公开(公告)号：EP2365539A1

公开(公告)日：2011-09-14

申请号：EP11167061.8

申请日：2004-05-26

申请人： Panasonic Electric Works Co., Ltd.

发明人： Hashimoto, Takuma ,  Sugimoto, Masaru ,  Yokotani, Ryoji ,  Nishioka, Koji ,  Iwahori, Yutara ,  Ishizaki, Shinya ,  Suzuki, Toshiyuki ,  Uchinono, Yoshiyuki ,  Muto, Masahide ,  Mori, Satoshi ,  Kimura, Hideyoshi

IPC分类号： H01L33/00

CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/15156 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/01005 ,  H01L2924/01033

摘要： A light-emitting device has a submount and a plate for heat transfer having a metallic plate (30). The submount has a mount base (10), at least one light-emitting diode chip (50) mounted thereon and electrically conducting (12,15) lines formed on the mount base to be connected electrically to the light-emitting diode chip. A first plane of the mount base of the submount is bonded thermally to the first plate. For example, the plate is a circuit board having a metallic plate, and the submount is bonded thermally to the metallic plate of the one of the at least one plate. In an example, a plurality of grooves (7) are formed at the bottom of the mount base (10).

摘要翻译： 发光装置具有底座和用于传热的板，具有金属板（30）。 底座具有安装座（10），安装在其上的至少一个发光二极管芯片（50）和形成在安装基座上以与发光二极管芯片电连接的导电（12,15）线。 底座的安装座的第一平面被热粘合到第一板。 例如，该板是具有金属板的电路板，并且该底座被热接合到该至少一个板之一的金属板。 在一个示例中，在安装基座（10）的底部形成有多个凹槽（7）。

公开(公告)号：EP1759422A4

公开(公告)日：2011-04-06

申请号：EP05755193

申请日：2005-06-02

申请人： UNIV ILLINOIS

发明人： NUZZO RALPH G ,  ROGERS JOHN A ,  MENARD ETIENNE ,  LEE KEON JAE ,  KHANG DAHL-YOUNG ,  SUN YUGANG ,  MEITL MATTHEW ,  ZHU ZHENGTAO

IPC分类号： H01L21/20 ,  B81C1/00 ,  H01L21/02 ,  H01L21/30 ,  H01L21/326 ,  H01L21/4763 ,  H01L21/77 ,  H01L23/48 ,  H01L27/01 ,  H01L29/06 ,  H01L29/08 ,  H01L29/786 ,  H01L31/0312 ,  H01L31/18

CPC分类号： H01L23/02 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02521 ,  H01L21/02603 ,  H01L21/02628 ,  H01L21/308 ,  H01L21/322 ,  H01L21/6835 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/04 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/12 ,  H01L29/76 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03926 ,  H01L31/1804 ,  H01L31/1864 ,  H01L31/1896 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/32 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/03 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/0362 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/08225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/80121 ,  H01L2224/80862 ,  H01L2224/80895 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15788 ,  H01L2924/1579 ,  Y02E10/547 ,  Y02P70/521 ,  Y10S977/707 ,  Y10S977/724 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

摘要翻译： 本发明提供了用于制造可印刷的半导体元件和组装可印刷的半导体元件到衬底上表面的方法和装置。 方法，设备和设备部件本发明的能够产生宽范围的柔性电子和光电子器件和基底包含聚合物材料上的设备的阵列。 本发明因此提供了可拉伸的半导体结构，并且能够在拉伸构型良好的性能可拉伸电子器件。

