公开(公告)号：US20170365546A1

公开(公告)日：2017-12-21

申请号：US15626687

申请日：2017-06-19

Applicant: Invensas Corporation

Inventor： Cyprian Emeka Uzoh ,  Pezhman Monadgemi ,  Terrence Caskey ,  Fatima Lina Ayatollahi ,  Belgacem Haba ,  Charles G. Woychik ,  Michael Newman

IPC: H01L23/498 ,  H01L23/48 ,  H01L23/367 ,  H01L21/768 ,  H01L23/373 ,  H01L23/36

CPC classification number: H01L23/49827 ,  H01L21/76829 ,  H01L21/76898 ,  H01L23/36 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/3736 ,  H01L23/481 ,  H01L23/49838 ,  H01L23/49866 ,  H01L2924/00 ,  H01L2924/0002

Abstract: An interconnect element includes a semiconductor or insulating material layer that has a first thickness and defines a first surface; a thermally conductive layer; a plurality of conductive elements; and a dielectric coating. The thermally conductive layer includes a second thickness of at least 10 microns and defines a second surface of the interconnect element. The plurality of conductive elements extend from the first surface of the interconnect element to the second surface of the interconnect element. The dielectric coating is between at least a portion of each conductive element and the thermally conductive layer.

公开(公告)号：US20170294321A1

公开(公告)日：2017-10-12

申请号：US15626577

申请日：2017-06-19

Applicant: Invensas Corporation

Inventor： Andrew Cao ,  Michael Newman

IPC: H01L21/48 ,  H01L23/14 ,  H01L25/16 ,  H01L23/00 ,  H01L25/065 ,  H01L23/13 ,  H01L23/498

CPC classification number: H01L21/4853 ,  H01L21/486 ,  H01L23/13 ,  H01L23/147 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/562 ,  H01L24/02 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/16 ,  H01L2224/0231 ,  H01L2224/0237 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05569 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/81424 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81464 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A component, e.g., interposer has first and second opposite sides, conductive elements at the first side and terminals at the second side. The terminals can connect with another component, for example. A first element at the first side can comprise a first material having a thermal expansion coefficient less than 10 ppm/° C., and a second element at the second side can comprise a plurality of insulated structures separated from one another by at least one gap. Conductive structure extends through at least one insulated structure and is electrically coupled with the terminals and the conductive elements. The at least one gap can reduce mechanical stress in connections between the terminals and another component.

公开(公告)号：US20170194373A1

公开(公告)日：2017-07-06

申请号：US15407842

申请日：2017-01-17

Applicant: Invensas Corporation

Inventor： Charles G. Woychik ,  Cyprian Emeka Uzoh ,  Michael Newman ,  Terrence Caskey

IPC: H01L27/146 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498 ,  H01L21/683

CPC classification number: H01L27/14634 ,  H01L21/4846 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5384 ,  H01L24/11 ,  H01L24/16 ,  H01L24/17 ,  H01L24/80 ,  H01L24/81 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/1469 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/13 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/97 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/351 ,  H05K1/0298 ,  H01L2224/81 ,  H01L2924/00

Abstract: A microelectronic assembly including a dielectric region, a plurality of electrically conductive elements, an encapsulant, and a microelectronic element are provided. The encapsulant may have a coefficient of thermal expansion (CTE) no greater than twice a CTE associated with at least one of the dielectric region or the microelectronic element.

公开(公告)号：US09558964B2

公开(公告)日：2017-01-31

申请号：US14524280

申请日：2014-10-27

Applicant: Invensas Corporation

Inventor： Charles G. Woychik ,  Cyprian Emeka Uzoh ,  Michael Newman ,  Terrence Caskey

IPC: H01L21/56 ,  H01L23/48 ,  H01L21/48 ,  H05K1/02 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L21/683 ,  H01L23/00

CPC classification number: H01L27/14634 ,  H01L21/4846 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5384 ,  H01L24/11 ,  H01L24/16 ,  H01L24/17 ,  H01L24/80 ,  H01L24/81 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/1469 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/13 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/97 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/351 ,  H05K1/0298 ,  H01L2224/81 ,  H01L2924/00

Abstract: A microelectronic assembly including a dielectric region, a plurality of electrically conductive elements, an encapsulant, and a microelectronic element are provided. The encapsulant may have a coefficient of thermal expansion (CTE) no greater than twice a CTE associated with at least one of the dielectric region or the microelectronic element.

