公开(公告)号：US20170110618A1

公开(公告)日：2017-04-20

申请号：US14885215

申请日：2015-10-16

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Laurent HERARD ,  David GANI

IPC: H01L31/167 ,  H01L33/00 ,  H01L31/0203 ,  H01L33/54 ,  H01L31/18 ,  H01L33/58

CPC classification number: H01L31/167 ,  G01D5/34715 ,  G01S7/481 ,  G01S7/4813 ,  G01S17/026 ,  H01L25/167 ,  H01L31/0203 ,  H01L31/16 ,  H01L31/18 ,  H01L33/005 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/15151 ,  H01L2924/1815 ,  H01L2933/005 ,  H01L2933/0058

Abstract: An electronic device includes a substrate, an optical sensor coupled to the substrate, and an optical emitter coupled to the substrate. A lens is aligned with the optical emitter and includes an upper surface and an encapsulation bleed stop groove around the upper surface. An encapsulation material is coupled to the substrate and includes first and second encapsulation openings therethrough aligned with the optical sensor and the lens, respectively.

公开(公告)号：US09620438B2

公开(公告)日：2017-04-11

申请号：US14615673

申请日：2015-02-06

Applicant: STMicroelectronics (Malta) Ltd ,  STMicroelectronics S.r.l. ,  STMicroelectronics Pte Ltd

Inventor： Roseanne Duca ,  Valter Motta ,  Xueren Zhang ,  Kim-Yong Goh

IPC: H01L23/02 ,  H01L23/495

CPC classification number: H01L23/49568 ,  H01L23/4334 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2924/18301 ,  H01L2924/00014

Abstract: An electronic device includes an integrated circuit chip mounted to a heat slug. The heat slug has a peripheral region having first thickness along a first direction, the peripheral region surrounding a recess region (having a second, smaller, thickness along the first direction) that defines a chip mounting surface along a second direction perpendicular to the first direction. The recess region defines side borders and a nook extends into the heat slug along the side borders. An insulating body embeds the integrated circuit one chip and heat slug. Material of the insulating body fills the nook.

公开(公告)号：US09525094B2

公开(公告)日：2016-12-20

申请号：US14671707

申请日：2015-03-27

Applicant: STMICROELECTRONICS PTE LTD ,  STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Eric Saugier ,  Wing Shenq Wong ,  David Gani

IPC: H01L31/167 ,  H01L31/02 ,  H01L25/16 ,  H01S5/022 ,  H01S5/183 ,  H01L31/18

CPC classification number: H01L31/167 ,  H01L25/167 ,  H01L31/02005 ,  H01L31/18 ,  H01L2224/18 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01S5/02248 ,  H01S5/0226 ,  H01S5/02276 ,  H01S5/183 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A proximity sensor having a relatively small footprint includes a substrate, a semiconductor die, a light emitting device, and a cap. The light emitting device overlies the semiconductor die. The semiconductor die is secured to the substrate and includes a sensor area capable of detecting light from by the light emitting device. The cap also is secured to the substrate and includes a light barrier that prevents some of the light emitted by the light emitting device from reaching the sensor area. In one embodiment, the light emitting device and the semiconductor die are positioned on the same side of the substrate, wherein the light emitting device is positioned on the semiconductor die. In another embodiment, the light emitting device is positioned on one side of the substrate and the semiconductor die is positioned on an opposing side of the substrate.

Abstract translation: 具有相对较小占地面积的接近传感器包括衬底，半导体管芯，发光器件和帽。 发光器件覆盖半导体管芯。 半导体管芯被固定到基板上并且包括能够检测来自发光器件的光的传感器区域。 盖子也被固定到基板上并且包括防止由发光装置发射的一些光到达传感器区域的光栅。 在一个实施例中，发光器件和半导体管芯位于衬底的相同侧上，其中发光器件位于半导体管芯上。 在另一个实施例中，发光器件位于衬底的一侧，并且半导体管芯位于衬底的相对侧上。

公开(公告)号：US09525002B2

公开(公告)日：2016-12-20

申请号：US14589210

申请日：2015-01-05

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Wing Shenq Wong

IPC: H01L31/0232 ,  H01L27/146

CPC classification number: H01L27/14636 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/16235 ,  H01L2924/00014

Abstract: An image sensor device may include an interconnect layer, an image sensor IC carried by the interconnect layer and having an image sensing surface, and encapsulation material laterally surrounding the image sensor IC and covering an upper surface of the image sensor IC up to the image sensing surface. The image sensor device may include an optical plate having a peripheral lower surface carried by an upper surface of the encapsulation material and aligned with the image sensing surface, the optical plate being spaced above the image sensing surface to define an internal cavity, and a lens assembly coupled to the encapsulation material and aligned with the image sensing surface.