公开(公告)号：EP2284888A2

公开(公告)日：2011-02-16

申请号：EP10008048.0

申请日：2010-08-02

申请人： Sony Corporation

发明人： Akiba, Akira ,  Mitarai, Shun ,  Ikeda, Koichi ,  Morita, Shinya

IPC分类号： H01L23/66 ,  H01Q1/38 ,  H01Q23/00 ,  H01Q1/22 ,  H01L23/498

CPC分类号： H01L23/66 ,  H01L23/13 ,  H01L23/147 ,  H01L23/645 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/16225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/12034 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/1515 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/157 ,  H01L2924/1903 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01Q1/38 ,  H01Q19/24 ,  H01Q19/30 ,  H05K1/024 ,  H05K1/141 ,  H05K1/16 ,  H05K2201/0191 ,  H05K2201/09036 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/20752

摘要： An interposer with which the manufacturing steps are able to be simplified and which shows superior high frequency characteristics is provided. The interposer includes: a substrate having a front face and a rear face; a wiring that is formed on the front face side of the substrate and is electrically connected to a semiconductor chip; an electric device connected to the wiring; and a concave section that is formed from the rear face side of the substrate in a position corresponding to the electric device.

摘要翻译： 提供了能够简化制造步骤并且显示出优异的高频特性的插入器。 所述插入件包括：具有正面和背面的基板; 形成在基板的正面侧并与半导体芯片电连接的布线; 连接到布线的电气设备; 以及从与所述电气装置对应的位置从所述基板的背面侧形成的凹部。

公开(公告)号：EP2120521A1

公开(公告)日：2009-11-18

申请号：EP07702269.7

申请日：2007-02-05

申请人： Princo Corp.

发明人： YANG, Chihkuang

IPC分类号： H05K3/36 ,  H05K1/14 ,  H05K3/46 ,  H01L23/48 ,  H01L23/12 ,  H01L23/50

CPC分类号： H05K1/117 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/5383 ,  H01L23/5385 ,  H01L24/16 ,  H01L2221/68318 ,  H01L2221/68345 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15159 ,  H05K1/142 ,  H05K3/0052 ,  H05K3/361 ,  H05K3/4611 ,  H05K2201/058 ,  H05K2201/091 ,  H05K2201/09109 ,  H05K2201/0919 ,  H01L2224/05599

摘要： Disclosed is a method of manufacturing a hybrid structure of multi-layer substrates. The method comprises steps of: separating a border district of at least one metal layer connecting with a border district of the corresponding dielectric layer from adjacent metal layers and adjacent dielectric layers for each multi-layer substrate and connecting a separated border of a metal layer of one multi-layer substrate with a separated border district of a metal layer of another multi-layer substrate to form a connection section. The hybrid structure comprises at least a first multi-layer substrate and a second multi-layer substrate. At least one first metal layer is connected with at least one second metal layer to form a connection section.

摘要翻译： 公开了一种制造多层基板的混合结构的方法。 该方法包括以下步骤：分离至少一种金属层的与相邻的金属层和邻近的介电层的每个多层基板对应的介电层的边界区连接的边界区和连接的金属层的分离的边界 与另一种多层基板的金属层的分离边界区一个多层基片，以形成连接部。 所述混合结构包括至少一个第一多层基板和第二多层基板。 至少一个第一金属层与至少一个第二金属层连接以形成连接部。

公开(公告)号：EP2015360A2

公开(公告)日：2009-01-14

申请号：EP08019004.4

申请日：2001-05-31

申请人： Murata Manufacturing Co. Ltd.

发明人： Sakai, Norio ,  Iida, Kazuhiro

IPC分类号： H01L23/498 ,  H05K3/40

CPC分类号： H05K3/403 ,  H01L23/49805 ,  H01L24/16 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/142 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15313 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/1632 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/4061 ,  H05K2201/09181 ,  H01L2224/0401

摘要： An electronic component is described which comprises an electronic component body (5) having first and second main surfaces (2, 3) opposed to each other, and side surfaces (4) connecting the first and second main surfaces (2, 3), a plurality of grooves (6) formed in the side surfaces (4), the grooves (6) extending from the first main surface (2) to the second main surface (3), an external terminal electrode (10) formed in each of the grooves (6), the external terminal electrode (10) having an axial direction dimension smaller than that of the electronic component body (5) and being arranged to reach the second main surface (3), and a connection conductor (37) formed in each of the grooves (6) separated from the external terminal electrode (10), the connection conductor (37) ) having an axial direction dimension smaller than that of the electronic component body (5) and being arranged to reach the first main surface (2).

