公开(公告)号：US09490228B2

公开(公告)日：2016-11-08

申请号：US14229003

申请日：2014-03-28

Applicant: Kyoung Soo Park ,  Soon Young Kwon ,  Ji Yeon Kim ,  Young Woo Park ,  Jae Sun Han ,  Ja Young Hwang

Inventor： Kyoung Soo Park ,  Soon Young Kwon ,  Ji Yeon Kim ,  Young Woo Park ,  Jae Sun Han ,  Ja Young Hwang

IPC: H01L23/00 ,  C09J9/02 ,  C09J7/00 ,  C09J11/00 ,  H05K3/32 ,  C08K7/16 ,  C08K9/02

CPC classification number: H01L24/29 ,  C08K7/16 ,  C08K9/02 ,  C09J7/00 ,  C09J7/10 ,  C09J9/02 ,  C09J11/00 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13013 ,  H01L2224/16225 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29366 ,  H01L2224/29371 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29411 ,  H01L2224/29416 ,  H01L2224/29424 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/29464 ,  H01L2224/29466 ,  H01L2224/29471 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/81191 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2924/07802 ,  H01L2924/15788 ,  H05K3/323 ,  Y10T428/24959 ,  Y10T428/25 ,  Y10T428/28 ,  Y10T428/2848 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An anisotropic conductive film includes a conductive adhesive layer including conductive particles and insulating particles, and an insulating adhesive layer not including conductive particles. In the anisotropic conductive film, the conductive particles and the insulating particles of the conductive adhesive layer have a total particle density of 7.0×105/d2 to 10.0×105/d2 (particles) per square millimeter (mm2) (where d is a diameter of the conductive particles in μm).

Abstract translation: 各向异性导电膜包括导电性粘合剂层，其包含导电性粒子和绝缘性粒子，以及不含导电性粒子的绝缘性粘合剂层。 在各向异性导电膜中，导电性粘接剂层的导电性粒子和绝缘性粒子的总粒子密度为7.0×10 5 / d 2〜10 10×10 6（粒子）/平方毫米（mm 2）（d为直径 的导电粒子）。

公开(公告)号：US09484240B2

公开(公告)日：2016-11-01

申请号：US14183823

申请日：2014-02-19

Applicant: NITTO DENKO CORPORATION

Inventor： Yuki Sugo ,  Yuta Kimura

IPC: H01L21/683 ,  H01L23/48 ,  H01L21/50 ,  C09J7/02 ,  C09J9/02 ,  C09J11/04 ,  H01L23/00 ,  C08G59/62 ,  C09J163/00 ,  C08K3/08

CPC classification number: H01L21/6836 ,  C08G59/621 ,  C08K3/02 ,  C08K3/08 ,  C08L33/06 ,  C09J7/20 ,  C09J9/02 ,  C09J11/04 ,  C09J163/00 ,  C09J2201/36 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/102 ,  H01L21/50 ,  H01L23/48 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/29424 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48145 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2224/83885 ,  H01L2224/83907 ,  H01L2224/85207 ,  H01L2224/92 ,  H01L2224/94 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/3511 ,  Y10T428/1405 ,  Y10T428/28 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2224/27 ,  H01L21/78 ,  H01L2224/83 ,  H01L2924/00

Abstract: The present invention provides a film adhesive that can prevent a thermal effect to a semiconductor wafer and that can suppress warping of the semiconductor wafer; a dicing tape with a film adhesive; and a method of manufacturing a semiconductor device.The present invention relates to a film adhesive comprising a thermoplastic resin and electrically conductive particles, the film adhesive having an adhesion strength measured at 25° C. after the film adhesive is pasted to a mirror silicon wafer at 40° C. of 0.5 N/10 mm or more.

Abstract translation: 本发明涉及一种包含热塑性树脂和导电颗粒的薄膜粘合剂，该膜粘合剂在40℃下将膜粘合剂粘贴到镜面硅晶片上之后，在25℃下测量的粘合强度为0.5N / 10毫米以上。

公开(公告)号：US20160300733A1

公开(公告)日：2016-10-13

申请号：US15037794

申请日：2014-10-31

Applicant: NITTO DENKO CORPORATION

Inventor： Goji Shiga ,  Tsuyoshi Ishizaka ,  Kosuke Morita ,  Chie Iino

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L21/568 ,  C09J7/10 ,  C09J7/40 ,  C09J2201/36 ,  C09J2203/326 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3128 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16146 ,  H01L2224/17181 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2924/014 ,  H01L2924/00

Abstract: A sealing sheet with separators on both surfaces is provided with a sealing sheet, a separator (A) stacked on one surface of the sealing sheet and having a thickness of 50 μm or more, and a separator (B) stacked on the other surface of the sealing sheet.

