公开(公告)号：US20050082653A1

公开(公告)日：2005-04-21

申请号：US10948976

申请日：2004-09-24

申请人： Bruce McWilliams ,  Giles Humpston ,  Belgacem Haba ,  David Tuckerman

发明人： Bruce McWilliams ,  Giles Humpston ,  Belgacem Haba ,  David Tuckerman

IPC分类号： H01L21/60 ,  H01L23/04 ,  H01L23/10 ,  H01L23/485 ,  H01L27/146 ,  H03H3/007 ,  H03H3/08 ,  H03H9/10 ,  H01L23/02

CPC分类号： H01L23/3114 ,  B81B2207/095 ,  B81C1/00293 ,  B81C1/00301 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019 ,  H01L21/76898 ,  H01L23/04 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/1401 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03H3/007 ,  H03H9/0547 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1064 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A method of making a plurality of sealed assemblies is provided which includes a) assembling a first element to a second element so that a bottom surface of the first element faces downwardly toward a front surface of the second element and a top surface of the first element faces upwardly away from the second element; and (b) forming ring seals surrounding regions of the front surface of the second element by introducing flowable material between the first element and the second element from the top surface of the first element through openings in the first element. A chip is provided which includes: (a) a body defining a front surface and one or more circuit elements on or within the body; (b) one or more bond pads exposed at the front surface in a bond pad region; and (c) a metallic ring exposed at the front surface, the ring substantially surrounding the bond pad region. Sealed chip assemblies are formed by sealing an array of the chips, e.g., in wafer form, to a cap element.

摘要翻译： 提供了一种制造多个密封组件的方法，其包括：a）将第一元件组装到第二元件，使得第一元件的底表面向下朝向第二元件的前表面并且第一元件的顶表面 面向上远离第二元件; 以及（b）通过从第一元件的顶表面通过第一元件中的开口引入第一元件和第二元件之间的可流动材料，形成围绕第二元件的前表面的区域的环形密封件。 提供了一种芯片，其包括：（a）主体，其在身体上或体内限定前表面和一个或多个电路元件; （b）在接合焊盘区域中的前表面处暴露的一个或多个接合焊盘; 和（c）在前表面露出的金属环，所述环基本上围绕所述接合焊盘区域。 密封的芯片组件通过将芯片的阵列（例如，晶片形式）密封到盖元件来形成。

公开(公告)号：US06721189B1

公开(公告)日：2004-04-13

申请号：US10098520

申请日：2002-03-13

申请人： Belgacem Haba

发明人： Belgacem Haba

IPC分类号： H05K114

CPC分类号： H05K1/147 ,  H01L2224/49175 ,  H01L2924/01079 ,  H01L2924/14 ,  H01R12/52 ,  H01R12/714 ,  H05K1/141 ,  H05K1/148 ,  H05K1/189 ,  H05K3/325 ,  H05K3/4691 ,  H05K2201/10159 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2203/167

摘要： The memory module includes a substantially rigid first circuit board having at least one memory chip disposed thereon. The memory module also includes a substantially rigid second circuit board having an array of electrical contact points disposed on a planar surface thereof. A flexible connector electrically couples the first circuit board to the second circuit board, such that the memory chip is electrically connected to the array of electrical contact points. Alternatively, the memory module that rigid/flex circuit board. The rigid/flex circuit board includes a substantially rigid first section having at least one memory chip disposed thereon, and a substantially rigid second section having an array of electrical contact points disposed on a planar surface thereof. The rigid/flex circuit board also includes a flexible third section in-between the first section to the second section.

摘要翻译： 存储器模块包括具有设置在其上的至少一个存储器芯片的基本刚性的第一电路板。 存储器模块还包括具有布置在其平坦表面上的电接触点阵列的基本上刚性的第二电路板。 柔性连接器将第一电路板电耦合到第二电路板，使得存储芯片电连接到电接触点阵列。 或者，刚性/柔性电路板的内存模块。 刚性/柔性电路板包括具有设置在其上的至少一个存储芯片的基本刚性的第一部分，以及设置在其平坦表面上的具有电接触点阵列的基本上刚性的第二部分。 刚性/柔性电路板还包括在第一部分与第二部分之间的柔性第三部分。

公开(公告)号：US06674161B1

公开(公告)日：2004-01-06

申请号：US09679143

申请日：2000-10-03

申请人： Belgacem Haba

发明人： Belgacem Haba

IPC分类号： H01L2304

CPC分类号： H01L25/50 ,  H01L25/0657 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2924/0002 ,  H01L2924/00

摘要： Semiconductor devices and methods of forming semiconductor devices are described. In one embodiment, at least one conductive structure is formed within a plurality of semiconductor substrates. At least portions of one of the conductive structures have oppositely facing, exposed outer surfaces. Individual substrates are stacked together in a die stack such that individual conductive structures on each substrate are in electrical contact with the conductive structures on a next adjacent substrate. In a preferred embodiment, the conductive structures comprise multi-layered, conductive pad structures.

