公开(公告)号：US08586408B2

公开(公告)日：2013-11-19

申请号：US13291882

申请日：2011-11-08

Applicant: Meng-Tse Chen ,  Wei-Hung Lin ,  Kuei-Wei Huang ,  Chih-Wei Lin ,  Chih Chun Chiu ,  Ming-Da Cheng ,  Chung-Shi Liu

Inventor： Meng-Tse Chen ,  Wei-Hung Lin ,  Kuei-Wei Huang ,  Chih-Wei Lin ,  Chih Chun Chiu ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L21/66 ,  H01L21/00

CPC classification number: H01L23/48 ,  H01L21/4853 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/49816 ,  H01L24/16 ,  H01L25/105 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15321 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05647

Abstract: A system and method for forming contacts is provided. An embodiment comprises forming the contacts on a substrate and then coining the contacts by physically shaping them using, e.g., a molding chamber. The physical shaping of the contacts may be performed using a patterned portion of the molding chamber or else by placing a patterned stencil around the contacts prior before a force is applied to physically reshape the contacts. The contacts may be reshaped into a cylindrical, oval, cuboid, or rectangular shape, for example.

Abstract translation: 提供一种用于形成触点的系统和方法。 一个实施例包括在基底上形成触点，然后通过使用例如模制室对它们进行物理成形来压接触点。 触点的物理成形可以使用模制室的图案化部分进行，或者在施加力以物理地重塑接触之前通过在接触件周围放置图案化模板。 触点可以重新成形为例如圆柱形，椭圆形，长方体形或矩形形状。

公开(公告)号：US20130260535A1

公开(公告)日：2013-10-03

申请号：US13476340

申请日：2012-05-21

Applicant: Meng-Tse CHEN ,  Hui-Min HUANG ,  Chun-Cheng LIN ,  Chih-Chun CHIU ,  Ming-Da CHENG ,  Chung-Shi LIU

Inventor： Meng-Tse CHEN ,  Hui-Min HUANG ,  Chun-Cheng LIN ,  Chih-Chun CHIU ,  Ming-Da CHENG ,  Chung-Shi LIU

IPC: H01L21/78 ,  B29C53/16

CPC classification number: B29C53/18 ,  H01L21/561 ,  H01L21/565 ,  H01L21/566 ,  H01L23/295 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/13147 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75315 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2924/00

Abstract: Embodiments of mechanisms for flattening a packaged structure are provided. The mechanisms involve a flattening apparatus and the utilization of protection layer(s) between the packaged structure and the surface(s) of the flattening apparatus. The protection layer(s) is made of a soft and non-sticking material to allow protecting exposed fragile elements of the packaged structure and easy separation after processing. The embodiments of flattening process involve flattening the warped packaged structure by pressure under elevated processing temperature. Processing under elevated temperature allows the package structure to be flattened within a reasonable processing time.

Abstract translation: 提供了用于使封装结构平坦化的机构的实施例。 这些机构涉及压平装置以及在封装结构和平坦化装置的表面之间利用保护层。 保护层由柔软和不粘的材料制成，以保护封装结构的暴露的易碎元件并且在加工之后易于分离。 扁平化过程的实施例涉及在升高的加工温度下通过压力使翘曲的包装结构变平。 在高温下进行处理可使包装结构在合理的处理时间内变平。

公开(公告)号：US20130234317A1

公开(公告)日：2013-09-12

申请号：US13416805

申请日：2012-03-09

Applicant: Meng-Tse Chen ,  Wei-Hung Lin ,  Yu-Peng Tsai ,  Chun-Cheng Lin ,  Chih-Wei Lin ,  Ming-Da Cheng ,  Chung-Shi Liu

Inventor： Meng-Tse Chen ,  Wei-Hung Lin ,  Yu-Peng Tsai ,  Chun-Cheng Lin ,  Chih-Wei Lin ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L25/07 ,  H01L21/60

CPC classification number: H01L24/32 ,  B23K35/24 ,  B23K35/3612 ,  H01L23/49816 ,  H01L24/17 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00014 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Packaging methods and packaged semiconductor devices are disclosed. In one embodiment, a packaging method includes providing a first die, partially packaging the first die, and forming a plurality of solder balls on a surface of the partially packaged first die. An epoxy flux is disposed over the plurality of solder balls. A second die is provided, and the second die is partially packaged. The plurality of solder balls is coupled to the partially packaged second die.

