公开(公告)号：US4868047A

公开(公告)日：1989-09-19

申请号：US158247

申请日：1988-02-19

Applicant: Akira Hasegawa ,  Masayuki Ishiwa

Inventor： Akira Hasegawa ,  Masayuki Ishiwa

IPC: B29C45/14 ,  B29C45/00 ,  B29K67/00 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/20 ,  H05K3/46

CPC classification number: H05K3/207 ,  B29C45/0005 ,  B29C45/0013 ,  H05K1/0373 ,  H05K1/095 ,  H05K2201/0209 ,  H05K2201/0245 ,  H05K2201/0251 ,  H05K2201/09118 ,  H05K2203/0156 ,  Y10S428/901 ,  Y10T428/251 ,  Y10T428/31681 ,  Y10T428/31786

Abstract: An injection molding resin-type printed wiring board having an electric circuit pattern layer formed integrally on the surface thereof and having reduced warpage. In the printed circuit board, the injection molding resin includes a thermoplastic resin composition essentially comprising polyethylene terephthalate and containing a flaky inorganic reinforcing material. The inorganic reinforcing material comprises single-substance fine mica flakes or a mixture of fine mica flakes and short glass fibers.

Abstract translation: 一种注塑树脂型印刷线路板，其电路图案层整体地形成在其表面上并具有减小的翘曲。 在印刷电路板中，注塑树脂包括基本上包含聚对苯二甲酸乙二醇酯并含有片状无机增强材料的热塑性树脂组合物。 无机增强材料包括单质微米云母片或细云母薄片和短玻璃纤维的混合物。

公开(公告)号：US4849284A

公开(公告)日：1989-07-18

申请号：US15191

申请日：1987-02-17

Applicant: David J. Arthur ,  John C. Mosko ,  Connie S. Jackson ,  G. Robert Traut

Inventor： David J. Arthur ,  John C. Mosko ,  Connie S. Jackson ,  G. Robert Traut

IPC: C08K3/00 ,  B32B15/08 ,  B32B15/082 ,  C08K9/06 ,  C08L27/12 ,  C09D127/12 ,  H01B3/44 ,  H01L23/08 ,  H01L23/14 ,  H05K1/03 ,  H05K1/05 ,  H05K3/38 ,  H05K3/46

CPC classification number: H05K1/0373 ,  C08K9/06 ,  H01B3/445 ,  H01L23/145 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/034 ,  H05K1/0366 ,  H05K1/056 ,  H05K2201/015 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0251 ,  H05K2201/068 ,  H05K3/389 ,  H05K3/4626 ,  Y10S428/901 ,  Y10T428/252 ,  Y10T428/259 ,  Y10T428/2995 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31692

Abstract: A ceramic filled fluoropolymer-based electrical substrate material well suited for forming rigid printed wiring board substrate materials and integrated circuit chip carriers is presented which exhibits improved electrical performance over other printed wiring board materials and circuit chip carriers. Also, the low coefficients of thermal expansion and compliant nature of this electrical substrate material results in improved surface mount reliability and plated through-hole reliability. The electrical substrate material preferably comprises polytetrafluoroethylene filled with silica along with a small amount of microfiberglass. In an important feature of this invention, the ceramic filler (silica) is coated with a silane coating material which renders the surface of the ceramic hydrophobic and provides improved tensile strength, peel strength and dimensional stability.

公开(公告)号：US4833022A

公开(公告)日：1989-05-23

申请号：US87195

申请日：1987-08-20

Applicant: William G. Bridges ,  Thomas A. Armer

Inventor： William G. Bridges ,  Thomas A. Armer

IPC: B32B15/08 ,  H05K1/03

CPC classification number: H05K1/036 ,  B32B15/08 ,  H05K1/032 ,  H05K1/0326 ,  H05K1/034 ,  H05K1/0346 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0355 ,  Y10T428/266 ,  Y10T428/31544 ,  Y10T428/31696 ,  Y10T428/31699

Abstract: Polymer/copper laminates and a method for their manufacture employing smooth, untreated, wrought-copper and characterized by cohesive and adhesive strength in the resulting laminates.

