公开(公告)号：US20090236128A1

公开(公告)日：2009-09-24

申请号：US12407685

申请日：2009-03-19

Applicant: Kiyotaka Tsukada ,  Takamichi Sugiura

Inventor： Kiyotaka Tsukada ,  Takamichi Sugiura

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/06

CPC classification number: H05K3/4644 ,  H05K3/0038 ,  H05K3/384 ,  H05K3/386 ,  H05K3/388 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2203/0353 ,  Y10T29/49126 ,  Y10T29/49156 ,  Y10T156/10

Abstract: A multilayer printed wiring board is manufactured by a method in which a core substrate is provided, an insulation layer including a thermosetting resin material is formed over the core substrate, an uncured resin layer including a thermoplastic resin material is placed on the insulation layer, the uncured resin layer is cured to form a resin complex layer including a resin complex comprising the thermosetting resin material and the thermoplastic resin material, and a conductive circuit is formed over the resin complex layer.

Abstract translation: 通过设置芯基板的方法制造多层印刷布线板，在芯基板上形成包含热固性树脂材料的绝缘层，将包含热塑性树脂材料的未固化树脂层放置在绝缘层上， 固化未固化的树脂层以形成包含含有热固性树脂材料和热塑性树脂材料的树脂配合物的树脂复合层，并且在树脂复合层上形成导电电路。

公开(公告)号：US07339118B1

公开(公告)日：2008-03-04

申请号：US09380994

申请日：1998-03-09

Applicant: Masaru Takada ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Hiroyuki Kobayashi ,  Mitsuhiro Kondo

Inventor： Masaru Takada ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Hiroyuki Kobayashi ,  Mitsuhiro Kondo

IPC: H05K1/03 ,  H05K3/36

CPC classification number: H01L24/49 ,  H01L23/49822 ,  H01L23/50 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/351 ,  H05K1/021 ,  H05K1/113 ,  H05K1/114 ,  H05K3/0035 ,  H05K3/28 ,  H05K3/3457 ,  H05K3/385 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4697 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2203/0315 ,  H05K2203/0554 ,  H05K2203/1581 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: In a printed wiring board, an odd number (n) of conductive layers (11-13) and insulating layers (21-23) are alternately laminated upon each other. The first conductive layer (11) is a parts connecting layer and the n-th conductive layer (13) is an external connecting layer which is connected to external connecting terminals (7). The second to (n−1)-th conductive layers (12) are current transmitting layers for transmitting internal currents. The surface of the n-th insulating layer (23) in a state where the external connecting terminals (7) are exposed on the surface. It is preferable to make the initial insulating layers of a glass-cloth reinforced prepreg and the external insulating layers of a resin.

Abstract translation: 在印刷电路板中，奇数（n）个导电层（11-13）和绝缘层（21-23）交替层叠。 第一导电层（11）是部分连接层，第n导电层（13）是连接到外部连接端子（7）的外部连接层。 第二到第（n-1）个导电层（12）是用于传输内部电流的电流传输层。 第n绝缘层（23）的表面露出外部连接端子（7）的状态。 优选制作玻璃布预浸料坯的初始绝缘层和树脂的外部绝缘层。

公开(公告)号：US20060169484A1

公开(公告)日：2006-08-03

申请号：US11304770

申请日：2005-12-16

Applicant: Takahiro Yamashita ,  Hiroyuki Watanabe ,  Kiyotaka Tsukada ,  Michio Ido ,  Morio Nakao

Inventor： Takahiro Yamashita ,  Hiroyuki Watanabe ,  Kiyotaka Tsukada ,  Michio Ido ,  Morio Nakao

IPC: H05K1/18 ,  H05K3/34

CPC classification number: H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/113 ,  H05K3/3457 ,  H05K2201/0347 ,  H05K2201/09436 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09627 ,  H05K2201/098 ,  Y10T29/49144 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: This invention provides a printed wiring board having an intensified drop impact resistance of a joint portion between pad and solder. An electrode pad comprises pad portion loaded with solder ball and a cylindrical portion projecting to the solder ball supporting the pad portion. An outer edge of the pad portion extends sideway from a cylindrical portion so that the outer edge is capable of bending. If the outer edge bends when stress is applied to the solder ball 30, stress on the outer edge of the pad portion on which stress is concentrated can be relaxed so as to intensify the joint strength between an electrode pad and solder ball.

