公开(公告)号：US20080237718A1

公开(公告)日：2008-10-02

申请号：US11694626

申请日：2007-03-30

Applicant: Vladimir Noveski ,  Sujit Sharan ,  Aleksandar Aleksov

Inventor： Vladimir Noveski ,  Sujit Sharan ,  Aleksandar Aleksov

IPC: H01L27/12 ,  H01L21/8238

CPC classification number: H01L27/0688 ,  H01L21/8221 ,  H01L21/84

Abstract: Methods and associated structures of forming a microelectronic device are described. Those methods may include forming a first HOD layer on a first side of a first silicon substrate, forming a CMOS region on a second side of the silicon substrate, forming amorphous silicon on the CMOS region, recrystallizing the amorphous silicon to form a first single crystal silicon layer, and forming a second HOD layer on the first single crystal silicon layer.

Abstract translation: 描述形成微电子器件的方法和相关结构。 这些方法可以包括在第一硅衬底的第一侧上形成第一HOD层，在硅衬底的第二侧上形成CMOS区域，在CMOS区域上形成非晶硅，使非晶硅重结晶以形成第一单晶 硅层，并在第一单晶硅层上形成第二HOD层。

公开(公告)号：US20230208009A1

公开(公告)日：2023-06-29

申请号：US17561542

申请日：2021-12-23

Applicant: Neelam PRABHU GAUNKAR ,  Georgios C. DOGIAMIS ,  Telesphor KAMGAING ,  Aleksandar ALEKSOV ,  Brandon RAWLINGS ,  Veronica STRONG

Inventor： Neelam PRABHU GAUNKAR ,  Georgios C. DOGIAMIS ,  Telesphor KAMGAING ,  Aleksandar ALEKSOV ,  Brandon RAWLINGS ,  Veronica STRONG

IPC: H01Q1/22 ,  H01Q9/04 ,  H01L23/498

CPC classification number: H01Q1/2283 ,  H01Q9/0407 ,  H01L23/49827 ,  H05K1/181

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a core, where the core comprises glass. In an embodiment, a buildup layer is over the core. In an embodiment, a patch antenna with a first patch is under the core, and a second patch is over a surface of the core opposite from the first patch. In an embodiment, the electronic package further comprises a via through the core and coupled to the patch antenna.

公开(公告)号：US20190207290A1

公开(公告)日：2019-07-04

申请号：US16325351

申请日：2016-09-30

Applicant: Brandon M. Rawlings ,  Shawna M. Liff ,  Sasha N. Oster ,  Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Aleksandar Aleksov, I ,  Johanna M. Swan ,  Richard J. Dischier

Inventor： Brandon M. Rawlings ,  Shawna M. Liff ,  Sasha N. Oster ,  Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Aleksandar Aleksov, I ,  Johanna M. Swan ,  Richard J. Dischier

IPC: H01P11/00 ,  H01P3/12 ,  H01P3/14 ,  H01P3/123

CPC classification number: H01P11/002 ,  H01P3/122 ,  H01P3/123 ,  H01P3/14

Abstract: A method of making a waveguide, comprises: extruding a first dielectric material as a waveguide core of the waveguide, wherein the waveguide core is elongate; and coextruding an outer layer with the waveguide core, wherein the outer layer is arranged around the waveguide core.

公开(公告)号：US20170094774A1

公开(公告)日：2017-03-30

申请号：US14866614

申请日：2015-09-25

Applicant: Adel Elsherbini ,  Aleksandar Aleksov ,  Shawna Liff

Inventor： Adel Elsherbini ,  Aleksandar Aleksov ,  Shawna Liff

IPC: H05K1/02 ,  H05K3/22 ,  H05K3/30 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/028 ,  H05K1/0283 ,  H05K1/0393 ,  H05K1/115 ,  H05K1/118 ,  H05K1/181 ,  H05K3/22 ,  H05K3/284 ,  H05K3/301 ,  H05K3/4691 ,  H05K2201/05 ,  H05K2201/057 ,  H05K2201/09263 ,  H05K2201/095 ,  H05K2203/1316

Abstract: Some forms relate to a stretchable computing device that includes a stretchable body; a first electronic component embedded within the stretchable body; a second electronic component embedded within the stretchable body; and wherein the first electronic component and the second electronic component are connected by stretchable electrical connectors that include vias. The stretchable electrical connectors are non-planar and/or may have a partial zig-zag shape and/or a partial coil shape. In some forms, the stretchable computing device further includes a textile attached to the stretchable body.

