公开(公告)号：US08841776B2

公开(公告)日：2014-09-23

申请号：US12071628

申请日：2008-02-25

申请人： Takao Nishimura ,  Yoshiaki Narisawa

发明人： Takao Nishimura ,  Yoshiaki Narisawa

IPC分类号： H01L25/065

CPC分类号： H01L25/0657 ,  H01L21/6836 ,  H01L24/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/743 ,  H01L2221/68327 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/29012 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/3012 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48992 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/83191 ,  H01L2224/83194 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06579 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/0532 ,  H01L2924/05042 ,  H01L2924/05032 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： In a semiconductor chip, a first semiconductor chip 21 is provided on a chip-mounting component 11, and bonding wires 36 connected to electrode pads 21E of the first semiconductor chip 21 are fixed by being covered with a first insulating adhesive 31. A second semiconductor chip 22 is mounted by being stacked on the first semiconductor chip 21, with the first insulating adhesive 31 therebetween. This structure can prevent problems such as breaking and short-circuits of bonding wires of the chip disposed directly on a substrate when another chip is mounted by being stacked.

摘要翻译： 在半导体芯片中，第一半导体芯片21设置在芯片安装部件11上，并且连接到第一半导体芯片21的电极焊盘21E的接合线36被第一绝缘粘合剂31覆盖固定。第二半导体 芯片22通过层叠在第一半导体芯片21上而第一绝缘粘合剂31在其间而被安装。 这种结构可以防止当通过堆叠安装另一个芯片时直接设置在基板上的芯片的接合线断裂和短路等问题。

公开(公告)号：US20070132102A1

公开(公告)日：2007-06-14

申请号：US11377393

申请日：2006-03-17

申请人： Takao Nishimura ,  Yoshiaki Narisawa ,  Yoshikazu Kumagaya

发明人： Takao Nishimura ,  Yoshiaki Narisawa ,  Yoshikazu Kumagaya

IPC分类号： H01L23/52

CPC分类号： H01L23/5382 ,  H01L23/3128 ,  H01L23/49531 ,  H01L23/49575 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48475 ,  H01L2224/4911 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/49429 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/85051 ,  H01L2224/85399 ,  H01L2224/85951 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A relay board provided in a semiconductor device, including an entire main surface that is made of a conductive material. The relay board may further include a substrate made of the same material as at least one semiconductor element provided in the semiconductor device. The main surface of the relay board may be formed at an upper part of the substrate.

摘要翻译： 设置在半导体器件中的中继板，包括由导电材料制成的整个主表面。 继电器板还可以包括由与半导体器件中的至少一个半导体元件相同的材料制成的衬底。 继电器板的主表面可以形成在基板的上部。

公开(公告)号：US08230590B2

公开(公告)日：2012-07-31

申请号：US11968971

申请日：2008-01-03

申请人： Takao Nishimura ,  Yoshiaki Narisawa

发明人： Takao Nishimura ,  Yoshiaki Narisawa

IPC分类号： H05K3/30 ,  H05K13/04 ,  H01L24/02

CPC分类号： H05K3/305 ,  H01L21/561 ,  H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/743 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/2731 ,  H01L2224/27901 ,  H01L2224/29014 ,  H01L2224/29015 ,  H01L2224/29019 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/3003 ,  H01L2224/30051 ,  H01L2224/30131 ,  H01L2224/30141 ,  H01L2224/30177 ,  H01L2224/32055 ,  H01L2224/32056 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/3303 ,  H01L2224/33051 ,  H01L2224/3313 ,  H01L2224/3314 ,  H01L2224/33177 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/75743 ,  H01L2224/75841 ,  H01L2224/81444 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/1579 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0126 ,  H05K2203/0545 ,  Y02P70/613 ,  H01L2924/07025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/0695 ,  H01L2224/0401

摘要： A method for mounting electronic components includes a step of providing an adhesive on each of plural electronic component mounting parts on a wiring board; and a step of fixing one of the electronic components on each of the plural electronic component mounting parts via the adhesive. When the adhesive is provided on each of the plural electronic component mounting parts, the center of gravity of a volume of the adhesive provided on the mounting part where an Nth electronic component is to be mounted is shifted in a direction closer to the mounting part where an (N minus 1 or greater)th electronic component is provided neighboring and adjacent to the mounting part where the Nth electronic component is to be mounted.

