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    Method for manufacturing a front electrode of a semiconductor device
    22.
    发明授权
    Method for manufacturing a front electrode of a semiconductor device 有权
    半导体装置的前电极的制造方法

    公开(公告)号：US09508877B2

    公开(公告)日：2016-11-29

    申请号：US15155199

    申请日：2016-05-16

    Applicant: Xiaoli Liu ,  Delin Li

    Inventor： Xiaoli Liu ,  Delin Li

    IPC: H01L21/00 ,  H01L31/0224 ,  H01L31/0216 ,  H01L31/028 ,  H01L31/068 ,  H01L31/18

    CPC classification number: H01L31/022425 ,  C09D5/24 ,  H01B1/16 ,  H01B1/22 ,  H01L29/456 ,  H01L31/02168 ,  H01L31/028 ,  H01L31/068 ,  H01L31/1804 ,  H01L31/1864 ,  Y02E10/50

    Abstract: The present invention provides a method for manufacturing a front electrode of a semiconductor device. The method includes using an electrically conductive paste composed of a glass-free corrosion binder, a metallic powder and an organic carrier. The corrosion binder is one or more Pb—Te based crystalline compounds having a fixed melting temperature in a range of 440° C. to 760° C. During a sintering process of the electrically conductive paste for forming an electrode, the glass-free corrosion binder is converted into a liquid for easily corroding and penetrating an antireflective insulating layer on a front side of the solar cell, so that a good ohmic contact is formed. At the same time, the electrically conductive metallic powder is wetted, and the combination of the metallic powder is promoted. As a result, a high-conductivity front electrode of a crystalline silicon solar cell is formed.

    Abstract translation: 本发明提供一种半导体器件的前电极的制造方法。 该方法包括使用由无玻璃腐蚀粘合剂，金属粉末和有机载体构成的导电糊剂。 腐蚀粘合剂是一种或多种在440℃至760℃范围内具有固定熔融温度的Pb-Te基结晶化合物。在用于形成电极的导电浆料的烧结过程中，无玻璃腐蚀 将粘合剂转化为液体，容易腐蚀并穿透太阳能电池正面上的抗反射绝缘层，从而形成良好的欧姆接触。 同时，导电性金属粉末被润湿，促进金属粉末的组合。 结果，形成了结晶硅太阳能电池的高导电性前电极。

    ELECTRICALLY CONDUCTIVE PASTE FOR FRONT ELECTRODE OF SOLAR CELL AND PREPARATION METHOD THEREOF
    23.
    发明申请
    ELECTRICALLY CONDUCTIVE PASTE FOR FRONT ELECTRODE OF SOLAR CELL AND PREPARATION METHOD THEREOF 审中-公开
    太阳能电池正极电气导电胶及其制备方法

    公开(公告)号：US20160260850A1

    公开(公告)日：2016-09-08

    申请号：US15155192

    申请日：2016-05-16

    Applicant: Xiaoli Liu ,  Delin Li

    Inventor： Xiaoli Liu ,  Delin Li

    IPC: H01L31/0224 ,  C09D5/24 ,  H01B1/22

    CPC classification number: H01L31/022425 ,  C09D5/24 ,  H01B1/16 ,  H01B1/22 ,  H01L29/456 ,  H01L31/02168 ,  H01L31/028 ,  H01L31/068 ,  H01L31/1804 ,  H01L31/1864 ,  Y02E10/50

    Abstract: The present invention provides an electrically conductive paste for a front electrode of a solar cell and a preparation method thereof. The electrically conductive paste is composed of a glass-free corrosion binder, a metallic powder and an organic carrier. The corrosion binder is one or more Pb—Te based crystalline compounds having a fixed melting temperature in a range of 440° C. to 760° C. During a sintering process of the electrically conductive paste for forming an electrode, the glass-free corrosion binder is converted into a liquid for easily corroding and penetrating an antireflective insulating layer on a front side of the solar cell, so that a good ohmic contact is formed. At the same time, the electrically conductive metallic powder is wetted, and the combination of the metallic powder is promoted. As a result, a high-conductivity front electrode of a crystalline silicon solar cell is formed.

    Abstract translation: 本发明提供一种太阳能电池的前电极用导电性糊剂及其制备方法。 导电糊料由无玻璃腐蚀粘合剂，金属粉末和有机载体组成。 腐蚀粘合剂是一种或多种在440℃至760℃范围内具有固定熔融温度的Pb-Te基结晶化合物。在用于形成电极的导电浆料的烧结过程中，无玻璃腐蚀 将粘合剂转化为液体，容易腐蚀并穿透太阳能电池正面上的抗反射绝缘层，从而形成良好的欧姆接触。 同时，导电性金属粉末被润湿，促进金属粉末的组合。 结果，形成了结晶硅太阳能电池的高导电性前电极。

    Ni-25 Heat-Resistent Nodular Graphite Cast Iron For Use In Exhaust Systems
    24.
    发明申请
    Ni-25 Heat-Resistent Nodular Graphite Cast Iron For Use In Exhaust Systems 有权
    Ni-25耐热球墨铸铁用于排气系统

    公开(公告)号：US20110011070A1

    公开(公告)日：2011-01-20

    申请号：US12919044

    申请日：2008-02-25

    Applicant: Robert Logan ,  Delin Li ,  Shuzhi Yu ,  Gangjun Liao

    Inventor： Robert Logan ,  Delin Li ,  Shuzhi Yu ,  Gangjun Liao

    IPC: F01N13/16 ,  C22C37/08 ,  C22C37/10

    CPC classification number: C22C37/04 ,  C22C37/08 ,  C22C37/10

    Abstract: A nodular graphite, heat-resistant cast iron composition for use in engine systems. The composition contains carbon 1.5-2.4 weight %, silicon 5.4-7.0 weight %, manganese 0.5-1.5 weight %, nickel 22.0-28.0 weight %, chromium 1.5-3.0 weight %, molybdenum 0.1-1.0 weight %, magnesium 0.03-0.1 weight %, and a balance weight % being substantially iron. The composition has an austenitic matrix. Additionally, the composition exhibits excellent oxidation resistance at high temperature and excellent mechanical properties at both room and high temperatures. Thus, the composition can be a lower cost substitute material for Ni-Resist D5S under thermocycling conditions experienced by exhaust gas accessories and housings such as engine exhaust manifolds, turbocharger housings, and catalytic converter housings.

