-
公开(公告)号:EP3371827A1
公开(公告)日:2018-09-12
申请号:EP16797704.0
申请日:2016-11-08
发明人: VELEZ, Mario Francisco , MUDAKATTE, Niranjan Sunil , YUN, Changhan Hobie , KIM, Daeik Daniel , BERDY, David Francis , KIM, Jonghae , MA, Yunfei , ZUO, Chengjie
IPC分类号: H01L23/522 , H01F17/04 , H01L23/64
CPC分类号: H01F27/2823 , H01F27/022 , H01F27/2828 , H01F27/29 , H01F38/14 , H01F41/06 , H01L21/565 , H01L23/3107 , H01L23/3157 , H01L23/5227 , H01L23/645 , H01L24/06 , H01L24/16 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/16 , H01L28/00 , H01L28/10 , H01L2223/6677 , H01L2224/0401 , H01L2224/04042 , H01L2224/08265 , H01L2224/16227 , H01L2224/45015 , H01L2224/45147 , H01L2224/4813 , H01L2224/73257 , H01L2924/00014 , H01L2924/15311 , H01L2924/16235 , H01L2924/19042 , H01L2924/19104 , H04B5/0037 , H04B5/0081 , H01L2224/05599 , H01L2924/20751 , H01L2224/85399
摘要: An inductor with multiple loops and semiconductor devices with such an inductor integrated thereon are proposed. In an aspect, the semiconductor device may include a die on a substrate, an inductor on the die in which the inductor comprises a wire with multiple non-planar loops above the die. In another aspect, the semiconductor device may include a plurality of posts on a die on a substrate, and an inductor on the die. The inductor may include a wire looped around the plurality of posts such that the inductor includes multiple non-planar loops.
-
公开(公告)号:EP2518880A3
公开(公告)日:2018-01-31
申请号:EP12165466.9
申请日:2012-04-25
发明人: Briere, Michael A.
IPC分类号: H02M7/00 , H01L29/20 , H01L29/66 , H01L29/00 , H01L29/423 , H01L27/088 , H01L21/02
CPC分类号: H02M7/003 , H01L21/8258 , H01L24/13 , H01L24/16 , H01L27/0688 , H01L27/085 , H01L27/092 , H01L2224/16227 , H01L2224/16265 , H01L2924/19041 , H01L2924/19042 , H01L2924/19104
摘要: In one implementation, an integrated power stage includes a common die situated over a load stage, the common die includes a driver stage and power switches. The power switches include a control transistor and a sync transistor. A drain of the control transistor receives an input voltage of the common die on one side (e.g., on a top surface) of the common die. A source of the control transistor is coupled to a drain of the sync transistor and provides an output voltage of the common die on an opposite side (e.g., on a bottom surface) of the common die. An interposer may be included under the power stage and includes an output inductor and optionally an output capacitor coupled to the output voltage of the common die on the opposite side of the common die.
摘要翻译: 在一个实现中,集成功率级包括位于负载级上的公共裸片,该公共裸片包括驱动器级和电源开关。 电源开关包括控制晶体管和同步晶体管。 控制晶体管的漏极在公共裸片的一侧(例如,在顶部表面上)接收公共裸片的输入电压。 控制晶体管的源极耦合到同步晶体管的漏极,并且在公共裸片的相反侧(例如,底部表面上)提供公共裸片的输出电压。 内插器可以被包括在功率级下,并且包括输出电感器和可选的输出电容器,该输出电容器被耦合到公共裸片的相对侧上的公共裸片的输出电压。
-
93.
公开(公告)号:EP3273467A2
公开(公告)日:2018-01-24
申请号:EP17175835.2
申请日:2017-06-13
IPC分类号: H01L21/60 , H01L23/522
CPC分类号: H01L23/5389 , B81C1/00246 , B81C2203/0735 , G02B6/4201 , G06K19/07745 , H01L23/34 , H01L23/5227 , H01L23/5228 , H01L23/5384 , H01L23/5386 , H01L23/57 , H01L23/58 , H01L24/02 , H01L24/19 , H01L24/20 , H01L25/16 , H01L27/0694 , H01L2223/54446 , H01L2224/02371 , H01L2224/02375 , H01L2224/04105 , H01L2224/06181 , H01L2224/2518 , H01L2224/32225 , H01L2224/83192 , H01L2224/92144 , H01L2924/14 , H01L2924/1434 , H01L2924/1461 , H01L2924/19015 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104
摘要: A die (102) for a semiconductor chip package includes a first surface (104) including an integrated circuit (106) formed therein. The die also includes a backside surface (108) opposite the first surface. The backside surface has a total surface area (206) defining a substantially planar region (302) of the backside surface. The die further includes at least one device (132) formed on the backside surface. The at least one device includes at least one extension (136) extending from the at least one device beyond the total surface area.