Abstract translation: 在两面上具有隔膜的密封片设置有密封片，层叠在密封片的一个表面上且厚度为50μm以上的隔膜（A）和层叠在另一个表面上的隔膜（B） 密封片。

公开(公告)号：US20160229965A1

公开(公告)日：2016-08-11

申请号：US14872249

申请日：2015-10-01

Applicant: Zephyros, Inc.

Inventor： Craig Chmielewski ,  Brandon Madaus ,  Dawn Dombrowski

IPC: C08J5/18 ,  C09J7/02

CPC classification number: C08J5/18 ,  C08G2650/56 ,  C08J2363/00 ,  C08J2409/02 ,  C08J2433/10 ,  C08J2463/00 ,  C08L71/00 ,  C09D171/00 ,  C09J7/10 ,  C09J7/25 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2413/00 ,  C09J2413/006 ,  C09J2463/00 ,  C09J2463/006 ,  C09J2479/02 ,  C09J2479/026 ,  C08L9/02 ,  C08L63/00

Abstract: A handling film to be applied to an adhesive, wherein the handling film comprises a polyhydroxyamino ether thermoplastic, a monofunctional epoxy, and a carboxylated nitrile butadiene elastomer.

Abstract translation: 一种应用于粘合剂的处理膜，其中处理膜包括多羟基氨基醚热塑性塑料，单官能环氧树脂和羧化腈丁二烯弹性体。

公开(公告)号：US20160218077A1

公开(公告)日：2016-07-28

申请号：US15023702

申请日：2014-09-29

Applicant: LINTEC CORPORATION

Inventor： Yuichiro Azuma ,  Sayaka Tsuchiyama ,  Akio Kabuto

IPC: H01L23/00 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L24/29 ,  B32B7/12 ,  B32B27/08 ,  B32B27/16 ,  B32B27/20 ,  B32B27/22 ,  B32B27/308 ,  B32B2250/44 ,  B32B2457/14 ,  C09J7/20 ,  C09J2201/36 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/31 ,  H01L21/6836 ,  H01L23/295 ,  H01L23/3142 ,  H01L23/544 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2223/54486 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2924/0002 ,  H01L2924/0635 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2924/20642 ,  H01L2924/20643

Abstract: The present invention relates to a composite sheet for resin film formation composed of a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer on a base and a heat curable film for resin film formation provided on the pressure-sensitive adhesive layer. The film for resin film formation includes a binder component having a reactive double bond group. The pressure-sensitive adhesive layer includes a non-energy ray curable pressure-sensitive adhesive composition or a cured product of an energy ray curable pressure-sensitive adhesive composition.

Abstract translation: 本发明涉及一种用于树脂膜形成的复合片材，其由在基底上具有压敏粘合剂层的压敏粘合片和用于树脂膜形成的热固化膜组成，该粘合片材设置在压敏粘合剂层上。 用于树脂膜形成的膜包括具有反应性双键基团的粘合剂组分。 压敏粘合剂层包括非能量射线固化型压敏粘合剂组合物或能量射线固化型压敏粘合剂组合物的固化产物。

公开(公告)号：US09376596B2

公开(公告)日：2016-06-28

申请号：US13782510

申请日：2013-03-01

Applicant: HITACHI CABLE, LTD.

