公开(公告)号：US20160204091A1

公开(公告)日：2016-07-14

申请号：US15075899

申请日：2016-03-21

Applicant: Invensas Corporation

Inventor： Ilyas Mohammed ,  Masud Beroz ,  Liang Wang

IPC: H01L25/16 ,  H01L33/32 ,  H01L33/62 ,  H01L33/60 ,  H01L33/58 ,  H01L33/06 ,  H01L33/22

CPC classification number: H01L25/167 ,  H01L33/0079 ,  H01L33/06 ,  H01L33/22 ,  H01L33/32 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Inverted optical device. In accordance with an embodiment of the present invention, a plurality of piggyback substrates are attached to a carrier wafer. The plurality of piggyback substrates are dissimilar in composition to the carrier wafer. The plurality of piggyback substrates are processed, while attached to the carrier wafer, to produce a plurality of integrated circuit devices. A flip wafer is attached to the plurality of light emitting diodes, away from the carrier wafer and the carrier wafer is removed. The plurality of light emitting diodes may be singulated to form individual light emitting diode devices.

公开(公告)号：US20160163679A1

公开(公告)日：2016-06-09

申请号：US14995726

申请日：2016-01-14

Applicant: Invensas Corporation

Inventor： Ilyas Mohammed ,  Belgacem Haba

IPC: H01L25/065 ,  H01L21/48 ,  H01L21/56 ,  H01L25/00 ,  H01L23/31

CPC classification number: H01L25/0657 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/565 ,  H01L21/566 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic assembly or package can include first and second support elements and a microelectronic element between inwardly facing surfaces of the support elements. First connectors and second connectors such as solder balls, metal posts, stud bumps, or the like face inwardly from the respective support elements and are aligned with and electrically coupled with one another in columns. The first connectors, the second connectors or both may be partially encapsulated prior to electrically coupling respective pairs of first and second connectors in columns. A method may include arranging extremities of first connectors or second connectors in a temporary layer before forming the partial encapsulation.

Abstract translation: 微电子组件或封装可以包括第一和第二支撑元件以及在支撑元件的向内表面之间的微电子元件。 第一连接器和第二连接器，例如焊球，金属柱，螺柱凸起等从相应的支撑元件向内表面并且彼此对齐并且彼此电连接。 第一连接器，第二连接器或两者可以在电耦合相应的第一和第二连接器对的列之前被部分封装。 方法可以包括在形成部分封装之前在临时层中布置第一连接器或第二连接器的末端。

公开(公告)号：US20160035712A1

公开(公告)日：2016-02-04

申请号：US14883977

申请日：2015-10-15

Applicant: Invensas Corporation

Inventor： Terrence Caskey ,  Ilyas Mohammed

IPC: H01L25/00 ,  H01L23/00

CPC classification number: H01L25/18 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/76802 ,  H01L21/76877 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3185 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/117 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/05554 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/06155 ,  H01L2224/12105 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/14131 ,  H01L2224/27334 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48108 ,  H01L2224/48145 ,  H01L2224/4824 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73217 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/82031 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/852 ,  H01L2224/92144 ,  H01L2224/92147 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2225/06596 ,  H01L2225/1035 ,  H01L2225/1052 ,  H01L2225/1076 ,  H01L2225/1082 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/186 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/05552

Abstract: A microelectronic package may include a first microelectronic unit including a semiconductor chip having first chip contacts, an encapsulant contacting an edge of the semiconductor chip, and first unit contacts exposed at a surface of the encapsulant and electrically connected with the first chip contacts. The package may include a second microelectronic unit including a semiconductor chip having second chip contacts at a surface thereof, and an encapsulant contacting an edge of the chip of the second unit and having a surface extending away from the edge. The surfaces of the chip and the encapsulant of the second unit define a face of the second unit. Package terminals at the face may be electrically connected with the first unit contacts through bond wires electrically connected with the first unit contacts, and the second chip contacts through metallized vias and traces formed in contact with the second chip contacts.

公开(公告)号：US20150325562A1

公开(公告)日：2015-11-12

申请号：US14806993

申请日：2015-07-23

Applicant: Invensas Corporation

Inventor： Belgacem Haba ,  Ilyas Mohammed

IPC: H01L25/00 ,  H01L21/3105 ,  H01L23/00 ,  H01L21/78 ,  H01L25/065

CPC classification number: H01L21/56 ,  H01L21/304 ,  H01L21/3105 ,  H01L21/50 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3107 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2225/06513 ,  H01L2225/06565 ,  H01L2225/06593 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A first area of a first surface of an encapsulated component can be thinned, the component including: a semiconductor chip having an active surface opposite the first surface, and an encapsulant extending outwardly from edges of the semiconductor chip. An entire area of the active surface may be aligned with the first area. After the abrading, a second area of the encapsulated component beyond the first area may have a thickness greater than a thickness of the first area. The second area can be configured to fully support the abraded encapsulated component in a state of the encapsulated component being manipulated by handling equipment.

