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公开(公告)号:US20060145352A1
公开(公告)日:2006-07-06
申请号:US11338529
申请日:2006-01-23
申请人: Tasao Soga , Hanae Hata , Tetsuya Nakatsuka , Mikio Negishi , Hirokazu Nakajima , Tsuneo Endoh
发明人: Tasao Soga , Hanae Hata , Tetsuya Nakatsuka , Mikio Negishi , Hirokazu Nakajima , Tsuneo Endoh
IPC分类号: H01L23/48
CPC分类号: H05K3/3484 , B23K35/0244 , B23K35/262 , H01L24/73 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/13144 , H01L2224/13147 , H01L2224/16 , H01L2224/16235 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/49171 , H01L2224/73204 , H01L2224/73265 , H01L2924/00013 , H01L2924/01012 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/01327 , H01L2924/09701 , H01L2924/10253 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H05K1/141 , H05K3/3463 , H05K2201/0215 , H05K2201/0218 , H05K2201/045 , H05K2201/10636 , Y02P70/611 , H01L2924/00014 , H01L2224/13099 , H01L2924/00 , H01L2924/00012 , H01L2224/05639 , H01L2224/05644 , H01L2224/05655 , H01L2224/05669
摘要: In an electronic device which realizes high-temperature-side solder bonding in temperature-hierarchical bonding, a bonding portion between a semiconductor device and a substrate is formed of metal balls made of Cu, or the like, and compounds formed of metal balls and Sn, and the metal balls are bonded together by the compounds.
摘要翻译: 在实现温度分级接合中的高温侧焊接的电子设备中,半导体器件与衬底之间的接合部分由Cu等金属球形成,并且由金属球和Sn形成的化合物 ,金属球通过化合物结合在一起。
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公开(公告)号:US06872465B2
公开(公告)日:2005-03-29
申请号:US10384931
申请日:2003-03-07
申请人: Tasao Soga , Hanae Hata , Tetsuya Nakatsuka , Mikio Negishi , Hirokazu Nakajima , Tsuneo Endoh
发明人: Tasao Soga , Hanae Hata , Tetsuya Nakatsuka , Mikio Negishi , Hirokazu Nakajima , Tsuneo Endoh
IPC分类号: B23K35/14 , B23K35/02 , B23K35/26 , H01L21/60 , H01L23/10 , H01L23/12 , H01L23/498 , H05K3/34 , B32B15/02
CPC分类号: H05K3/3484 , B23K35/0244 , B23K35/025 , B23K35/262 , H01L23/49816 , H01L24/73 , H01L24/81 , H01L2224/05548 , H01L2224/05568 , H01L2224/05573 , H01L2224/11334 , H01L2224/13022 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L2224/73204 , H01L2224/73265 , H01L2224/81801 , H01L2224/82 , H01L2224/85 , H01L2224/86 , H01L2924/01012 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/01327 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/16152 , H01L2924/166 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H05K2201/0215 , Y10T428/12181 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722 , Y10T428/1275 , Y10T428/12889 , Y10T428/12896 , Y10T428/1291 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要: In a solder that realizes high-temperature-side solder bonding in temperature-hierarchical bonding, a connection portion between a semiconductor device and a substrate is formed of metal balls made of Cu or the like and compounds formed of metal balls and Sn, and the metal balls are bonded together by the compounds.
