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91.发明授权公开(公告)号：US08820612B2
公开(公告)日：2014-09-02
申请号：US13525855
申请日：2012-06-18
CPC分类号： B23K1/0016 , B23K1/20 , B23K3/0623 , B23K2101/42 , H01L21/6835 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2221/68372 , H01L2224/03464 , H01L2224/0401 , H01L2224/05571 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/11002 , H01L2224/11312 , H01L2224/11462 , H01L2224/1147 , H01L2224/11849 , H01L2224/11902 , H01L2224/13023 , H01L2224/13082 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/1403 , H01L2224/14505 , H01L2224/16237 , H01L2224/94 , H01L2924/00011 , H01L2924/00014 , H01L2924/01322 , H01L2224/03 , H01L2224/11 , H01L2924/00012 , H01L2924/01029 , H01L2924/01047 , H01L2924/01083 , H01L2924/01049 , H01L2924/01079 , H01L2924/00 , H01L2224/05552 , H01L2224/81805
摘要： Solder bumps of uniform height are provided on a substrate through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a patterned layer of photoresist. Solder is injected over the pillars or BLM, filling the channels. The solder, which does not contain flux, is allowed to solidify. It forms a plurality of solder structures (bumps) of equal heights. Solder injection and solidification are preferably carried out in a nitrogen environment or a forming gas environment. Molten solder can be injected in channels formed in round wafers without spillage using a carrier assembly that accommodates such wafers and a fill head.
摘要翻译： 通过使用注射成型的焊料在基板上设置均匀高度的焊料凸块。 在图案化的光致抗蚀剂层的通道内的I / O焊盘上形成铜柱或极限极限冶金。 焊料注入柱子或BLM，填充通道。 允许不含焊剂的焊料固化。 它形成相同高度的多个焊料结构（凸块）。 焊接注入和固化优选在氮气环境或形成气体环境中进行。 可以使用容纳这种晶片和填充头的载体组件将熔融焊料注入到以圆形晶片形成的通道中而不会溢出。
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公开(公告)号：US08685858B2
公开(公告)日：2014-04-01
申请号：US13220816
申请日：2011-08-30
IPC分类号： H01L21/311
CPC分类号： H01L31/035227 , C03C15/00 , C03C17/06 , C03C2218/34 , H01L31/022433 , H01L31/02363 , H01L31/035281 , H01L31/0376 , H01L31/0392 , H01L31/03921 , H01L31/03923 , H01L31/03925 , H01L31/056 , H01L31/075 , Y02E10/52 , Y02E10/541 , Y02E10/548 , Y10S438/945 , Y10S977/773 , Y10S977/779 , Y10T428/12014 , Y10T428/12069 , Y10T428/12076 , Y10T428/24479 , Y10T428/24488 , Y10T428/2982
摘要： Hemispheres and spheres are formed and employed for a plurality of applications. Hemispheres are employed to form a substrate having an upper surface and a lower surface. The upper surface includes peaks of pillars which have a base attached to the lower surface. The peaks have a density defined at the upper surface by an array of hemispherical metal structures that act as a mask during an etch to remove substrate material down to the lower surface during formation of the pillars. The pillars are dense and uniform and include a microscale average diameter. The spheres are formed as independent metal spheres or nanoparticles for other applications.
摘要翻译： 半球和球形成并用于多种应用。 半球用于形成具有上表面和下表面的基底。 上表面包括具有附接到下表面的基部的柱的峰。 峰在上表面具有通过半球形金属结构的阵列定义的密度，其在蚀刻期间用作掩模，以在形成支柱期间将基底材料移除到下表面。 支柱是致密和均匀的，并且包括微米级的平均直径。 球形成为独立的金属球体或纳米颗粒用于其他应用。
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公开(公告)号：US20130327811A1
公开(公告)日：2013-12-12
申请号：US13548186
申请日：2012-07-12
申请人： Bing Dang , Jae-Woong Nah
发明人： Bing Dang , Jae-Woong Nah
IPC分类号： B23K3/06
CPC分类号： H01L24/97 , H01L21/4853 , H01L23/49816 , H01L24/75 , H01L24/81 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/75315 , H01L2224/7598 , H01L2224/81005 , H01L2224/81191 , H01L2224/81192 , H01L2224/81815 , H01L2224/83104 , H01L2224/94 , H01L2224/97 , H01L2924/00014 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2224/81 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要： Solder is simultaneously transferred from a mold to a plurality of 3D assembled modules to provide solder bumps on the modules. The mold includes cavities containing injected molten solder or preformed solder balls. A fixture including resilient pressure pads and vacuum lines extending through the pads applies pressure to the modules when they are positioned on the mold. Following reflow and solder transfer to the modules, the fixture is displaced with respect to the mold. The modules, being attached to the fixture by vacuum pressure through the pads, are displaced from the mold with the fixture.
