公开(公告)号：US20110151657A1

公开(公告)日：2011-06-23

申请号：US12673975

申请日：2008-06-27

申请人： Romain Coffy ,  Jacky Seiller ,  Gil Provent

发明人： Romain Coffy ,  Jacky Seiller ,  Gil Provent

IPC分类号： H01L21/28

CPC分类号： H05K3/3473 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L2224/0401 ,  H01L2224/11472 ,  H01L2224/11474 ,  H01L2224/11849 ,  H01L2224/11903 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/94 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/014 ,  H01L2924/12036 ,  H05K2203/043 ,  H05K2203/0574 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

摘要： A method for fabricating electrical bonding pads on the electrical contact areas of a wafer includes producing first blocks made of a solder material, producing second blocks made of a solder material on these first blocks, and passing the blocks through an oven so as to shape the blocks into approximately domed electrical bonding pads.

摘要翻译： 用于在晶片的电接触区域上制造电接合焊盘的方法包括制造由焊料材料制成的第一块，在这些第一块上产生由焊料材料制成的第二块，并使块通过炉， 嵌入大致圆顶的电焊盘。

公开(公告)号：US07737565B2

公开(公告)日：2010-06-15

申请号：US11601569

申请日：2006-11-17

申请人： Romain Coffy

发明人： Romain Coffy

IPC分类号： H01L23/28

CPC分类号： H01L25/105 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stackable semiconductor package includes a board having first electrical connections, an integrated circuit chip fixed on a front face of the board, second electrical connections which connect the chip to the first electrical connections of the board and front electrical contact terminals arranged beyond at least one edge of the chip on the front face of this board. An encapsulation block of a coating material is formed on the front face of the board and encapsulates the chip, its electrical connections and the front terminals. The block has at least one opening which at least partially uncovers the front terminals with a view to receiving electrical connection beads of a stacked second package. This one opening is preferably in the form of a groove.

摘要翻译： 可堆叠的半导体封装包括具有第一电连接的板，固定在板的前表面上的集成电路芯片，将芯片连接到板的第一电连接和布置在至少一个以上的前电接触端子的第二电连接 芯片的边缘在该板的正面上。 涂层材料的封装块形成在板的正面，并封装芯片，其电气连接和前端子。 该块具有至少一个开口，其至少部分地露出前端子，以接收堆叠的第二封装的电连接珠。 该一个开口优选为凹槽的形式。

公开(公告)号：US20140057394A1

公开(公告)日：2014-02-27

申请号：US13594498

申请日：2012-08-24

申请人： Anandan Ramasamy ,  Yonggang Jin ,  Yun Liu ,  Eric Saugier ,  Romain Coffy ,  How Yuan Hwang

发明人： Anandan Ramasamy ,  Yonggang Jin ,  Yun Liu ,  Eric Saugier ,  Romain Coffy ,  How Yuan Hwang

IPC分类号： H01L21/60 ,  H01L21/56

CPC分类号： H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/14 ,  H01L24/19 ,  H01L24/81 ,  H01L24/96 ,  H01L24/97 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/06181 ,  H01L2224/11334 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/14181 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2225/06524 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2224/05 ,  H01L2224/81 ,  H01L2224/11 ,  H01L2924/014 ,  H01L2224/05552 ,  H01L2924/00

摘要： A manufacturing process includes forming a reconstituted wafer, including embedding semiconductor dice in a molding compound layer and forming through-wafer vias in the layer. A fan-out redistribution layer is formed on a front side of the wafer, with electrical traces interconnecting the dice, through-wafer vias, and contact pads positioned on the redistribution layer. Solder balls are positioned on the contact pads and a molding compound layer is formed on the redistribution layer, reinforcing the solder balls. A second fan-out redistribution layer is formed on a back side of the wafer, with electrical traces interconnecting back ends of the through-wafer vias and contact pads positioned on a back face of the second redistribution layer. Flip-chips and/or surface-mounted devices are coupled to the contact pads of the second redistribution layer and encapsulated in an underfill layer formed on the back face of the second redistribution layer.

摘要翻译： 一种制造方法包括形成重构的晶片，包括将半导体晶片嵌入到模塑复合层中并在该层中形成贯通晶片通孔。 在晶片的前侧形成扇出重分布层，其中电迹线将骰子，贯穿晶片通孔和位于再分布层上的接触焊盘相互连接。 焊球定位在接触垫上，并且在再分布层上形成模塑料层，从而加强焊球。 第二扇出再分配层形成在晶片的背面上，其中电迹线互连贯通晶片通孔的后端和位于第二再分布层的背面上的接触焊盘。 翻转芯片和/或表面安装器件耦合到第二再分布层的接触焊盘，并且封装在形成在第二再分配层的背面上的底部填充层中。