摘要翻译： 电子部件的安装方法包括在布线基板上的多个电子部件安装部的各个上设置粘合剂的工序; 以及通过粘合剂将电子部件中的一个固定在多个电子部件安装部的每一个上的步骤。 当粘合剂设置在多个电子部件安装部件中的每一个上时，设置在安装第N个电子部件的安装部分上的粘合剂的体积重心沿更靠近安装部分的方向移动， 设置与第N电子部件要安装的安装部相邻且相邻的（N负1以上）电子部件。

公开(公告)号：US20080196245A1

公开(公告)日：2008-08-21

申请号：US11968971

申请日：2008-01-03

申请人： Takao Nishimura ,  Yoshiaki Narisawa

发明人： Takao Nishimura ,  Yoshiaki Narisawa

IPC分类号： H05K3/30

CPC分类号： H05K3/305 ,  H01L21/561 ,  H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/743 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/2731 ,  H01L2224/27901 ,  H01L2224/29014 ,  H01L2224/29015 ,  H01L2224/29019 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/3003 ,  H01L2224/30051 ,  H01L2224/30131 ,  H01L2224/30141 ,  H01L2224/30177 ,  H01L2224/32055 ,  H01L2224/32056 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/3303 ,  H01L2224/33051 ,  H01L2224/3313 ,  H01L2224/3314 ,  H01L2224/33177 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/75743 ,  H01L2224/75841 ,  H01L2224/81444 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/1579 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0126 ,  H05K2203/0545 ,  Y02P70/613 ,  H01L2924/07025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/0695 ,  H01L2224/0401

摘要： A method for mounting electronic components includes a step of providing an adhesive on each of plural electronic component mounting parts on a wiring board; and a step of fixing one of the electronic components on each of the plural electronic component mounting parts via the adhesive. When the adhesive is provided on each of the plural electronic component mounting parts, the center of gravity of a volume of the adhesive provided on the mounting part where an Nth electronic component is to be mounted is shifted in a direction closer to the mounting part where an (N minus 1 or greater)th electronic component is provided neighboring and adjacent to the mounting part where the Nth electronic component is to be mounted.

摘要翻译： 电子部件的安装方法包括在布线基板上的多个电子部件安装部的各个上设置粘合剂的工序; 以及通过粘合剂将电子部件中的一个固定在多个电子部件安装部的每一个上的步骤。 当粘合剂设置在多个电子部件安装部件中的每一个上时，设置在安装第N个电子部件的安装部分上的粘合剂的体积重心沿更靠近安装部分的方向移动， 设置与第N电子部件要安装的安装部相邻且相邻的（N负1以上）电子部件。

公开(公告)号：US07973404B2

公开(公告)日：2011-07-05

申请号：US11377393

申请日：2006-03-17

申请人： Takao Nishimura ,  Yoshiaki Narisawa ,  Yoshikazu Kumagaya

发明人： Takao Nishimura ,  Yoshiaki Narisawa ,  Yoshikazu Kumagaya

IPC分类号： H01L23/34

CPC分类号： H01L23/5382 ,  H01L23/3128 ,  H01L23/49531 ,  H01L23/49575 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48475 ,  H01L2224/4911 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/49429 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/85051 ,  H01L2224/85399 ,  H01L2224/85951 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A relay board provided in a semiconductor device, including an entire main surface that is made of a conductive material. The relay board may further include a substrate made of the same material as at least one semiconductor element provided in the semiconductor device. The main surface of the relay board may be formed at an upper part of the substrate.

摘要翻译： 设置在半导体器件中的中继板，包括由导电材料制成的整个主表面。 继电器板还可以包括由与半导体器件中的至少一个半导体元件相同的材料制成的衬底。 继电器板的主表面可以形成在基板的上部。

公开(公告)号：US07906852B2

公开(公告)日：2011-03-15

申请号：US11868036

申请日：2007-10-05

申请人： Takao Nishimura ,  Yoshiaki Narisawa

发明人： Takao Nishimura ,  Yoshiaki Narisawa

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L23/3128 ,  H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/743 ,  H01L24/83 ,  H01L24/91 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/1308 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/26145 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/83051 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83856 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/0695 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/013

摘要： A semiconductor device, includes a wiring board; a first semiconductor element mounted on the wiring board; a second semiconductor element mounted on the first semiconductor element so that a position of the second semiconductor element is shifted relative to a position of the first semiconductor element; wherein a part of a main surface of the second semiconductor element faces the first semiconductor element; and an electrode pad provided on the main surface of the second semiconductor element is connected to a second semiconductor element connection pad of the wiring board by a connection part.