    Abstract translation: 用于发动机系统的结节状石墨，耐热铸铁组合物。 该组合物包含1.5-2.4重量％的碳，5.4-7.0重量％的硅，0.5-1.5重量％的锰，22.0-28.0重量％的镍，1.5-3.0重量％的铬，0.1-1.0重量％的钼，0.03-0.1重量％ ％，平衡重量％基本上为铁。 该组合物具有奥氏体基质。 此外，该组合物在高温下表现出优异的抗氧化性和在室温和高温下都具有优异的机械性能。 因此，组合物可以是由排气附件和诸如发动机排气歧管，涡轮增压器壳体和催化转化器壳体的壳体经历的热循环条件下的Ni-Resist D5S的较低成本替代材料。

    Method of making assemblies having stacked semiconductor chips
    26.
    发明授权
    Method of making assemblies having stacked semiconductor chips 有权
    制造具有层叠半导体芯片的组件的方法

    公开(公告)号：US07229850B2

    公开(公告)日：2007-06-12

    申请号：US11165877

    申请日：2005-06-24

    Applicant: Delin Li

    Inventor： Delin Li

    IPC: H01L21/00

    CPC classification number: H01L25/0657 ,  H01L24/73 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/32225 ,  H01L2224/4824 ,  H01L2224/05644 ,  H01L2224/05647

    Abstract: A method of manufacturing a plurality of semiconductor chip packages and the resulting chip package assemblies. The method includes providing a circuitized substrate having terminals and leads. A first microelectronic element is arranged with the substrate and contacts on the microelectronic element are connected to the substrate. A conductive member is placed on top of the first microelectronic element and is used to support a second microelectronic element. The second microelectronic element is arranged with the conductive member in a top and bottom position. The second microelectronic element is then also connected by leads from contacts on the second microelectronic element to pads and terminals on the circuitized substrate. The conductive member is then connected to a third pad or set of pads on the substrate. An encapsulant material may be deposited so as to encapsulate the leads and at least one surface of the microelectronic elements. The encapsulant material is then cured thereby defining a composite of chip assemblies which may be singulated into individual chip packages.

    Abstract translation: 一种制造多个半导体芯片封装的方法以及所得到的芯片封装组件。 该方法包括提供具有端子和引线的电路化基板。 第一微电子元件与衬底一起布置，并且微电子元件上的触点连接到衬底。 导电构件放置在第一微电子元件的顶部上，并用于支撑第二微电子元件。 第二微电子元件布置成导电构件处于顶部和底部位置。 第二微电子元件然后还通过引线从第二微电子元件上的触点连接到电路化基板上的焊盘和端子。 然后将导电构件连接到衬底上的第三衬垫或一组衬垫。 可以沉积密封剂材料以便封装引线和微电子元件的至少一个表面。 密封剂材料然后被固化，从而限定了可以被分成单个芯片封装的芯片组件的复合材料。

    Method of making assemblies having stacked semiconductor chips
    28.
    发明申请
    Method of making assemblies having stacked semiconductor chips 有权
    制造具有层叠半导体芯片的组件的方法

    公开(公告)号：US20050239234A1

    公开(公告)日：2005-10-27

    申请号：US11165877

    申请日：2005-06-24

    Applicant: Delin Li

    Inventor： Delin Li

    IPC: H01L25/065 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

    CPC classification number: H01L25/0657 ,  H01L24/73 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/32225 ,  H01L2224/4824 ,  H01L2224/05644 ,  H01L2224/05647

    Abstract: A method of manufacturing a plurality of semiconductor chip packages and the resulting chip package assemblies. The method includes providing a circuitized substrate having terminals and leads. A first microelectronic element is arranged with the substrate and contacts on the microelectronic element are connected to the substrate. A conductive member is placed on top of the first microelectronic element and is used to support a second microelectronic element. The second microelectronic element is arranged with the conductive member in a top and bottom position. The second microelectronic element is then also connected by leads from contacts on the second microelectronic element to pads and terminals on the circuitized substrate. The conductive member is then connected to a third pad or set of pads on the substrate. An encapsulant material may be deposited so as to encapsulate the leads and at least one surface of the microelectronic elements. The encapsulant material is then cured thereby defining a composite of chip assemblies which may be singulated into individual chip packages.

    Abstract translation: 一种制造多个半导体芯片封装的方法以及所得到的芯片封装组件。 该方法包括提供具有端子和引线的电路化基板。 第一微电子元件与衬底一起布置，微电子元件上的触点连接到衬底。 导电构件放置在第一微电子元件的顶部上，并用于支撑第二微电子元件。 第二微电子元件布置成导电构件处于顶部和底部位置。 第二微电子元件然后还通过引线从第二微电子元件上的触点连接到电路化基板上的焊盘和端子。 然后将导电构件连接到衬底上的第三衬垫或一组衬垫。 可以沉积密封剂材料以便封装引线和微电子元件的至少一个表面。 密封剂材料然后被固化，从而限定了可以被分成单个芯片封装的芯片组件的复合材料。

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