Abstract translation: 公开了封装方法和封装的半导体器件。 在一个实施例中，包装方法包括提供第一模具，部分地包装第一模具，以及在部分封装的第一模具的表面上形成多个焊球。 环氧助焊剂设置在多个焊球上。 提供第二模具，并且第二模具被部分包装。 多个焊球与部分封装的第二管连接。

公开(公告)号：US20130187269A1

公开(公告)日：2013-07-25

申请号：US13427787

申请日：2012-03-22

Applicant: Hung-Jen LIN ,  Tsung-Ding WANG ,  Chien-Hsiun LEE ,  Wen-Hsiung LU ,  Ming-Da CHENG ,  Chung-Shi LIU

Inventor： Hung-Jen LIN ,  Tsung-Ding WANG ,  Chien-Hsiun LEE ,  Wen-Hsiung LU ,  Ming-Da CHENG ,  Chung-Shi LIU

IPC: H01L23/498 ,  H01L21/56

CPC classification number: H01L24/81 ,  H01L21/563 ,  H01L21/565 ,  H01L21/566 ,  H01L21/768 ,  H01L23/3114 ,  H01L23/3171 ,  H01L23/525 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L2224/02311 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0347 ,  H01L2224/03612 ,  H01L2224/03614 ,  H01L2224/0362 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05073 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05187 ,  H01L2224/05582 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/21 ,  H01L2224/27318 ,  H01L2224/27334 ,  H01L2224/27416 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/81024 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01047 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/2076 ,  H01L2224/81 ,  H01L2924/01029 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/014 ,  H01L2224/11 ,  H01L2924/00

Abstract: A package assembly including a semiconductor die electrically coupled to a substrate by an interconnected joint structure. The semiconductor die includes a bump overlying a semiconductor substrate, and a molding compound layer overlying the semiconductor substrate and being in physical contact with a first portion of the bump. The substrate includes a no-flow underfill layer on a conductive region. A second portion of the bump is in physical contact with the no-flow underfill layer to form the interconnected joint structure.

Abstract translation: 一种包装组件，其包括通过互连的接合结构电耦合到衬底的半导体管芯。 半导体管芯包括覆盖半导体衬底的凸块和覆盖半导体衬底并与凸点的第一部分物理接触的模塑复合层。 衬底包括导电区域上的无流动底部填充层。 凸块的第二部分与无流动底部填充层物理接触以形成互连的连接结构。

公开(公告)号：US20130187268A1

公开(公告)日：2013-07-25

申请号：US13357379

申请日：2012-01-24

Applicant: Chun-Cheng Lin ,  Chung-Shi Liu ,  Kuei-Wei Huang ,  Cheng-Ting Chen ,  Wei-Hung Lin ,  Ming-Da Cheng

Inventor： Chun-Cheng Lin ,  Chung-Shi Liu ,  Kuei-Wei Huang ,  Cheng-Ting Chen ,  Wei-Hung Lin ,  Ming-Da Cheng

IPC: H01L23/498 ,  H01L21/56

CPC classification number: H01L25/0657 ,  H01L21/0273 ,  H01L21/486 ,  H01L21/56 ,  H01L21/76898 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49866 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0231 ,  H01L2224/0239 ,  H01L2224/03452 ,  H01L2224/0401 ,  H01L2224/05083 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/1131 ,  H01L2224/11424 ,  H01L2224/1152 ,  H01L2224/1162 ,  H01L2224/11825 ,  H01L2224/11849 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13118 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13611 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01048 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15747 ,  H01L2924/18161 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2924/20642 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A system and method for packaging semiconductor dies is provided. An embodiment comprises a first package with a first contact and a second contact. A post-contact material is formed on the first contact in order to adjust the height of a joint between the contact pad a conductive bump. In another embodiment a conductive pillar is utilized to control the height of the joint between the contact pad and external connections.

