公开(公告)号：US08604354B2

公开(公告)日：2013-12-10

申请号：US12645191

申请日：2009-12-22

Applicant: Shoji Ito ,  Tomofumi Kitada ,  Tadanori Ominato

Inventor： Shoji Ito ,  Tomofumi Kitada ,  Tadanori Ominato

IPC: H05K1/02

CPC classification number: H05K3/4015 ,  B29C65/48 ,  B29C65/4815 ,  B29C65/483 ,  B29C65/5057 ,  B29C66/1122 ,  B29C66/43 ,  B29C66/472 ,  B29C66/474 ,  B29C66/8322 ,  B29K2027/18 ,  B29K2063/00 ,  B29K2077/10 ,  B29K2079/08 ,  B29K2101/12 ,  B29K2105/0079 ,  B29K2305/10 ,  B29K2305/14 ,  B29K2995/0005 ,  B29L2009/003 ,  B29L2031/3425 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H05K3/281 ,  H05K3/305 ,  H05K3/361 ,  H05K2201/0221 ,  H05K2201/10234 ,  H05K2201/10977 ,  H05K2203/041 ,  H05K2203/1189 ,  Y10T156/10

Abstract: A printed wiring board including: an insulated substrate; a conductive circuit provided on one side of this insulated substrate; a cover layer covering the insulated substrate and the conductive circuit; and a conductive particle buried in this cover layer, wherein the conductive particle is buried in the cover layer so that the conductive particle contacts the conductive circuit and protrudes from the cover layer; and the conductive particle serves as an electric contact point.

Abstract translation: 一种印刷线路板，包括：绝缘基板; 设置在该绝缘基板一侧的导电电路; 覆盖绝缘基板和导电电路的覆盖层; 以及埋置在该覆盖层中的导电性粒子，其中，导电粒子被掩埋在覆盖层中，使得导电粒子与导电电路接触并从覆盖层突出; 并且导电粒子用作电接触点。

公开(公告)号：US08557630B2

公开(公告)日：2013-10-15

申请号：US13201084

申请日：2010-05-14

Applicant: Shoji Sakemi

Inventor： Shoji Sakemi

IPC: H01L21/00

CPC classification number: H05K3/305 ,  H01L23/49811 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/0102 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00

Abstract: A challenge to be met by the present invention is to provide an electronic component mounting method and an electronic component mount structure that make it possible to assure bonding strength for an electronic component whose underside is provided with bumps.In electronic component mounting operation during which an electronic component (6) whose underside is provided with bumps (7) with solder is mounted on a substrate (1), a solder bonding material (3) including solder particles contained in a first thermosetting resin is used for bonding the bumps (7) to an electrode (2) formed on the substrate (1), thereby forming a solder bonding area (7*) where the solder particles and the bumps (7) are fused and solidified and a first resin reinforcement area (3a*) that reinforces the solder bonding area (7*). Further, an adhesive (4) containing as a principal component a second thermosetting resin not including solder particles is used for fixing an outer edge (6a) of the electronic component (6) to reinforcement points set on the substrate (1). Even when the solder bonding material (3) and the bonding agent (4) are blended together, normal thermal curing of the thermosetting resin is not hindered. Bonding strength can thereby be assured for the electronic component (6) whose underside is provided with the bumps (7).

Abstract translation: 本发明要解决的课题是提供一种电子部件安装方法和电子部件安装结构，其能够确保下侧设置有凸块的电子部件的接合强度。 在电子部件安装操作中，其中底部设有具有焊料的凸块（7）的电子部件（6）安装在基板（1）上，包括在第一热固性树脂中的焊料颗粒的焊料接合材料（3） 用于将凸起（7）接合到形成在基板（1）上的电极（2），从而形成焊料颗粒和凸块（7）熔融固化的焊接区域（7 *），第一树脂 加强区域（3a *），加强焊接区域（7 *）。 此外，使用以不含焊料颗粒的第二热固性树脂作为主要成分的粘合剂（4）将电子部件（6）的外边缘（6a）固定在设置在基板（1）上的加强点上。 即使将焊料接合材料（3）和粘合剂（4）混合在一起，也不会妨碍热固性树脂的正常热固化。 因此，对于其下侧设置有凸块（7）的电子部件（6），可以确保接合强度。

公开(公告)号：US20130264105A1

公开(公告)日：2013-10-10

申请号：US13712385

申请日：2012-12-12

Applicant: SAN-EI-KAGAKU CO., LTD.

