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    Composites of powdered fillers and polymer matrix
    21.
    发明授权
    Composites of powdered fillers and polymer matrix 有权
    粉末填料和聚合物基体的复合材料

    公开(公告)号：US06391082B1

    公开(公告)日：2002-05-21

    申请号：US09345813

    申请日：1999-07-02

    Applicant: Richard A. Holl

    Inventor： Richard A. Holl

    IPC: C22C105

    CPC classification number: B22F3/227 ,  B01F2013/1086 ,  B01J2219/00094 ,  B22F1/0074 ,  B22F1/02 ,  B22F3/20 ,  B22F7/04 ,  B22F2998/00 ,  B29B7/401 ,  B29B7/603 ,  B29B7/82 ,  B29B7/845 ,  B29B7/90 ,  B29B13/10 ,  B29C47/00 ,  B29C47/0019 ,  B29C47/50 ,  B29C67/242 ,  B29C70/58 ,  B29K2021/00 ,  B29K2071/00 ,  B29K2105/16 ,  B29K2503/04 ,  C08J3/212 ,  C08J2371/12 ,  C08K3/01 ,  C08L71/12 ,  C22C32/0094 ,  H01L21/4882 ,  H01L23/145 ,  H01L23/293 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/12044 ,  H05K1/0373 ,  H05K3/022 ,  H05K3/14 ,  H05K3/381 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0227 ,  H05K2201/0254 ,  H05K2201/068 ,  H05K2201/0792 ,  H05K2201/083 ,  H05K2203/0278 ,  H05K2203/068 ,  H05K2203/1194 ,  Y10T428/12028 ,  H01L2924/00

    Abstract: Composite materials comprising at least 60 volume %, preferably 70 volume %, of particles of finely powdered filler material in a matrix of poly(arylene ether) polymer material are made by forming a mixture of the components, forming the required bodies therefrom, and then heating and pressing the bodies to a temperature sufficient to melt the polymer and to a pressure sufficient to disperse the melted polymer into the interstices between the filler particles. Surprisingly these polymer materials can only be effective as bonding materials when the solids content is as high as that specified, since with lower contents the resultant bodies are too friable. This is completely contrary to accepted prior art practice which considers that composites are progressivly weakened as the solids content is increased, so that such content must be limited. In processes to obtain as complete a dispersion of the components as possible they are individually dispersed in a liquid dispersion medium containing the polymer together with necessary additives, each mixture being ground if required to obtain a desired particle size, the mixtures are mixed, again ground to produce thorough dispersion, are separated from the liquid dispersion medium and green articles formed from the resulting pasty mixture. The green articles are then heated and pressed as described above. Mixtures of different filler materials may be used to tailor the electrical and physical properties of the final materials. The articles preferably comprise substrates for use in electronic circuits.

    Abstract translation: 在聚（亚芳基醚）聚合物材料的基体中包含至少60体积％，优选70体积％的细粉末状填料的颗粒的复合材料通过形成组分的混合物制成，从而形成所需体，然后 将物体加热和压制到足以熔化聚合物的温度和足以将熔融的聚合物分散到填料颗粒之间的空隙中的压力。 令人惊讶的是，当固体含量高达规定值时，这些聚合物材料只能作为粘合材料有效，因为所得物体的含量较低，因此太脆。 这完全违背了接受的现有技术实践，认为随着固体含量增加，复合材料逐渐减弱，因此这些内容必须受到限制。 在获得尽可能完整的组分分散体的方法中，它们分别分散在含有聚合物的液体分散介质中以及必要的添加剂，如果需要，每个混合物被研磨以获得所需的粒度，混合物再次混合 从液体分散介质和由所得糊状混合物形成的绿色物品分离，以产生彻底的分散。 然后如上所述加热和按压绿色制品。 可以使用不同填料材料的混合物来定制最终材料的电学和物理性能。 物品优选地包括用于电子电路的基底。