摘要翻译： 一种半导体器件，包括布线板; 安装在所述布线板上的第一半导体元件; 安装在所述第一半导体元件上的第二半导体元件，使得所述第二半导体元件的位置相对于所述第一半导体元件的位置移位; 其中所述第二半导体元件的主表面的一部分面向所述第一半导体元件; 并且设置在第二半导体元件的主表面上的电极焊盘通过连接部分连接到布线板的第二半导体元件连接焊盘。

公开(公告)号：US20090321927A1

公开(公告)日：2009-12-31

申请号：US12557986

申请日：2009-09-11

申请人： Takao Nishimura ,  Yoshiaki Narisawa

发明人： Takao Nishimura ,  Yoshiaki Narisawa

IPC分类号： H01L23/49 ,  H01L21/60

CPC分类号： H01L23/3128 ,  H01L23/4952 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/85 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/48482 ,  H01L2224/48487 ,  H01L2224/48499 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/4899 ,  H01L2224/48992 ,  H01L2224/4911 ,  H01L2224/49112 ,  H01L2224/4917 ,  H01L2224/49426 ,  H01L2224/49429 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85191 ,  H01L2224/85205 ,  H01L2224/85206 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/30105 ,  H01L2224/85181 ,  H01L2924/0665 ,  H01L2924/07025 ,  H01L2924/0635 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48455 ,  H01L2224/4554

摘要： To provide a small, high-performance semiconductor device in which contact between adjacent wires is prevented for increased flexibility in designing a wiring layout, and an efficient method for manufacturing the semiconductor device. The semiconductor device includes a substrate 10 having an electrode 21A arranged on its surface; and a first semiconductor element 11A which includes an electrode 22 arranged on its surface and which is supported by the substrate 10, wherein a first wire 41 is connected through a first bump 31 to at least one of the electrodes over the substrate 10 and semiconductor element 11A (i.e., at least one of the electrodes 21 and 22), and a second wire 42 is connected through a second bump 32 to a bonding portion of the wire 41.

摘要翻译： 为了提供防止相邻导线之间的接触以提高布线布局设计的灵活性的小型高性能半导体器件，以及制造半导体器件的有效方法。 半导体器件包括：衬底10，其具有布置在其表面上的电极21A; 以及第一半导体元件11A，其包括布置在其表面上并由衬底10支撑的电极22，其中第一线41通过第一凸块31连接到衬底10上的至少一个电极和半导体元件 11A（即，电极21和22中的至少一个），并且第二线42通过第二凸块32连接到线41的接合部分。

公开(公告)号：US08134240B2

公开(公告)日：2012-03-13

申请号：US12557986

申请日：2009-09-11

申请人： Takao Nishimura ,  Yoshiaki Narisawa

发明人： Takao Nishimura ,  Yoshiaki Narisawa

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L23/3128 ,  H01L23/4952 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/85 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/48482 ,  H01L2224/48487 ,  H01L2224/48499 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/4899 ,  H01L2224/48992 ,  H01L2224/4911 ,  H01L2224/49112 ,  H01L2224/4917 ,  H01L2224/49426 ,  H01L2224/49429 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85191 ,  H01L2224/85205 ,  H01L2224/85206 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/30105 ,  H01L2224/85181 ,  H01L2924/0665 ,  H01L2924/07025 ,  H01L2924/0635 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48455 ,  H01L2224/4554

摘要： To provide a small, high-performance semiconductor device in which contact between adjacent wires is prevented for increased flexibility in designing a wiring layout, and an efficient method for manufacturing the semiconductor device. The semiconductor device includes a substrate 10 having an electrode 21A arranged on its surface; and a first semiconductor element 11A which includes an electrode 22 arranged on its surface and which is supported by the substrate 10, wherein a first wire 41 is connected through a first bump 31 to at least one of the electrodes over the substrate 10 and semiconductor element 11A (i.e., at least one of the electrodes 21 and 22), and a second wire 42 is connected through a second bump 32 to a bonding portion of the wire 41.

