公开(公告)号：US07935568B2

公开(公告)日：2011-05-03

申请号：US11590616

申请日：2006-10-31

申请人： Vage Oganesian ,  David Ovrutsky ,  Charles Rosenstein ,  Belgacem Haba ,  Giles Humpston

发明人： Vage Oganesian ,  David Ovrutsky ,  Charles Rosenstein ,  Belgacem Haba ,  Giles Humpston

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L24/11 ,  H01L23/3114 ,  H01L24/06 ,  H01L24/12 ,  H01L24/16 ,  H01L24/48 ,  H01L24/94 ,  H01L27/14618 ,  H01L27/14683 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/274 ,  H01L2224/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method is provided for fabricating a unit including a semiconductor element such as a sensor unit, e.g., for optical imaging. A semiconductor element has plurality of conductive features exposed at the front surface and semiconductive or conductive material exposed at least one of the front and rear surfaces. At least some of the conductive features are insulated from the exposed semiconductive or conductive material. By electrodeposition, an insulative layer is formed to overlie the at least one of exposed semiconductive material or conductive material. Subsequently, a plurality of conductive contacts and a plurality of conductive traces are formed overlying the electrodeposited insulative layer, the conductive traces connecting the conductive features to the conductive contacts. The unit can be incorporated in a camera module having an optical element in registration with an imaging area of the semiconductor element.

摘要翻译： 提供了一种用于制造包括诸如传感器单元的半导体元件的单元的方法，例如用于光学成像。 半导体元件具有在前表面处暴露的多个导电特征，并且暴露在前表面和后表面中的至少一个上的半导体或导电材料。 至少一些导电特征与暴露的半导电材料或导电材料绝缘。 通过电沉积，形成绝缘层以覆盖暴露的半导体材料或导电材料中的至少一种。 随后，多个导电触点和多个导电迹线形成在电沉积绝缘层上，导电迹线将导电特征连接到导电触点。 该单元可以结合在具有与半导体元件的成像区域对准的光学元件的相机模块中。

公开(公告)号：US20100270679A1

公开(公告)日：2010-10-28

申请号：US12829709

申请日：2010-07-02

申请人： Belgacem Haba ,  Giles Humpston

发明人： Belgacem Haba ,  Giles Humpston

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L23/525 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/11 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/484 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/85399

摘要： A method of making microelectronic packages includes making a subassembly by providing a plate having a top surface, a bottom surface and openings extending between the top and bottom surfaces, attaching a compliant layer to the top surface of the plate, the compliant layer having openings that are aligned with the openings extending through the plate, and providing electrically conductive features on the compliant layer. After making the subassembly, the bottom surface of the plate is attached with the top surface of a semiconductor wafer so that the openings extending through the plate are aligned with contacts on the wafer. At least some of the electrically conductive features on the compliant layer are electrically interconnected with the contacts on the semiconductor wafer.

摘要翻译： 制造微电子封装的方法包括通过提供具有顶表面，底表面和在顶表面和底表面之间延伸的开口的板来制造子组件，将柔性层附接到板的顶表面，顺应层具有开口， 与延伸穿过板的开口对齐，并且在柔性层上提供导电特征。 在制造子组件之后，板的底表面与半导体晶片的顶表面相连，使得延伸穿过该板的开口与晶片上的触点对准。 柔性层上的至少一些导电特征与半导体晶片上的触点电互连。

公开(公告)号：US20090065907A1

公开(公告)日：2009-03-12

申请号：US12221204

申请日：2008-07-31

申请人： Belgacem Haba ,  Giles Humpston ,  Moti Margalit

发明人： Belgacem Haba ,  Giles Humpston ,  Moti Margalit

IPC分类号： H01L23/538 ,  H01L21/44

CPC分类号： H01L21/76898 ,  H01L21/76805 ,  H01L23/3114 ,  H01L23/481 ,  H01L24/12 ,  H01L24/24 ,  H01L24/82 ,  H01L24/95 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/2518 ,  H01L2224/82039 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00

摘要： A microelectronic unit 400 can include a semiconductor element 401 having a front surface, a microelectronic semiconductor device adjacent to the front surface, contacts 403 at the front surface and a rear surface remote from the front surface. The semiconductor element 401 can have through holes 410 extending from the rear surface through the semiconductor element 401 and through the contacts 403. A dielectric layer 411 can line the through holes 410. A conductive layer 412 may overlie the dielectric layer 411 within the through holes 410. The conductive layer 412 can conductively interconnect the contacts 403 with unit contacts.

