公开(公告)号：US08541691B2

公开(公告)日：2013-09-24

申请号：US12952759

申请日：2010-11-23

申请人： Takashi Kariya ,  Toshiki Furutani ,  Takeshi Kawanishi

发明人： Takashi Kariya ,  Toshiki Furutani ,  Takeshi Kawanishi

IPC分类号： H05K1/16

CPC分类号： H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/112 ,  H05K3/4602 ,  H05K3/4688 ,  H05K2201/0187 ,  H05K2201/10674 ,  H01L2224/05599

摘要： A circuit wiring board including a wiring substrate, multiple electronic components provided on a surface of the wiring substrate, and a heat resistant substrate accommodated in the wiring substrate and having a core substrate and a built-up wiring layer formed over the core substrate. The built-up wiring layer includes a conductive layer and an interlayer resin insulating layer, and the electronic components are electrically connected to the conductive layer of the built-up wiring layer.

摘要翻译： 一种电路布线板，包括布线基板，设置在所述布线基板的表面上的多个电子部件和容纳在所述布线基板中的耐热基板，并且具有形成在所述芯基板上的芯基板和积层布线层。 叠层布线层包括导电层和层间树脂绝缘层，并且电子部件电连接到组合布线层的导电层。

公开(公告)号：US08415781B2

公开(公告)日：2013-04-09

申请号：US13205027

申请日：2011-08-08

申请人： Takashi Kariya ,  Toshiki Furutani ,  Shinobu Kato

发明人： Takashi Kariya ,  Toshiki Furutani ,  Shinobu Kato

IPC分类号： H01F5/00 ,  H01L23/48

CPC分类号： H01L24/19 ,  H01L21/568 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L24/06 ,  H01L24/17 ,  H01L24/20 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/06135 ,  H01L2224/06177 ,  H01L2224/12105 ,  H01L2224/13 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73209 ,  H01L2224/73217 ,  H01L2224/81192 ,  H01L2224/9202 ,  H01L2224/92124 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2924/351 ,  H01L2924/00

摘要： An electronic component including a wiring board having a power-source pattern and a signal pattern, a semiconductor element mounted on the wiring board and having a power-source electrode pad and a signal electrode pad, a first connection portion being made of a conductive material and connecting the signal pattern of the wiring board and the signal electrode pad of the semiconductor element, and a second connection portion being made of a conductive material and connecting the power-source pattern of the wiring board and the power-source electrode pad of the semiconductor element. The conductive material of the first connection portion and the conductive material of the second connection portion are selected such that the conductive material of the second connection portion has an electrical resistance which is lower than an electrical resistance of the conductive material of the first connection portion.

摘要翻译： 一种电子部件，包括具有电源图案和信号图案的布线板，安装在布线基板上并具有电源电极焊盘和信号电极焊盘的半导体元件，第一连接部分由导电材料制成 并且连接所述布线板的信号图案和所述半导体元件的信号电极焊盘;以及第二连接部，其由导电材料制成，并且将所述布线板的电源图案和所述电源电极焊盘 半导体元件。 选择第一连接部分的导电材料和第二连接部分的导电材料，使得第二连接部分的导电材料具有低于第一连接部分的导电材料的电阻的电阻。

公开(公告)号：US08409461B2

公开(公告)日：2013-04-02

申请号：US11566847

申请日：2006-12-05

申请人： Takashi Kariya ,  Toshiki Furutani ,  Takeshi Kawanishi

发明人： Takashi Kariya ,  Toshiki Furutani ,  Takeshi Kawanishi

IPC分类号： C03C15/00 ,  C03C25/68 ,  H05K3/00

CPC分类号： H05K3/4092 ,  H05K2201/0311 ,  H05K2203/308 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49156

摘要： The present invention is to provide a method of manufacturing a printed wiring board with a component mounting pin to connect a printed wiring board and an electronic component. A method of manufacturing a printed wiring board (1) with a component mounting pin (18) at a stage to form a component mounting surface after layers of a predetermined number were formed includes the steps of forming a conductive land (11) on the component mounting surface, covering the component mounting surface with an insulating layer (12) except the conductive land (11) of the component mounting surface, partly forming near the conductive land (11) of the upper surface of the insulating layer (12) a sacrificial layer (14) which can be removed in the subsequent process, forming conductive layers (16, 17) on the upper surfaces of the conductive land (11) and the sacrificial layer (14) with a plating process to pattern the conductive layers (16, 17), forming the component mounting pin (18) elongated from the conductive land (11) by partly removing the sacrificial layer (14) located under the patterned conductive layers (16, 17) and erecting the component mounting pin (18).