Abstract translation: 本发明提供了一种印刷电路板，其具有焊盘和焊料之间的接合部分的强烈的耐滴落冲击性。 电极焊盘包括装载有焊球的焊盘部分和突出到支撑焊盘部分的焊球的圆柱形部分。 衬垫部分的外边缘从圆筒部分侧向延伸，使得外边缘能够弯曲。 如果当对焊球30施加应力时外边缘弯曲，则可以放松应力集中的焊盘部分的外边缘上的应力，以增强电极焊盘和焊球之间的接合强度。

公开(公告)号：US20060068613A1

公开(公告)日：2006-03-30

申请号：US11229672

申请日：2005-09-20

Applicant: Kiyotaka Tsukada ,  Terumasa Ninomaru ,  Masaki Kizaki

Inventor： Kiyotaka Tsukada ,  Terumasa Ninomaru ,  Masaki Kizaki

IPC: H01R12/00

CPC classification number: H05K1/028 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01R12/714 ,  H05K1/0366 ,  H05K1/141 ,  H05K3/28 ,  H05K3/363 ,  H05K3/4652 ,  H05K3/4682 ,  H05K2201/029 ,  H05K2203/1536

Abstract: A flexible printed wiring board includes a first conductor layer in the element mounting part adjacent to the top surface of the wiring board; a second conductor layer in the element mounting part adjacent to the bottom surface of the wiring board; and a third conductor layer between the first conductor layer and the second conductor layer, wherein the first and third conductor layers extend through and beyond the bending part, and the second conductor layer is absent in the bending part.

Abstract translation: 柔性印刷布线板包括与元件安装部分相邻的第一导体层，与布线板的顶表面相邻; 所述元件安装部分中的与所述布线板的底面相邻的第二导体层; 以及在所述第一导体层和所述第二导体层之间的第三导体层，其中所述第一和第三导体层延伸穿过所述弯曲部分并且超过所述弯曲部分，并且所述第二导体层在所述弯曲部分中不存在。

公开(公告)号：US06986917B2

公开(公告)日：2006-01-17

申请号：US10408588

申请日：2003-04-07

Applicant: Masaru Takada ,  Hiroyuki Kobayashi ,  Kenji Chihara ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Mitsuhiro Kondo

Inventor： Masaru Takada ,  Hiroyuki Kobayashi ,  Kenji Chihara ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Mitsuhiro Kondo

IPC: B05D3/04

CPC classification number: H01L24/32 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/112 ,  H05K1/116 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/027 ,  H05K3/242 ,  H05K3/243 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/428 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09381 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/0959 ,  H05K2201/09781 ,  H05K2203/0554 ,  H05K2203/0571 ,  H05K2203/107 ,  H05K2203/175 ,  Y10S428/901 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

Abstract translation: 在具有导体电路（6）的绝缘板（7）的表面上印刷包括热固性树脂的阻焊剂。 然后将阻焊剂热固化以形成具有低热膨胀系数的绝缘膜（1）。 然后将激光束（2）施加到要形成开口的绝缘膜的部分，以烧掉用于形成开口（10）的相同部分，由此导体电路（6）暴露。 该开口可以通过在其内表面上形成金属电镀膜而形成为导电孔。 优选地，形成外部连接垫以覆盖开口。 通过使用在电镀完成后优选用激光束切断的电镀铅来形成金属涂膜。

公开(公告)号：US06809415B2

公开(公告)日：2004-10-26

申请号：US09740424

申请日：2000-12-19

Applicant: Kiyotaka Tsukada ,  Mitsuhiro Kondo ,  Kenji Chihara ,  Naoto Ishida ,  Atsushi Shouda