Inventor： Kazunori KITAMURA

IPC: H05K1/02 ,  H05K3/00 ,  H05K1/18

CPC classification number: H05K1/0296 ,  H01L23/49894 ,  H01L24/81 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/83104 ,  H01L2224/83192 ,  H01L2924/12042 ,  H05K1/181 ,  H05K3/00 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3442 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0588 ,  Y02P70/613 ,  Y10T156/10 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

Abstract: The present invention provides a solder-mounted board which realizes reliable mounting of a component thereon; a method for producing the board; and a semiconductor device. The solder-mounted board includes a substrate; a wiring layer; a solder pad for mounting a component by the mediation of the solder; and an insulating layer which covers the wiring layer such that at least the solder pad is exposed, the wiring layer, the solder pad, and the insulating layer being provided on at least one surface of the substrate, wherein the insulating layer is formed of a first insulating layer provided on the substrate and the wiring layer, and a second insulating layer provided on at least a portion of the first insulating layer.

Abstract translation: 本发明提供了一种实现可靠地安装组件的焊接安装板， 一种生产该板的方法; 和半导体器件。 焊接安装板包括基板; 布线层; 用于通过焊料中介来安装部件的焊盘; 以及绝缘层，其覆盖所述布线层，使得至少所述焊盘露出，所述布线层，所述焊盘和所述绝缘层设置在所述基板的至少一个表面上，其中所述绝缘层由 设置在所述基板和所述布线层上的第一绝缘层，以及设置在所述第一绝缘层的至少一部分上的第二绝缘层。

公开(公告)号：US08551275B2

公开(公告)日：2013-10-08

申请号：US11277679

申请日：2006-03-28

Applicant: Shin Tsumura

Inventor： Shin Tsumura

IPC: B32B37/00 ,  B44C1/17

CPC classification number: B41J2/1609 ,  B41J2/14209 ,  B41J2/1623 ,  B41J2002/14217 ,  B41J2002/14225 ,  B41J2002/14306 ,  B41J2002/14362 ,  B41J2002/14491 ,  B41J2202/20 ,  H05K3/325 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/035 ,  H05K2201/0367 ,  H05K2201/10977 ,  H05K2203/0537

Abstract: Disclosed herein is an adhesive application method of applying adhesive to a protruding part formed on a substrate. The adhesive application method includes an adhesive preparing step of forming an adhesive layer on the surface of a plate member, an adhesive applying step of allowing the protruding part and the adhesive layer to be brought into contact with each other such that the surface of the substrate around the protruding part does not contact the adhesive layer, and a moving step of moving the substrate and the plate member relative to each other in the plane parallel with the surface of the plate member while the surface of the substrate around the protruding part is not in contact with the adhesive layer and the protruding part and the adhesive layer are in contact with each other.

Abstract translation: 本文公开了一种将粘合剂施加到形成在基板上的突出部分的粘合剂施加方法。 粘合剂施加方法包括在板构件的表面上形成粘合剂层的粘合剂制备步骤，允许突出部分和粘合剂层彼此接触的粘合剂施加步骤，使得基底的表面 在突出部周围不与粘合剂层接触的移动步骤以及在与板部件的表面平行的平面中使基板和板部件相对移动的移动步骤，而突出部周围的基板的表面不是 与粘合剂层和突出部分和粘合剂层相接触。

公开(公告)号：US08541291B2

公开(公告)日：2013-09-24

申请号：US13159773

申请日：2011-06-14

Applicant: Bruce K. Furman ,  Jae-Woong Nah

Inventor： Bruce K. Furman ,  Jae-Woong Nah

IPC: H01L21/00 ,  H01L21/44

CPC classification number: H05K3/3436 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/0508 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/11901 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2224/13611 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/328 ,  H05K2201/0367 ,  H05K2201/0379 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/0338 ,  Y02P70/613 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2224/13099

Abstract: An electrical structure and method for forming electrical interconnects. The method includes positioning a sacrificial carrier substrate such that a first surface of a non-solder metallic core structure within the sacrificial carrier substrate is in contact with a first electrically conductive pad. The first surface is thermo-compression bonded to the first electrically conductive pad. The sacrificial carrier substrate is removed from the non-solder metallic core structure. A solder structure is formed on a second electrically conductive pad. The first substrate comprising the non-solder metallic core structure is positioned such that a second surface of the non-solder metallic core structure is in contact with the solder structure. The solder structure is heated to a temperature sufficient to cause the solder structure to melt and form an electrical and mechanical connection between the second surface of the non-solder metallic core structure and the second electrically conductive pad.