公开(公告)号：US20130105982A1

公开(公告)日：2013-05-02

申请号：US13287816

申请日：2011-11-02

申请人： Yonggang Jin ,  Romain Coffy ,  Jerome Teysseyre

发明人： Yonggang Jin ,  Romain Coffy ,  Jerome Teysseyre

IPC分类号： H01L21/78 ,  H01L23/485

CPC分类号： H01L23/498 ,  H01L21/561 ,  H01L21/76283 ,  H01L21/76802 ,  H01L21/76838 ,  H01L23/3114 ,  H01L23/34 ,  H01L23/36 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/05 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/02331 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/04105 ,  H01L2224/05008 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05548 ,  H01L2224/05553 ,  H01L2224/05562 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/96 ,  H01L2924/00014 ,  H01L2924/181 ,  Y10T29/49124 ,  Y10T29/49174 ,  Y10T29/49204 ,  H01L2224/03 ,  H01L2224/05552 ,  H01L2924/00

摘要： A fan-out wafer level package is provided with a semiconductor die embedded in a reconstituted wafer. A redistribution layer is positioned over the semiconductor die, and includes a land grid array on a face of the package. A copper heat spreader is formed in the redistribution layer over the die in a same layer as a plurality of electrical traces configured to couple circuit pads of the semiconductor die to respective contact lands of the land grid array. In operation, the heat spreader improves efficiency of heat transfer from the die to the circuit board.

摘要翻译： 扇出晶片级封装设置有嵌入重构晶片中的半导体管芯。 再分配层位于半导体管芯上方，并且在封装的表面上包括焊盘栅格阵列。 铜管散热器形成在芯片上的再分配层中，与多个配置成将半导体管芯的电路焊盘耦合到焊盘栅极阵列的接触焊盘的多个电迹线相同的层中。 在操作中，散热器提高了从模具到电路板的热传递的效率。

公开(公告)号：US20120248625A1

公开(公告)日：2012-10-04

申请号：US13433447

申请日：2012-03-29

申请人： Romain Coffy ,  Emmanuelle Vigier-Blanc

发明人： Romain Coffy ,  Emmanuelle Vigier-Blanc

IPC分类号： H01L23/522

CPC分类号： G01S7/4813 ,  G01S17/026 ,  H01L25/167 ,  H01L27/14618 ,  H01L31/0203 ,  H01L31/02164 ,  H01L31/167 ,  H01L31/173 ,  H01L2224/16225

摘要： A semiconductor package includes a transmissive support plate and includes at least one elongate hole. An integrated circuit semiconductor device is mounted on a rear face of the support plate. The semiconductor device includes first and second optical elements oriented towards the rear face of the support plate, where the first and second optical elements are placed on either side of the elongate hole. An encapsulation material made of an opaque material encapsulates the semiconductor device and fills the elongate hole so as to form an optical insulation partition between the first and second optical elements. A cavity is left, however, between each optical element and a rear face of the support plate.

摘要翻译： 半导体封装包括透射支撑板并且包括至少一个细长孔。 集成电路半导体器件安装在支撑板的后表面上。 半导体器件包括朝向支撑板的后表面定向的第一和第二光学元件，其中第一和第二光学元件被放置在细长孔的任一侧上。 由不透明材料制成的封装材料封装半导体器件并填充细长孔，以在第一和第二光学元件之间形成光学绝缘隔板。 然而，在每个光学元件和支撑板的后表面之间留有空腔。

公开(公告)号：US20120020039A1

公开(公告)日：2012-01-26

申请号：US13163533

申请日：2011-06-17

申请人： Romain Coffy ,  Jean-François Sauty

发明人： Romain Coffy ,  Jean-François Sauty

IPC分类号： H05K7/02 ,  H05K3/00 ,  H05K9/00

CPC分类号： H05K9/0022 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/97 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K3/284 ,  H05K3/388 ,  H05K2201/0179 ,  H05K2201/09872 ,  Y10T29/49124 ,  H01L2224/81 ,  H01L2924/00

摘要： A surface-mounted shielded multicomponent assembly, comprising a wafer on which several electronic components are assembled; an insulating layer conformally deposited on the structure with a thickness smaller than the height of the electronic components, comprising at least one opening emerging on a contact of said wafer; a conductive shielding layer covering the insulating layer and said at least one opening; and a resin layer covering the conductive layer.

摘要翻译： 一种表面安装的屏蔽多组件组件，包括其上组装有几个电子部件的晶片; 绝缘层，其以厚度小于所述电子部件的高度的方式平坦地沉积在所述结构上，包括在所述晶片的触点上露出的至少一个开口; 覆盖绝缘层和所述至少一个开口的导电屏蔽层; 以及覆盖导电层的树脂层。

公开(公告)号：US20110018135A1

公开(公告)日：2011-01-27

申请号：US12843515

申请日：2010-07-26

申请人： Romain Coffy ,  Fabien Quercia

发明人： Romain Coffy ,  Fabien Quercia

IPC分类号： H01L23/498 ,  B23K1/20

CPC分类号： H01L24/85 ,  H01L24/02 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/4845 ,  H01L2224/48458 ,  H01L2224/48463 ,  H01L2224/48475 ,  H01L2224/48482 ,  H01L2224/48499 ,  H01L2224/48724 ,  H01L2224/48799 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/20752 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48824 ,  H01L2924/00015

摘要： A wire is electrically connected to an electrical bonding pad of an integrated circuit chip and electronic device through an intermediate electrical interconnect block that is interposed between the electrical bonding pad and one end of the electrical lead wire.