    COMPOSITES OF POWDERED FILLERS AND POLYMER MATRIX
    22.
    发明申请
    COMPOSITES OF POWDERED FILLERS AND POLYMER MATRIX 有权
    粉末填料和聚合物基质的复合材料

    公开(公告)号：US20020038582A1

    公开(公告)日：2002-04-04

    申请号：US09345813

    申请日：1999-07-02

    Inventor： RICHARD A. HOLL

    IPC: C22C029/00

    CPC classification number: B22F3/227 ,  B01F2013/1086 ,  B01J2219/00094 ,  B22F1/0074 ,  B22F1/02 ,  B22F3/20 ,  B22F7/04 ,  B22F2998/00 ,  B29B7/401 ,  B29B7/603 ,  B29B7/82 ,  B29B7/845 ,  B29B7/90 ,  B29B13/10 ,  B29C47/00 ,  B29C47/0019 ,  B29C47/50 ,  B29C67/242 ,  B29C70/58 ,  B29K2021/00 ,  B29K2071/00 ,  B29K2105/16 ,  B29K2503/04 ,  C08J3/212 ,  C08J2371/12 ,  C08K3/01 ,  C08L71/12 ,  C22C32/0094 ,  H01L21/4882 ,  H01L23/145 ,  H01L23/293 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/12044 ,  H05K1/0373 ,  H05K3/022 ,  H05K3/14 ,  H05K3/381 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0227 ,  H05K2201/0254 ,  H05K2201/068 ,  H05K2201/0792 ,  H05K2201/083 ,  H05K2203/0278 ,  H05K2203/068 ,  H05K2203/1194 ,  Y10T428/12028 ,  H01L2924/00

    Abstract: Composite materials comprising at least 60 volume %, preferably 70 volume %, of particles of finely powdered filler material in a matrix of poly(arylene ether) polymer material are made by forming a mixture of the components, forming the required bodies therefrom, and then heating and pressing the bodies to a temperature sufficient to melt the polymer and to a pressure sufficient to disperse the melted polymer into the interstices between the filler particles. Surprisingly these polymer materials can only be effective as bonding materials when the solids content is as high as that specified, since with lower contents the resultant bodies are too friable. This is completely contrary to accepted prior art practice which considers that composites are progressivly weakened as the solids content is increased, so that such content must be limited. In processes to obtain as complete a dispersion of the components as possible they are individually dispersed in a liquid dispersion medium containing the polymer together with necessary additives, each mixture being ground if required to obtain a desired particle size, the mixtures are mixed, again ground to produce thorough dispersion, are separated from the liquid dispersion medium and green articles formed from the resulting pasty mixture. The green articles are then heated and pressed as described above. Mixtures of different filler materials may be used to tailor the electrical and physical properties of the final materials. The articles preferably comprise substrates for use in electronic circuits.

    Abstract translation: 在聚（亚芳基醚）聚合物材料的基体中包含至少60体积％，优选70体积％的细粉末状填料的颗粒的复合材料通过形成组分的混合物制成，从而形成所需体，然后 将物体加热和压制到足以熔化聚合物的温度和足以将熔融的聚合物分散到填料颗粒之间的空隙中的压力。 令人惊讶的是，当固体含量高达规定值时，这些聚合物材料只能作为粘合材料有效，因为所得物体的含量较低，因此太脆。 这完全违背了接受的现有技术实践，认为随着固体含量增加，复合材料逐渐减弱，因此这些内容必须受到限制。 在获得尽可能完整的组分分散体的方法中，它们分别分散在含有聚合物的液体分散介质中以及必要的添加剂，如果需要，每个混合物被研磨以获得所需的粒度，混合物再次混合 从液体分散介质和由所得糊状混合物形成的绿色物品分离，以产生彻底的分散。 然后如上所述加热和按压绿色制品。 可以使用不同填料材料的混合物来定制最终材料的电学和物理性能。 物品优选地包括用于电子电路的基底。

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