摘要翻译： 描述了一种电子部件，其包括具有彼此相对的第一和第二主表面（2,3）的电子部件主体（5）和连接第一和第二主表面（2,3）的侧表面（4） 形成在侧面（4）上的多个槽（6），从第一主表面（2）延伸到第二主表面（3）的槽（6），形成在每个 沟槽（6），外部端子电极（10）的轴向尺寸小于电子部件主体（5）的轴向尺寸，并设置成到达第二主表面（3）;以及连接导体（37），形成在 与外部端子电极（10）分离的每个槽（6），连接导体（37））的轴向尺寸小于电子部件主体（5）的轴向尺寸，并且布置成到达第一主表面 2）。

公开(公告)号：EP1536673A4

公开(公告)日：2008-08-27

申请号：EP03733093

申请日：2003-05-27

申请人： TAIYO YUDEN KK

发明人： MIYAZAKI MASASHI ,  TAKAYAMA MITSUHIRO ,  SAWATARI TATSURO

IPC分类号： H05K3/46 ,  H01L23/498 ,  H01L23/538 ,  H05K1/02 ,  H05K1/18 ,  H05K3/44

CPC分类号： H05K1/185 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/021 ,  H05K3/445 ,  H05K3/4641 ,  H05K2201/0969 ,  H05K2201/09745 ,  H01L2924/00

摘要： A composite multi-layer substrate (20) comprising a flat plate-like core member (21) formed of a material having an excellent electric conductivity, an excellent heat conductivity, and a high rigidity, a front resin layer (22) and a rear resin layer (23) covering at least the front and rear surfaces of the core member (21), and a bottomless hole (24) formed in the core member (21) through the front and rear sides of the core member (21), wherein an electronic component (25) is installed in the bottomless hole (24), whereby since the strength of the composite multi-layer substrate (20) can be assured by the rigidity of the core member (21), conventional prior art glass cloth can be eliminated, deterioration in the electric characteristics caused by ion migration can be avoided and will result in reduced production cost.

公开(公告)号：EP0959498B1

公开(公告)日：2008-06-18

申请号：EP97943157.4

申请日：1997-10-08

申请人： Hitachi Chemical Company, Ltd.

发明人： YAMAMOTO, Kazunori ,  SHIMADA, Yasushi ,  KUMASHIRO, Yasushi ,  INADA, Teiichi ,  KURIYA, Hiroyuki ,  KANEDA, Aizou ,  TOMIYAMA, Takeo ,  NOMURA, Yoshihiro ,  HOSOKAWA, Yoichi ,  KIRIHARA, Hiroshi ,  KAGEYAMA, Akira

IPC分类号： H01L23/12 ,  C09J163/00 ,  H01L21/58 ,  C09J133/00 ,  C09J7/02

CPC分类号： H01L23/49827 ,  C09J163/00 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/15159 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/31511 ,  Y10T428/31515 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： The invention aims at improving the temperature resisting cycle characteristics after mounting and moisture absorption resiting reflow characteristics of a chip-mounted semiconductor, and provides an adhesive which functions as a bonding member (3) to be used when a semiconductor chip (6) is mounted on an organic supporting substrate (4) and which has storage moduli at 25 °C and at 260 °C as measured with a dynamic visco-elasticity measuring instrument of 10-2000 MPa and 3-50 MPa, respectively, a double-coated adhesive film produced therewith, a semiconductor device, an semiconductor chip mounting substrate, and methods of manufacturing these products.