摘要翻译: 用于半导体芯片封装的管芯(102)包括其中形成有集成电路(106)的第一表面(104)。 该模具还包括与第一表面相对的背侧表面(108)。 背侧表面具有限定背侧表面的基本上平面的区域(302)的总表面区域(206)。 管芯还包括形成在背侧表面上的至少一个装置(132)。 所述至少一个装置包括从所述至少一个装置延伸超出整个表面区域的至少一个延伸部(136)。
-
94.
公开(公告)号:EP3238250A1
公开(公告)日:2017-11-01
申请号:EP14891616.6
申请日:2014-12-24
申请人: Intel Corporation
发明人: RUSU, Stefan , GARDNER, Donald
IPC分类号: H01L25/065
CPC分类号: H01L25/18 , H01L23/481 , H01L23/5223 , H01L23/5227 , H01L23/64 , H01L24/02 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/85 , H01L24/92 , H01L25/0657 , H01L25/16 , H01L28/10 , H01L28/40 , H01L28/90 , H01L2224/02372 , H01L2224/05548 , H01L2224/13024 , H01L2224/13025 , H01L2224/131 , H01L2224/13144 , H01L2224/13147 , H01L2224/16145 , H01L2224/16146 , H01L2224/16227 , H01L2224/16235 , H01L2224/1703 , H01L2224/17181 , H01L2224/32145 , H01L2224/45147 , H01L2224/48227 , H01L2224/4847 , H01L2224/73204 , H01L2224/73253 , H01L2224/73257 , H01L2224/81203 , H01L2224/81207 , H01L2224/85207 , H01L2224/92125 , H01L2224/92227 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06568 , H01L2225/06589 , H01L2924/00014 , H01L2924/1421 , H01L2924/1427 , H01L2924/1432 , H01L2924/14335 , H01L2924/1434 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19104 , H01L2924/014 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要: Integrated passive components in a stacked integrated circuit package are described. In one embodiment an apparatus has a substrate, a first die coupled to the substrate over the substrate, the first die including a power supply circuit coupled to the substrate to receive power, a second die having a processing core and coupled to the first die over the first die, the first die being coupled to the power supply circuit to power the processing core, and a passive device attached to the first die and coupled to the power supply circuit.
摘要翻译: 描述了堆叠集成电路封装中的集成无源组件。 在一个实施例中,一种装置具有衬底,在衬底上耦合到衬底的第一管芯,第一管芯包括耦合到衬底以接收功率的电源电路,具有处理核心并耦合到第一管芯上的第二管芯 第一管芯,第一管芯耦合到电源电路以给处理核心供电,以及无源器件,附接到第一管芯并耦合到电源电路。
-
95.OUTPUT MATCHING NETWORK HAVING A SINGLE COMBINED SERIES AND SHUNT CAPACITOR COMPONENT 审中-公开
标题翻译: 具有单一组合系列和并联电容器组件的输出匹配网络公开(公告)号:EP3213411A1
公开(公告)日:2017-09-06
申请号:EP15771449.4
申请日:2015-09-18
申请人: Raytheon Company
发明人: KAPER, Valery, S.
CPC分类号: H03H7/383 , H01L23/66 , H01L2223/6655 , H01L2223/6661 , H01L2224/48265 , H01L2924/1306 , H01L2924/14 , H01L2924/1421 , H01L2924/19041 , H01L2924/19104 , H03F1/56 , H03F3/195 , H03F3/245 , H03F2200/387
摘要: A matching network requiring a predetermined shunt capacitance in a transformation of the impedance at the output to a transistor to a load. The matching network includes a vertically stacked shunt capacitor, for providing the entire predetermined capacitance, and a series DC blocking capacitor.
摘要翻译: 匹配网络在将输出端的阻抗变换到晶体管到负载时需要预定的分流电容。 匹配网络包括用于提供整个预定电容的垂直堆叠并联电容器和串联隔直流电容器。
-
96.
