公开(公告)号：US20220139861A1

公开(公告)日：2022-05-05

申请号：US17574051

申请日：2022-01-12

Applicant: Rohm Co., Ltd.

Inventor： Kenji FUJII

IPC: H01L23/00 ,  H01L23/495 ,  H01L23/31

Abstract: A semiconductor device includes an electric conductor, a semiconductor element, and a bonding layer. The electric conductor has a main surface and a rear surface opposite to the main surface in a thickness direction. The semiconductor element includes a main body and electrodes. The main body has a side facing the main surface of the conductor, and the electrodes each protrude toward the main surface from the side of the main body to be electrically connected to the main surface. The bonding layer is held in contact with the main surface and the electrodes. Each electrode includes a base portion in contact with the main body, and a columnar portion protruding toward the main surface from the base portion to be held in contact with the bonding layer, which is a sintered body of a metal powder.

公开(公告)号：US20150091164A1

公开(公告)日：2015-04-02

申请号：US14503148

申请日：2014-09-30

Applicant: ROHM CO., LTD.

Inventor： Mamoru YAMAGAMI ,  Kenji FUJII

IPC: H01L23/31 ,  H01L23/492 ,  H01L23/00 ,  H01L23/29

CPC classification number: H01L24/49 ,  H01L23/3107 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/525 ,  H01L23/53223 ,  H01L23/53238 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/36 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/02375 ,  H01L2224/0346 ,  H01L2224/0347 ,  H01L2224/0391 ,  H01L2224/03914 ,  H01L2224/0401 ,  H01L2224/04034 ,  H01L2224/04042 ,  H01L2224/05008 ,  H01L2224/05009 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05147 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05548 ,  H01L2224/05554 ,  H01L2224/05557 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/05583 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/08245 ,  H01L2224/13024 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13582 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2224/1411 ,  H01L2224/16245 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/40479 ,  H01L2224/40491 ,  H01L2224/40499 ,  H01L2224/40993 ,  H01L2224/4112 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48177 ,  H01L2224/48247 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/4912 ,  H01L2224/49177 ,  H01L2224/73221 ,  H01L2224/8485 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/20754 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/2075 ,  H01L2924/20757 ,  H01L2924/20756 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/20755 ,  H01L2924/014 ,  H01L2224/051

Abstract: An inventive semiconductor device includes: a semiconductor chip including an integrated circuit; a plurality of electrode pads provided on the semiconductor chip and connected to the integrated circuit; a rewiring to which the electrode pads are electrically connected together, the rewiring being exposed on an outermost surface of the semiconductor chip and having an exposed surface area greater than the total area of the electrode pads; and a resin package which seals the semiconductor chip.

Abstract translation: 本发明的半导体器件包括：包括集成电路的半导体芯片; 设置在半导体芯片上并连接到集成电路的多个电极焊盘; 重新布线，其中电极焊盘电连接在一起，重新布线暴露在半导体芯片的最外表面上，并具有大于电极焊盘总面积的暴露表面积; 以及密封半导体芯片的树脂封装。

公开(公告)号：US20240038709A1

公开(公告)日：2024-02-01

申请号：US18482617

申请日：2023-10-06

Applicant: Rohm Co., Ltd.

Inventor： Kenji FUJII

IPC: H01L23/00 ,  H01L23/495 ,  H01L23/31

CPC classification number: H01L24/16 ,  H01L23/49548 ,  H01L23/3107 ,  H01L24/73 ,  H01L24/13 ,  H01L24/29 ,  H01L2224/29147 ,  H01L2224/16245 ,  H01L2224/73203 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/29139 ,  H01L2224/16059

Abstract: A semiconductor device includes an electric conductor, a semiconductor element, and a bonding layer. The electric conductor has a main surface and a rear surface opposite to the main surface in a thickness direction. The semiconductor element includes a main body and electrodes. The main body has a side facing the main surface of the conductor, and the electrodes each protrude toward the main surface from the side of the main body to be electrically connected to the main surface. The bonding layer is held in contact with the main surface and the electrodes. Each electrode includes a base portion in contact with the main body, and a columnar portion protruding toward the main surface from the base portion to be held in contact with the bonding layer, which is a sintered body of a metal powder.