公开(公告)号：US09520378B2

公开(公告)日：2016-12-13

申请号：US13725356

申请日：2012-12-21

Applicant: Aleksandar Aleksov ,  Shawna M. Liff

Inventor： Aleksandar Aleksov ,  Shawna M. Liff

IPC: H01L23/00 ,  G06F1/18 ,  G06F1/20

CPC classification number: H01L24/80 ,  C08G8/30 ,  C08G2261/3424 ,  C09J5/00 ,  C09J161/14 ,  C09J163/00 ,  C09J165/00 ,  C09J2203/326 ,  C09J2400/163 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/02 ,  H01L23/3672 ,  H01L23/3737 ,  H01L23/433 ,  H01L24/01 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/0384 ,  H01L2224/04026 ,  H01L2224/05638 ,  H01L2224/05688 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2731 ,  H01L2224/2732 ,  H01L2224/27416 ,  H01L2224/27418 ,  H01L2224/27422 ,  H01L2224/27848 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/32245 ,  H01L2224/32501 ,  H01L2224/32505 ,  H01L2224/73253 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83201 ,  H01L2224/83203 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/83484 ,  H01L2224/83487 ,  H01L2224/83862 ,  H01L2224/83986 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/171 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/05442 ,  H01L2924/05342 ,  H01L2924/095 ,  H01L2924/0665 ,  H01L2924/0715 ,  H01L2924/00012 ,  H01L2924/066 ,  H01L2924/06 ,  H01L2924/07001 ,  H01L2924/014 ,  H01L2924/04953

Abstract: A thermal matched composite material, suitable for use as a die is described. In one example, the material includes a metal plate and a substrate having a coefficient of thermal expansion (CTE) lower than the metal plate to carry microelectronic circuits. An adhesive layer between the substrate and the metal plate physically attaches the metal plate to the substrate so that the combined metal plate and substrate have a higher CTE than the substrate alone.

Abstract translation: 描述适合用作模具的热匹配复合材料。 在一个示例中，材料包括金属板和具有低于金属板的热膨胀系数（CTE）的基板，以承载微电子电路。 基板和金属板之间的粘合剂层将金属板物理地附接到基板，使得组合的金属板和基板具有比单独的基板更高的CTE。

公开(公告)号：US20140166080A1

公开(公告)日：2014-06-19

申请号：US13717186

申请日：2012-12-17

Applicant: Aleksandar Aleksov ,  Brian S. Doyle ,  Ravindranath V. Mahajan

Inventor： Aleksandar Aleksov ,  Brian S. Doyle ,  Ravindranath V. Mahajan

IPC: H01L31/048 ,  H01L31/0203 ,  H01G9/20 ,  H01L31/0232

CPC classification number: H01L31/0488 ,  H01L27/301 ,  H02S20/26 ,  Y02B10/10 ,  Y02E10/50

Abstract: An apparatus for collecting solar energy, including a first panel, wherein the first panel allows at least 50% of incident light having a wavelength in the range of 1 nm to 1,500 nm to pass through said panel and a second panel, wherein the second panel allows at least 50% of incident light having a wavelength in the range of 410 nm to 650 nm to pass through said panel. A photovoltaic cell is disposed between the first panel and second panel, which includes a first electrode disposed adjacent to the first panel, a second electrode disposed adjacent to the second panel, a photovoltaic component contacting the first and second electrodes. The photovoltaic component absorbs at least 50% of light having a wavelength in one of the following ranges: greater than 650 nm, less than 410 nm and combinations thereof.