公开(公告)号:EP3084824A4
公开(公告)日:2017-08-16
申请号:EP13899411
申请日:2013-12-19
申请人: INTEL CORP
IPC分类号: H01L23/485 , H01L21/60 , H01L23/367 , H01L23/49 , H01L23/552 , H01L25/065 , H01L29/06
CPC分类号: H01L25/0652 , H01L23/367 , H01L23/3675 , H01L23/5226 , H01L23/5227 , H01L23/552 , H01L23/562 , H01L23/564 , H01L23/66 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/85 , H01L25/065 , H01L25/0657 , H01L27/0207 , H01L29/0657 , H01L2223/6677 , H01L2224/131 , H01L2224/1319 , H01L2224/16105 , H01L2224/16113 , H01L2224/16225 , H01L2224/16227 , H01L2224/48091 , H01L2224/481 , H01L2224/48106 , H01L2224/4813 , H01L2224/48137 , H01L2224/48145 , H01L2224/48225 , H01L2224/48227 , H01L2224/48482 , H01L2224/49 , H01L2224/73257 , H01L2224/81001 , H01L2224/81007 , H01L2224/8114 , H01L2224/81801 , H01L2224/8185 , H01L2224/85801 , H01L2225/06506 , H01L2225/0651 , H01L2225/06551 , H01L2225/06589 , H01L2924/00014 , H01L2924/19104 , H01L2224/45099 , H01L2224/05599 , H01L2224/45015 , H01L2924/207 , H01L2924/014 , H01L2924/00012
摘要: Embodiments of a flexibly-wrapped integrated circuit die device and a method for mounting a flexibly-wrapped integrated circuit die to a substrate are disclosed. In some embodiments, the flexibly-wrapped integrated circuit die device includes a substrate and a flexible integrated circuit die coupled to the substrate in a substantially vertical orientation with reference to a surface of the substrate.
摘要翻译: 公开了柔性封装的集成电路管芯器件的实施例和用于将柔性封装的集成电路管芯安装到衬底的方法。 在一些实施例中,柔性封装的集成电路管芯器件包括衬底和柔性集成电路管芯,柔性集成电路管芯关于衬底的表面以基本垂直的方向耦合到衬底。
-
97.CHIP ON CHIP ATTACH (PASSIVE IPD AND PMIC) FLIP CHIP BGA USING NEW CAVITY BGA SUBSTRATE 审中-公开
标题翻译: 倒装芯片BGA芯片-ON-芯片安装(IPD被动句与PMIC)使用新的BGA腔衬底公开(公告)号:EP3133645A1
公开(公告)日:2017-02-22
申请号:EP16188226.1
申请日:2013-03-04
发明人: IAN, Kent
IPC分类号: H01L25/065 , H01L23/13 , H01L25/16
CPC分类号: H01L25/50 , H01L21/563 , H01L21/565 , H01L23/13 , H01L23/293 , H01L23/3128 , H01L23/49816 , H01L23/49866 , H01L23/49894 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/32 , H01L24/73 , H01L24/81 , H01L25/0657 , H01L25/16 , H01L2224/13147 , H01L2224/1403 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/16265 , H01L2224/1703 , H01L2224/32225 , H01L2224/73204 , H01L2225/06513 , H01L2225/06517 , H01L2225/06568 , H01L2924/12042 , H01L2924/15153 , H01L2924/15156 , H01L2924/15159 , H01L2924/15311 , H01L2924/15313 , H01L2924/1579 , H01L2924/181 , H01L2924/18161 , H01L2924/19011 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19051 , H01L2924/19104 , H01L2924/35121 , H01L2924/00
摘要: An integrated passive device and power management integrated circuit are directly connected, active surface to active surface, resulting in a pyramid die stack. The die stack is flip-chip attached to a laminate substrate having a cavity drilled therein wherein the smaller die fits into the cavity. The die to die attach is not limited to IPD and PMIC and can be used for other die types as required.
