公开(公告)号：US20180047698A1

公开(公告)日：2018-02-15

申请号：US15792398

申请日：2017-10-24

Applicant: ROHM CO., LTD.

Inventor： Mamoru YAMAGAMI ,  Kenji FUJII

IPC: H01L23/00 ,  H01L23/495 ,  H01L23/31 ,  H01L23/525 ,  H01L23/532

CPC classification number: H01L24/49 ,  H01L23/3107 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/525 ,  H01L23/53223 ,  H01L23/53238 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/36 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/02375 ,  H01L2224/0346 ,  H01L2224/0347 ,  H01L2224/0391 ,  H01L2224/03914 ,  H01L2224/0401 ,  H01L2224/04034 ,  H01L2224/04042 ,  H01L2224/05008 ,  H01L2224/05009 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05147 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05548 ,  H01L2224/05554 ,  H01L2224/05557 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/05583 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/08245 ,  H01L2224/13024 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13582 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2224/1411 ,  H01L2224/16245 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/40479 ,  H01L2224/40491 ,  H01L2224/40499 ,  H01L2224/40993 ,  H01L2224/4112 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48177 ,  H01L2224/48247 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/4912 ,  H01L2224/49177 ,  H01L2224/73221 ,  H01L2224/8485 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/20754 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/2075 ,  H01L2924/20757 ,  H01L2924/20756 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/20755 ,  H01L2924/014 ,  H01L2224/051

Abstract: An inventive semiconductor device includes: a semiconductor chip including an integrated circuit; a plurality of electrode pads provided on the semiconductor chip and connected to the integrated circuit; a rewiring to which the electrode pads are electrically connected together, the rewiring being exposed on an outermost surface of the semiconductor chip and having an exposed surface area greater than the total area of the electrode pads; and a resin package which seals the semiconductor chip.

公开(公告)号：US20170040243A1

公开(公告)日：2017-02-09

申请号：US15221375

申请日：2016-07-27

Applicant: ROHM CO., LTD.

Inventor： Kenji FUJII ,  Mamoru YAMAGAMI

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/29 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L24/03 ,  H01L21/4853 ,  H01L23/3121 ,  H01L23/3171 ,  H01L23/3192 ,  H01L23/49541 ,  H01L24/08 ,  H01L24/29 ,  H01L2224/0401 ,  H01L2224/16245 ,  H01L2224/81815 ,  H01L2924/3512

Abstract: A semiconductor device includes a semiconductor chip, a terminal layer, an insulation layer with an opening, a protection layer with an opening, an inner conductive member, an outer conductive member, and a conductive bonding member. The insulation layer includes a first insulation layer, and a second insulation layer opposite to the functional surface of the chip with respect to the first insulation layer. The second insulation layer includes a shield portion overlapping with the terminal layer in plan view, and a retracted portion not overlapping with the terminal layer in plan view. A back surface of the retracted portion of the second insulation layer is more distant from the functional surface in a z-direction than is the main surface of the terminal layer that is opposite to the functional surface.

Abstract translation: 半导体器件包括半导体芯片，端子层，具有开口的绝缘层，具有开口的保护层，内部导电构件，外部导电构件和导电接合构件。 绝缘层包括第一绝缘层和与芯片的功能表面相对于第一绝缘层相对的第二绝缘层。 第二绝缘层包括在平面图中与端子层重叠的屏蔽部分和在平面图中与端子层不重叠的缩回部分。 第二绝缘层的缩回部分的后表面在z方向上的功能表面比与功能表面相反的端子层的主表面更远。

公开(公告)号：US20170038438A1

公开(公告)日：2017-02-09

申请号：US15226672

申请日：2016-08-02

Applicant: ROHM CO., LTD.