Inventor： Daisuke Shanai ,  Tomiya Abe

IPC: H01B5/14 ,  B32B27/34 ,  C09J7/02 ,  H01B7/08 ,  H01B7/295 ,  B32B27/06 ,  B32B27/18 ,  B32B27/36 ,  C08K3/00 ,  C08K5/00 ,  C08K5/29 ,  C08K3/22

CPC classification number: C09J7/02 ,  C08K3/016 ,  C08K5/0066 ,  C08K5/29 ,  C08K2003/2224 ,  C09J7/22 ,  C09J7/30 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2467/006 ,  C09J2477/00 ,  H01B7/0823 ,  H01B7/295 ,  Y10T428/24959 ,  Y10T428/264 ,  Y10T428/2843

Abstract: There is provided an adhesive film, comprising: an insulator film; an adhesive layer formed on the insulator film; and an intermediate adhesive layer interposed between the insulator film and the adhesive layer, wherein the intermediate adhesive layer is made of a mixed resin composition of a copolyamide being a crystalline resin solvable in a non-halogen based organic solvent and having a melting point of 100° C. or more and 150° C. or less, and a non-crystalline resin, and the intermediate adhesive layer contains a non-halogen flame retardant by 100 pts. wt. or more and 250 pts. wt. or less with respect to 100 pts. wt. of the mixed resin composition.

Abstract translation: 提供了一种粘合膜，包括：绝缘膜; 形成在绝缘膜上的粘合剂层; 以及介于所述绝缘体膜和所述粘合剂层之间的中间粘合剂层，其中所述中间粘合剂层由可溶解在非卤素类有机溶剂中并具有熔点为100的结晶树脂的共聚酰胺的混合树脂组合物制成 ℃以上且150℃以下，非结晶性树脂，中间粘合剂层含有100个无卤阻燃剂。 重量 或更多和250点。 重量 或更少。 重量 的混合树脂组合物。

公开(公告)号：US20160144599A1

公开(公告)日：2016-05-26

申请号：US14899156

申请日：2013-06-17

Applicant: YKK CORPORATION

Inventor： Takayuki Ogyu ,  Shintaro Ohsugi ,  Kumiko Oyama

IPC: B32B7/12 ,  B32B27/34 ,  B32B27/40 ,  B32B27/08

CPC classification number: B32B7/12 ,  A44B19/34 ,  B32B27/08 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/40 ,  B32B2307/412 ,  B32B2405/00 ,  C09J7/22 ,  C09J7/35 ,  C09J2201/36 ,  C09J2423/00 ,  C09J2423/166 ,  C09J2467/00 ,  C09J2467/006 ,  C09J2475/00 ,  C09J2475/006 ,  C09J2477/00 ,  C09J2477/006

Abstract: A slide fastener reinforcement tape is provided that exhibits in particular, high performance launderability and peel strength between a reinforcement tape and a fastener tape, in environments harsher than those set forth in the prior art. Specifically, provided is a slide fastener reinforcement tape formed by laminating an adhesive layer on the back surface of a transparent elastomer film, wherein the slide fastener reinforcement tape is characterized in that the adhesive layer is a polyester-based hot-melt adhesive, a two-part type curable adhesive or a polyamide-based hot-melt adhesive, and the melting point of the adhesive layer is higher than 120° C. and no more than 160° C. and the melt viscosity at 200° C. is higher than 2000 poise and no more than 5500 poise.

Abstract translation: 提供了一种拉链加强带，其在比现有技术中更严格的环境中表现出特别高强度的拉链和拉伸带之间的剥离强度。 具体地说，提供了一种通过在透明弹性体膜的背面上层压粘合剂层而形成的拉链加强带，其中拉链加强带的特征在于粘合剂层是聚酯基热熔粘合剂， - 一种类型的可固化粘合剂或聚酰胺基热熔粘合剂，并且粘合剂层的熔点高于120℃且不超过160℃，并且在200℃下的熔体粘度高于 2000泊，不超过5500泊。

公开(公告)号：US20160083626A1

公开(公告)日：2016-03-24

申请号：US14779845

申请日：2014-01-23

Applicant: NITTO DENKO CORPORATION

Inventor： Hirofumi EBE ,  Takashi HABU

IPC: C09J7/02 ,  C09J133/00 ,  C09J163/00 ,  C09J165/02 ,  H05K1/03 ,  G01D5/20

CPC classification number: H05K1/0313 ,  B32B7/12 ,  B32B27/00 ,  B32B27/08 ,  B32B27/18 ,  B32B27/308 ,  B32B27/38 ,  B32B2307/208 ,  B32B2405/00 ,  B32B2457/08 ,  C08K3/08 ,  C08K2201/01 ,  C09J7/245 ,  C09J7/25 ,  C09J7/35 ,  C09J9/00 ,  C09J133/00 ,  C09J163/00 ,  C09J165/02 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  G01D5/20 ,  G06F3/046 ,  G06F2203/04103 ,  H01F1/26 ,  H01F1/37 ,  H05K1/0373 ,  H05K3/281 ,  H05K2201/0195 ,  H05K2201/086