Abstract translation: 提供一种用于封装半导体管芯的系统和方法。 实施例包括具有第一触点和第二触点的第一封装。 在第一接触件上形成接触后材料，以便调节接触垫之间的接头的高度，导体凸块。 在另一个实施例中，使用导电柱来控制接触垫和外部连接之间的接头的高度。

公开(公告)号：US20130154086A1

公开(公告)日：2013-06-20

申请号：US13331061

申请日：2011-12-20

Applicant: Chen-Hua Yu ,  Chung-Shi Liu ,  Chun-Cheng Lin ,  Meng-Tse Chen ,  Ming-Da Cheng

Inventor： Chen-Hua Yu ,  Chung-Shi Liu ,  Chun-Cheng Lin ,  Meng-Tse Chen ,  Ming-Da Cheng

IPC: H01L23/48 ,  H01L21/50

CPC classification number: H01L23/31 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/14 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00

Abstract: A method includes performing an etching step on a package. The package includes a package component, a connector on a top surface of the package component, a die bonded to the top surface of the package component, and a molding material molded over the top surface of the package component. The molding material covers the connector, wherein a portion of the molding material covering the connector is removed by the etching step, and the connector is exposed.

Abstract translation: 一种方法包括对包装进行蚀刻步骤。 该包装包括包装部件，在包装部件的顶表面上的连接器，结合到包装部件的顶表面的管芯，以及模制在包装部件的顶表面上的模制材料。 成型材料覆盖连接器，其中通过蚀刻步骤去除覆盖连接器的成型材料的一部分，并且连接器被暴露。

公开(公告)号：US08440503B1

公开(公告)日：2013-05-14

申请号：US13298056

申请日：2011-11-16

Applicant: Hsiu-Jen Lin ,  Chih-Wei Lin ,  Cheng-Ting Chen ,  Ming-Da Cheng ,  Chung-Shi Liu

Inventor： Hsiu-Jen Lin ,  Chih-Wei Lin ,  Cheng-Ting Chen ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L21/00

CPC classification number: H01L24/75 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/75283 ,  H01L2224/7598 ,  H01L2224/81005 ,  H01L2224/81136 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/8123 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/97 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/81

Abstract: A method includes placing a cover over a lower package component, wherein the cover comprises an opening aligned to the lower package component. An upper package component is placed over the lower package component. The upper package component is aligned to the opening, and a solder region is dispose between the upper package component and the lower package component. The cover and the upper package component are exposed to a radiation to reflow the solder region.

Abstract translation: 一种方法包括将盖子放置在下部封装部件上，其中盖子包括与下部封装部件对准的开口。 上封装组件放置在下封装组件上。 上部封装部件与开口对准，并且焊接区域配置在上部封装部件和下部封装部件之间。 盖和上部封装部件暴露于辐射以回流焊接区域。

公开(公告)号：US20130095608A1

公开(公告)日：2013-04-18

申请号：US13272032

申请日：2011-10-12

Applicant: Meng-Tse Chen ,  Chun-Cheng Lin ,  Kuei-Wei Huang ,  Yu-Peng Tsai ,  Wei-Hung Lin ,  Ming-Da Cheng ,  Chung-Shi Liu

Inventor： Meng-Tse Chen ,  Chun-Cheng Lin ,  Kuei-Wei Huang ,  Yu-Peng Tsai ,  Wei-Hung Lin ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L21/50 ,  H01L21/00

CPC classification number: B23Q3/18 ,  H01L21/50 ,  H01L21/561 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75733 ,  H01L2224/75744 ,  H01L2224/75754 ,  H01L2224/7598 ,  H01L2224/75983 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/83104 ,  H01L2224/83862 ,  H01L2224/83868 ,  H01L2224/83874 ,  H01L2224/97 ,  H01L2924/3511 ,  Y10T29/41 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/014

Abstract: A method includes dispensing an underfill between a first package component and a second package component, wherein the first package component is placed on a lower jig, and the second package component is over and bonded to the first package component. A through-opening is in the lower jig and under the first package component. The underfill is cured, wherein during the step of curing the underfill, a force is applied to flatten the first package component. The force is applied by performing an action selected from the group consisting of vacuuming and air blowing through the through-opening.