Inventor： Kiyotaka Tsukada ,  Mitsuhiro Kondo ,  Kenji Chihara ,  Naoto Ishida ,  Atsushi Shouda

IPC: H01L2348

CPC classification number: H05K3/3452 ,  H01L23/3171 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/1148 ,  H01L2224/13021 ,  H01L2924/0002 ,  H05K3/3457 ,  H05K2201/098 ,  H05K2203/0594 ,  H01L2224/05552

Abstract: A printed circuit board 1 providing superior adhesion between a substrate 2 and a conductor pattern 3 and preventing damage of the substrate 2. The width c of the bottom surface 310 of the conductor pattern 3 is greater than the width d of the top surface 320. Accordingly, the conductor pattern 3 has a trapezoidal cross-section. The two side surfaces 315 of a lower portion 31 of the conductor pattern 3 are coated by a solder resist. The two side surfaces 325 at the upper portion 32 of the conductor pattern 3 are exposed from the solder resist 4. A solder ball 6 engages the two side surfaces 325.

Abstract translation: 一种印刷电路板1，其在基板2和导体图案3之间提供优异的粘合性并防止基板2的损坏。导体图案3的底面310的宽度c大于顶面320的宽度d。 因此，导体图案3具有梯形截面。 导体图案3的下部31的两个侧表面315被阻焊剂涂覆。 导体图案3的上部32处的两个侧表面325从阻焊剂4露出。焊球6与两个侧表面325接合。

公开(公告)号：US06455783B1

公开(公告)日：2002-09-24

申请号：US09554481

申请日：2000-05-11

Applicant: Kiyotaka Tsukada ,  Mitsuhiro Kondo ,  Naoto Ishida ,  Kouji Asano ,  Hisashi Minoura

Inventor： Kiyotaka Tsukada ,  Mitsuhiro Kondo ,  Naoto Ishida ,  Kouji Asano ,  Hisashi Minoura

IPC: H05K103

CPC classification number: H05K3/403 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49805 ,  H01L23/49822 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H05K1/182 ,  H05K3/0035 ,  H05K3/0082 ,  H05K3/064 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/09454 ,  H05K2201/09518 ,  H05K2201/09645 ,  H05K2203/0554 ,  H05K2203/1394 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00

Abstract: A method for manufacturing a multilayer printed circuit board that shortens the distance between pattern layers and facilitates formation of a minute conductive hole having superior conductive reliability. A core substrate (21) including ad core pattern (12, 13), which has a pad (101, 111), is first prepared. Then, a laminated plate is formed by laminating an insulating layer (22) on the surface of the core substrate. Afterward, a surface pattern (11) is formed on the surface of the laminated plate. Further, the conductive hole (30, 31) is formed by irradiating a laser beam at the laminated plate. The bottom opening of the conductive hole (30, 31) is covered by the pad (101, 111).

Abstract translation: 一种制造多层印刷电路板的方法，其缩短图案层之间的距离，并且有助于形成具有优良导电可靠性的微小导电孔。 首先准备包括具有焊盘（101,111）的焊盘图案（12,13）的芯基板（21）。 然后，通过在芯基板的表面上层叠绝缘层（22）来形成层压板。 之后，在层叠板的表面上形成表面图案（11）。 此外，通过在层压板上照射激光束来形成导电孔（30,31）。 导电孔（30,31）的底部开口由垫（101,111）覆盖。

公开(公告)号：US06201185B1

公开(公告)日：2001-03-13

申请号：US09091505

申请日：1998-09-09

Applicant: Naoto Ishida ,  Teruo Hayashi ,  Kiyotaka Tsukada

Inventor： Naoto Ishida ,  Teruo Hayashi ,  Kiyotaka Tsukada

IPC: H01L2302

CPC classification number: H01L21/4846 ,  H01L23/055 ,  H01L23/49805 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/12041 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  Y10T29/4913 ,  Y10T29/49135 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A plurality of side-surface patterns 11 and 12 are disposed on the wall surfaces of a mount opening portion 2 for mounting electronic parts thereat. The mount opening portion includes projection portions 21 that project toward an interior thereof from the wall surfaces thereof. End portions of the respective side-surface patterns 11 and 12 extend to the side surfaces of the projection portions 21. Also, a plurality of side-surface patterns can be provided on the wall surfaces of the mount opening portion by etching the side-surface pattern non-formation portions of the conductive layer formed on the entirety of the wall surfaces of the mount opening portion in a state where the side-surface pattern formation portions are coated with a side-surface pattern resist film made of a negative photosensitive resin. With this structure, the side-surface patterns can be prevented from being peeled off, and side-surface patterns having a plurality of potentials can be readily formed.