摘要翻译: 集成无源器件和电力管理集成电路直接相连时,活性表面,以表面活性,在一个金字塔产生的堆栈。 堆栈是倒装芯片附连到在其中具有钻出的worin越小装配到腔体中的腔体的层叠体的基材。 到管芯附装管芯并不限于IPD和PMIC,并且可以用于其它类型的作为所需。
-
公开(公告)号:EP3093877A3
公开(公告)日:2017-02-22
申请号:EP16161578.6
申请日:2016-03-22
申请人: MediaTek, Inc
发明人: TSAI, Shiann-Tsong
IPC分类号: H01L21/48 , H01L23/00 , H01L23/495
CPC分类号: H01L25/16 , H01L21/4832 , H01L21/561 , H01L21/563 , H01L21/568 , H01L23/293 , H01L23/31 , H01L23/3128 , H01L23/4952 , H01L23/49816 , H01L23/5389 , H01L24/03 , H01L24/06 , H01L24/14 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/25 , H01L24/43 , H01L24/46 , H01L24/82 , H01L24/96 , H01L25/0657 , H01L25/50 , H01L2224/02371 , H01L2224/02379 , H01L2224/02381 , H01L2224/04042 , H01L2224/12105 , H01L2224/24146 , H01L2224/24195 , H01L2224/24225 , H01L2224/2512 , H01L2224/25174 , H01L2224/32145 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/82101 , H01L2224/96 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06562 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01047 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/18162 , H01L2924/18165 , H01L2924/19042 , H01L2924/19104 , H01L2924/19105 , H01L2224/45015 , H01L2924/207 , H01L2224/05599 , H01L2924/00012 , H01L2224/19 , H01L2224/11 , H01L2224/82
摘要: A semiconductor package includes a semiconductor die having an active surface and a bottom surface opposite to the active surface; a plurality of bond pads distributed on the active surface of the semiconductor die; an encapsulant covering the active surface of the semiconductor die, wherein the encapsulant comprises a bottom surface that is flush with the bottom surface of the semiconductor; and a plurality of printed interconnect features embedded in the encapsulant for electrically connecting the plurality of bond pads. Each of the printed interconnect features comprises a conductive wire and a conductive pad being integral with the conductive wire.
-
公开(公告)号:EP3104409A2
公开(公告)日:2016-12-14
申请号:EP16166593.0
申请日:2016-04-22
申请人: MediaTek, Inc
发明人: LIN, Tzu-Hung , PENG, I-Hsuan , HSIAO, Ching-Wen
IPC分类号: H01L23/538 , H01L25/16 , H01L25/10 , H01L21/60 , H01L21/56
CPC分类号: H01L25/16 , H01L21/568 , H01L21/78 , H01L23/49811 , H01L23/5383 , H01L23/5384 , H01L23/5389 , H01L24/13 , H01L24/16 , H01L24/19 , H01L24/20 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/92 , H01L24/94 , H01L24/97 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/04042 , H01L2224/04105 , H01L2224/12105 , H01L2224/131 , H01L2224/13147 , H01L2224/1403 , H01L2224/14051 , H01L2224/16145 , H01L2224/16265 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73209 , H01L2224/73253 , H01L2224/73265 , H01L2224/73267 , H01L2224/81815 , H01L2224/92124 , H01L2224/92225 , H01L2224/92244 , H01L2224/94 , H01L2224/97 , H01L2225/0651 , H01L2225/06568 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/1431 , H01L2924/1432 , H01L2924/1434 , H01L2924/1436 , H01L2924/15311 , H01L2924/19011 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/37001 , H01L2924/014 , H01L2924/00012 , H01L2224/83 , H01L2224/81 , H01L2924/00
摘要: A semiconductor package assembly is provided. The semiconductor package assembly includes a semiconductor package. The semiconductor package includes a semiconductor die (100). A redistribution layer (RDL) structure (230) is disposed on the semiconductor die and is electrically connected to the semiconductor die. An active (140) or passive element (150) is disposed between the semiconductor die and the RDL structure. A molding compound (220) surrounds the semiconductor die and the active or passive element.