Abstract translation: 一种用于形成电互连的电结构和方法。 该方法包括定位牺牲载体衬底，使得牺牲载体衬底内的非焊料金属芯结构的第一表面与第一导电焊盘接触。 第一表面被热压接合到第一导电焊盘。 从非焊接金属芯结构去除牺牲载体衬底。 在第二导电焊盘上形成焊料结构。 包括非焊料金属芯结构的第一衬底定位成使得非焊料金属芯结构的第二表面与焊料结构接触。 将焊料结构加热到足以使焊料结构熔化并在非焊接金属芯结构的第二表面和第二导电焊盘之间形成电和机械连接的温度。

公开(公告)号：US08501583B2

公开(公告)日：2013-08-06

申请号：US12497996

申请日：2009-07-06

Applicant: Takashi Kitae ,  Seiji Karashima ,  Susumu Sawada ,  Seiichi Nakatani

Inventor： Takashi Kitae ,  Seiji Karashima ,  Susumu Sawada ,  Seiichi Nakatani

IPC: H01L21/30 ,  H01L21/4763

CPC classification number: H05K3/3436 ,  H01L21/563 ,  H01L24/06 ,  H01L24/11 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/0401 ,  H01L2224/05555 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/06505 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/14505 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/29393 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/323 ,  H05K3/363 ,  H05K2201/0209 ,  H05K2201/10977 ,  H05K2203/083 ,  H05K2203/087 ,  H05K2203/1178 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/01051 ,  H01L2924/01049 ,  H01L2924/01083 ,  H01L2924/0695 ,  H01L2924/05432 ,  H01L2924/0001

Abstract: A resin containing a conductive particle and a gas bubble generating agent is supplied in a space between the substrates each having a plurality of electrodes. The resin is then heated to melt the conductive particle contained in the resin and generate gas bubbles from the gas bubble generating agent. A step portion is formed on at least one of the substrates. In the process of heating the resin, the resin is pushed aside by the growing gas bubbles, and as a result of that, the conductive particle contained in the resin is led to a space between the electrodes, and a connector is formed in the space. At the same time, the resin is led to a space between parts of the substrates at which the step portion is formed, and cured to fix the distance between the substrates.

Abstract translation: 在每个具有多个电极的基板之间的空间中提供含有导电颗粒和气泡发生剂的树脂。 然后将树脂加热以熔化包含在树脂中的导电颗粒，并从气泡发生剂产生气泡。 在至少一个基板上形成台阶部。 在加热树脂的过程中，通过生长的气泡将树脂推开，其结果是，包含在树脂中的导电颗粒被引导到电极之间的空间，并且在空间中形成连接器 。 同时，树脂被引导到形成台阶部分的基板的部分之间的空间，并固化以固定基板之间的距离。

公开(公告)号：US08499998B2

公开(公告)日：2013-08-06

申请号：US12576572

申请日：2009-10-09

Applicant: Yoshiyuki Wada ,  Tadahiko Sakai

Inventor： Yoshiyuki Wada ,  Tadahiko Sakai

IPC: B23K31/02 ,  H01L21/70

CPC classification number: H05K3/3442 ,  H05K1/0227 ,  H05K1/0231 ,  H05K1/186 ,  H05K3/305 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/09909 ,  H05K2201/10636 ,  H05K2201/10977 ,  Y02P70/611 ,  Y02P70/613

Abstract: A core layer has on its front surface a pair of connecting electrodes forming a wiring pattern and a resist formed between the pair of electrodes; an electronic component having a pair of connecting terminals; a solder part joining between electrodes and connecting terminals; and a sealing resin part filling a gap between the bottom surface of the electronic component and the front surface of the core layer and covering the resist and the solder part, to prevent a defect of a component built-in printed circuit substrate.

Abstract translation: 核心层在其前表面上形成一对形成布线图案的连接电极和形成在该对电极之间的抗蚀剂; 具有一对连接端子的电子部件; 连接电极和连接端子之间的焊料部分; 以及密封树脂部分，填充电子部件的底表面和芯层的前表面之间的间隙并覆盖抗蚀剂和焊料部分，以防止组件内置印刷电路基板的缺陷。

公开(公告)号：US08465214B2

公开(公告)日：2013-06-18

申请号：US13057432

申请日：2010-01-21

Applicant: Andreas Matiss ,  Alexander Jacob ,  Christoph Leonhardt

Inventor： Andreas Matiss ,  Alexander Jacob ,  Christoph Leonhardt

IPC: G02B6/36

CPC classification number: H05K1/0243 ,  G02B6/4201 ,  G02B6/4274 ,  H05K1/024 ,  H05K3/3421 ,  H05K2201/09909 ,  H05K2201/10121 ,  H05K2201/10977 ,  Y10T29/49144