Inventor： Mamoru YAMAGAMI

IPC: G01R33/07 ,  H01L43/04 ,  H01L43/14 ,  H01L43/06

CPC classification number: G01R33/07 ,  G01R33/0047 ,  G01R33/0052 ,  H01L43/04 ,  H01L43/065 ,  H01L43/14 ,  H01L2224/97 ,  H01L2924/15156 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A semiconductor device includes a semiconductor element, a semiconductor substrate including a substrate main surface and a recess that recedes from the substrate main surface and houses the semiconductor element, a conductive layer electrically connected to the semiconductor element and formed on the semiconductor substrate, a sealing resin covering the semiconductor element and including a resin main surface that faces in the same direction as the substrate main surface, and spherical conductors electrically connected to the conductive layer and protruding outward from the resin main surface.

Abstract translation: 半导体器件包括半导体元件，包括基板主表面的半导体基板和从基板主表面后退并容纳半导体元件的凹部，与半导体元件电连接并形成在半导体基板上的导电层，密封 树脂覆盖半导体元件并且包括面向与基板主表面相同的方向的树脂主表面，以及与导电层电连接并从树脂主表面向外突出的球形导体。

公开(公告)号：US20150294928A1

公开(公告)日：2015-10-15

申请号：US14669169

申请日：2015-03-26

Applicant: ROHM CO., LTD.

Inventor： Kenji FUJII ,  Yasumasa KASUYA ,  Mamoru YAMAGAMI ,  Naoki KINOSHITA ,  Motoharu HAGA

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/367 ,  H01L23/31 ,  H01L23/29

CPC classification number: H01L23/49527 ,  H01L23/291 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3142 ,  H01L23/3171 ,  H01L23/3675 ,  H01L23/4334 ,  H01L23/4822 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49568 ,  H01L23/49572 ,  H01L23/525 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/33 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/02311 ,  H01L2224/02331 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0346 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05084 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05181 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05583 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/1145 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/1161 ,  H01L2224/11825 ,  H01L2224/13008 ,  H01L2224/13011 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13024 ,  H01L2224/13147 ,  H01L2224/13561 ,  H01L2224/13582 ,  H01L2224/13624 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2224/13666 ,  H01L2224/16014 ,  H01L2224/16245 ,  H01L2224/16258 ,  H01L2224/17107 ,  H01L2224/29008 ,  H01L2224/29082 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29164 ,  H01L2224/29166 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/753 ,  H01L2224/75301 ,  H01L2224/75981 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81201 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/8146 ,  H01L2224/81464 ,  H01L2224/81466 ,  H01L2224/8183 ,  H01L2224/83191 ,  H01L2224/83201 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/8346 ,  H01L2224/83464 ,  H01L2224/83466 ,  H01L2224/8383 ,  H01L2224/92225 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/05042 ,  H01L2924/07025 ,  H01L2924/17724 ,  H01L2924/17747 ,  H01L2924/181 ,  H01L2924/182 ,  H01L2924/186 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/05166 ,  H01L2924/01028 ,  H01L2924/0665

Abstract: A semiconductor device has a semiconductor element provided with a functional surface on which a functional circuit is formed and with a back surface facing in the opposite direction to the functional surface, while also having a lead supporting the semiconductor element and electrically connected to the semiconductor element, and a resin package covering at least a portion of the semiconductor element and the lead. The semiconductor element has a functional surface side electrode formed on the functional surface and equipped with a functional surface side raised part that projects in the direction in which the functional surface faces. The functional surface side raised part of the functional surface side electrode is joined to the lead by solid state bonding.

Abstract translation: 半导体器件具有设置有功能表面的半导体元件，功能电路形成在其上，并且背面面向与功能表面相反的方向，同时还具有支撑半导体元件并与半导体元件电连接的引线 以及覆盖半导体元件和引线的至少一部分的树脂封装。 半导体元件具有形成在功能面上的功能面侧电极，其具有在功能面朝向的方向突出的功能面侧凸起部。 功能面侧电极的功能面侧隆起部通过固态接合而与引线接合。

公开(公告)号：US20150255369A1

公开(公告)日：2015-09-10

申请号：US14722745

申请日：2015-05-27

Applicant: ROHM CO., LTD.