摘要翻译： 微电子单元400可以包括具有前表面的半导体元件401，与前表面相邻的微电子半导体器件，在前表面处的触点403和远离前表面的后表面。 半导体元件401可以具有从后表面延伸通过半导体元件401并通过触点403的通孔410.电介质层411可以使通孔410线化。导电层412可覆盖通孔内的电介质层411 导电层412可以将触点403与单元触点导电地互连。

公开(公告)号：US20080088033A1

公开(公告)日：2008-04-17

申请号：US11581888

申请日：2006-10-17

申请人： Giles Humpston ,  Guilian Gao ,  Belgacem Haba

发明人： Giles Humpston ,  Guilian Gao ,  Belgacem Haba

IPC分类号： H01L23/48

CPC分类号： H01L23/4985 ,  H01L23/49811 ,  H01L24/48 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/3011 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package includes a microelectronic element having contacts, a flexible substrate spaced from and overlying the microelectronic element and a plurality of conductive posts extending from the flexible substrate and projecting away from the microelectronic element. The conductive posts are electrically interconnected with the microelectronic element. Each conductive post has a conductive base that is in contact with the flexible substrate and a conductive tip that extends from the base, with the base of the conductive post having a larger diameter than the tip of the conductive post. In certain embodiments, the conductive base and the conductive tip have a cylindrical shape.

摘要翻译： 微电子封装包括具有触点的微电子元件，与微电子元件隔开并覆盖的柔性基板以及从柔性基板延伸并远离微电子元件突出的多个导电柱。 导电柱与微电子元件电互连。 每个导电柱具有与柔性基板接触的导电基底和从基部延伸的导电尖端，导电柱的基部具有比导电柱的尖端更大的直径。 在某些实施例中，导电基底和导电尖端具有圆柱形形状。

公开(公告)号：US20080036100A1

公开(公告)日：2008-02-14

申请号：US11435970

申请日：2006-05-17

申请人： Bruce M. McWilliams ,  Belgacem Haba ,  Giles Humpston

发明人： Bruce M. McWilliams ,  Belgacem Haba ,  Giles Humpston

IPC分类号： H01L23/58 ,  B23K31/02

CPC分类号： B23K3/0623 ,  B23K2101/40 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/1148 ,  H01L2224/11902 ,  H01L2224/1191 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00012

摘要： Elongated solder masses are formed by contacting the molten solder with the walls of holes in a dielectric layer overlying the front face of a chip element such as a wafer. The elongated solder masses have a relatively large aspect ratio, or ratio of height to maximum diameter, and thus provide a high reliability connection with a relatively small diameter compatible with closely spaced contacts on the chip.

摘要翻译： 通过使熔融焊料与位于诸如晶片的芯片元件的前表面上的介电层中的孔的壁接触来形成细长的焊料质量。 细长的焊料质量具有相对较大的纵横比或高度与最大直径的比率，并因此提供与芯片上紧密间隔的触头相兼容的相对较小直径的高可靠性连接。

公开(公告)号：US07224056B2

公开(公告)日：2007-05-29

申请号：US10949844

申请日：2004-09-24

申请人： Robert Burtzlaff ,  Belgacem Haba ,  Giles Humpston ,  David B. Tuckerman ,  Michael Warner ,  Craig S. Mitchell

发明人： Robert Burtzlaff ,  Belgacem Haba ,  Giles Humpston ,  David B. Tuckerman ,  Michael Warner ,  Craig S. Mitchell

IPC分类号： H01L23/12

CPC分类号： H01L23/3114 ,  B81B2207/095 ,  B81C1/00293 ,  B81C1/00301 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019 ,  H01L21/76898 ,  H01L23/04 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/1401 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03H3/007 ,  H03H9/0547 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1064 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A packaged microelectronic device is provided which includes: (a) a unit having a chip with an upwardly-facing front surface and a downwardly-facing rear surface, a lid overlying at least a portion of the front surface of the chip, the lid having a top surface facing upwardly away from the chip and unit connections exposed at the top surface of the lid. At least some of the unit connections are electrically connected to the chip. The packaged microelectronic device also includes a package structure including structure defining package terminals, at least some of the package terminals being electrically connected to the chip. The package structure, the unit or both define a downwardly-facing bottom surface of the package, the terminals being exposed at the bottom surface.