Abstract translation: 多个侧面图案11和12设置在用于在其上安装电子部件的安装开口部分2的壁表面上。 安装开口部分包括从其壁表面向其内部突出的突出部分21。 各侧面图案11,12的端部延伸到突出部21的侧面。另外，通过蚀刻侧面图案，可以在安装口部的壁面上设置多个侧面图案 在侧面图案形成部分涂覆有由负感光性树脂制成的侧面图案抗蚀剂膜的状态下，形成在安装开口部分的整个壁表面上的导电层的图案非形成部分。 利用这种结构，可以防止侧表面图案被剥离，并且可以容易地形成具有多个电位的侧表面图案。

公开(公告)号：US4993481A

公开(公告)日：1991-02-19

申请号：US412837

申请日：1989-09-26

Applicant: Masayuki Kamimoto ,  Yoshiyuki Abe ,  Yoshio Takahashi ,  Ryuji Sakamoto ,  Kotaro Tanaka ,  Akira Negishi ,  Hidetoshi Yamauchi ,  Kiyotaka Tsukada ,  Yoshimi Ohashi

Inventor： Masayuki Kamimoto ,  Yoshiyuki Abe ,  Yoshio Takahashi ,  Ryuji Sakamoto ,  Kotaro Tanaka ,  Akira Negishi ,  Hidetoshi Yamauchi ,  Kiyotaka Tsukada ,  Yoshimi Ohashi

IPC: F28D20/00 ,  C04B38/00 ,  F28D20/02

CPC classification number: F28D20/02 ,  C04B38/0006 ,  F28D20/023 ,  Y02E60/145

Abstract: A thermal storage unit has a thermal storage material which performs heat exchange through a fluid filled in a thermal storage body arranged within a vessel having an opening communicated to outside. The thermal storage body is a porous ceramic molding which contains the thermal storage medium.

Abstract translation: 热存储单元具有通过布置在具有与外部连通的开口的容器内的蓄热体中填充的流体进行热交换的蓄热材料。 储热体是含有热存储介质的多孔陶瓷模制件。

公开(公告)号：US4846673A

公开(公告)日：1989-07-11

申请号：US223274

申请日：1988-07-22

Applicant: Kiyotaka Tsukada

Inventor： Kiyotaka Tsukada

IPC: C04B41/88 ,  C04B35/565

CPC classification number: C04B35/565

Abstract: A process for preparing a heat-resistant composite body, comprising forming silicon carbide crystal powder into a molded product, sintering the molded product in a non-oxidizing atmosphere, and thereafter filling with metallic silicon the inside of permeable voids of said porous body obtained by sintering. Powder having an average particle diameter of 5 .mu.m or less is used as said silicon carbide crystals to form it into secondary particles having an average particle diameter of from 40 to 150 .mu.m and such a particle size distribution that 60% by weight or more of particles are included in .+-.20% of the average particle diameter. This is followed by pressure molding to form a molded product using a molding pressure such that said granular secondary particles collapse at their surface areas to mutually bond there and at the same time the insides thereof remain uncollapsed, and also the molded product may have a bulk specific density of from 1.1 to 2.0 g/cm.sup.3. The molded product is heated to a temperature of from 1,400.degree. to 2,100.degree. C. to carry out sintering in a non-oxidizing atmosphere. Thereafter the inside of the resulting sintered body is filled with metallic silicon in an amount of from 45 to 140 parts by weight based on 100 parts by weight of the silicon carbide.