Abstract translation: 一种用于收集太阳能的装置，包括第一面板，其中所述第一面板允许波长在1nm至1,500nm范围内的至少50％的入射光通过所述面板和第二面板，其中所述第二面板 允许波长在410nm至650nm范围内的至少50％的入射光通过所述面板。 光伏电池设置在第一面板和第二面板之间，其包括邻近第一面板设置的第一电极，邻近第二面板设置的第二电极，与第一和第二电极接触的光伏组件。 光伏组件吸收至少50％的具有以下范围之一的波长的光：大于650nm，小于410nm及其组合。

公开(公告)号：US20140085846A1

公开(公告)日：2014-03-27

申请号：US13625406

申请日：2012-09-24

Applicant: Qing Ma ,  Johanna M. Swan ,  Robert Starkston ,  John S. Guzek ,  Robert L. Sankman ,  Aleksandar Aleksov

Inventor： Qing Ma ,  Johanna M. Swan ,  Robert Starkston ,  John S. Guzek ,  Robert L. Sankman ,  Aleksandar Aleksov

IPC: H05K1/18 ,  B32B38/04 ,  B32B38/10 ,  H05K1/00

CPC classification number: H01L23/5386 ,  B32B2457/08 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/09 ,  H01L24/13 ,  H01L24/17 ,  H01L24/19 ,  H01L24/24 ,  H01L24/81 ,  H01L24/82 ,  H01L25/0655 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/08238 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/81192 ,  H01L2224/814 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2224/8203 ,  H01L2224/821 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/18162 ,  H01L2924/2064 ,  H01L2924/20641 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/185 ,  H05K3/4688 ,  H05K2201/017 ,  H05K2203/1469 ,  Y10T156/1057 ,  H01L2924/014 ,  H01L2924/00

Abstract: Embodiments of the present description relate to the field of fabricating microelectronic structures. The microelectronic structures may include a glass routing structure formed separately from a trace routing structure, wherein the glass routing structure is incorporated with the trace routing substrate, either in a laminated or embedded configuration. Also disclosed are embodiments of a microelectronic package including at least one microelectronic device disposed proximate to the glass routing structure of the microelectronic substrate and coupled with the microelectronic substrate by a plurality of interconnects. Further, disclosed are embodiments of a microelectronic structure including at least one microelectronic device embedded within a microelectronic encapsulant having a glass routing structure attached to the microelectronic encapsulant and a trace routing structure formed on the glass routing structure.

Abstract translation: 本说明书的实施例涉及制造微电子结构的领域。 微电子结构可以包括与轨迹路由结构分开形成的玻璃布线结构，其中玻璃布线结构以层叠或嵌入的形式结合到迹线布线基板中。 还公开了微电子封装的实施例，其包括设置在微电子衬底的玻璃布线结构附近并通过多个互连与微电子衬底耦合的至少一个微电子器件。 此外，公开了微电子结构的实施例，其包括嵌入微电子密封剂内的至少一个微电子器件，该微电子器件具有连接到微电子密封剂的玻璃布线结构和形成在玻璃布线结构上的迹线布线结构。

公开(公告)号：US20130335939A1

公开(公告)日：2013-12-19

申请号：US13992791

申请日：2011-12-06

Applicant: Aleksandar Aleksov ,  Sanka Ganesan

Inventor： Aleksandar Aleksov ,  Sanka Ganesan

IPC: B81B7/00

CPC classification number: B81B7/0006 ,  B23K35/0288 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L2224/1132 ,  H01L2224/11474 ,  H01L2224/11849 ,  H01L2224/11903 ,  H01L2224/13012 ,  H01L2224/13014 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/1403 ,  H01L2224/141 ,  H01L2224/14135 ,  H01L2224/14136 ,  H01L2224/14177 ,  H01L2224/14179 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81815 ,  H01L2924/01322 ,  H01L2924/3511 ,  H05K3/3436 ,  H05K2201/09418 ,  H05K2201/10734 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00

Abstract: The present description relates to the field of fabricating microelectronic assemblies, wherein a microelectronic device may be attached to a microelectronic substrate with a plurality of shaped and oriented solder joints. The shaped and oriented solder joints may be substantially oval, wherein the major axis of the substantially oval solder joints may be substantially oriented toward a neutral point or center of the microelectronic device. Embodiments of the shaped and oriented solder joint may reduce the potential of solder joint failure due to stresses, such as from thermal expansion stresses between the microelectronic device and the microelectronic substrate.