公开(公告)号：US4809058A

公开(公告)日：1989-02-28

申请号：US941812

申请日：1986-12-15

Applicant: Takao Funamoto ,  Ryoichi Kajiwara ,  Mituo Katou ,  Takeshi Matsuzaka ,  Tomohiko Shida ,  Hiroshi Wachi ,  Kazuya Takahashi ,  Masatoshi Watanabe ,  Minoru Yamada ,  Keiichirou Nakanishi ,  Katuo Sugawara

Inventor： Takao Funamoto ,  Ryoichi Kajiwara ,  Mituo Katou ,  Takeshi Matsuzaka ,  Tomohiko Shida ,  Hiroshi Wachi ,  Kazuya Takahashi ,  Masatoshi Watanabe ,  Minoru Yamada ,  Keiichirou Nakanishi ,  Katuo Sugawara

IPC: H01L23/473 ,  H01L23/538 ,  H05K1/02 ,  H05K1/03 ,  H05K7/20 ,  H01L23/02 ,  H01L25/04 ,  H01L39/02

CPC classification number: H05K1/0373 ,  H01L23/473 ,  H01L23/5383 ,  H01L23/5385 ,  H05K1/0272 ,  H01L2924/0002 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/064

Abstract: An integrated circuit device comprising a wiring substrate on one surface of which integrated circuit chips are mounted, a power source substrate of a laminated structure provided in contact with the other surface of the wiring substrate and formed by alternately laminating a plurality of feeding conductor layers of a heat conductive metal and a plurality of electrically insulating layers of an electrically insulating material, and bonding together the laminated layers, a means for electrically connecting the wiring substrate and the power source substrate to each other, and a heat radiating means inserted in at least either the feeding conductor layers or the electrically insulating layers and adapted to radiate the heat, which occurs in the power source substrate, to the outside thereof. This integrated circuit device has a power source substrate of a remarkably high heat radiating efficiency, and is suitably used as an integrated circuit device having integrated circuit chips mounted with a high density on a wiring substrate therein.

Abstract translation: 一种集成电路装置，其特征在于，在其一面上安装有集成电路芯片的布线基板，与所述布线基板的另一面接触而形成的叠层结构的电源基板，通过交替层叠多个馈电导体层 导电金属和多个电绝缘材料的电绝缘层，并且将层叠层结合在一起;将布线基板和电源基板彼此电连接的装置，以及至少插入至少 馈电导体层或电绝缘层，并且适于将发生在电源基板中的热辐射到其外部。 该集成电路装置具有显着高的散热效率的电源基板，并且适合用作集成电路装置，其中集成电路芯片以高密度安装在其布线基板上。

公开(公告)号：US4703395A

公开(公告)日：1987-10-27

申请号：US911726

申请日：1986-09-26

Applicant: Thomas L. Cline

Inventor： Thomas L. Cline

IPC: H05K1/02 ,  H05K1/03 ,  H05K7/02

CPC classification number: H05K1/036 ,  H05K1/0271 ,  H05K1/0272 ,  H05K2201/0251 ,  Y10S428/901 ,  Y10T428/24149 ,  Y10T428/24694 ,  Y10T428/253 ,  Y10T428/31989

Abstract: This invention relates generally to an electronic circuit breadboard assembly having a particular novel layered construction. In place of a conventional solid chipboard laminated construction, an undulated midstratum layer is utilized in such manner that air cells or pockets are formed within the structure. An overlayer and an underlayer are adhesively applied to the undulated midstratum layer. The invention results in a breadboard assembly which may be much more economically manufactured while yielding superior end product strength and durability. The invention has widespread utility in the electronics assembly field as a superior substitute for the currently used solid laminated chipboard design.

Abstract translation: 本发明一般涉及一种具有特殊新型分层结构的电子线路面包板组件。 代替常规的实心刨花板层压结构，以这样的方式使用起伏的中间层，使得在结构内形成气泡或凹穴。 将覆盖层和底层粘合地施加到起伏的中间层。 本发明产生了一种面包板组件，其可以在产生优异的最终产品强度和耐久性的同时更经济地制造。 本发明在电子装配领域具有广泛的用途，作为目前使用的固体层压刨花板设计的优异替代品。

公开(公告)号：US4442139A

公开(公告)日：1984-04-10

申请号：US102576

申请日：1979-12-11

Applicant: Alan Brigham

Inventor： Alan Brigham

IPC: B32B27/08 ,  H01B1/24 ,  H01M4/96 ,  H05B3/14 ,  H05F3/02 ,  H05K1/03 ,  H05K1/09 ,  H05K3/10 ,  H05K3/38 ,  H05K9/00 ,  B05D5/12