摘要翻译: 在实现温度分级接合中的高温侧焊料接合的焊料中,半导体器件与基板之间的连接部由金属球等构成的金属球和由金属球和Sn形成的化合物形成, 金属球通过化合物结合在一起。
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公开(公告)号:US07259465B2
公开(公告)日:2007-08-21
申请号:US10104826
申请日:2002-03-22
申请人: Tasao Soga , Hanae Shimokawa , Tetsuya Nakatsuka , Kazuma Miura , Mikio Negishi , Hirokazu Nakajima , Tsuneo Endoh
发明人: Tasao Soga , Hanae Shimokawa , Tetsuya Nakatsuka , Kazuma Miura , Mikio Negishi , Hirokazu Nakajima , Tsuneo Endoh
IPC分类号: H01L29/40
CPC分类号: H01L24/13 , B32B15/01 , C22C5/02 , C22C9/02 , C22C11/06 , C22C13/00 , H01L21/50 , H01L21/56 , H01L21/563 , H01L23/10 , H01L23/3128 , H01L23/3677 , H01L23/4334 , H01L23/4924 , H01L23/49513 , H01L24/11 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/97 , H01L25/16 , H01L2224/0401 , H01L2224/06102 , H01L2224/11334 , H01L2224/1134 , H01L2224/1147 , H01L2224/13099 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/16235 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/29294 , H01L2224/29298 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/81024 , H01L2224/81054 , H01L2224/81203 , H01L2224/81205 , H01L2224/8121 , H01L2224/81409 , H01L2224/81815 , H01L2224/8319 , H01L2224/83801 , H01L2224/97 , H01L2924/00011 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01088 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15738 , H01L2924/1576 , H01L2924/15787 , H01L2924/16152 , H01L2924/16315 , H01L2924/166 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K1/141 , H05K3/3463 , H05K3/3484 , H05K2201/0215 , H05K2201/045 , H05K2201/09572 , H05K2201/10636 , Y02P70/611 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2924/01031 , H01L2924/01026 , H01L2924/3512 , H01L2924/00015 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/83205
摘要: Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu, etc., and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.
摘要翻译: 形成在半导体器件和衬底之间的接合部包括Cu等的金属球,Sn和金属球的化合物以及金属球通过化合物结合在一起。
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公开(公告)号:US08022551B2
公开(公告)日:2011-09-20
申请号:US11399856
申请日:2006-04-07
申请人: Tasao Soga , Hanae Shimokawa , Tetsuya Nakatsuka , Kazuma Miura , Mikio Negishi , Hirokazu Nakajima , Tsuneo Endoh
发明人: Tasao Soga , Hanae Shimokawa , Tetsuya Nakatsuka , Kazuma Miura , Mikio Negishi , Hirokazu Nakajima , Tsuneo Endoh
IPC分类号: H01L29/40
CPC分类号: H01L24/13 , B32B15/01 , C22C5/02 , C22C9/02 , C22C11/06 , C22C13/00 , H01L21/50 , H01L21/56 , H01L21/563 , H01L23/10 , H01L23/3128 , H01L23/3677 , H01L23/4334 , H01L23/4924 , H01L23/49513 , H01L24/11 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/97 , H01L25/16 , H01L2224/0401 , H01L2224/06102 , H01L2224/11334 , H01L2224/1134 , H01L2224/1147 , H01L2224/13099 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/16235 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/29294 , H01L2224/29298 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/81024 , H01L2224/81054 , H01L2224/81203 , H01L2224/81205 , H01L2224/8121 , H01L2224/81409 , H01L2224/81815 , H01L2224/8319 , H01L2224/83801 , H01L2224/97 , H01L2924/00011 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01088 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15738 , H01L2924/1576 , H01L2924/15787 , H01L2924/16152 , H01L2924/16315 , H01L2924/166 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K1/141 , H05K3/3463 , H05K3/3484 , H05K2201/0215 , H05K2201/045 , H05K2201/09572 , H05K2201/10636 , Y02P70/611 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2924/01031 , H01L2924/01026 , H01L2924/3512 , H01L2924/00015 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/83205
摘要: Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu, or other materials and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.