Abstract translation: 本说明书涉及制造微电子组件的领域，其中微电子器件可以附接到具有多个成形和取向的焊点的微电子衬底。 成形和定向的焊接接头可以是基本上椭圆形的，其中基本上椭圆形焊点的长轴可以基本上朝向微电子器件的中性点或中心定向。 成形和取向的焊接接头的实施例可以减少由于应力（例如来自微电子器件和微电子衬底之间的热膨胀应力）引起的焊点故障的可能性。

公开(公告)号：US08186051B2

公开(公告)日：2012-05-29

申请号：US12079785

申请日：2008-03-28

Applicant: Aleksandar Aleksov ,  Vladimir Noveski ,  Sujit Sharan ,  Shankar Ganapathysubramanian

Inventor： Aleksandar Aleksov ,  Vladimir Noveski ,  Sujit Sharan ,  Shankar Ganapathysubramanian

IPC: H05K3/02

CPC classification number: H05K1/0201 ,  H01L21/4807 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/06 ,  H05K3/107 ,  H05K3/205 ,  H05K3/388 ,  H05K3/4617 ,  H05K3/4629 ,  H05K3/4647 ,  H05K2201/0175 ,  H05K2201/0187 ,  H05K2201/0376 ,  H05K2201/096 ,  H05K2201/09881 ,  H05K2203/0733 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00

Abstract: Methods for fabricating a layer or layers for use in package substrates and die spacers are described. In one implementation the layer or layers are fabricated to include a plurality of ceramic wells lying within a plane and separated by metallic via with recesses within the ceramic wells being occupied by a dielectric filler material.

Abstract translation: 描述了用于制造用于封装衬底和管芯间隔件的层或层的方法。 在一个实施方案中，制造层或层以包括位于平面内的多个陶瓷阱并且由金属通孔隔开，陶瓷井中的凹陷被介电填料材料占据。

公开(公告)号：US20080237844A1

公开(公告)日：2008-10-02

申请号：US11729200

申请日：2007-03-28

Applicant: Aleksandar Aleksov ,  Vladimir Noveski ,  Sujit Sharan

Inventor： Aleksandar Aleksov ,  Vladimir Noveski ,  Sujit Sharan

IPC: H01L23/36

CPC classification number: H01L23/3731 ,  H01L23/3732 ,  H01L25/0657 ,  H01L2224/0554 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A microelectronic package includes a package substrate (110, 310, 410), a plurality of dies (120, 610, 630) arranged in a stack (150, 350, 450) above the package substrate, with a first die (121) located above the package substrate at a bottom (151) of the stack and an uppermost die (122) located at a top (152) of the stack, and a plurality of heat spreaders (130, 330, 430, 620) stacked above the first die, with a first heat spreader (131) located above the uppermost die. One of the plurality of heat spreaders is located between each pair of adjacent dies. Each one of the plurality of heat spreaders has an extending portion (132) that extends laterally beyond an edge (123) of an adjacent die, and at least one of the plurality of heat spreaders both provides electrical interconnectivity and thermal conductivity.

Abstract translation: 微电子封装包括封装衬底（110,310,410），布置在封装衬底上方的堆叠（150,350,450）中的多个管芯（120,610,630），第一管芯（121）位于 在所述堆叠的底部（151）处的所述封装衬底上方，以及位于所述堆叠的顶部（152）处的最上面的模具（122）以及堆叠在所述堆叠的顶部（152）上方的多个散热器（130,330,430,620） 模具，第一个散热器（131）位于最上面的模具上方。 多个散热器中的一个位于每对相邻的模具之间。 多个散热器中的每一个具有横向延伸超过相邻模具的边缘（123）的延伸部分（132），并且多个散热器中的至少一个均提供电互连性和导热性。