公开(公告)号：US20180005981A1

公开(公告)日：2018-01-04

申请号：US15707632

申请日：2017-09-18

Applicant: ROHM CO., LTD.

Inventor： Motoharu HAGA ,  Shingo YOSHIDA ,  Yasumasa KASUYA ,  Toichi NAGAHARA ,  Akihiro KIMURA ,  Kenji FUJII

IPC: H01L23/00 ,  H01L23/495 ,  B23K20/10 ,  H01L21/56 ,  B23K20/24 ,  B23K20/00 ,  H01L23/31

CPC classification number: H01L24/85 ,  B23K20/005 ,  B23K20/10 ,  B23K20/24 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/03 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/83 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29118 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48451 ,  H01L2224/48453 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48507 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48847 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/78303 ,  H01L2224/78307 ,  H01L2224/78309 ,  H01L2224/83 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/83439 ,  H01L2224/838 ,  H01L2224/85 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/8592 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01066 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01204 ,  H01L2924/01205 ,  H01L2924/01206 ,  H01L2924/013 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/05442 ,  H01L2924/0665 ,  H01L2924/10162 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19107 ,  H01L2924/20752 ,  H01L2924/20757 ,  H01L2924/3512 ,  H01L2924/01026 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/207 ,  H01L2924/20753 ,  H01L2924/20756 ,  H01L2924/20758 ,  H01L2924/00015

Abstract: A semiconductor device according to the present invention includes a semiconductor chip, an electrode pad made of a metal material containing aluminum and formed on a top surface of the semiconductor chip, an electrode lead disposed at a periphery of the semiconductor chip, a bonding wire having a linearly-extending main body portion and having a pad bond portion and a lead bond portion formed at respective ends of the main body portion and respectively bonded to the electrode pad and the electrode lead, and a resin package sealing the semiconductor chip, the electrode lead, and the bonding wire, the bonding wire is made of copper, and the entire electrode pad and the entire pad bond portion are integrally covered by a water-impermeable film.

公开(公告)号：US20160190045A1

公开(公告)日：2016-06-30

申请号：US14971313

申请日：2015-12-16

Applicant: ROHM CO., LTD.

Inventor： Kenji FUJII ,  Mamoru YAMAGAMI

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L21/565 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49568 ,  H01L23/49582 ,  H01L23/5283 ,  H01L24/00 ,  H01L2224/16245 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor device includes: a semiconductor element having a functional surface formed with a functional circuit and a reverse surface opposite to the functional surface; an electroconductive support member supporting the semiconductor element and electrically connected to the semiconductor element; and a resin package covering the semiconductor element and at least a part of the electroconductive support member. The semiconductor element is provided with an electrode including a projection on the functional surface and with a reinforcing layer formed on the functional surface. The semiconductor device further includes a solid-state welded portion formed by solid state welding of at least a part of the projection of the electrode and at least a part of the electroconductive support member.

Abstract translation: 半导体器件包括：具有形成有功能电路的功能表面和与功能表面相对的反面的半导体元件; 支撑所述半导体元件并电连接到所述半导体元件的导电支撑构件; 以及覆盖半导体元件和至少一部分导电支撑构件的树脂封装。 半导体元件设置有在功能表面上具有突起的电极和在功能表面上形成的增强层。 半导体器件还包括通过固体焊接形成的固态焊接部分，该焊接部分至少部分电极的突出部分和至少一部分导电支撑部件。

公开(公告)号：US20160013143A1

公开(公告)日：2016-01-14

申请号：US14793057

申请日：2015-07-07

Applicant: ROHM CO., LTD.

Inventor： Kenji FUJII ,  Satoshi KAGEYAMA

IPC: H01L23/00

CPC classification number: H01L24/05 ,  H01L23/3171 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05083 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05664 ,  H01L2224/32245 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48451 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/78306 ,  H01L2224/85181 ,  H01L2224/85439 ,  H01L2224/85447 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention provides an electronic device that is able to achieve an improvement in yield or an electronic device that is able to prevent a sealing resin from exfoliating from a sub-electrode. The electronic device is provided with an electronic element and a wire bonded to the electronic element. The electronic element includes a bonding pad to which the wire is bonded. The bonding pad includes a Pd layer that directly contacts the wire.