Inventor： Shoji YASUNAGA ,  Mamoru YAMAGAMI

IPC: H01L23/373 ,  H01L23/495 ,  H01L23/00

CPC classification number: H01L23/49568 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/367 ,  H01L23/3731 ,  H01L23/3736 ,  H01L23/4334 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/06 ,  H01L24/14 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/06051 ,  H01L2224/0612 ,  H01L2224/06505 ,  H01L2224/14104 ,  H01L2224/145 ,  H01L2224/1451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/4912 ,  H01L2224/495 ,  H01L2224/73265 ,  H01L2224/78313 ,  H01L2224/85181 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/12042 ,  H01L2924/1304 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: [Object]A semiconductor device is configured to release heat from semiconductor chips more efficiently. [Means for Solution]A semiconductor device includes: a die pad 11 which has a die pad main surface 111 and a die pad rear surface 112; a semiconductor chip 41 mounted on the die pad main surface 111; a sealing resin portion 7 formed with a recess 75 for exposure of the die pad rear surface 11 and covering the die pad 11 and the semiconductor chip 41; and a heat releasing layer 6 disposed in the recess 75. The recess 75 has a recess groove 753 outside the die pad 11 in a direction in which the die pad rear surface 112 extends, and the recess groove 753 is closer to the die pad main surface 111 than to the die pad rear surface 112. The heat releasing layer 6 has a junction layer which is in contact with the die pad rear surface 112 and having part thereof filling the recess groove 753.

Abstract translation: 半导体器件被配置为更有效地从半导体芯片释放热量。 解决方案的半导体器件包括：具有管芯焊盘主表面111和管芯焊盘后表面112的管芯焊盘11; 安装在芯片主表面111上的半导体芯片41; 密封树脂部分7，形成有用于暴露芯片垫背面11并覆盖芯片焊盘11和半导体芯片41的凹部75; 以及设置在凹部75中的散热层6.凹部75在芯片焊盘后表面112延伸的方向上具有凹部凹槽753，并且凹槽753更靠近模具垫主体 表面111相对于管芯焊盘后表面112.散热层6具有与管芯焊盘后表面112接触并且其部分填充凹槽753的接合层。

公开(公告)号：US20150091143A1

公开(公告)日：2015-04-02

申请号：US14497722

申请日：2014-09-26

Applicant: ROHM CO., LTD.

Inventor： Kenji FUJII ,  Mamoru YAMAGAMI

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49575 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49555 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/06 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05644 ,  H01L2224/06135 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48235 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/48227

Abstract: A semiconductor device includes first and semiconductor elements, an electroconductive support member including electroconductive elements, and a resin package. The first semiconductor element includes a first active surface and first electrodes formed on the first active surface. The second semiconductor element includes a second active surface and second electrodes formed on the second active surface. The electroconductive support member is electrically connected to the first and second semiconductor elements and support these elements. The resin package covers the first and second semiconductor elements. The second semiconductor element is located between the first semiconductor element and the electroconductive support member. The first electrodes of the first semiconductor element and the electroconductive elements are connected by wire. An electroconductive bonding material is also provided that bonds the second electrodes of the second semiconductor element and the electroconductive elements to which the wire is bonded.

Abstract translation: 半导体器件包括第一和半导体元件，包括导电元件的导电支撑元件和树脂封装。 第一半导体元件包括第一有源表面和形成在第一有源表面上的第一电极。 第二半导体元件包括形成在第二有源表面上的第二有源表面和第二电极。 导电支撑构件电连接到第一和第二半导体元件并支撑这些元件。 树脂封装覆盖第一和第二半导体元件。 第二半导体元件位于第一半导体元件和导电支撑构件之间。 第一半导体元件的第一电极和导电元件通过导线连接。 还提供了一种导电接合材料，其结合第二半导体元件的第二电极和与导线接合的导电元件。