Abstract translation: 提供了包括电介质区域，多个导电元件，密封剂和微电子元件的微电子组件。 密封剂可以具有不大于与电介质区域或微电子元件中的至少一个相关联的CTE的两倍的热膨胀系数（CTE）。

公开(公告)号：US20160329290A1

公开(公告)日：2016-11-10

申请号：US15212603

申请日：2016-07-18

Applicant: Invensas Corporation

Inventor： Belgacem Haba ,  Charles G. Woychik ,  Cyprian Emeka Uzoh ,  Michael Newman ,  Terrence Caskey

IPC: H01L23/00

CPC classification number: H01L24/13 ,  H01L21/563 ,  H01L23/564 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02372 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0347 ,  H01L2224/03912 ,  H01L2224/03914 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05557 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/05609 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05657 ,  H01L2224/05664 ,  H01L2224/10145 ,  H01L2224/1146 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11903 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/13164 ,  H01L2224/1319 ,  H01L2224/14517 ,  H01L2224/1601 ,  H01L2224/16057 ,  H01L2224/16058 ,  H01L2224/16104 ,  H01L2224/16105 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16503 ,  H01L2224/17505 ,  H01L2224/17517 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81001 ,  H01L2224/81007 ,  H01L2224/811 ,  H01L2224/81139 ,  H01L2224/8192 ,  H01L2224/83104 ,  H01L2224/9201 ,  H01L2224/9212 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2924/00014 ,  H05K1/181 ,  H05K3/30 ,  Y10T29/4913 ,  H01L2924/00012 ,  H01L2924/01015 ,  H01L2924/01074 ,  H01L2224/05552

Abstract: Microelectronic assemblies and methods for making the same are disclosed herein. In one embodiment, a method of forming a microelectronic assembly comprises assembling first and second components to have first major surfaces of the first and second components facing one another and spaced apart from one another by a predetermined spacing, the first component having first and second oppositely-facing major surfaces, a first thickness extending in a first direction between the first and second major surfaces, and a plurality of first metal connection elements at the first major surface, the second component having a plurality of second metal connection elements at the first major surface of the second component; and plating a plurality of metal connector regions each connecting and extending continuously between a respective first connection element and a corresponding second connection element opposite the respective first connection element in the first direction.

Abstract translation: 本文公开了微电子组件及其制造方法。 在一个实施例中，形成微电子组件的方法包括组装第一和第二部件以使第一和第二部件的第一主表面彼此面对并且彼此隔开预定间隔，第一部件具有第一和第二相对 主表面，在第一和第二主表面之间沿第一方向延伸的第一厚度和在第一主表面处的多个第一金属连接元件，第二部件在第一主要部分具有多个第二金属连接元件 第二部件的表面; 以及电镀多个金属连接器区域，每个金属连接器区域在第一方向上在相应的第一连接元件和与相应的第一连接元件相对的相应的第二连接元件之间连续延伸。

公开(公告)号：US09312175B2

公开(公告)日：2016-04-12

申请号：US13722365

申请日：2012-12-20

Applicant: Invensas Corporation

Inventor： Belgacem Haba ,  Fatima Lina Ayatollahi ,  Michael Newman ,  Pezhman Monadgemi

IPC: H01L21/768 ,  H01L23/50 ,  H01L23/522 ,  H01L23/48

CPC classification number: H01L23/481 ,  H01L21/76898 ,  H01L23/50 ,  H01L23/5226 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Microelectronic elements and methods of their manufacture are disclosed. A microelectronic element may include a substrate including an opening extending through a semiconductor region of the substrate, a dielectric layer cover a wall of the opening within at least a first portion of the opening, a first metal disposed within the first portion of the opening, a second metal disposed within a second portion of the opening. The second metal may form at least part of a contact of the microelectronic element.

Abstract translation: 公开了微电子元件及其制造方法。 微电子元件可以包括：衬底，其包括延伸穿过衬底的半导体区域的开口;电介质层覆盖开口的至少第一部分内的开口的壁;布置在开口的第一部分内的第一金属， 设置在开口的第二部分内的第二金属。 第二金属可以形成微电子元件的接触的至少一部分。

公开(公告)号：US20160079214A1

公开(公告)日：2016-03-17

申请号：US14952064

申请日：2015-11-25

Applicant: Invensas Corporation

Inventor： Terrence Caskey ,  Ilyas Mohammed ,  Cyprian Uzoh ,  Charles G. Woychik ,  Michael Newman ,  Pezhman Monadgemi ,  Reynaldo Co ,  Ellis Chau ,  Belgacem Haba

IPC: H01L25/10 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L25/105 ,  H01L21/486 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/02379 ,  H01L2224/04042 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48108 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73257 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/381 ,  H05K1/0298 ,  H05K3/46 ,  Y10T29/49126 ,  Y10T29/49162 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A method for making an interposer includes forming a plurality of wire bonds bonded to one or more first surfaces of a first element. A dielectric encapsulation is formed contacting an edge surface of the wire bonds which separates adjacent wire bonds from one another. Further processing comprises removing at least portions of the first element, wherein the interposer has first and second opposite sides separated from one another by at least the encapsulation, and the interposer having first contacts and second contacts at the first and second opposite sides, respectively, for electrical connection with first and second components, respectively, the first contacts being electrically connected with the second contacts through the wire bonds.