CPC classification number: H05K9/009 ,  B32B27/08 ,  H01B1/24 ,  H01M4/96 ,  H05B3/145 ,  H05F3/02 ,  H05K1/0366 ,  H05K3/102 ,  H05K1/036 ,  H05K1/095 ,  H05K2201/0251 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2201/0323 ,  H05K3/38 ,  Y10T428/23914 ,  Y10T428/23921 ,  Y10T428/24893 ,  Y10T428/2918 ,  Y10T428/30

Abstract: An element comprises a support, preferably a continuous polymeric film, and fibrous material, preferably a spun glass fiber web, which is secured to the support and protrudes therefrom, the protruding fibrous material being part of a layer comprising randomly distributed fibers having solid material, especially particulate material, adhered thereto. The element can be prepared from a composition containing solid material dissolved or dispersed in a liquid medium by applying said composition to fibrous material which is partially embedded in one surface of a support and then drying to evaporate the liquid medium.

Abstract translation: 元件包括支撑件，优选连续聚合物膜，以及纤维材料，优选玻璃纤维网，其被固定到支撑件并从其突出，所述突出的纤维材料是包含具有固体材料的随机分布的纤维的层的一部分， 特别是颗粒材料。 该元件可以由含有固体材料的组合物制备，所述组合物通过将所述组合物施加到部分地嵌入载体的一个表面中然后干燥以蒸发液体介质的纤维材料，溶解或分散在液体介质中。

公开(公告)号：US4335180A

公开(公告)日：1982-06-15

申请号：US213876

申请日：1980-12-08

Applicant: G. Robert Traut

Inventor： G. Robert Traut

IPC: B29C67/02 ,  B29C70/02 ,  B29C70/88 ,  B32B15/08 ,  H01B3/44 ,  H01B3/48 ,  H05K1/02 ,  H05K1/03 ,  H05K1/16 ,  B32B27/00

CPC classification number: B32B15/08 ,  B29C67/02 ,  B29C70/025 ,  B29C70/88 ,  H01B3/445 ,  H01B3/48 ,  H05K1/034 ,  H05K1/0366 ,  H05K1/0373 ,  B29K2105/0064 ,  B29K2105/007 ,  B29K2105/12 ,  B29K2105/122 ,  B29K2105/16 ,  B29K2995/0006 ,  B29L2007/002 ,  H05K1/024 ,  H05K1/162 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0251 ,  Y10T428/249951 ,  Y10T428/31544 ,  Y10T428/31692 ,  Y10T428/31699

Abstract: Microwave circuit boards and methods of making microwave circuit boards, the circuit boards having relatively high dielectric constants, excellent moisture resistance, and reduced tendency to incur changes in dimensions after processing. The method comprises blending in a polymer dispersion, a particulate filler material having a high dielectric constant and microfibrous material to form a slurry of polymer, filler, and fiber. A flocculant is added to the slurry to agglomerate the polymer particles, the filler particles, and the microfibers to produce a dough-like material. The dough-like material is eventually formed into a sheet, and is thereafter dried. A conductive foil such as copper is then applied to both sides of the sheet to provide a microwave circuit board.

Abstract translation: 微波电路板和制造微波电路板的方法，电路板具有相对较高的介电常数，优异的耐湿性，并且减少加工后的尺寸变化的倾向。 该方法包括在聚合物分散体中混合具有高介电常数的微粒填充材料和微纤维材料，以形成聚合物，填料和纤维的浆料。 将絮凝剂加入到浆料中以使聚合物颗粒，填料颗粒和微纤维聚集以产生面团状材料。 面团状材料最终形成片材，然后干燥。 然后将诸如铜的导电箔施加到片材的两侧以提供微波电路板。

公开(公告)号：US3925297A

公开(公告)日：1975-12-09

申请号：US46563774

申请日：1974-04-30

Applicant: WESTINGHOUSE ELECTRIC CORP

Inventor： SPRENGLING GERHARD R

IPC: C08J5/08 ,  C08K5/02 ,  H01B3/00 ,  H01B3/30 ,  H01B3/40 ,  H05K1/03 ,  C08L63/00

CPC classification number: H05K1/0373 ,  C08J5/08 ,  C08K5/02 ,  H01B3/002 ,  H01B3/006 ,  H01B3/30 ,  H01B3/40 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2203/122 ,  C08L63/00