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公开(公告)号：US20130292455A1
公开(公告)日：2013-11-07
申请号：US13463412
申请日：2012-05-03
CPC分类号： B23K31/02 , B23K1/0016 , B23K3/047 , B23K35/0222 , B23K37/04 , B23K2101/40 , H01L24/81 , H01L2924/10253 , H01L2924/1305 , H01L2924/15787 , H01L2924/00
摘要： A flip chip assembly apparatus includes at least one warpage-suppressor assembly. Each warpage-suppressor assembly can include a side heater, a deformable material pad, and an actuator assembly for moving the side heater and the deformable material pad. Each side heater provides additional heat to peripheral solder balls during bonding of two substrates, thereby facilitating the reflow of the peripheral solder balls. Each deformable material pad contacts, and presses down on, a surface of one of the two substrates under bonding. The deformable material pad(s) can prevent or minimize warpage of the contacted substrate.
摘要翻译： 倒装芯片组装装置包括至少一个翘曲抑制组件。 每个翘曲抑制组件可以包括侧加热器，可变形材料垫和用于移动侧加热器和可变形材料垫的致动器组件。 每个侧面加热器在两个基板的接合期间向外围焊球提供额外的热量，从而便于外围焊球的回流。 每个可变形材料焊盘在粘合下接触并压下两个基板之一的表面。 可变形材料垫可以防止或最小化接触的基底的翘曲。
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公开(公告)号：US08476773B2
公开(公告)日：2013-07-02
申请号：US12787485
申请日：2010-05-26
IPC分类号： H01L23/52
CPC分类号： H01L24/16 , H01L21/563 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/27 , H01L24/28 , H01L24/31 , H01L24/73 , H01L24/81 , H01L24/94 , H01L2221/68377 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/11003 , H01L2224/1131 , H01L2224/11334 , H01L2224/114 , H01L2224/116 , H01L2224/11822 , H01L2224/1308 , H01L2224/13082 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1357 , H01L2224/136 , H01L2224/16 , H01L2224/16225 , H01L2224/17051 , H01L2224/274 , H01L2224/29111 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/8121 , H01L2224/81815 , H01L2924/0001 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H05K3/3436 , H05K2201/0379 , H05K2201/094 , H05K2201/10234 , H05K2201/10242 , H05K2201/10977 , Y02P70/613 , Y10T29/49165 , H01L2224/45111 , H01L2924/01047 , H01L2224/13099 , H01L2924/01083 , H01L2924/00 , H01L2224/29099 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An electrical structure including a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.
摘要翻译： 一种电结构，包括包括第一导电焊盘的第一基板，包括第二导电焊盘的第二基板和将第一导电焊盘电连接和机械连接到第二导电焊盘的互连结构。 互连结构包括非焊料金属芯结构，第一焊料结构和第二焊料结构。 第一焊料结构将非焊料金属芯结构的第一部分电连接并机械地连接到第一导电焊盘。 第二焊料结构将非焊料金属芯结构的第二部分电连接并机械连接到第二导电焊盘。
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公开(公告)号：US20130001279A1
公开(公告)日：2013-01-03
申请号：US13613000
申请日：2012-09-13
IPC分类号： B23K31/02
CPC分类号： B23K1/0016 , B23K35/3601 , B23K35/362
摘要： The present invention is directed to a soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects.
摘要翻译： 本发明还涉及一种用于接合物体的焊接方法，其包括以下步骤：将焊剂组合物施加到一个或多个物体的至少一部分上并连接物体。
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公开(公告)号：US08342387B2
公开(公告)日：2013-01-01
申请号：US13438505
申请日：2012-04-03
申请人： Peter A. Gruber , Jae-Woong Nah
发明人： Peter A. Gruber , Jae-Woong Nah
IPC分类号： B23K31/02
CPC分类号： H01L24/11 , H01L24/13 , H01L2224/11003 , H01L2224/1111 , H01L2224/13111 , H01L2224/13116 , H01L2924/01322 , H01L2924/14 , H01L2924/3841 , H05K3/3478 , H05K2203/041 , H01L2924/01082 , H01L2924/01029 , H01L2924/01047 , H01L2924/01083 , H01L2924/0105 , H01L2924/00
摘要： The present disclosure relates to methods of making solder balls having a uniform size. More particularly, the disclosure relates to improved solder ball formation processes that prevent or reduce bridging/merging of two or more solder balls during reflow. The processes of the instant disclosure are desirable because they do not require a sifting step to obtain uniformly-sized solder balls.