Abstract: An arrangement including an electrical conductor track carrier and a component applied on the conductor track carrier. The component is a fiber-optoelectronic component and has: a housing, at least one electro-optical or optoelectronic component, at least one fiber-optic interface connected to the electro-optical or optoelectronic component, and at least one electrical interface for connecting the component on the conductor track carrier. The electrical interface has at least one bent electrical soldering connection element which is attached by one end to a base connection section of the housing base and extends from there laterally toward the outside so that the other end of the soldering connection element projects laterally and is soldered laterally outside the outer housing contour on the conductor track carrier. The soldering connection element is bent away from the base connection section so that the base connection section is at a distance from the conductor track carrier.

Abstract translation: 一种包括电导体轨道载体和施加在导体轨道载体上的​​分量的装置。 该组件是光纤 - 光电子部件，并具有：壳体，至少一个电光或光电子部件，连接到电光或光电子部件的至少一个光纤接口，以及至少一个电接口，用于连接 导体轨道载体上的​​分量。 电接口具有至少一个弯曲的电焊接连接元件，该弯曲的电焊接连接元件一端连接到壳体基座的基部连接部分，并从其横向向外延伸，使得焊接连接元件的另一端向外突出并被焊接 在导体轨道载体上的​​外壳轮廓外侧。 焊接连接元件从基座连接部分弯曲，使得基座连接部分距离导体轨道架一定距离。

公开(公告)号：US20130126091A1

公开(公告)日：2013-05-23

申请号：US13813507

申请日：2011-08-02

Applicant: Wolfgang Schrittwieser ,  Patrick Lenhardt ,  Patrick Grasser

Inventor： Wolfgang Schrittwieser ,  Patrick Lenhardt ,  Patrick Grasser

IPC: C09J163/00

CPC classification number: C09J163/00 ,  H01L21/563 ,  H01L2224/73203 ,  H01L2924/01004 ,  H01L2924/01025 ,  H05K3/305 ,  H05K13/0469 ,  H05K2201/10977 ,  H05K2203/1189 ,  Y02P70/613

Abstract: In the case of an adhesive for fixing an electronic component on a circuit board and/or for embedding an electronic component into a circuit board, the electronic component to be fixed and/or embedded being fixed by means of an adhesive bond on a ply or layer of a circuit board, and fixing optionally being followed by jacketing by plies, and/or by covering by at least one further ply, an epoxy resin-based adhesive is selected, which has at least one added additive to adjust the surface tension and/or viscosity, especially a defoamer and/or an additive for adjusting the levelling properties, which can achieve reliable fixing of a component, especially with avoidance of cavities or air inclusions below the surface of the component to be fixed. Also provided are a method and a use.

Abstract translation: 在用于将电子部件固定在电路板上和/或将电子部件嵌入到电路板中的粘合剂的情况下，通过粘合剂将待固定和/或嵌入的电子部件固定在层或 电路板的层，以及任选地通过层叠包覆的固定和/或通过至少一个另外的层覆盖，选择环氧树脂基粘合剂，其具有至少一种添加的添加剂以调节表面张力和 /或粘度，特别是消泡剂和/或用于调节流平性能的添加剂，其可以实现部件的可靠固定，特别是避免在要固定的部件的表面下面的空腔或空气夹杂物。 还提供了一种方法和用途。

公开(公告)号：US08446739B2

公开(公告)日：2013-05-21

申请号：US12641934

申请日：2009-12-18

Applicant: Masato Harikae

Inventor： Masato Harikae

IPC: H05K9/00 ,  H05K1/16

CPC classification number: H05K3/305 ,  H01L21/563 ,  H01L23/3114 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01057 ,  H04M1/0277 ,  H05K3/3436 ,  H05K2201/10371 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/1178 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/0401

Abstract: An electronic circuit device comprising an attaching material between an electronic component and a circuit board is disclosed. A bonding resin is situated on a side of an electronic component and flowed between the electronic component and a circuit board. The flow action may be facilitated by thermoplasticity and capillary action.

Abstract translation: 公开了一种电子电路装置，其包括在电子部件和电路板之间的附接材料。 接合树脂位于电子部件的一侧，并且在电子部件和电路板之间流动。 可以通过热塑性和毛细作用促进流动作用。