摘要翻译： 描述了半导体器件和半导体器件形成方法。 在一个实施例中，在多个半导体衬底内形成至少一个导电结构。 一个导电结构的至少一部分具有相对面对的暴露的外表面。 单个衬底在管芯堆叠中堆叠在一起，使得每个衬底上的各个导电结构与下一个相邻衬底上的导电结构电接触。 在优选实施例中，导电结构包括多层导电垫结构。

公开(公告)号：US06545875B1

公开(公告)日：2003-04-08

申请号：US09568424

申请日：2000-05-10

申请人： Donald V. Perino ,  Belgacem Haba ,  Sayeh Khalili

发明人： Donald V. Perino ,  Belgacem Haba ,  Sayeh Khalili

IPC分类号： H05K702

CPC分类号： G11C5/04 ,  G06F13/409 ,  G11C5/00 ,  H05K1/023 ,  H05K1/117 ,  H05K1/141 ,  H05K1/147 ,  H05K1/148 ,  H05K7/1459 ,  H05K2201/10189

摘要： Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.

公开(公告)号：US06518091B1

公开(公告)日：2003-02-11

申请号：US09655300

申请日：2000-09-05

申请人： Belgacem Haba

发明人： Belgacem Haba

IPC分类号： H01L2144

CPC分类号： H01L21/568 ,  B29C70/62 ,  B29C70/882 ,  G02F1/1339 ,  H01L21/6835 ,  H01L23/49827 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/27438 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29499 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12044 ,  H01L2924/14 ,  H05K3/323 ,  H05K3/368 ,  H05K3/4623 ,  H05K2201/0133 ,  H05K2201/0248 ,  H05K2201/083 ,  H05K2201/09536 ,  H05K2203/104 ,  H05K2203/105 ,  H01L2924/00

摘要： A method of making an anisotropic conductive element for use in microelectronic packaging includes providing a layer of material having a pair of oppositely-directed major faces, the layer incorporating a curable dielectric material in a fluid condition and electrically conductive particles in the curable dielectric material and applying a magnetic field to the layer of a material so as to alter the configuration of the particles and so as to form areas of high particle concentration defining a plurality of conductive paths extending between the major faces of the layer of a material. After applying the magnetic field, the dielectric material is cured. The layer may be compressed for moving the conductive particles together to provide lower resistance electrical paths through the layer. In certain embodiments, at last some of the conductive particles are elongated so that when the magnetic field is applied to the layer of a material, the magnetic field turns the axes of elongation of at least some of the elongated particles towards the vertical direction. In other embodiments, the magnetic field moves at least some of the conductive particles in horizontal directions.

摘要翻译： 制造用于微电子封装的各向异性导电元件的方法包括提供具有一对相反方向的主面的材料层，该层包含处于流体状态的可固化电介质材料和可固化电介质材料中的导电颗粒，以及 对材料层施加磁场，以便改变颗粒的构型并形成高的颗粒浓度的区域，从而限定在材料层的主要表面之间延伸的多个导电路径。 施加磁场后，介电材料固化。 该层可以被压缩以将导电颗粒移动到一起以提供穿过层的较低电阻的电路径。 在某些实施例中，最后一些导电颗粒是细长的，使得当磁场被施加到材料层时，磁场使至少一些细长颗粒的伸长轴线向垂直方向转动。 在其他实施例中，磁场沿水平方向移动至少一些导电颗粒。

公开(公告)号：US06496255B2

公开(公告)日：2002-12-17

申请号：US09923143

申请日：2001-08-06

申请人： Kazumi Sugai ,  Belgacem Haba ,  Yukio Morishige

发明人： Kazumi Sugai ,  Belgacem Haba ,  Yukio Morishige

IPC分类号： G01N2100

CPC分类号： G01N21/55

摘要： A sample is rotated about an axis perpendicular to a surface of the sample in predetermined angular steps. The surface of the sample is irradiated with linearly polarized light, and a reflected intensity of light reflected from the surface of the sample is detected in each angular step. Based on a rotational angle dependency of the reflected intensity, the crystal face orientation of the sample is determined. To improve signal-to-noise ratio, the crystal lattice of the sample is excited. Further, the surface of the sample is irradiated with a plurality of linearly polarized light beams to obtain a plurality of reflected intensities.

公开(公告)号：US06449159B1

公开(公告)日：2002-09-10

申请号：US09564064

申请日：2000-05-03

申请人： Belgacem Haba

发明人： Belgacem Haba

IPC分类号： H05K720

CPC分类号： H01L23/647 ,  H01L23/36 ,  H01L23/367 ,  H01L23/4985 ,  H01L23/5387 ,  H01L23/552 ,  H01L24/86 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2225/06551 ,  H01L2225/06579 ,  H01L2225/06589 ,  H01L2924/14 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/1056 ,  H05K2201/10674

摘要： The invention provides a semiconductor module comprising a heat spreader, at least two semiconductors thermally coupled to the heat spreader, and a plurality of electrically conductive leads electrically connected to the semiconductors. The leads may form part of a flexible circuit at least partially attached to the heat spreader, where at least one of the electrically conductive leads is preferably common to both of the semiconductors. The two semiconductors may be mounted or preferably directly bonded onto opposing side walls of the heat spreader. The invention also provides a method of making the abovementioned semiconductor module.