Abstract translation: 封装部件的第一表面的第一区域可以变薄，所述部件包括：具有与第一表面相对的有效表面的半导体芯片以及从半导体芯片的边缘向外延伸的密封剂。 有源表面的整个区域可以与第一区域对齐。 在研磨之后，超过第一区域的包封组分的第二区域可以具有大于第一区域的厚度的厚度。 第二区域可以被配置为在被处理设备操纵的封装部件的状态下完全支撑磨损的封装部件。

公开(公告)号：US20150279823A1

公开(公告)日：2015-10-01

申请号：US14230388

申请日：2014-03-31

Applicant: Invensas Corporation

Inventor： Belgacem Haba ,  Ilyas Mohammed ,  Liang Wang

IPC: H01L25/10 ,  H01L21/56 ,  H01L23/00 ,  H01L25/00

CPC classification number: H01L25/50 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L23/13 ,  H01L23/3157 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81805 ,  H01L2224/92125 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06544 ,  H01L2225/06582 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/15333 ,  H01L2924/014 ,  H01L2924/00

Abstract: A microelectronic assembly can be made by joining first and second subassemblies by electrically conductive masses to connect electrically conductive elements on support elements of each subassembly. A patterned layer of photo-imageable material may overlie a surface of one of the support elements and have openings with cross-sectional dimensions which are constant or monotonically increasing with height from the surface of that support element, where the masses extend through the openings and have dimensions defined thereby. An encapsulation can be formed by flowing an encapsulant into a space between the joined first and second subassemblies.

Abstract translation: 微电子组件可以通过用导电块连接第一和第二子组件来连接每个子组件的支撑元件上的导电元件来制造。 可光成像材料的图案层可以覆盖在一个支撑元件的表面上，并且具有开口，其横截面尺寸与该支撑元件的表面的高度不变或单调地增加，其中质量延伸穿过开口和 具有由此定义的尺寸。 可以通过将密封剂流入连接的第一和第二子组件之间的空间来形成封装。

公开(公告)号：US09123600B2

公开(公告)日：2015-09-01

申请号：US13778654

申请日：2013-02-27

Applicant: Invensas Corporation

Inventor： Belgacem Haba ,  Richard Dewitt Crisp ,  Wael Zohni ,  Ilyas Mohammed

IPC: H01L21/00 ,  H01L23/13 ,  H01L23/538 ,  H01L25/065 ,  H01L23/31 ,  H01L23/498 ,  H01L23/525 ,  H01L25/10

CPC classification number: H01L23/5386 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/525 ,  H01L23/5384 ,  H01L23/5385 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A chip package has multiple chips that may be arranged side-by-side or in a staggered, stair step arrangement. The contacts of the chips are connected to interconnect pads carried on the chips themselves or on a redistribution substrate. The interconnect pads desirably are arranged in a relatively narrow interconnect zone, such that the interconnect pads can be readily wire-bonded or otherwise connected to a package substrate.

Abstract translation: 芯片封装具有多个芯片，可以并排布置或以交错的台阶布置布置。 芯片的触点连接到芯片本身或再分布基板上承载的互连焊盘。 互连焊盘理想地布置在相对窄的互连区域中，使得互连焊盘可以容易地线接合或以其他方式连接到封装衬底。

公开(公告)号：US20150129876A1

公开(公告)日：2015-05-14

申请号：US14605550

申请日：2015-01-26

Applicant: Invensas Corporation

Inventor： Ilyas Mohammed ,  Liang Wang

IPC: H01L33/00 ,  H01L33/36 ,  H01L33/48 ,  H01L33/18 ,  H01L33/14

CPC classification number: H01L33/0012 ,  H01L33/0095 ,  H01L33/14 ,  H01L33/16 ,  H01L33/18 ,  H01L33/36 ,  H01L33/486 ,  H01L2933/0016 ,  H01L2933/0033 ,  H05B33/14 ,  H05B33/22

Abstract: Non-crystalline inorganic light emitting diode. In accordance with a first embodiment of the present invention, an article of manufacture includes a light emitting diode. The light emitting diode includes a non-crystalline inorganic light emission layer and first and second semiconducting non-crystalline inorganic charge transport layers surrounding the light emission layer. The light emission layer may be amorphous. The charge transport layers may be configured to inject one type of charge carrier and block the other type of charge carrier.