摘要翻译： 本发明提供一种制造印刷电路板的方法，该印刷电路板具有用于连接印刷电路板和电子部件的元件安装销。 在形成预定数量的层之后形成部件安装表面的阶段，制造具有部件安装销（18）的印刷电路板（1）的方法包括以下步骤：在部件上形成导电焊盘（11） 在绝缘层（12）的上表面附近形成靠近绝缘层（12）的导电焊盘（11）附近的除了元件安装表面的导电焊盘（11）之外的绝缘层（12）覆盖部件安装表面， （14），其可以在随后的工艺中去除，在导电焊盘（11）和牺牲层（14）的上表面上形成导电层（16,17），用电镀工艺对导电层（16）进行图案化 ，17），通过部分去除位于图案化导电层（16,17）下方的牺牲层（14）并竖立元件安装销（18），形成从导电焊盘（11）延伸的部件安装销（18）。

公开(公告)号：US08395054B2

公开(公告)日：2013-03-12

申请号：US12616891

申请日：2009-11-12

申请人： Takashi Kariya ,  Daiki Komatsu

发明人： Takashi Kariya ,  Daiki Komatsu

IPC分类号： H05K1/16

CPC分类号： H01L23/13 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5383 ,  H01L23/5385 ,  H01L23/5387 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/12044 ,  H05K1/0306 ,  H05K1/144 ,  H05K1/183 ,  H05K3/4602 ,  H05K3/4605 ,  H05K3/4608 ,  H05K3/4691 ,  H05K3/4694 ,  H05K2201/0187 ,  H05K2201/055 ,  H05K2201/068 ,  H05K2201/09509 ,  H05K2201/10545 ,  H05K2201/10674 ,  H05K2203/063 ,  H01L2224/05599

摘要： To provide a substrate for mounting a semiconductor element, in which fine-pitch wiring layers are formed to allow a semiconductor element to be mounted, while heat generated in the semiconductor element will not result in a decrease in reliability. Semiconductor-element mounting substrate sandwiches low-thermal-expansion substrate with upper interlayer resin layer and lower interlayer resin layer, and conductive circuit of organic substrate and first conductive circuit of low-thermal-expansion substrate are connected by via conductor formed in interlayer resin layer. Therefore, low-thermal-expansion substrate for mounting semiconductor element may be connected to organic substrate that is connected to outside substrates, without arranging an organic substrate and resin layers on the lower surface of low-thermal-expansion substrate, where impact from the thermal history of semiconductor element is notable.

摘要翻译： 为了提供用于安装半导体元件的基板，其中形成微细间距布线层以允许安装半导体元件，同时在半导体元件中产生的热量不会导致可靠性降低。 半导体元件安装基板将具有上层间树脂层和下层间树脂层的低热膨胀基板夹持，有机基板的导电电路和低热膨胀基板的第一导电电路通过在层间树脂层中形成的通孔导体连接 。 因此，用于安装半导体元件的低热膨胀基板可以连接到与外部基板连接的有机基板，而不在低热膨胀基板的下表面上布置有机基板和树脂层，其中来自热 半导体元件的历史是值得注意的。

公开(公告)号：US08108990B2

公开(公告)日：2012-02-07

申请号：US12255699

申请日：2008-10-22

申请人： Takashi Kariya ,  Hironori Tanaka

发明人： Takashi Kariya ,  Hironori Tanaka

IPC分类号： H05K3/00

CPC分类号： H05K1/162 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/642 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/3011 ,  H05K3/4602 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0352 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09718 ,  H05K2201/09827 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  H01L2224/05599

摘要： A printed circuit board including a conductor portion, an insulating layer formed over the conductor portion, a thin-film capacitor formed over the insulating layer and including a first electrode, a second electrode and a high-dielectric layer interposed between the first electrode and the second electrode, and a via-hole conductor structure formed through the second electrode and insulating layer and electrically connecting the second electrode and the conductor portion. The via-hole conductor structure has a first portion in the second electrode and a second portion in the insulating layer. The first portion of the via-hole conductor structure has a truncated-cone shape tapering toward the conductor portion.

