公开(公告)号：US10070207B2

公开(公告)日：2018-09-04

申请号：US15396035

申请日：2016-12-30

Applicant: Intel Corporation

Inventor： Matthew J. Adiletta ,  Aaron Gorius ,  Myles Wilde ,  Michael T. Crocker

IPC: H04J14/00 ,  H04Q11/00 ,  H04B10/25

Abstract: Technologies for optical communication in a rack cluster in a data center are disclosed. In the illustrative embodiment, a network switch is connected to each of 1,024 sleds by an optical cable that enables communication at a rate of 200 gigabits per second. The optical cable has low loss, allowing for long cable lengths, which in turn allows for connecting to a large number of sleds. The optical cable also has a very high intrinsic bandwidth limit, allowing for the bandwidth to be upgraded without upgrading the optical infrastructure.

公开(公告)号：US20180027703A1

公开(公告)日：2018-01-25

申请号：US15396653

申请日：2016-12-31

Applicant: Intel Corporation

Inventor： Matthew J. Adiletta ,  Aaron Gorius ,  Myles Wilde ,  Michael T. Crocker

IPC: H05K7/20 ,  G05D23/20 ,  G05D23/19

CPC classification number: H04Q11/0005 ,  B25J15/0014 ,  B65G1/0492 ,  G02B6/3882 ,  G02B6/3893 ,  G02B6/3897 ,  G02B6/4292 ,  G02B6/4452 ,  G05D23/1921 ,  G05D23/2039 ,  G06F1/183 ,  G06F3/061 ,  G06F3/0611 ,  G06F3/0613 ,  G06F3/0616 ,  G06F3/0619 ,  G06F3/0625 ,  G06F3/0631 ,  G06F3/0638 ,  G06F3/064 ,  G06F3/0647 ,  G06F3/0653 ,  G06F3/0655 ,  G06F3/0658 ,  G06F3/0659 ,  G06F3/0664 ,  G06F3/0665 ,  G06F3/067 ,  G06F3/0673 ,  G06F3/0679 ,  G06F3/0683 ,  G06F3/0688 ,  G06F3/0689 ,  G06F8/65 ,  G06F9/30036 ,  G06F9/3887 ,  G06F9/4401 ,  G06F9/5016 ,  G06F9/5044 ,  G06F9/505 ,  G06F9/5072 ,  G06F9/5077 ,  G06F9/544 ,  G06F11/141 ,  G06F11/3414 ,  G06F12/0862 ,  G06F12/0893 ,  G06F12/10 ,  G06F12/109 ,  G06F12/1408 ,  G06F13/161 ,  G06F13/1668 ,  G06F13/1694 ,  G06F13/4022 ,  G06F13/4068 ,  G06F13/409 ,  G06F13/42 ,  G06F13/4282 ,  G06F15/8061 ,  G06F16/9014 ,  G06F2209/5019 ,  G06F2209/5022 ,  G06F2212/1008 ,  G06F2212/1024 ,  G06F2212/1041 ,  G06F2212/1044 ,  G06F2212/152 ,  G06F2212/202 ,  G06F2212/401 ,  G06F2212/402 ,  G06F2212/7207 ,  G06Q10/06 ,  G06Q10/06314 ,  G06Q10/087 ,  G06Q10/20 ,  G06Q50/04 ,  G07C5/008 ,  G08C17/02 ,  G08C2200/00 ,  G11C5/02 ,  G11C5/06 ,  G11C7/1072 ,  G11C11/56 ,  G11C14/0009 ,  H03M7/30 ,  H03M7/3084 ,  H03M7/3086 ,  H03M7/40 ,  H03M7/4031 ,  H03M7/4056 ,  H03M7/4081 ,  H03M7/6005 ,  H03M7/6023 ,  H04B10/25 ,  H04B10/2504 ,  H04L9/0643 ,  H04L9/14 ,  H04L9/3247 ,  H04L9/3263 ,  H04L12/2809 ,  H04L29/12009 ,  H04L41/024 ,  H04L41/046 ,  H04L41/0813 ,  H04L41/082 ,  H04L41/0896 ,  H04L41/12 ,  H04L41/145 ,  H04L41/147 ,  H04L41/5019 ,  H04L43/065 ,  H04L43/08 ,  H04L43/0817 ,  H04L43/0876 ,  H04L43/0894 ,  H04L43/16 ,  H04L45/02 ,  H04L45/52 ,  H04L47/24 ,  H04L47/38 ,  H04L47/765 ,  H04L47/782 ,  H04L47/805 ,  H04L47/82 ,  H04L47/823 ,  H04L49/00 ,  H04L49/15 ,  H04L49/25 ,  H04L49/357 ,  H04L49/45 ,  H04L49/555 ,  H04L67/02 ,  H04L67/10 ,  H04L67/1004 ,  H04L67/1008 ,  H04L67/1012 ,  H04L67/1014 ,  H04L67/1029 ,  H04L67/1034 ,  H04L67/1097 ,  H04L67/12 ,  H04L67/16 ,  H04L67/306 ,  H04L67/34 ,  H04L69/04 ,  H04L69/329 ,  H04Q1/04 ,  H04Q11/00 ,  H04Q11/0003 ,  H04Q11/0062 ,  H04Q11/0071 ,  H04Q2011/0037 ,  H04Q2011/0041 ,  H04Q2011/0052 ,  H04Q2011/0073 ,  H04Q2011/0079 ,  H04Q2011/0086 ,  H04Q2213/13523 ,  H04Q2213/13527 ,  H04W4/023 ,  H04W4/80 ,  H05K1/0203 ,  H05K1/181 ,  H05K5/0204 ,  H05K7/1418 ,  H05K7/1421 ,  H05K7/1422 ,  H05K7/1447 ,  H05K7/1461 ,  H05K7/1485 ,  H05K7/1487 ,  H05K7/1489 ,  H05K7/1491 ,  H05K7/1492 ,  H05K7/1498 ,  H05K7/2039 ,  H05K7/20709 ,  H05K7/20727 ,  H05K7/20736 ,  H05K7/20745 ,  H05K7/20836 ,  H05K13/0486 ,  H05K2201/066 ,  H05K2201/10121 ,  H05K2201/10159 ,  H05K2201/10189 ,  Y02D10/14 ,  Y02D10/151 ,  Y02P90/30 ,  Y04S10/54 ,  Y10S901/01