摘要翻译： 本发明提供一种半导体模块，其包括散热器，至少两个热耦合到散热器的半导体以及电连接到半导体的多个导电引线。 引线可以形成至少部分地附接到散热器的柔性电路的一部分，其中至少一个导电引线优选地是两个半导体共同的。 两个半导体可以被安装或优选地直接结合到散热器的相对的侧壁上。 本发明还提供了制造上述半导体模块的方法。

公开(公告)号：US06428328B2

公开(公告)日：2002-08-06

申请号：US09977803

申请日：2001-10-15

申请人： Belgacem Haba ,  Anthony B. Faraci

发明人： Belgacem Haba ,  Anthony B. Faraci

IPC分类号： H01R1201

CPC分类号： H05K3/326 ,  H01L2224/0401 ,  H01L2224/05551 ,  H01L2224/05552 ,  H01L2224/05557 ,  H01L2224/16237 ,  H01L2224/8114 ,  H01R12/89 ,  H01R13/193 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165 ,  Y10T29/49213

摘要： A connector for microelectronic elements includes a sheetlike dielectric layer having a plurality of through holes desirably arranged in a rectangular grid pattern. Each hole is provided on one major surface with a generally laminar contact having at least one projection extending inwardly over the through hole. Contact pads on the second major surface of the dielectric layer overlie the through holes to provide a blind end which is electrically connected to the other contact by means of a metal layer lining the through hole. The resulting connectors provide low or zero insertion force sockets for mounting microelectronic elements having bump leads thereto. The bump leads may be received within corresponding sockets without engagement with the contact or projection, and then, by movement in a lateral direction, engaging the contact or projection to provide electrical connection to the socket.

摘要翻译： 用于微电子元件的连接器包括具有期望地布置成矩形网格图案的多个通孔的片状电介质层。 每个孔设置在一个主表面上，具有大致层状接触，其具有在通孔上向内延伸的至少一个突起。 电介质层的第二主表面上的接触焊盘覆盖在通孔上，以提供盲端，该盲端通过衬套穿过通孔的金属层与另一接触电连接。 所得到的连接器提供低或零插入力插座，用于安装具有凸起引线的微电子元件。 凸起引线可以被接收在相应的插座中，而不与触点或突起接合，然后通过沿横向的移动来接合触点或突起以提供到插座的电连接。

公开(公告)号：US06376904B1

公开(公告)日：2002-04-23

申请号：US09685941

申请日：2000-10-10

申请人： Belgacem Haba ,  Donald V. Perino ,  Sayeh Khalili

发明人： Belgacem Haba ,  Donald V. Perino ,  Sayeh Khalili

IPC分类号： H01L2334

CPC分类号： H01L25/0657 ,  H01L23/3128 ,  H01L23/5385 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/73 ,  H01L25/0652 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85447 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06579 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00

摘要： A semiconductor module having a first integrated circuit die having a planar surface. The first integrated circuit die has a first conductive pad disposed substantially on the planar surface and a redistributed conductive pad electrically connected to the first conductive pad. The redistributed conductive pad is disposed near a periphery of the planar surface. The semiconductor module has a second integrated circuit die stacked adjacent to the planar surface and offset from the periphery, such that a second conductive pad on the second integrated circuit die can be electrically connected to the redistributed conductive pad.

摘要翻译： 一种半导体模块，具有具有平坦表面的第一集成电路管芯。 第一集成电路管芯具有基本上设置在平面表面上的第一导电焊盘和电连接到第一导电焊盘的再分布导电焊盘。 再分布的导电焊盘设置在平面的周边附近。 半导体模块具有与平面相邻并且与周边偏移堆叠的第二集成电路管芯，使得第二集成电路管芯上的第二导电焊盘可以电连接到再分布的导电焊盘。

公开(公告)号：US06261863B1

公开(公告)日：2001-07-17

申请号：US09471973

申请日：1999-12-23

申请人： Masud Beroz ,  Thomas H. DiStefano ,  Anthony B. Faraci ,  Joseph Fjelstad ,  Belgacem Haba

发明人： Masud Beroz ,  Thomas H. DiStefano ,  Anthony B. Faraci ,  Joseph Fjelstad ,  Belgacem Haba

IPC分类号： H01L2144

CPC分类号： H05K3/4092 ,  H01L23/49811 ,  H01L23/4985 ,  H01L23/5387 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： A connection component for a microelectronic device such as a semiconductor chip incorporates a support layer and conductive structures extending across a surface of the support layer. The conductive structures have anchors connecting them to the support layer, and releasable or unanchored portions. A method of making a connection component includes removing material from the conductive structures or the support layer or both to form the anchors.

摘要翻译： 用于诸如半导体芯片的微电子器件的连接部件包括支撑层和延伸穿过支撑层的表面的导电结构。 导电结构具有将它们连接到支撑层，以及可释放或未锚定部分的锚固件。 制造连接部件的方法包括从导电结构或支撑层或两者移除材料以形成锚固件。