摘要翻译: 提供半导体封装组件。 该半导体封装组件包括半导体封装。 该半导体封装包括半导体管芯(100)。 再分布层(RDL)结构(230)设置在半导体管芯上并电连接到半导体管芯。 有源(140)或无源元件(150)设置在半导体管芯和RDL结构之间。 模塑料(220)围绕半导体管芯和有源或无源元件。
-
100.INTEGRATED CIRCUIT CHIP USING TOP POST-PASSIVATION TECHNOLOGY AND BOTTOM STRUCTURE TECHNOLOGY 审中-公开
标题翻译: INTEGRIERTE CHIPSCHALTUNG MIT OBERER POST-PASSIVIERUNGSTECHNOLOGIE UND UNTERER STRUKTURTECHNOLOGIE公开(公告)号:EP2414801A4
公开(公告)日:2016-11-16
申请号:EP10759186
申请日:2010-03-11
申请人: QUALCOMM INC
发明人: LIN MOU-SHIUNG , LEE JIN-YUAN , LO HSIN-JUNG , YANG PING-JUNG , LIU TE-SHENG
IPC分类号: G01L7/00 , G06F1/16 , G06F19/00 , H01L21/56 , H01L23/00 , H01L23/31 , H01L23/48 , H01L23/522 , H01L25/065 , H01L25/16 , H01L25/18
CPC分类号: G06F1/16 , G11C5/147 , H01L21/563 , H01L23/3128 , H01L23/3171 , H01L23/3192 , H01L23/481 , H01L23/5223 , H01L23/5227 , H01L23/60 , H01L23/66 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/50 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/16 , H01L25/18 , H01L25/50 , H01L2223/6611 , H01L2223/6666 , H01L2224/02166 , H01L2224/02311 , H01L2224/02313 , H01L2224/02321 , H01L2224/0233 , H01L2224/02331 , H01L2224/0235 , H01L2224/0237 , H01L2224/02371 , H01L2224/02375 , H01L2224/02381 , H01L2224/0239 , H01L2224/024 , H01L2224/0345 , H01L2224/03462 , H01L2224/03464 , H01L2224/03612 , H01L2224/03614 , H01L2224/03912 , H01L2224/0392 , H01L2224/0401 , H01L2224/04042 , H01L2224/05024 , H01L2224/05027 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05176 , H01L2224/05181 , H01L2224/05187 , H01L2224/05541 , H01L2224/05548 , H01L2224/05554 , H01L2224/0556 , H01L2224/05567 , H01L2224/05572 , H01L2224/056 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/05673 , H01L2224/05676 , H01L2224/11 , H01L2224/11009 , H01L2224/1132 , H01L2224/11334 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11849 , H01L2224/119 , H01L2224/1191 , H01L2224/13 , H01L2224/13006 , H01L2224/1302 , H01L2224/13022 , H01L2224/13024 , H01L2224/13082 , H01L2224/13083 , H01L2224/13084 , H01L2224/13099 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13169 , H01L2224/13294 , H01L2224/133 , H01L2224/13311 , H01L2224/13609 , H01L2224/1403 , H01L2224/1411 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/16265 , H01L2224/17181 , H01L2224/2919 , H01L2224/2929 , H01L2224/29294 , H01L2224/293 , H01L2224/29339 , H01L2224/32105 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48111 , H01L2224/48145 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48644 , H01L2224/48647 , H01L2224/48664 , H01L2224/48669 , H01L2224/48764 , H01L2224/48769 , H01L2224/48824 , H01L2224/48844 , H01L2224/48847 , H01L2224/48864 , H01L2224/4911 , H01L2224/49175 , H01L2224/4918 , H01L2224/73203 , H01L2224/73204 , H01L2224/73207 , H01L2224/73215 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/81191 , H01L2224/81411 , H01L2224/81444 , H01L2224/81801 , H01L2224/81815 , H01L2224/8185 , H01L2224/81895 , H01L2224/81903 , H01L2224/83101 , H01L2224/83104 , H01L2224/83851 , H01L2224/92 , H01L2224/9202 , H01L2224/92125 , H01L2224/92127 , H01L2224/92147 , H01L2224/92225 , H01L2224/92247 , H01L2224/94 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2225/06589 , H01L2225/1023 , H01L2225/1029 , H01L2225/1058 , H01L2225/107 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01059 , H01L2924/01068 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/1421 , H01L2924/1433 , H01L2924/15311 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/19105 , H01L2924/30105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2224/48869 , H01L2224/48744 , H01L2924/00012 , H01L2224/03 , H01L2224/0361 , H01L2924/0665 , H01L2224/81 , H01L2224/83 , H01L24/78 , H01L2224/85 , H01L21/56 , H01L21/78 , H01L2924/0635 , H01L2924/07025 , H01L21/304 , H01L21/76898 , H01L2224/0231
-
-
-
-
-
-
-
-
-