摘要翻译: 在半导体器件和衬底之间形成的每一个接合点包括Cu的金属球或Sn的其它材料和化合物以及金属球,金属球通过化合物结合在一起。
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公开(公告)号:US20070031279A1
公开(公告)日:2007-02-08
申请号:US11399856
申请日:2006-04-07
申请人: Tasao Soga , Hanae Shimokawa , Tetsuya Nakatsuka , Kazuma Miura , Mikio Negishi , Hirokazu Nakajima , Tsuneo Endoh
发明人: Tasao Soga , Hanae Shimokawa , Tetsuya Nakatsuka , Kazuma Miura , Mikio Negishi , Hirokazu Nakajima , Tsuneo Endoh
IPC分类号: C22C9/02
CPC分类号: H01L24/13 , B32B15/01 , C22C5/02 , C22C9/02 , C22C11/06 , C22C13/00 , H01L21/50 , H01L21/56 , H01L21/563 , H01L23/10 , H01L23/3128 , H01L23/3677 , H01L23/4334 , H01L23/4924 , H01L23/49513 , H01L24/11 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/97 , H01L25/16 , H01L2224/0401 , H01L2224/06102 , H01L2224/11334 , H01L2224/1134 , H01L2224/1147 , H01L2224/13099 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/16235 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/29294 , H01L2224/29298 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/81024 , H01L2224/81054 , H01L2224/81203 , H01L2224/81205 , H01L2224/8121 , H01L2224/81409 , H01L2224/81815 , H01L2224/8319 , H01L2224/83801 , H01L2224/97 , H01L2924/00011 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01088 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15738 , H01L2924/1576 , H01L2924/15787 , H01L2924/16152 , H01L2924/16315 , H01L2924/166 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K1/141 , H05K3/3463 , H05K3/3484 , H05K2201/0215 , H05K2201/045 , H05K2201/09572 , H05K2201/10636 , Y02P70/611 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2924/01031 , H01L2924/01026 , H01L2924/3512 , H01L2924/00015 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/83205
摘要: Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu, or other materials and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.
摘要翻译: 在半导体器件和衬底之间形成的每一个接合点包括Cu的金属球或Sn的其它材料和化合物以及金属球,金属球通过化合物结合在一起。
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公开(公告)号:US07075183B2
公开(公告)日:2006-07-11
申请号:US09880733
申请日:2001-06-12
申请人: Tasao Soga , Hanae Shimokawa , Tetsuya Nakatsuka , Kazuma Miura , Mikio Negishi , Hirokazu Nakajima , Tsuneo Endoh
发明人: Tasao Soga , Hanae Shimokawa , Tetsuya Nakatsuka , Kazuma Miura , Mikio Negishi , Hirokazu Nakajima , Tsuneo Endoh
IPC分类号: H01L29/40
CPC分类号: H01L24/13 , B32B15/01 , C22C5/02 , C22C9/02 , C22C11/06 , C22C13/00 , H01L21/50 , H01L21/56 , H01L21/563 , H01L23/10 , H01L23/3128 , H01L23/3677 , H01L23/4334 , H01L23/4924 , H01L23/49513 , H01L24/11 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/97 , H01L25/16 , H01L2224/0401 , H01L2224/06102 , H01L2224/11334 , H01L2224/1134 , H01L2224/1147 , H01L2224/13099 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/16235 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/29294 , H01L2224/29298 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/81024 , H01L2224/81054 , H01L2224/81203 , H01L2224/81205 , H01L2224/8121 , H01L2224/81409 , H01L2224/81815 , H01L2224/8319 , H01L2224/83801 , H01L2224/97 , H01L2924/00011 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01088 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15738 , H01L2924/1576 , H01L2924/15787 , H01L2924/16152 , H01L2924/16315 , H01L2924/166 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K1/141 , H05K3/3463 , H05K3/3484 , H05K2201/0215 , H05K2201/045 , H05K2201/09572 , H05K2201/10636 , Y02P70/611 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2924/01031 , H01L2924/01026 , H01L2924/3512 , H01L2924/00015 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/83205
摘要: Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu etc. and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.