Abstract translation: 非结晶无机发光二极管。 根据本发明的第一实施例，制品包括发光二极管。 发光二极管包括非结晶无机发光层和围绕发光层的第一和第二半导体非结晶无机电荷输送层。 发光层可以是无定形的。 电荷输送层可以被配置为注入一种类型的电荷载体并阻挡另一种类型的电荷载体。

公开(公告)号：US20150034371A1

公开(公告)日：2015-02-05

申请号：US14517268

申请日：2014-10-17

Applicant: INVENSAS CORPORATION

Inventor： Belgacem Haba ,  Ilyas Mohammed ,  Terrence Caskey ,  Reynaldo Co ,  Ellis Chau

IPC: H05K1/18

CPC classification number: H05K1/11 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/528 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/10126 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1191 ,  H01L2224/13017 ,  H01L2224/13022 ,  H01L2224/13076 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13101 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14135 ,  H01L2224/16105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/32225 ,  H01L2224/45012 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45101 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45624 ,  H01L2224/45655 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15322 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/0298 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/10515 ,  H05K2201/10977 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/014

Abstract: A structure may include bond elements having bases joined to conductive elements at a first portion of a first surface and end surfaces remote from the substrate. A dielectric encapsulation element may overlie and extend from the first portion and fill spaces between the bond elements to separate the bond elements from one another. The encapsulation element has a third surface facing away from the first surface. Unencapsulated portions of the bond elements are defined by at least portions of the end surfaces uncovered by the encapsulation element at the third surface. The encapsulation element at least partially defines a second portion of the first surface that is other than the first portion and has an area sized to accommodate an entire area of a microelectronic element. Some conductive elements are at the second portion and configured for connection with such microelectronic element.

Abstract translation: 结构可以包括在第一表面的第一部分和远离基底的端表面处具有连接到导电元件的基底的结合元件。 电介质封装元件可以从第一部分覆盖并延伸并填充接合元件之间的空间，以将接合元件彼此分开。 封装元件具有背离第一表面的第三表面。 粘合元件的未封装部分由在第三表面处被封装元件未覆盖的至少部分端面限定。 封装元件至少部分地限定除了第一部分之外的第一表面的第二部分，并且具有尺寸适于容纳微电子元件的整个区域的区域。 一些导电元件位于第二部分并被配置为与这种微电子元件连接。

公开(公告)号：US08941111B2

公开(公告)日：2015-01-27

申请号：US13725923

申请日：2012-12-21

Applicant: Invensas Corporation

Inventor： Ilyas Mohammed ,  Liang Wang

IPC: H01L33/16 ,  H01L33/18 ,  H05B33/14 ,  H05B33/22

CPC classification number: H01L33/0012 ,  H01L33/0095 ,  H01L33/14 ,  H01L33/16 ,  H01L33/18 ,  H01L33/36 ,  H01L33/486 ,  H01L2933/0016 ,  H01L2933/0033 ,  H05B33/14 ,  H05B33/22

Abstract: Non-crystalline inorganic light emitting diode. In accordance with a first embodiment of the present invention, an article of manufacture includes a light emitting diode. The light emitting diode includes a non-crystalline inorganic light emission layer and first and second semiconducting non-crystalline inorganic charge transport layers surrounding the light emission layer. The light emission layer may be amorphous. The charge transport layers may be configured to inject one type of charge carrier and block the other type of charge carrier.

Abstract translation: 非结晶无机发光二极管。 根据本发明的第一实施例，制品包括发光二极管。 发光二极管包括非结晶无机发光层和围绕发光层的第一和第二半导体非结晶无机电荷输送层。 发光层可以是无定形的。 电荷输送层可以被配置为注入一种类型的电荷载体并阻挡另一种类型的电荷载体。

公开(公告)号：US20150014856A1

公开(公告)日：2015-01-15

申请号：US13942602

申请日：2013-07-15

Applicant: Invensas Corporation

Inventor： Ilyas Mohammed ,  Belgacem Haba

IPC: H01L23/28 ,  H01L21/56

CPC classification number: H01L23/28 ,  H01L21/56 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/5389 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

Abstract: A microelectronic assembly or package can include first and second support elements and a microelectronic element between inwardly facing surfaces of the support elements. First connectors and second connectors such as solder balls, metal posts, stud bumps, or the like face inwardly from the respective support elements and are aligned with and electrically coupled with one another in columns. Dielectric reinforcing collars are provided on outer surfaces of the first connectors, second connectors or both, and an encapsulation separates pairs of coupled connectors from one another and may fill spaces between support elements.

Abstract translation: 微电子组件或封装可以包括第一和第二支撑元件以及在支撑元件的向内表面之间的微电子元件。 第一连接器和第二连接器，例如焊球，金属柱，螺柱凸起等从相应的支撑元件向内表面并且彼此对齐并且彼此电连接。 电介质增强套环设置在第一连接器，第二连接器或两者的外表面上，并且封装将成对的耦合连接器彼此分开并且可以填充支撑元件之间的空间。