Abstract: Technologies for rack cooling includes monitoring a temperature of a sled mounted in a rack and controlling a cooling system of the rack based on the temperature of the sled. The cooling system includes a cooling fan array, which may be controlled to cool the sled. Additionally, if needed, one or more adjacent cooling fan arrays that are located adjacent to the controlled cooling fan array may be adjusted to provide additional cooling to the sled.

公开(公告)号：US20180024306A1

公开(公告)日：2018-01-25

申请号：US15396041

申请日：2016-12-30

Applicant: INTEL CORPORATION

Inventor： Matthew J. Adiletta ,  Aaron Gorius ,  Myles Wilde ,  Michael T. Crocker

IPC: G02B6/44 ,  G02B6/42 ,  G02B6/38

Abstract: Technologies for blind mating of optical connectors in a rack of a data center are disclosed. In the illustrative embodiment, a sled can be slid into a rack and an optical connector on the sled will blindly mate with a corresponding optical connector on the rack. The illustrative optical connector on the sled includes two guide post receivers which mate with corresponding guide posts on the optical connector on the rack such that, when mated, optical fibers of the optical connector on the rack will be aligned and optically coupled with corresponding optical fibers on the optical connector of the sled.

公开(公告)号：US12082370B2

公开(公告)日：2024-09-03

申请号：US17337342

申请日：2021-06-02

Applicant: Intel Corporation

Inventor： Aaron Gorius ,  Michael T. Crocker ,  Jonathan W. Thibado ,  Matthew J. Adiletta ,  John C. Gulick ,  Emery E. Frey

IPC: H05K7/20

CPC classification number: H05K7/20272 ,  H05K7/20236 ,  H05K7/20281 ,  H05K7/205

Abstract: Examples described herein relate to a system. The system can include a container that contains fluid to provide two phase immersion liquid cooling (2PILC) for a system within the container. The container can enclose a first circuit board with a first side of the first circuit board is conductively coupled to at least one device. The container can enclose a motherboard conductively coupled to a second side of the first circuit board with a first side of the motherboard is conductively coupled to the second side of the first circuit board. The motherboard can include at least four edges. Connectors can conductively connect the motherboard with a second circuit board. The second circuit board can include at least four edges and an edge of the motherboard is oriented approximately 90 degrees to an edge of the second circuit board. At least one device can include one or more of: a processor, memory device, accelerator device, or network interface.