Abstract: A soft magnetic thermosetting adhesive film includes a magnetic layer and a surface layer laminated on one side of the magnetic layer. The magnetic layer is formed from a magnetic composition containing acrylic resin, epoxy resin, phenol resin, and soft magnetic particles. The surface layer is formed from a surface layer composition containing acrylic resin, epoxy resin, and phenol resin and not substantially containing soft magnetic particles.

Abstract translation: 软磁性热固性粘合膜包括层叠在磁性层一侧的磁性层和表面层。 磁性层由含有丙烯酸树脂，环氧树脂，酚醛树脂和软磁性颗粒的磁性组合物形成。 表面层由含有丙烯酸树脂，环氧树脂和酚醛树脂的表面层组合物形成，基本上不含软磁性颗粒。

公开(公告)号：US20160056066A1

公开(公告)日：2016-02-25

申请号：US14783339

申请日：2014-04-03

Applicant: NITTO DENKO CORPORATION

Inventor： Goji SHIGA ,  Naohide TAKAMOTO

IPC: H01L21/683 ,  H01L23/00 ,  H01L23/544 ,  C09J7/02 ,  C09J133/08

CPC classification number: H01L21/6836 ,  C08K3/013 ,  C08K3/36 ,  C08K7/18 ,  C08K2201/003 ,  C09J7/38 ,  C09J7/385 ,  C09J133/04 ,  C09J133/08 ,  C09J2201/122 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  H01L23/544 ,  H01L24/16 ,  H01L24/17 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2223/54433 ,  H01L2223/54453 ,  H01L2223/54486 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/01014 ,  H01L2924/0635 ,  C08L33/04

Abstract: The present invention provides an adhesive sheet used in manufacture of a semiconductor device, containing a filler having an average particle size of 0.3 μm or less and an acrylic resin, wherein the content of the filler is in the range of 20 to 45% by weight with respect to the entire adhesive sheet, and the content of the acrylic resin is in the range of 40 to 70% by weight with respect to entire resin components.

Abstract translation: 本发明提供一种用于制造半导体器件的粘合片，其包含平均粒度为0.3μm以下的填料和丙烯酸树脂，其中填料的含量为20〜45重量％ 相对于整个粘合片，丙烯酸树脂的含量相对于树脂成分的总量为40〜70重量％。

公开(公告)号：US20160016338A1

公开(公告)日：2016-01-21

申请号：US14335326

申请日：2014-07-18

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Marc D. Radcliffe ,  Daniel W. Hennen ,  Brett J. Sitter ,  Michael L. Steiner ,  Thomas R. Hoffend, JR. ,  Audrey A. Sherman ,  John J. Stradinger ,  Olester Benson, JR.

IPC: B29C41/22 ,  B29D11/00 ,  C09J7/00

CPC classification number: B29C41/22 ,  B29D11/0073 ,  B29L2011/00 ,  C09J7/00 ,  C09J7/10 ,  C09J7/20 ,  C09J2201/36 ,  C09J2201/622

Abstract: A multilayer optical adhesive including a first viscoelastic or elastomeric adhesive layer and a second viscoelastic or elastomeric adhesive layer. A crosslinked or soluble resin layer may be disposed between the first viscoelastic or elastomeric adhesive layer and the second viscoelastic or elastomeric adhesive layer or the first viscoelastic or elastomeric adhesive layer may be immediately adjacent to the second viscoelastic or elastomeric adhesive layer. An interface between immediately adjacent layers is structured and there is a difference in refractive indices across the interface.

Abstract translation: 包括第一粘弹性或弹性粘合剂层和第二粘弹性或弹性粘合剂层的多层光学粘合剂。 交联或可溶的树脂层可以设置在第一粘弹性或弹性粘合剂层和第二粘弹性或弹性粘合剂层之间，或者第一粘弹性或弹性粘合剂层可以紧邻第二粘弹性或弹性粘合剂层。 结构紧邻相邻层之间的界面，并且在界面上的折射率存在差异。