摘要翻译： 导线通过中间电互连块电连接到集成电路芯片和电子器件的电接合焊盘，所述中间电互连块插入在电接合焊盘和电引线的一端之间。

公开(公告)号：US09134421B2

公开(公告)日：2015-09-15

申请号：US13531638

申请日：2012-06-25

申请人： Julien Vittu ,  Romain Coffy

发明人： Julien Vittu ,  Romain Coffy

IPC分类号： H01L33/00 ,  G01S17/02 ,  G01S7/481 ,  G01J1/02 ,  G01J1/04 ,  H01L31/16 ,  H01L33/48 ,  H01L25/16

CPC分类号： G01S17/026 ,  G01J1/0271 ,  G01J1/0403 ,  G01J1/0407 ,  G01S7/4813 ,  H01L25/167 ,  H01L31/16 ,  H01L33/48 ,  H01L2224/48227 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An electronic package includes a substrate wafer having front and rear faces and a through passage having a front window and a blind cavity communicating laterally with the front window. A receiving integrated circuit chip is mounted on the rear face and includes an optical sensor situated opposite the blind cavity. A transparent encapsulant extends above the optical sensor and at least partially fills the through passage. An emitting integrated circuit chip, embedded in the transparent encapsulant, includes an optical emitter of luminous radiation. The emitting integrated circuit chip may be mounted to the front face or within the through passage to the receiving integrated circuit chip. The substrate wafer may further include a second through passage. The receiving integrated circuit chip further includes a second optical sensor situated opposite the second through passage. A cover plate is mounted to the front face at the second through passage.

摘要翻译： 电子封装包括具有前表面和后表面的基底晶片和具有前窗和与前窗横向连通的盲腔的通孔。 接收集成电路芯片安装在后表面上并且包括位于盲腔相对的光学传感器。 透明密封剂在光学传感器上方延伸并且至少部分地填充通过通道。 嵌入在透明密封剂中的发射集成电路芯片包括发光体的发光体。 发射集成电路芯片可以安装到前面或通向接收集成电路芯片的通路内。 衬底晶片还可以包括第二穿通通道。 接收集成电路芯片还包括与第二贯穿通道相对的第二光学传感器。 盖板在第二通道处被安装到前表面。

公开(公告)号：US08754523B2

公开(公告)日：2014-06-17

申请号：US13045771

申请日：2011-03-11

申请人： Romain Coffy

发明人： Romain Coffy

IPC分类号： H01L23/488 ,  H01L23/00 ,  H05K3/34 ,  H01L23/538 ,  H01L23/498

CPC分类号： H05K3/3436 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01033 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2224/82

摘要： A surface-mounted electronic component including balls bonded to its front surface and, on the front surface, a protective resin layer having a thickness smaller than the ball height, wherein grooves extend in the resin layer between balls of the chip.

摘要翻译： 一种表面安装的电子部件，包括与其前表面接合的球体，并且在前表面上具有厚度小于球高度的保护树脂层，其中凹槽在芯片的球之间在树脂层中延伸。

公开(公告)号：US08232113B2

公开(公告)日：2012-07-31

申请号：US12990684

申请日：2009-05-20

申请人： Romain Coffy

发明人： Romain Coffy

IPC分类号： G01R31/26

CPC分类号： G01R31/2884 ,  G01R1/0408 ,  G01R31/2822 ,  H01L22/32 ,  H01L24/03 ,  H01L24/05 ,  H01L24/10 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L2224/03 ,  H01L2224/0392 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/0558 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2224/11 ,  H01L2924/00

摘要： A method for manufacturing and for testing an integrated circuit, including the steps of forming, on the upper portion of the integrated circuit, a passivation layer including openings at the level of metal tracks of the last interconnect stack of the integrated circuit; forming, in the openings, first pads connected to second pads formed on the passivation layer by conductive track sections, the first pads being intended for the connection of the integrated circuit; testing the integrated circuit by bringing test tips in contact with the second pads; and eliminating at least a portion of at least one of the conductive track sections.

摘要翻译： 一种用于制造和测试集成电路的方法，包括以下步骤：在所述集成电路的上部形成钝化层，所述钝化层包括在所述集成电路的最后互连叠层的金属轨道的水平面处的开口; 在开口中形成通过导电轨道部分连接到形成在钝化层上的第二焊盘的第一焊盘，第一焊盘用于连接集成电路; 通过将测试头与第二个焊盘接触来测试集成电路; 以及消除所述导电轨道部分中的至少一个的至少一部分。