Abstract: A composition is disclosed of about 15 to about 70% organic resin, about 30 to about 85% nonconductive filler, and about 0.001% to about 1.0% of a surfactant having a perfluorinated chain at least 3 carbon atoms long at one end and a polar group at the other end, and having the property of lowering the surface energy of the resin. The composition is hardened into an article such as a printed circuit board. Unexpectedly, the presence of the surfactant in the articles decreases the drop in volume resistivity which occurs in high humidity. Also disclosed is a method of making the article by coating the filler with a solution of the surfactant, evaporating the solvent, immersing the filler in the resin, and hardening the resin.

公开(公告)号：US3392075A

公开(公告)日：1968-07-09

申请号：US53958965

申请日：1965-10-23

Applicant: OWENS CORNING FIBERGLASS CORP

Inventor： WINSOR BROWN ALFRED ,  LEARY DAVID E

IPC: H01B1/00 ,  H01B3/00 ,  H01B3/04 ,  H05K1/03

CPC classification number: H05K1/0373 ,  H01B1/00 ,  H01B3/002 ,  H01B3/004 ,  H01B3/04 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/0209 ,  H05K2201/0245 ,  H05K2201/0251

公开(公告)号：US20170006701A1

公开(公告)日：2017-01-05

申请号：US15125573

申请日：2014-03-11

Applicant: EMPIRE TECHNOLOGY DEVELOPMENT LLC

Inventor： Vincenzo CASASANTA, III

IPC: H05K1/03 ,  H05K1/11 ,  H05K1/18 ,  H05K3/40 ,  H05K3/12 ,  C08J5/04 ,  B32B5/12 ,  B32B27/08 ,  B32B27/18 ,  B32B27/22 ,  B32B27/36 ,  C08J5/00 ,  H05K1/09 ,  H05K3/00

CPC classification number: H05K1/0366 ,  B32B3/266 ,  B32B5/02 ,  B32B5/08 ,  B32B5/12 ,  B32B5/22 ,  B32B5/26 ,  B32B9/02 ,  B32B9/04 ,  B32B25/02 ,  B32B25/042 ,  B32B25/08 ,  B32B27/08 ,  B32B27/18 ,  B32B27/22 ,  B32B27/28 ,  B32B27/281 ,  B32B27/283 ,  B32B27/285 ,  B32B27/286 ,  B32B27/302 ,  B32B27/304 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B27/38 ,  B32B27/40 ,  B32B27/42 ,  B32B2260/021 ,  B32B2260/04 ,  B32B2260/046 ,  B32B2262/04 ,  B32B2262/062 ,  B32B2262/065 ,  B32B2262/10 ,  B32B2262/101 ,  B32B2262/14 ,  B32B2264/0278 ,  B32B2264/105 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2307/546 ,  B32B2307/7163 ,  B32B2307/75 ,  B32B2457/08 ,  C08J5/005 ,  C08J5/041 ,  C08J2367/04 ,  C08K3/08 ,  C08K2003/0806 ,  H05K1/0353 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/095 ,  H05K1/097 ,  H05K1/115 ,  H05K1/181 ,  H05K3/0011 ,  H05K3/1216 ,  H05K3/1241 ,  H05K3/125 ,  H05K3/1275 ,  H05K3/22 ,  H05K3/4038 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0145 ,  H05K2201/0162 ,  H05K2201/0212 ,  H05K2201/0251 ,  H05K2201/0269 ,  H05K2201/0278 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/0271 ,  H05K2203/0769 ,  H05K2203/1105 ,  H05K2203/176 ,  H05K2203/178 ,  Y02P70/611 ,  Y02P70/613 ,  C08L67/04

Abstract: Biodegradable printed circuit boards, or PCBs, may be produced from substrate sheets that include at least one biodegradable polymer. In addition, the electrical traces used on the PCBs, may also include a biodegradable polymer incorporated with an electrically conductive material. The PCBs may be composted to degrade the PCBs, and the

Abstract translation: 可生物降解的印刷电路板或PCB可以由包括至少一种可生物降解的聚合物的基材片制成。 另外，PCB上使用的电迹线也可以包括结合有导电材料的可生物降解的聚合物。 PCB可能被堆肥以降解PCBs