Joseph Fjelstad ,  Belgacem Haba

IPC分类号： H01L2144

CPC分类号： H05K3/4092 ,  H01L23/49811 ,  H01L23/4985 ,  H01L23/5387 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： A connection component for a microelectronic device such as a semiconductor chip incorporates a support layer and conductive structures extending across a surface of the support layer. The conductive structures have anchors connecting them to the support layer, and releasable or unanchored portions. A method of making a connection component includes removing material from the conductive structures or the support layer or both to form the anchors.

摘要翻译： 用于诸如半导体芯片的微电子器件的连接部件包括支撑层和延伸穿过支撑层的表面的导电结构。 导电结构具有将它们连接到支撑层，以及可释放或未锚定部分的锚固件。 制造连接部件的方法包括从导电结构或支撑层或两者移除材料以形成锚固件。

公开(公告)号：US06239386B1

公开(公告)日：2001-05-29

申请号：US08695642

申请日：1996-08-12

申请人： Thomas H. DiStefano ,  John W. Smith ,  Konstantine N. Karavakis ,  Zlata Kovac ,  Joseph Fjelstad

发明人： Thomas H. DiStefano ,  John W. Smith ,  Konstantine N. Karavakis ,  Zlata Kovac ,  Joseph Fjelstad

IPC分类号： H01R909

CPC分类号： H01R13/2414 ,  H01R12/714 ,  H05K1/0272 ,  H05K1/036 ,  H05K1/056 ,  H05K1/116 ,  H05K3/0032 ,  H05K3/445 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0382 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0554 ,  H05K2203/0582 ,  H05K2203/135 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad on the engaged circuit panel. Thus, when the circuit panels are compressed with the interposers, the contacts expand radially and wipe across the pads. The wiping action facilitates bonding of the contacts to the pads, as by conductive bonding material carried on the contacts themselves.