公开(公告)号：US11349734B2

公开(公告)日：2022-05-31

申请号：US16506457

申请日：2019-07-09

Applicant: Intel Corporation

Inventor： Matthew J. Adiletta ,  Aaron Gorius ,  Myles Wilde ,  Michael T. Crocker

IPC: G06F7/00 ,  H04L43/08 ,  G06F16/901 ,  H04B10/25 ,  G02B6/38 ,  G02B6/42 ,  G02B6/44 ,  G06F1/18 ,  G06F1/20 ,  G06F3/06 ,  G06F8/65 ,  G06F9/30 ,  G06F9/4401 ,  G06F9/54 ,  G06F12/109 ,  G06F12/14 ,  G06F13/16 ,  G06F13/40 ,  G08C17/02 ,  G11C5/02 ,  G11C7/10 ,  G11C11/56 ,  G11C14/00 ,  H03M7/30 ,  H03M7/40 ,  H04L41/14 ,  H04L43/0817 ,  H04L43/0876 ,  H04L43/0894 ,  H04L49/00 ,  H04L49/25 ,  H04L49/356 ,  H04L49/45 ,  H04L67/02 ,  H04L67/306 ,  H04L69/04 ,  H04L69/329 ,  H04Q11/00 ,  H05K7/14 ,  G06F15/16 ,  G06F9/38 ,  G06F9/50 ,  H04L41/12 ,  H04L41/5019 ,  H04L43/16 ,  H04L47/24 ,  H04L47/38 ,  H04L67/1004 ,  H04L67/1034 ,  H04L67/1097 ,  H04L67/12 ,  H04L67/51 ,  H05K5/02 ,  H04W4/80 ,  G06Q10/08 ,  G06Q10/00 ,  G06Q50/04 ,  H04L43/065 ,  H04J14/00 ,  H04L41/147 ,  H04L67/1008 ,  H04L41/0813 ,  H04L67/1029 ,  H04L41/0896 ,  H04L47/70 ,  H04L47/78 ,  H04L41/082 ,  H04L67/00 ,  H04L67/1012 ,  B25J15/00 ,  B65G1/04 ,  H05K7/20 ,  H04L49/55 ,  H04L67/10 ,  H04W4/02 ,  H04L45/02 ,  G06F13/42 ,  H05K1/18 ,  G05D23/19 ,  G05D23/20 ,  H04L47/80 ,  H05K1/02 ,  H04L45/52 ,  H04Q1/04 ,  G06F12/0893 ,  H05K13/04 ,  G11C5/06 ,  G06F11/14 ,  G06F11/34 ,  G06F12/0862 ,  G06F15/80 ,  H04L47/765 ,  H04L67/1014 ,  G06F12/10 ,  G06Q10/06 ,  G07C5/00 ,  H04L12/28 ,  H04L61/00 ,  H04L41/02 ,  H04L9/06 ,  H04L9/14 ,  H04L9/32 ,  H04L41/046 ,  H04L49/15

Abstract: Examples may include racks for a data center and sleds for the racks, the sleds arranged to house physical resources for the data center. The sleds and racks can be arranged to be autonomously manipulated, such as, by a robot. The sleds and racks can include features to facilitate automated installation, removal, maintenance, and manipulation by a robot.

公开(公告)号：US11200104B2

公开(公告)日：2021-12-14

申请号：US16346341

申请日：2017-11-29

Applicant: INTEL CORPORATION

Inventor： Matthew J. Adiletta ,  Myles Wilde ,  Aaron Gorius ,  Michael T. Crocker ,  Paul H. Dormitzer ,  Mark A. Schmisseur

IPC: H01P5/08 ,  H01P5/00 ,  H04B3/52 ,  H05K7/14 ,  G06F11/07 ,  G06F11/30 ,  G06F9/50 ,  G06F11/34 ,  H04Q11/00 ,  G06F16/28

Abstract: Racks and rack pods to support a plurality of sleds are disclosed herein. Switches for use in the rack pods are also disclosed herein. A rack comprises a plurality of sleds and a plurality of electromagnetic waveguides. The plurality of sleds are vertically spaced from one another. The plurality of electromagnetic waveguides communicate data signals between the plurality of sleds.