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公开(公告)号:US20060061974A1
公开(公告)日:2006-03-23
申请号:US10451610
申请日:2001-12-19
申请人: Tasao Soga , Hanae Hata , Toshiharu Ishida , Kanko Ishida , Tetsuya Nakatsuka , Masahide Okamoto , Kazuma Miura
发明人: Tasao Soga , Hanae Hata , Toshiharu Ishida , Kanko Ishida , Tetsuya Nakatsuka , Masahide Okamoto , Kazuma Miura
CPC分类号: H01L24/01 , B23K3/063 , B23K2101/40 , H01L24/27 , H01L24/29 , H01L24/33 , H01L24/73 , H01L24/75 , H01L24/83 , H01L2224/0401 , H01L2224/04026 , H01L2224/16225 , H01L2224/29 , H01L2224/29076 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/292 , H01L2224/29211 , H01L2224/29311 , H01L2224/29347 , H01L2224/29499 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/83101 , H01L2224/8319 , H01L2224/83801 , H01L2924/00011 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/13091 , H01L2924/15311 , H01L2924/15724 , H01L2924/15747 , H01L2924/15787 , H01L2924/1579 , H01L2924/16152 , H01L2924/166 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K3/3478 , H05K2201/0215 , H05K2203/0143 , H05K2203/0278 , H05K2203/0405 , H05K2203/0425 , Y10T428/12528 , Y10T428/12708 , Y10T428/12903 , H01L2924/00014 , H01L2924/05432 , H01L2924/00 , H01L2924/01007 , H01L2924/01031 , H01L2924/01022 , H01L2924/01026 , H01L2924/01049 , H01L2924/01083 , H01L2924/00012 , H01L2924/3512 , H01L2224/13111 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/29298
摘要: A solder foil formed from a material comprising particles of Cu, etc. as metal particles and Sn particles as solder particles by rolling is suitable for solder bonding at a high temperature side in temperature-hierarchical bonding, and semiconductor devices and electronic devices produced by use of such solder bonding have distinguished reliability of mechanical characteristics, etc.
摘要翻译: 由包含作为金属颗粒的Cu等颗粒和作为焊料颗粒的Sn颗粒通过轧制形成的焊料箔适用于在温度分级粘合中的高温侧的焊接,以及通过使用制造的半导体器件和电子器件 这种焊接结合具有突出的机械特性的可靠性等。
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公开(公告)号:US07722962B2
公开(公告)日:2010-05-25
申请号:US10451610
申请日:2001-12-19
申请人: Tasao Soga , Hanae Hata , Toshiharu Ishida , Kanko Ishida, legal representative , Tetsuya Nakatsuka , Masahide Okamoto , Kazuma Miura
发明人: Tasao Soga , Hanae Hata , Toshiharu Ishida , Tetsuya Nakatsuka , Masahide Okamoto , Kazuma Miura
CPC分类号: H01L24/01 , B23K3/063 , B23K2101/40 , H01L24/27 , H01L24/29 , H01L24/33 , H01L24/73 , H01L24/75 , H01L24/83 , H01L2224/0401 , H01L2224/04026 , H01L2224/16225 , H01L2224/29 , H01L2224/29076 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/292 , H01L2224/29211 , H01L2224/29311 , H01L2224/29347 , H01L2224/29499 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/83101 , H01L2224/8319 , H01L2224/83801 , H01L2924/00011 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/13091 , H01L2924/15311 , H01L2924/15724 , H01L2924/15747 , H01L2924/15787 , H01L2924/1579 , H01L2924/16152 , H01L2924/166 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K3/3478 , H05K2201/0215 , H05K2203/0143 , H05K2203/0278 , H05K2203/0405 , H05K2203/0425 , Y10T428/12528 , Y10T428/12708 , Y10T428/12903 , H01L2924/00014 , H01L2924/05432 , H01L2924/00 , H01L2924/01007 , H01L2924/01031 , H01L2924/01022 , H01L2924/01026 , H01L2924/01049 , H01L2924/01083 , H01L2924/00012 , H01L2924/3512 , H01L2224/13111 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/29298
摘要: A solder foil formed from a material comprising particles of Cu, etc. as metal particles and Sn particles as solder particles by rolling is suitable for solder bonding at a high temperature side in temperature-hierarchical bonding, and semiconductor devices and electronic devices produced by use of such solder bonding have distinguished reliability of mechanical characteristics, etc.