摘要翻译： 本公开涉及制造具有均匀尺寸的焊球的方法。 更具体地说，本公开涉及改进的焊球形成过程，其防止或减少回流期间两个或更多个焊球的桥接/合并。 本公开的方法是期望的，因为它们不需要筛选步骤来获得均匀尺寸的焊球。
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公开(公告)号：US08242010B2
公开(公告)日：2012-08-14
申请号：US12787503
申请日：2010-05-26
IPC分类号： H01L21/44
CPC分类号： H01L24/16 , H01L21/563 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/27 , H01L24/28 , H01L24/31 , H01L24/73 , H01L24/81 , H01L24/94 , H01L2221/68377 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/11003 , H01L2224/1131 , H01L2224/11334 , H01L2224/114 , H01L2224/116 , H01L2224/11822 , H01L2224/1308 , H01L2224/13082 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1357 , H01L2224/136 , H01L2224/16 , H01L2224/16225 , H01L2224/17051 , H01L2224/274 , H01L2224/29111 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/8121 , H01L2224/81815 , H01L2924/0001 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H05K3/3436 , H05K2201/0379 , H05K2201/094 , H05K2201/10234 , H05K2201/10242 , H05K2201/10977 , Y02P70/613 , Y10T29/49165 , H01L2224/45111 , H01L2924/01047 , H01L2224/13099 , H01L2924/01083 , H01L2924/00 , H01L2224/29099 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An electrical interconnect forming method. The electrical interconnect includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.
摘要翻译： 电互连形成方法。 电互连包括包括第一导电焊盘的第一衬底，包括第二导电焊盘的第二衬底以及将第一导电焊盘电连接和机械地连接到第二导电焊盘的互连结构。 互连结构包括非焊料金属芯结构，第一焊料结构和第二焊料结构。 第一焊料结构将非焊料金属芯结构的第一部分电连接并机械地连接到第一导电焊盘。 第二焊料结构将非焊料金属芯结构的第二部分电连接并机械连接到第二导电焊盘。
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公开(公告)号：US08162203B1
公开(公告)日：2012-04-24
申请号：US13030594
申请日：2011-02-18
申请人： Peter A. Gruber , Jae-Woong Nah
发明人： Peter A. Gruber , Jae-Woong Nah
IPC分类号： B23K31/02
CPC分类号： H01L24/11 , H01L24/13 , H01L2224/11003 , H01L2224/1111 , H01L2224/13111 , H01L2224/13116 , H01L2924/01322 , H01L2924/14 , H01L2924/3841 , H05K3/3478 , H05K2203/041 , H01L2924/01082 , H01L2924/01029 , H01L2924/01047 , H01L2924/01083 , H01L2924/0105 , H01L2924/00
摘要： The present disclosure relates to methods of making solder balls having a uniform size. More particularly, the disclosure relates to improved solder ball formation processes that prevent or reduce bridging/merging of two or more solder balls during reflow. The processes of the instant disclosure are desirable because they do not require a sifting step to obtain uniformly-sized solder balls.
摘要翻译： 本公开涉及制造具有均匀尺寸的焊球的方法。 更具体地说，本公开涉及改进的焊球形成过程，其防止或减少回流期间两个或更多个焊球的桥接/合并。 本公开的方法是期望的，因为它们不需要筛选步骤来获得均匀尺寸的焊球。
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公开(公告)号：US20120045869A1
公开(公告)日：2012-02-23
申请号：US12861017
申请日：2010-08-23
申请人： Michael A. Gaynes , Jae-Woong Nah
发明人： Michael A. Gaynes , Jae-Woong Nah
CPC分类号： B23K1/0016 , B23K3/047 , H01L21/563 , H01L24/13 , H01L24/16 , H01L24/73 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0657 , H01L25/50 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/48227 , H01L2224/73104 , H01L2224/73204 , H01L2224/75252 , H01L2224/75303 , H01L2224/75315 , H01L2224/75745 , H01L2224/81815 , H01L2224/81903 , H01L2224/83191 , H01L2224/83192 , H01L2224/9211 , H01L2225/06513 , H01L2225/06568 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , H01L2924/1203 , H01L2924/1305 , H01L2924/1306 , H01L2924/15787 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2924/3512
摘要： A low thermal conductivity material layer covers a peripheral portion of the bottom surface of the conductive plate of a chip bonder head. The center portion of the conductive plate is exposed or covered with another conductive plate laterally surrounded by the low thermal conductivity material layer. During bonding, the chip bonder head holds a first substrate upside down and heats the first substrate through the conductive plate. Heating of a fillet, i.e., the laterally extruding portion, of a pre-applied underfill material is reduced because the temperature at the exposed surfaces of the low thermal conductivity material layer is lower than the temperature at the bottom surface of the conductive plate. The longer curing time and the more uniform shape of the fillet in the bonded structure enhance the structural reliability of the bonded substrates.
摘要翻译： 低导热性材料层覆盖芯片接合头的导电板的底面的周边部分。 导电板的中心部分被另一导电板暴露或覆盖，导电板横向被低导热材料层包围。 在接合期间，芯片接合头将第一衬底倒置并且通过导电板加热第一衬底。 由于低导热材料层的暴露表面的温度低于导电板的底表面处的温度，加热了预先施加的底部填充材料的圆角，即侧向挤压部分。 接合结构中固化时间越长，圆角形状越均匀，提高了粘合基材的结构可靠性。
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