公开(公告)号：EP1864325A2

公开(公告)日：2007-12-12

申请号：EP06737749.9

申请日：2006-03-10

申请人： Skyworks Solutions, Inc.

发明人： GAN, Qing ,  WARREN, Robert ,  LOBIANCO, Anthony ,  LIANG, Steve

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H01L23/49822 ,  B81C1/00269 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/1146 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16235 ,  H01L2224/2746 ,  H01L2224/29011 ,  H01L2224/291 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/32235 ,  H01L2224/73103 ,  H01L2224/81005 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/9211 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/15159 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： According to an exemplary embodiment, a wafer level package includes a device wafer including at least one device wafer contact pad and a device, and where the at least one device wafer contact pad is electrically connected to the device. The wafer level package includes a first polymer layer situated over the device wafer. The wafer level package includes at least one passive component situated over the first polymer layer and having a first terminal and a second terminal. The first terminal of the at least one passive component is electrically connected to the at least one device wafer contact pad. The wafer level package includes a second polymer layer situated over the at least one passive component. The wafer level package includes at least one polymer layer contact pad situated over the second polymer layer and electrically connected to the second terminal of the at least one passive component.

摘要翻译： 根据示例性实施例，晶片级封装包括包括至少一个器件晶片接触焊盘和器件的器件晶片，并且其中所述至少一个器件晶片接触焊盘电连接到所述器件。 晶片级封装包括位于器件晶片上方的第一聚合物层。 晶片级封装包括位于第一聚合物层之上并具有第一端子和第二端子的至少一个无源部件。 所述至少一个无源部件的第一端子电连接到所述至少一个器件晶片接触焊盘。 晶片级封装包括位于至少一个无源部件上的第二聚合物层。 晶片级封装包括至少一个聚合物层接触焊盘，其位于第二聚合物层之上并电连接到至少一个无源部件的第二端子。

公开(公告)号：EP0583201B1

公开(公告)日：2003-11-19

申请号：EP93402036.3

申请日：1993-08-10

申请人： COMMISSARIAT A L'ENERGIE ATOMIQUE

发明人： Massit, Claude ,  Nicolas, Gérard

IPC分类号： H01L25/10 ,  H01L25/065

CPC分类号： H01L25/105 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1088 ,  H01L2924/01014 ,  H01L2924/10253 ,  H01L2924/15159 ,  H01L2924/16153 ,  H01L2924/1627 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

公开(公告)号：EP0766410A3

公开(公告)日：2000-05-03

申请号：EP96115555.3

申请日：1996-09-27

申请人： KABUSHIKI KAISHA TOSHIBA

发明人： Yoshihara, Kunio ,  Morizuka, Kouhei ,  Konno, Mitsuo ,  Ashizawa, Yasuo ,  Akagi, Junko ,  Kuriyama, Yasuhiko ,  Morinaga, Motoyasu ,  Takagi, Eiji ,  Sizuki, Yasushi ,  Iseki, Yuji ,  Hanawa, Takeshi ,  Miyagi, Takeshi

IPC分类号： H04B1/38 ,  H01Q1/22 ,  H03D7/00

CPC分类号： H03D7/00 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/6677 ,  H01L2224/05554 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/4823 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/15165 ,  H01L2924/16152 ,  H01L2924/1616 ,  H01L2924/16195 ,  H01L2924/16251 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01Q23/00 ,  H04B1/408 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： Disclosed is an ultra high frequency radio communication apparatus having: a receiver antenna; a transmitter antenna; an IC chip being electrically connected to the receiver antenna and the transmitter antenna; a substrate on which the receiver antenna, the transmitter antenna and the IC chip are mounted; an input terminal for inputting to the IC chip a base band input signal; an output terminal for outputting a base band output signal from the IC chip; and a control signal terminal for inputting a control signal for controlling the IC chip to the IC chip. The IC chip is placed in a shielding space such that the cut-off frequency of the shielding space is higher than the frequency of a carrier signal for radio communication.