摘要翻译: 由包含作为金属颗粒的Cu等颗粒和作为焊料颗粒的Sn颗粒通过轧制形成的焊料箔适合于在温度分级粘合中的高温侧的焊料接合,以及通过使用制造的半导体器件和电子器件 这种焊接结合具有突出的机械特性的可靠性等。
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公开(公告)号:US06563225B2
公开(公告)日:2003-05-13
申请号:US10083543
申请日:2002-02-27
申请人: Tasao Soga , Toshiharu Ishida , Kazuma Miura , Hanae Hata , Masahide Okamoto , Tetsuya Nakatsuka
发明人: Tasao Soga , Toshiharu Ishida , Kazuma Miura , Hanae Hata , Masahide Okamoto , Tetsuya Nakatsuka
IPC分类号: H01L2348
CPC分类号: H01L24/27 , B22F1/0003 , B23K1/0004 , B23K35/0244 , B23K35/282 , B23K2101/40 , C22C18/00 , C22C18/04 , H01L24/29 , H01L24/33 , H01L24/73 , H01L24/75 , H01L24/83 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/29218 , H01L2224/29339 , H01L2224/29347 , H01L2224/29411 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/751 , H01L2224/75251 , H01L2224/75745 , H01L2224/83101 , H01L2224/8319 , H01L2224/83801 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01018 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/0134 , H01L2924/0135 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/15311 , H01L2924/16152 , H01L2924/166 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/00014 , H01L2924/01051 , H01L2924/01031 , H01L2924/01022 , H01L2924/01028 , H01L2924/01026 , H01L2924/01049 , H01L2924/00012 , H01L2924/01083 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要: There is provided an electronic device comprising at least one electronic part and a substrate on which said electronic part is mounted, said electronic part and said substrate being bonded by a joint comprising a phase of Al particles and another phase of a Al—Mg—Ge—Zn alloy, said Al particles being connected to each other by said Al—Mg—Ge—Zn alloy phase.
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10.Method of producing an electronic device having a PB free solder connection 有权
标题翻译: 制造具有无铅焊料连接的电子器件的方法公开(公告)号:US07013564B2
公开(公告)日:2006-03-21
申请号:US09971566
申请日:2001-10-09
申请人: Hanae Shimokawa , Tasao Soga , Hiroaki Okudaira , Toshiharu Ishida , Tetsuya Nakatsuka , Yoshiharu Inaba , Asao Nishimura
发明人: Hanae Shimokawa , Tasao Soga , Hiroaki Okudaira , Toshiharu Ishida , Tetsuya Nakatsuka , Yoshiharu Inaba , Asao Nishimura
CPC分类号: H05K1/181 , B23K1/0016 , B23K35/004 , B23K35/007 , B23K35/262 , B23K2101/40 , H01L23/488 , H01L23/49811 , H01L23/532 , H01L24/29 , H01L2224/83101 , H01L2924/01322 , H01L2924/15747 , H05K3/3426 , H05K3/3463 , H05K2201/10909 , Y02P70/613 , Y10T29/49144 , Y10T29/49149 , Y10T29/49169 , Y10T428/12708 , Y10T428/12715 , H01L2924/00
摘要: A method of producing an electronic device by connecting a lead of a semiconductor device with an electrode of a circuit board to form a bonded structure. In the bonded structure, a lead-free Sn—Ag—Bi alloy solder is applied to an electrode through an Sn—Bi alloy layer. The Sn—Bi alloy, preferably, comprises 1 to 20 wt % Bi in order to obtain good wettability of the solder. In order to obtain desirable bonding characteristics having higher reliability in the invention, a copper layer is provided under the Sn—Bi alloy layer thereby obtaining an enough bonding strength.
摘要翻译: 一种通过将半导体器件的引线与电路板的电极连接以形成接合结构来制造电子器件的方法。 在接合结构中,通过Sn-Bi合金层将无铅Sn-Ag-Bi合金焊料施加到电极。 Sn-Bi合金优选含有1〜20重量%的Bi,以获得良好的焊料润湿性。 为了获得本发明中具有较高可靠性的理想的接合特性,在Sn-Bi合金层下方设置有铜层,从而获得足够的接合强度。
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