Abstract translation: 图像传感器装置可以包括互连层，由互连层承载并具有图像感测表面的图像传感器IC，以及侧向围绕图像传感器IC并且覆盖图像传感器IC的上表面的封装材料，直到图像感测 表面。 图像传感器装置可以包括光学板，其具有由封装材料的上表面承载并与图像感测表面对准的周边下表面，光学板在图像感测表面上方间隔开以限定内部空腔，并且透镜 组件耦合到封装材料并与图像感测表面对齐。

公开(公告)号：US09502381B2

公开(公告)日：2016-11-22

申请号：US14817502

申请日：2015-08-04

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En Luan

IPC: H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L25/00 ,  H01L25/065

CPC classification number: H01L24/92 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/29 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3171 ,  H01L23/49513 ,  H01L23/49575 ,  H01L23/49838 ,  H01L23/49861 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/94 ,  H01L24/96 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/0569 ,  H01L2224/2741 ,  H01L2224/27416 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/85207 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/181 ,  H01L2224/27 ,  H01L2224/03 ,  H01L2924/00012 ,  H01L2224/43 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2224/85399

Abstract: Embodiments of the present disclosure provide a semiconductor device, a semiconductor package, and a method for manufacturing a semiconductor device. The semiconductor device comprises: a semiconductor die; an electrical isolation layer formed on a surface of the semiconductor die; a substrate; and a non-conductive adhesive layer disposed between the electrical isolation layer and the substrate, so as to adhere the electrical isolation layer to the substrate.

Abstract translation: 本公开的实施例提供半导体器件，半导体封装以及半导体器件的制造方法。 半导体器件包括：半导体管芯; 形成在所述半导体管芯的表面上的电隔离层; 底物; 以及设置在电绝缘层和基板之间的非导电粘合剂层，以将电隔离层粘附到基板。

公开(公告)号：US09466550B2

公开(公告)日：2016-10-11

申请号：US14741535

申请日：2015-06-17

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En Luan

IPC: H01L23/48 ,  H01L23/373 ,  H01L23/498 ,  H01L23/367 ,  H01L23/31 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/562 ,  H01L21/4846 ,  H01L21/4853 ,  H01L21/4871 ,  H01L21/4882 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/78 ,  H01L23/18 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/373 ,  H01L23/3737 ,  H01L23/498 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16235 ,  H01L2224/18 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/3511

Abstract: An electronic device may include an integrated circuit (IC), electrically conductive connectors coupled to the IC, and a heat sink layer adjacent the IC and opposite the electrically conductive connectors. The electronic device may include an encapsulation material surrounding the IC and the electrically conductive connectors, a redistribution layer having electrically conductive traces coupled to the electrically conductive connectors, a stiffener between the heat sink layer and the redistribution layer, and a fan-out component between the heat sink layer and the redistribution layer and being in the encapsulation material.

Abstract translation: 电子设备可以包括集成电路（IC），耦合到IC的导电连接器以及与IC相邻并与导电连接器相对的散热层。 电子设备可以包括围绕IC和导电连接器的封装材料，具有耦合到导电连接器的导电迹线的再分布层，散热层和再分布层之间的加强件，以及在散热层之间的扇出部分， 散热层和再分配层，并且在封装材料中。

公开(公告)号：US09430328B2

公开(公告)日：2016-08-30

申请号：US14597845

申请日：2015-01-15

Applicant: STMICROELECTRONICS S.r.l. ,  STMICROELECTRONICS PTE LTD

Inventor： Antonino Conte ,  Kailash Khairnar

IPC: G11C29/00 ,  G06F11/10 ,  G11C29/52 ,  G06F11/08 ,  G11C13/00

CPC classification number: G06F11/1068 ,  G06F11/08 ,  G06F11/1048 ,  G11C13/0004 ,  G11C13/004 ,  G11C29/52 ,  G11C2013/0054

Abstract: A memory device may include memory cells. The method may include receiving a request of reading a selected data word associated with a selected code word stored with an error correction code, and reading a first code word representing a first version of the selected code word by comparing a state of each selected memory cell with a first reference. The method may include verifying the first code word, setting the selected code word according to the first code word in response to a positive verification, reading at least one second code word representing a second version of the selected code word, verifying the second code word, and setting the selected code word according to the second code word in response to a negative verification of the first code word and to a positive verification of the second code word.