摘要翻译： 一种印刷电路板，包括导体部分，在导体部分上形成的绝缘层，形成在绝缘层之上的薄膜电容器，并且包括第一电极，第二电极和介于第一电极和第二电极之间的高电介质层 第二电极和通过第二电极和绝缘层形成的通孔导体结构，并且电连接第二电极和导体部分。 通孔导体结构在第二电极中具有第一部分，在绝缘层中具有第二部分。 通孔导体结构的第一部分具有朝向导体部分逐渐变细的截锥形。

公开(公告)号：US20110290544A1

公开(公告)日：2011-12-01

申请号：US13206084

申请日：2011-08-09

申请人： Naohiro Hirose ,  Takashi Kariya ,  Yoji Mori

发明人： Naohiro Hirose ,  Takashi Kariya ,  Yoji Mori

IPC分类号： H05K1/02

CPC分类号： H01R9/09 ,  H01L23/12 ,  H01L23/48 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H05K1/0256 ,  H05K1/0263 ,  H05K1/0265 ,  H05K1/0271 ,  H05K1/113 ,  H05K1/115 ,  H05K1/116 ,  H05K3/184 ,  H05K3/241 ,  H05K3/382 ,  H05K3/4602 ,  H05K3/4661 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09272 ,  H05K2201/09454 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09627 ,  H05K2201/09727 ,  H05K2201/09781 ,  H05K2201/10734 ,  H05K2203/0594 ,  Y10T29/49155 ,  Y10T29/49194 ,  Y10T428/31504

摘要： A printed wiring board including a core substrate, a build-up layer formed over the core substrate and including a first insulating layer, a conductor layer formed over the first insulating layer, and a second insulating layer formed over the conductor layer, and one or more wiring patterns formed over the first insulating layer. The conductor layer includes conductor portions, and the conductor portions have notched portions, respectively, facing each other across the wiring pattern.

摘要翻译： 一种印刷电路板，包括芯基板，形成在所述芯基板上并包括第一绝缘层的堆积层，形成在所述第一绝缘层上的导体层和形成在所述导体层上的第二绝缘层，以及一个或 在第一绝缘层上形成更多的布线图案。 导体层包括导体部分，并且导体部分分别具有跨越布线图案彼此面对的切口部分。

公开(公告)号：US07982139B2

公开(公告)日：2011-07-19

申请号：US11356350

申请日：2006-02-17

申请人： Takashi Kariya ,  Akira Mochida

发明人： Takashi Kariya ,  Akira Mochida

IPC分类号： H05K1/16

CPC分类号： H05K1/162 ,  H05K1/0231 ,  H05K1/0271 ,  H05K1/113 ,  H05K3/4602 ,  H05K2201/0133 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0187 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09718 ,  H05K2201/09763 ,  H05K2201/10522 ,  H05K2201/10734

摘要： A multilayer printed wiring board 10 includes: a mounting portion 60 on the top surface of which is mounted a semiconductor element that is electrically connected to a wiring pattern 32, etc.; and a capacitor portion 40 having a high dielectric constant layer 43, formed of ceramic and first and second layer electrodes 41 and 42 that sandwich the high dielectric constant layer 43. One of either of the first and second layer electrodes 41 and 42 is connected to a power supply line of the semiconductor element and the other of either of the first and second layer electrodes 41 and 42 is connected to a ground line. In this multilayer printed wiring board 10, high dielectric constant layer 43 included in the layered capacitor portion 40, which is connected between the power supply line and the ground line, is formed of ceramic. With this structure, the static capacitance of the layered capacitor portion 40 can be high, and an adequate decoupling effect is exhibited even under circumstances in which instantaneous potential drops occur readily.

摘要翻译： 多层印刷电路板10包括：安装部分60，其顶表面上安装有电连接到布线图案32的半导体元件; 以及具有由陶瓷形成的高介电常数层43的电容器部分40和夹在高介电常数层43上的第一和第二层电极41和42。第一和第二层电极41和42中的一个连接到 半导体元件的电源线和第一和第二层电极41和42中的另一个连接到接地线。 在这种多层印刷电路板10中，连接在电源线和接地线之间的层状电容器部分40中包括的高介电常数层43由陶瓷形成。 利用这种结构，层状电容器部分40的静态电容可以很高，并且即使在容易发生瞬时电位下降的情况下也可以发挥足够的去耦效应。

公开(公告)号：US07888803B2

公开(公告)日：2011-02-15

申请号：US11580928

申请日：2006-10-16

申请人： Takashi Kariya ,  Hironori Tanaka

发明人： Takashi Kariya ,  Hironori Tanaka

IPC分类号： H01L23/48

CPC分类号： H05K1/162 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/642 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/3011 ,  H05K3/4602 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0352 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09718 ,  H05K2201/09827 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  H01L2224/05599

摘要： A printed circuit board including a conductor portion, an insulating layer formed over the conductor portion, a thin-film capacitor formed over the insulating layer and including a first electrode, a second electrode and a high-dielectric layer interposed between the first electrode and the second electrode, and a via-hole conductor structure formed through the second electrode and insulating layer and electrically connecting the second electrode and the conductor portion. The via-hole conductor structure has a first portion in the second electrode and a second portion in the insulating layer. The first portion of the via-hole conductor structure has a truncated-cone shape tapering toward the conductor portion.