Abstract translation: 本发明提供能够实现产量提高的电子设备或能够防止密封树脂从副电极剥离的电子设备。 电子装置设置有电子元件和接合到电子元件的导线。 电子元件包括接合焊盘，接合线与导线接合。 焊盘包括直接接触导线的Pd层。

公开(公告)号：US20230090494A1

公开(公告)日：2023-03-23

申请号：US17798532

申请日：2021-02-17

Applicant: ROHM CO., LTD.

Inventor： Kenji FUJII ,  Akinori NII

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor device includes a conductor, a semiconductor element, and a bonding layer. The conductor has obverse surfaces and reverse surfaces facing away from each other in a thickness direction. The semiconductor element has a body layer and electrodes projecting toward the obverse surfaces from a side of the body layer that opposes the obverse surfaces in the thickness direction. The bonding layer bonds the obverse surfaces and the electrodes. Each electrode has a base portion in contact with the body layer and a columnar portion projecting from the base portion and in contact with the bonding layer. The electrodes include a first electrode and a second electrode located closer to the periphery of the body layer than is the first electrode as viewed in the thickness direction. The second electrode is larger in area of the columnar portion than the first electrode, as viewed in the thickness direction.

公开(公告)号：US20240379507A1

公开(公告)日：2024-11-14

申请号：US18777108

申请日：2024-07-18

Applicant: ROHM CO., LTD.

Inventor： Akinori NII ,  Hiroaki AOYAMA ,  Kenji FUJII

IPC: H01L23/495 ,  H01L23/00

Abstract: A semiconductor device includes a lead, a semiconductor element, a sealing resin, and a first conductive section. The lead includes an obverse surface facing in a thickness direction. The semiconductor element includes a circuit section, an element first surface, and first electrodes on the element first surface. The first electrodes are connected to the obverse surface. The sealing resin covers the lead partially and the semiconductor element. The lead includes first terminal sections and a second terminal section aligned in a first direction crossing the thickness direction. Each first electrode is electrically connected to the circuit section. Each first terminal section is electrically connected to the circuit section via one first electrode. The first conductive section is between the second terminal section and the element first surface and connected to the second terminal section and the element first surface. The first conductive section is insulated from the circuit section.

公开(公告)号：US20230386983A1

公开(公告)日：2023-11-30

申请号：US18449360

申请日：2023-08-14

Applicant: ROHM CO., LTD.

Inventor： Yoshizo OSUMI ,  Taro NISHIOKA ,  Tomohira KIKUCHI ,  Kenji FUJII ,  Hiroaki MATSUBARA

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/49575 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/48 ,  H01L2224/48175 ,  H01L2224/48137

Abstract: A semiconductor device includes first and second semiconductor elements, a conductive support, a third semiconductor element and a sealing resin. The conductive support includes first and second leads spaced apart in a first direction. The first semiconductor element is supported by the first lead. The second semiconductor element is supported by the second lead. The third semiconductor element, supported by the conductive support, insulates the first semiconductor element and the second semiconductor element. The sealing resin covers a part of the conductive support. A distance d1 between the first lead and the second lead in the first direction is greater than distance d0 given by Equation below. In Equation below, Y is the number of years of insulation life (years) expected for the semiconductor device, A and B are constants determined by a material of the sealing resin, and X is a voltage (kVrms).





d
⁢
0

=



Y
A

B

×
0.15
×
X

公开(公告)号：US20230110154A1

公开(公告)日：2023-04-13

申请号：US17911101

申请日：2021-03-18

Applicant: ROHM CO., LTD.

Inventor： Bin ZHANG ,  Kenji FUJII ,  Akinori NII

IPC: H01L21/50 ,  H01L23/13 ,  H01L23/495 ,  H01L23/00

Abstract: A semiconductor device includes a semiconductor element, a conducting member, a conductive bonding material, a resin member and a first barrier layer. The semiconductor element includes an element first surface and an element second surface facing away from each other in a thickness direction, with the element first surface provided with an electrode. The conducting member includes an obverse surface facing the element first surface and a reverse surface facing away from the obverse surface. The conductive bonding material is disposed between the electrode and the obverse surface of the conducting member. The resin member covers at least a portion of the conducting member, the semiconductor element and the conductive bonding material. The first barrier layer is disposed between the electrode and the conductive bonding material to prevent a reaction between the electrode and the conductive bonding material.