Abstract translation: 一种方法包括在第一包装部件和第二包装部件之间分配底部填充物，其中第一包装部件被放置在下部夹具上，并且第二包装部件结合到第一包装部件上。 通孔位于下夹具中并在第一包装部件下方。 底部填充物被固化，其中在固化底部填充物的步骤期间，施加力以使第一包装部件变平。 通过执行从通过通孔的抽真空和空气吹扫的组中选择的动作来施加力。

公开(公告)号：US20130075921A1

公开(公告)日：2013-03-28

申请号：US13240629

申请日：2011-09-22

Applicant: Meng-Tse Chen ,  Chih-Wei Lin ,  Chun-Cheng Lin ,  Wen-Hsiung Lu ,  Ming-Da Cheng ,  Chung-Shi Liu

Inventor： Meng-Tse Chen ,  Chih-Wei Lin ,  Chun-Cheng Lin ,  Wen-Hsiung Lu ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L23/498 ,  H01L21/60 ,  H01L21/50

CPC classification number: H01L23/49816 ,  H01L21/486 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49827 ,  H01L23/49894 ,  H01L24/16 ,  H01L2221/68345 ,  H01L2224/13023 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2924/12042 ,  H01L2924/15331 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method includes applying a polymer-comprising material over a carrier, and forming a via over the carrier. The via is located inside the polymer-comprising material, and substantially penetrates through the polymer-comprising material. A first redistribution line is formed on a first side of the polymer-comprising material. A second redistribution line is formed on a second side of the polymer-comprising material opposite to the first side. The first redistribution line is electrically coupled to the second redistribution line through the via.

Abstract translation: 一种方法包括在载体上涂覆含聚合物的材料，并在载体上形成通孔。 通孔位于含聚合物的材料的内部，并且基本上穿透包含聚合物的材料。 在包含聚合物的材料的第一面上形成第一再分配线。 第二再分配线形成在与第一侧相对的含聚合物材料的第二侧上。 第一再分配线通过通孔电耦合到第二再分配线。

公开(公告)号：US20120299181A1

公开(公告)日：2012-11-29

申请号：US13118108

申请日：2011-05-27

Applicant: Meng-Tse Chen ,  Wei-Hung Lin ,  Sheng-Yu Wu ,  Chun-Cheng Lin ,  Kuei-Wei Huang ,  Yu-Peng Tsai ,  Chih-Wei Lin ,  Wen-Hsiung Lu ,  Hsiu-Jen Lin ,  Bor-Ping Jang ,  Ming-Da Cheng ,  Chung-Shi Liu

Inventor： Meng-Tse Chen ,  Wei-Hung Lin ,  Sheng-Yu Wu ,  Chun-Cheng Lin ,  Kuei-Wei Huang ,  Yu-Peng Tsai ,  Chih-Wei Lin ,  Wen-Hsiung Lu ,  Hsiu-Jen Lin ,  Bor-Ping Jang ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L23/488 ,  H01L21/56

CPC classification number: H01L24/17 ,  H01L21/565 ,  H01L21/566 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/81 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16055 ,  H01L2224/16113 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1304 ,  H01L2924/14 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/00

Abstract: A method of packaging includes placing a package component over a release film, wherein solder balls on a surface of the package component are in physical contact with the release film. Next, A molding compound filled between the release film and the package component is cured, wherein during the step of curing, the solder balls remain in physical contact with the release film.

Abstract translation: 包装方法包括将包装部件放置在脱模膜上，其中包装部件表面上的焊球与剥离膜物理接触。 接下来，填充在剥离膜和包装部件之间的模塑料固化，其中在固化步骤期间，焊球与剥离膜保持物理接触。