公开(公告)号：US20200052494A1

公开(公告)日：2020-02-13

申请号：US16057588

申请日：2018-08-07

Applicant: Intel Corporation

Inventor： Naoki Matsumura ,  Simon N. Peffers ,  Steven Lloyd ,  Michael T. Crocker ,  Aaron Gorius

IPC: H02J7/00

Abstract: In some examples, a control unit is configured to adjust charge termination voltage of a rechargeable energy storage device. The control unit is adapted to charge the rechargeable energy storage device to a charge termination voltage where the rechargeable energy storage device has capacity to support peak load but comes close to a system shutdown voltage after supporting peak load. The control unit is also adapted to increase the charge termination voltage if a voltage of the rechargeable energy storage device is near a system shutdown voltage after supporting peak load.

公开(公告)号：US10356495B2

公开(公告)日：2019-07-16

申请号：US15396653

申请日：2016-12-31

Applicant: Intel Corporation

Inventor： Matthew J. Adiletta ,  Aaron Gorius ,  Myles Wilde ,  Michael T. Crocker

IPC: H05K7/20 ,  H04Q11/00 ,  H03M7/40 ,  H03M7/30 ,  G06F16/901 ,  G06F3/06 ,  G11C7/10 ,  H05K7/14 ,  G06F1/18 ,  G06F13/40 ,  H05K5/02 ,  G08C17/02 ,  H04L12/24 ,  H04L29/08 ,  H04L12/26 ,  H04L12/851 ,  G06F9/50 ,  H04L12/911 ,  G06F12/109 ,  H04L29/06 ,  G11C14/00 ,  G11C5/02 ,  G11C11/56 ,  G02B6/44 ,  G06F8/65 ,  G06F12/14 ,  G06F13/16 ,  H04B10/25 ,  G06F9/4401 ,  G02B6/38 ,  G02B6/42 ,  B25J15/00 ,  B65G1/04 ,  H04L12/931 ,  H04L12/939 ,  H04W4/02 ,  H04L12/751 ,  G06F13/42 ,  H05K1/18 ,  G05D23/19 ,  G05D23/20 ,  H04L12/927 ,  H05K1/02 ,  H04L12/781 ,  H04Q1/04 ,  G06F12/0893 ,  H05K13/04 ,  G11C5/06 ,  G06F11/14 ,  G06F11/34 ,  G06F12/0862 ,  G06F15/80 ,  H04L12/919 ,  G06F12/10 ,  G06Q10/06 ,  G07C5/00 ,  H04L12/28 ,  H04L29/12 ,  H04L9/06 ,  H04L9/14 ,  H04L9/32 ,  H04L12/933 ,  H04L12/947 ,  H04L12/811 ,  H04W4/80 ,  G06Q10/08 ,  G06Q10/00 ,  G06Q50/04

Abstract: Technologies for rack cooling includes monitoring a temperature of a sled mounted in a rack and controlling a cooling system of the rack based on the temperature of the sled. The cooling system includes a cooling fan array, which may be controlled to cool the sled. Additionally, if needed, one or more adjacent cooling fan arrays that are located adjacent to the controlled cooling fan array may be adjusted to provide additional cooling to the sled.