摘要翻译： 一种印刷电路板，包括导体部分，在导体部分上形成的绝缘层，形成在绝缘层之上的薄膜电容器，并且包括第一电极，第二电极和介于第一电极和第二电极之间的高电介质层 第二电极和通过第二电极和绝缘层形成的通孔导体结构，并且电连接第二电极和导体部分。 通孔导体结构在第二电极中具有第一部分，在绝缘层中具有第二部分。 通孔导体结构的第一部分具有朝向导体部分逐渐变细的截锥形。

公开(公告)号：US07888605B2

公开(公告)日：2011-02-15

申请号：US12034572

申请日：2008-02-20

申请人： Hajime Sakamoto ,  Tadashi Sugiyama ,  Dongdong Wang ,  Takashi Kariya

发明人： Hajime Sakamoto ,  Tadashi Sugiyama ,  Dongdong Wang ,  Takashi Kariya

IPC分类号： H05K1/16

CPC分类号： H01L24/29 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/83 ,  H01L25/03 ,  H01L25/18 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2223/54486 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/18162 ,  H01L2924/30107 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09036 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09918 ,  H05K2201/10674 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/3512 ,  H01L2924/00

摘要： A multilayer printed circuit board has an IC chip included in a core substrate in advance, and an intermediate layer provided on a pad of the IC chip. Due to this, it is possible to electronically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the intermediate layer made of copper on the die pad, it is possible to prevent resin residues on the pad and to improve connection characteristics between the pad and a via hole, and to improve reliability.

摘要翻译： 多层印刷电路板预先具有包括在芯基板中的IC芯片，以及设置在IC芯片的焊盘上的中间层。 由此，可以在不使用引线部件和密封树脂的情况下将IC芯片电连接到多层印刷电路板。 此外，通过在芯片焊盘上设置由铜制成的中间层，可以防止焊盘上的树脂残留物并改善焊盘和通孔之间的连接特性，并提高可靠性。

公开(公告)号：US07881071B2

公开(公告)日：2011-02-01

申请号：US12331054

申请日：2008-12-09

申请人： Takashi Kariya ,  Toshiki Furutani

发明人： Takashi Kariya ,  Toshiki Furutani

IPC分类号： H05K1/11 ,  H05K1/14

CPC分类号： H05K1/0271 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/0373 ,  H05K1/115 ,  H05K3/28 ,  H05K3/4007 ,  H05K3/4602 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/068 ,  H05K2201/10674 ,  Y10T29/49126 ,  Y10T29/49151 ,  Y10T29/49162 ,  H01L2224/0401

摘要： A multilayer printed wiring board includes: a build-up layer that is formed on a core substrate and has a conductor pattern disposed on an upper surface; a low elastic modulus layer that is formed on the build-up layer; lands that are disposed on an upper surface of the low elastic modulus layer and connected via solder bumps to a IC chip; and conductor posts that pass through the low elastic modulus layer and electrically connect lands with conductor patterns. The conductor posts have the aspect ratio Rasp (height/minimum diameter) of not less than and the minimum diameter exceeding 30 μm, and the aspect ratio Rasp of external conductor posts, which are positioned at external portions of the low elastic modulus layer, is greater than or equal to the aspect ratio Rasp of internal conductor posts, which are positioned at internal portions of the low elastic modulus layer.

摘要翻译： 多层印刷布线板包括：形成在芯基板上并具有布置在上表面上的导体图案的堆积层; 形成在积层层上的低弹性模量层; 在低弹性模量层的上表面配置并通过焊锡凸块与IC芯片连接的焊盘; 以及穿过低弹性模量层并将焊盘电连接到导体图案的导体柱。 导体柱的纵横比Rasp（高度/最小直径）不小于并且最小直径超过30μm，并且位于低弹性模量层的外部的外部导体柱的纵横比Rasp为 大于或等于位于低弹性模量层的内部的内部导体柱的纵横比Rasp。