Abstract translation: 存储器件可以包括存储器单元。 该方法可以包括：接收读取与通过纠错码存储的所选码字相关联的所选择的数据字的请求，以及通过比较所选择的存储单元的状态来读取表示所选码字的第一版本的第一码字 第一个参考。 该方法可以包括验证第一代码字，响应于正验证，根据第一代码字设置所选择的代码字，读取表示所选代码字的第二版本的至少一个第二代码字，验证第二代码字 并且响应于第一代码字的否定验证和第二代码字的肯定验证，根据第二代码字设置所选择的代码字。

公开(公告)号：US20160181299A1

公开(公告)日：2016-06-23

申请号：US14578718

申请日：2014-12-22

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jean-Michel GREBET ,  Wee Chin Judy LIM

IPC: H01L27/146 ,  H01L31/02 ,  H01L31/0203

CPC classification number: H01L27/14618 ,  H01L27/14636 ,  H01L27/14683 ,  H01L31/0203 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/00014

Abstract: An image sensing device may include an interconnect layer and grid array contacts carried by the interconnect layer, and an image sensor IC carried by the interconnect layer and coupled to the grid array contacts, the image sensor IC having an image sensing surface. The image sensing device may include a transparent plate carried by the image sensor IC and aligned with the image sensing surface, and a cap carried by the interconnect layer and having an opening aligned with the image sensing surface. The cap may have an upper wall spaced above the interconnect layer and the image sensor IC to define an internal cavity, and the cap may define an air vent coupled to the internal cavity.

Abstract translation: 图像感测装置可以包括由互连层承载的互连层和栅极阵列触点，以及由互连层承载并耦合到栅极阵列触点的图像传感器IC，图像传感器IC具有图像感测表面。 图像感测装置可以包括由图像传感器IC携带并与图像感测表面对准的透明板，以及由互连层承载并具有与图像感测表面对准的开口的盖。 盖可以具有在互连层上方间隔开的上壁和图像传感器IC以限定内部空腔，并且帽可以限定联接到内部空腔的通风口。

公开(公告)号：US20160172272A1

公开(公告)日：2016-06-16

申请号：US14567070

申请日：2014-12-11

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Wing Shenq WONG

IPC: H01L23/495 ,  H01L25/065 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/49513 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L25/0655 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/29011 ,  H01L2224/29076 ,  H01L2224/29082 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83007 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/83815 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/014

Abstract: A single chip integrated circuit (IC) package includes a die pad, and a spacer ring on the die pad defining a solder receiving area. A solder body is on the die pad within the solder receiving area. An IC die is on the spacer ring and is secured to the die pad by the solder body within the solder receiving area. Encapsulating material surrounds the die pad, spacer ring, and IC die. For a multi-chip IC package, a dam structure is on the die pad and defines multiple solder receiving areas. A respective solder body is on the die pad within a respective solder receiving area. An IC die is within each respective solder receiving area and is held in place by a corresponding solder body. Encapsulating material surrounds the die pad, dam structure, and plurality of IC die.

Abstract translation: 单芯片集成电路（IC）封装包括管芯焊盘和在焊盘上的间隔环，其限定焊料接收区域。 焊料体位于焊料接收区域内的焊盘上。 IC芯片位于间隔环上，并通过焊料体在焊料接收区域内固定到管芯焊盘。 封装材料围绕芯片焊盘，间隔环和IC芯片。 对于多芯片IC封装，模块焊盘上有一个坝结构，并定义了多个焊料接收区域。 相应的焊料体在相应的焊料接收区域内的焊盘上。 IC芯片在每个相应的焊料接收区域内，并通过相应的焊料体保持就位。 封装材料围绕芯片焊盘，堤坝结构和多个IC管芯。

公开(公告)号：US20160172262A1

公开(公告)日：2016-06-16

申请号：US14565484

申请日：2014-12-10

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yiyi MA ,  Kim-Yong GOH ,  Xueren ZHANG ,  Wei Zhen GOH

IPC: H01L23/31 ,  H01L23/482 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L24/85 ,  H01L23/3107 ,  H01L23/4822 ,  H01L23/49555 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48177 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An integrated circuit (IC) device includes an IC and encapsulating material surrounding the IC. Leads are coupled to the IC and extend outwardly from sides of the encapsulating material, with each lead having three contiguous exposed segments with upper and lower bends defining a Z-shape. In another example, the leads include an upper horizontal segment, lower horizontal segment, and intermediate curved segment extending upwardly from the upper horizontal segment and downwardly to the lower horizontal segment.

Abstract translation: 集成电路（IC）装置包括IC和围绕IC的封装材料。 引线耦合到IC并从封装材料的侧面向外延伸，每个引线具有三个连续的暴露段，其中上部和下部弯曲限定Z形。 在另一示例中，引线包括上水平段，下水平段和从上水平段向上延伸到下水平段的中间弯曲段。