Abstract translation: 制造插入件的方法包括形成结合到第一元件的一个或多个第一表面的多个引线键合。 形成电介质封装，其接触将引线接合部彼此分隔开的引线接合的边缘表面。 进一步的处理包括去除第一元件的至少一部分，其中插入件具有通过至少封装相互隔开的第一和第二相对侧，并且插入件分别在第一和第二相对侧具有第一接触和第二接触， 分别与第一和第二部件电连接，第一触点通过引线键与第二触点电连接。

公开(公告)号：US20140264794A1

公开(公告)日：2014-09-18

申请号：US13828938

申请日：2013-03-14

Applicant: INVENSAS CORPORATION

Inventor： Charles G. Woychik ,  Cyprian Emeka Uzoh ,  Michael Newman ,  Terrence Caskey

IPC: H05K1/02 ,  H01L21/58 ,  H01L23/495

CPC classification number: H01L27/14634 ,  H01L21/4846 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5384 ,  H01L24/11 ,  H01L24/16 ,  H01L24/17 ,  H01L24/80 ,  H01L24/81 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/1469 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/13 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/97 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/351 ,  H05K1/0298 ,  H01L2224/81 ,  H01L2924/00

Abstract: A microelectronic assembly including a dielectric region, a plurality of electrically conductive elements, an encapsulant, and a microelectronic element are provided. The encapsulant may have a coefficient of thermal expansion (CTE) no greater than twice a CTE associated with at least one of the dielectric region or the microelectronic element.

Abstract translation: 提供了包括电介质区域，多个导电元件，密封剂和微电子元件的微电子组件。 密封剂可以具有不大于与电介质区域或微电子元件中的至少一个相关联的CTE的两倍的热膨胀系数（CTE）。

公开(公告)号：US20140240938A1

公开(公告)日：2014-08-28

申请号：US13776035

申请日：2013-02-25

Applicant: INVENSAS CORPORATION

Inventor： Michael Newman ,  Cyprian Emeka Uzoh ,  Charles G. Woychik ,  Pezhman Monadgemi ,  Terrence Caskey

IPC: H05K1/11 ,  H05K3/40

CPC classification number: H01L21/486 ,  H01L23/147 ,  H01L23/49827 ,  H01L2224/13 ,  H01L2224/16225 ,  H05K1/111 ,  H05K3/0014 ,  H05K3/4038 ,  Y10T29/49117

Abstract: An interposer can have conductive elements at a first side and terminals at a second side opposite therefrom, for connecting with a microelectronic element and a second component, respectively. The component can include a first element having a thermal expansion coefficient less than 10 ppm/° C., and an insulating second element, with a plurality of openings extending from the second side through the second element towards the first element. Conductive structure extending through the openings in the second element and through the first element electrically connects the terminals with the conductive elements.

Abstract translation: 插入件可以在第一侧具有导电元件，并且在与其相对的第二侧具有端子，用于分别与微电子元件和第二元件连接。 该组件可以包括具有小于10ppm /℃的热膨胀系数的第一元件和绝缘的第二元件，其中多个开口从第二侧延伸穿过第二元件朝向第一元件。 延伸穿过第二元件中的开口并通过第一元件的导电结构将端子与导电元件电连接。

公开(公告)号：US20140179099A1

公开(公告)日：2014-06-26

申请号：US13724223

申请日：2012-12-21

Applicant: INVENSAS CORPORATION

Inventor： Cyprian Emeka Uzoh ,  Pezhman Monadgemi ,  Michael Newman ,  Charles G. Woychik ,  Terrence Caskey

IPC: H01L21/768

CPC classification number: H01L21/76898 ,  H01L21/31053 ,  H01L21/561 ,  H01L21/6835 ,  H01L21/768 ,  H01L21/76841 ,  H01L21/76877 ,  H01L21/78 ,  H01L23/481 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2924/0002 ,  H01L2924/12042 ,  H01L2924/00

Abstract: Methods of forming a microelectronic assembly and the resulting structures and devices are disclosed herein. In one embodiment, a method of forming a microelectronic assembly includes removing material exposed at portions of a surface of a substrate to form a processed substrate having a plurality of thinned portions separated by integral supporting portions of the processed substrate having a thickness greater than a thickness of the thinned portions, at least some of the thinned portions including a plurality of electrically conductive interconnects extending in a direction of the thicknesses of the thinned portions and exposed at the surface; and removing the supporting portions of the substrate to sever the substrate into a plurality of individual thinned portions, at least some individual thinned portions including the interconnects.

Abstract translation: 本文公开了形成微电子组件的方法以及所得到的结构和装置。 在一个实施例中，形成微电子组件的方法包括去除在衬底的表面的部分处暴露的材料，以形成经处理的衬底，该衬底具有多个由处理衬底的整体支撑部分分隔开的薄化部分，该部分的厚度大于厚度 减薄部分中的至少一些薄化部分包括在薄壁部分的厚度方向上延伸并在表面露出的多个导电互连件; 以及去除衬底的支撑部分以将衬底切割成多个单独的薄化部分，至少一些单独的变薄部分，包括互连。