摘要:
The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the solder joint and provides a flat solderable surface for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.
摘要:
According to the present invention a technique for providing a planarized substrate with dendritic connections of solder balls, especially a multi-layer ceramic substrate is provided. In the case where the substrate has a raised central portion on the top surface on which are disposed top surface metallurgy pads, a layer of conformable photoimagable material is placed over the top surface.The photoimagable material is exposed and developed in a pattern corresponding to the pattern of the top surface metallurgy pads to form vias in the photoimagable material. Copper is plated in the vias in contact with the top surface metallurgy pads. The exposed surface of the photoimagable surface is then planarized, preferably by mechanical polishing to form a flat planar surface, with the ends of the vias exposed. Dendritic connector pads are then grown on the exposed ends of the vias to which solder ball connections of an I/C chip are releasably connected.
摘要:
A method and apparatus for testing semi-conductor chips is disclosed. The individual semiconductor chips have I/O contacts. The apparatus is provided with an interposer that has contacts corresponding to the contacts on the semiconductor chip. Both the chip and the interposer contacts can be any known type including metal ball, bumps, or tabs or may be provided with dendritic surfaces. The chip contacts are first brought into relative loose temporary contact with the contacts on the interposer and then a compressive force greater that 5 grams per chip contact is applied to the chip to force the chip contacts into good electrical contact with the interposer contacts. Testing of the chip is then performed. The tests may include heating of the chip as well as the application of signals to the chip contacts. After testing the chip is removed from the substrate.
摘要:
According to the present invention a technique for providing a planarized substrate with dendritic connections of solder balls, especially a multi-layer ceramic substrate is provided. In the case where the substrate has a raised central portion on the top surface on which are disposed top surface metallurgy pads, a layer of conformable photoimagable material is placed over the top surface.The photoimagable material is exposed and developed in a pattern corresponding to the pattern of the top surface metallurgy pads to form vias in the photoimagable material. Copper is plated in the vias in contact with the top surface metallurgy pads. The exposed surface of the photoimagable surface is then planarized, preferably by mechanical polishing to form a flat planar surface, with the ends of the vias exposed. Dendritic connector pads are then grown on the exposed ends of the vias to which solder ball connections of an I/C chip are releasably connected.
摘要:
A process for manufacturing circuit boards comprising providing a circuitized substrate having a dielectric surface, providing a peel apart structure including a metal layer and a peelable film, laminating the peel apart structure to the circuitized substrate with the metal layer positioned adjacent said dielectric surface, forming holes in the circuitized substrate through the peel apart structure, applying a filler material including an organic base to the peel apart structure, applying a sacrificial film onto the filler material, and applying sufficient heat and pressure to the sacrificial film to force the filler material into the holes to substantially fill the holes is provided.
摘要:
A process of tenting plated through holes with a photoimageable dielectric is provided which includes a dielectric film comprising a photoimageable epoxy based resin layer and a peelable polyester layer. In accordance with the process of the present invention, the peelable polyester layer of the dielectric film is removed prior to baking, developing, patterning or curing the structure.
摘要:
A printed circuit board for use in an electronic device package such as a ball grid array package or organic chip carrier package includes a glass-free dielectric for separating and insulating power cores, circuitry or plated through holes from each other to prevent shorts caused by a migration of conductive material along glass-based prepreg substrates.
摘要:
A technique for polishing an exposed surface of metal on a substrate to remove defects from mechanical working of metals, such as burrs and pigtails resulting from drilling, and defects from plating, such as nodules and depressions, is provided. The substrate has an exposed metal surface such as copper thereon which is to be treated to remove defects. A planarizing or polishing head, preferably a rotating roller, is provided which is continuously rotating with respect to the substrate, with the head in contact with the metal surface on the substrate. A chemical etchant, essentially free of abrasive material, is continuously supplied to the interface between the metal surface and the head. The treating and polishing continues until the defects have been removed or reduced to an acceptable value. In some instances where significant height reduction is required, thus requiring significant metal removal, several passes of the substrate may be required or a device with multiple heads may be used. The polishing head preferably includes a film having a layer of very fine grit embedded therein, such as 5.mu.-15.mu. silicon carbide (SiC).
摘要:
A process for making a circuitized substrate is defined wherein the substrate is treated with two different, e.g., additive and subtractive, metallization processes. The process is thus able to effectively produce substrates including conductive features, e. g., high density circuit lines and chip heat-sinking pads, of two different degrees of resolution in a cost effective and expeditious manner. The resulting product is also defined.
摘要:
A process for making a circuitized substrate is defined wherein the substrate is treated with two different, e.g., additive and subtractive, metallization processes. The process is thus able to effectively produce substrates including conductive features, e.g., high density circuit lines and chip heat-sinking pads, of two different degrees of resolution in a cost effective and expeditious manner. The resulting product is also defined.