摘要翻译： 为了提供防止相邻导线之间的接触以提高布线布局设计的灵活性的小型高性能半导体器件，以及制造半导体器件的有效方法。 半导体器件包括：衬底10，其具有布置在其表面上的电极21A; 以及第一半导体元件11A，其包括布置在其表面上并由衬底10支撑的电极22，其中第一线41通过第一凸块31连接到衬底10上的至少一个电极和半导体元件 11A（即，电极21和22中的至少一个），并且第二线42通过第二凸块32连接到线41的接合部分。

公开(公告)号：US20080150120A1

公开(公告)日：2008-06-26

申请号：US12071628

申请日：2008-02-25

申请人： Takao Nishimura ,  Yoshiaki Narisawa

发明人： Takao Nishimura ,  Yoshiaki Narisawa

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L25/0657 ,  H01L21/6836 ,  H01L24/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/743 ,  H01L2221/68327 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/29012 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/3012 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48992 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/83191 ,  H01L2224/83194 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06579 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/0532 ,  H01L2924/05042 ,  H01L2924/05032 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： In a semiconductor chip, a first semiconductor chip 21 is provided on a chip-mounting component 11, and bonding wires 36 connected to electrode pads 21E of the first semiconductor chip 21 are fixed by being covered with a first insulating adhesive 31. A second semiconductor chip 22 is mounted by being stacked on the first semiconductor chip 21, with the first insulating adhesive 31 therebetween. This structure can prevent problems such as breaking and short-circuits of bonding wires of the chip disposed directly on a substrate when another chip is mounted by being stacked.

摘要翻译： 在半导体芯片中，第一半导体芯片21设置在芯片安装部件11上，并且与第一半导体芯片21的电极焊盘21E连接的接合线36被第一绝缘胶31覆盖。 第二半导体芯片22通过堆叠在第一半导体芯片21上而第一绝缘粘合剂31在其间安装。 这种结构可以防止当通过堆叠安装另一个芯片时直接设置在基板上的芯片的接合线的断裂和短路等问题。

公开(公告)号：US20080023831A1

公开(公告)日：2008-01-31

申请号：US11643836

申请日：2006-12-22

申请人： Takao Nishimura ,  Yoshiaki Narisawa

发明人： Takao Nishimura ,  Yoshiaki Narisawa

IPC分类号： H01L23/48

CPC分类号： H01L23/3128 ,  H01L23/4952 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/85 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/48482 ,  H01L2224/48487 ,  H01L2224/48499 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/4899 ,  H01L2224/48992 ,  H01L2224/4911 ,  H01L2224/49112 ,  H01L2224/4917 ,  H01L2224/49426 ,  H01L2224/49429 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85191 ,  H01L2224/85205 ,  H01L2224/85206 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/30105 ,  H01L2224/85181 ,  H01L2924/0665 ,  H01L2924/07025 ,  H01L2924/0635 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48455 ,  H01L2224/4554

摘要： To provide a small, high-performance semiconductor device in which contact between adjacent wires is prevented for increased flexibility in designing a wiring layout, and an efficient method for manufacturing the semiconductor device. The semiconductor device includes a substrate 10 having an electrode 21A arranged on its surface; and a first semiconductor element 11A which includes an electrode 22 arranged on its surface and which is supported by the substrate 10, wherein a first wire 41 is connected through a first bump 31 to at least one of the electrodes over the substrate 10 and semiconductor element 11A (i.e., at least one of the electrodes 21 and 22), and a second wire 42 is connected through a second bump 32 to a bonding portion of the wire 41.

摘要翻译： 为了提供防止相邻导线之间的接触以提高布线布局设计的灵活性的小型高性能半导体器件，以及制造半导体器件的有效方法。 半导体器件包括其表面上布置有电极21A的衬底10; 以及第一半导体元件11A，其包括布置在其表面上并由衬底10支撑的电极22，其中第一线41通过第一凸块31连接到衬底10上的至少一个电极和半导体 元件11A（即，电极21和22中的至少一个），第二导线42通过第二凸块32连接到导线41的接合部分。