公开(公告)号：US10349152B2

公开(公告)日：2019-07-09

申请号：US15396187

申请日：2016-12-30

Applicant: INTEL CORPORATION

Inventor： Matthew J. Adiletta ,  Aaron Gorius ,  Myles Wilde ,  Michael T. Crocker

IPC: G06F1/16 ,  H04Q11/00 ,  H03M7/40 ,  H03M7/30 ,  G06F16/901 ,  G06F3/06 ,  G11C7/10 ,  H05K7/14 ,  G06F1/18 ,  G06F13/40 ,  H05K5/02 ,  G08C17/02 ,  H04L12/24 ,  H04L29/08 ,  H04L12/26 ,  H04L12/851 ,  G06F9/50 ,  H04L12/911 ,  G06F12/109 ,  H04L29/06 ,  G11C14/00 ,  G11C5/02 ,  G11C11/56 ,  G02B6/44 ,  G06F8/65 ,  G06F12/14 ,  G06F13/16 ,  H04B10/25 ,  G06F9/4401 ,  G02B6/38 ,  G02B6/42 ,  B25J15/00 ,  B65G1/04 ,  H05K7/20 ,  H04L12/931 ,  H04L12/939 ,  H04W4/02 ,  H04L12/751 ,  G06F13/42 ,  H05K1/18 ,  G05D23/19 ,  G05D23/20 ,  H04L12/927 ,  H05K1/02 ,  H04L12/781 ,  H04Q1/04 ,  G06F12/0893 ,  H05K13/04 ,  G11C5/06 ,  G06F11/14 ,  G06F11/34 ,  G06F12/0862 ,  G06F15/80 ,  H04L12/919 ,  G06F12/10 ,  G06Q10/06 ,  G07C5/00 ,  H04L12/28 ,  H04L29/12 ,  H04L9/06 ,  H04L9/14 ,  H04L9/32 ,  H04L12/933 ,  H04L12/947 ,  H04L12/811 ,  H04W4/80 ,  G06Q10/08 ,  G06Q10/00 ,  G06Q50/04

Abstract: Examples may include racks for a data center and sleds for the racks, the sleds arranged to house physical resources for the data center. The sleds and racks can be arranged to be autonomously manipulated, such as, by a robot. The sleds and racks can include features to facilitate automated installation, removal, maintenance, and manipulation by a robot.

公开(公告)号：US20190021182A1

公开(公告)日：2019-01-17

申请号：US16120419

申请日：2018-09-03

Applicant: Intel Corporation

Inventor： Matthew J. Adiletta ,  Aaron Gorius ,  Myles Wilde ,  Michael T. Crocker

IPC: H05K7/14 ,  H05K13/04 ,  H05K7/20 ,  H05K5/02 ,  H05K1/18 ,  H05K1/02 ,  H04W4/02 ,  H04Q11/00 ,  H04Q1/04 ,  H04L29/08 ,  H04L29/06 ,  H04L12/939 ,  H04L12/931 ,  H04L12/947 ,  H04L12/933 ,  H04L12/911 ,  H04L12/927 ,  H04L12/919 ,  H04L12/851 ,  H04L12/781 ,  H04L12/751 ,  H04L12/26 ,  H04L12/24 ,  H04L29/12 ,  H04L12/28 ,  H04L9/32 ,  H04L9/14 ,  H04L9/06 ,  H04B10/25 ,  H03M7/30 ,  H03M7/40 ,  G11C14/00 ,  G11C11/56 ,  G11C7/10 ,  G11C5/06 ,  G11C5/02 ,  G08C17/02 ,  G07C5/00 ,  G06Q10/06 ,  G06F17/30 ,  G06F15/80 ,  G06F13/42 ,  G06F13/40 ,  G06F13/16 ,  G06F12/14 ,  G06F12/109 ,  G06F12/10 ,  G06F12/0893 ,  G06F12/0862 ,  G06F11/34 ,  G06F11/14 ,  G06F9/50 ,  G06F9/4401 ,  G06F8/65 ,  G06F3/06 ,  G06F1/18 ,  G05D23/20 ,  G05D23/19 ,  G02B6/44 ,  G02B6/42 ,  G02B6/38 ,  B65G1/04 ,  B25J15/00 ,  H04W4/80 ,  G06Q50/04 ,  G06Q10/00 ,  G06Q10/08

Abstract: Technologies for optical communication in a rack cluster in a data center are disclosed. In the illustrative embodiment, a network switch is connected to each of 1,024 sleds by an optical cable that enables communication at a rate of 200 gigabits per second. The optical cable has low loss, allowing for long cable lengths, which in turn allows for connecting to a large number of sleds. The optical cable also has a very high intrinsic bandwidth limit, allowing for the bandwidth to be upgraded without upgrading the optical infrastructure.