摘要翻译： 提供一种封装的微电子器件，其包括：（a）具有面向上的前表面和面向下的后表面的芯片的单元，覆盖所述芯片的前表面的至少一部分的盖，所述盖具有 面向上远离芯片的顶表面和暴露在盖的顶表面处的单元连接。 至少一些单元连接电连接到芯片。 封装的微电子器件还包括包括限定封装端子的结构的封装结构，至少一些封装端子电连接到芯片。 封装结构，单元或两者限定了封装的向下的底部表面，端子在底部表面露出。

公开(公告)号：US20060278997A1

公开(公告)日：2006-12-14

申请号：US11284289

申请日：2005-11-21

申请人： David Gibson ,  Giles Humpston ,  Belgacem Haba

发明人： David Gibson ,  Giles Humpston ,  Belgacem Haba

IPC分类号： H01L23/48

CPC分类号： H01L25/105 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16147 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/73204 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3011 ,  H05K3/3436 ,  H05K2201/09827 ,  H05K2201/10674 ,  H05K2203/0455 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A microelectronic element is mounted to a substrate using solder elements disposed at least partially within vias of the substrate. The vias have tapering walls. During reflow of the solder, the microelectronic element may move toward the substrate. Such movement may be impelled, for example, by interfacial tension between the solder and the tapering via wall. This movement reduces the height of the completed assembly.

摘要翻译： 使用至少部分地设置在衬底的通孔内的焊料元件将微电子元件安装到衬底上。 通孔有逐渐变细的墙壁。 在焊料回流期间，微电子元件可以朝向衬底移动。 这种移动可以例如通过焊料和锥形通孔壁之间的界面张力而被推动。 该运动减少了完成组件的高度。

公开(公告)号：US07759166B2

公开(公告)日：2010-07-20

申请号：US11582186

申请日：2006-10-17

申请人： Belgacem Haba ,  Giles Humpston

发明人： Belgacem Haba ,  Giles Humpston

IPC分类号： H01L21/00

CPC分类号： H01L23/525 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/11 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/484 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/85399

摘要： A method of making microelectronic packages includes making a subassembly by providing a plate having a top surface, a bottom surface and openings extending between the top and bottom surfaces, attaching a compliant layer to the top surface of the plate, the compliant layer having openings that are aligned with the openings extending through the plate, and providing electrically conductive features on the compliant layer. After making the subassembly, the bottom surface of the plate is attached with the top surface of a semiconductor wafer so that the openings extending through the plate are aligned with contacts on the wafer. At least some of the electrically conductive features on the compliant layer are electrically interconnected with the contacts on the semiconductor wafer.

摘要翻译： 制造微电子封装的方法包括通过提供具有顶表面，底表面和在顶表面和底表面之间延伸的开口的板来制造子组件，将柔性层附接到板的顶表面，顺应层具有开口， 与延伸穿过板的开口对齐，并且在柔性层上提供导电特征。 在制造子组件之后，板的底表面与半导体晶片的顶表面相连，使得延伸穿过该板的开口与晶片上的触点对准。 柔性层上的至少一些导电特征与半导体晶片上的触点电互连。

公开(公告)号：US07453139B2

公开(公告)日：2008-11-18

申请号：US11318815

申请日：2005-12-27

申请人： Michael J. Nystrom ,  Belgacem Haba ,  Giles Humpston

发明人： Michael J. Nystrom ,  Belgacem Haba ,  Giles Humpston

IPC分类号： H01L21/44 ,  H01L23/495

CPC分类号： H01L23/3114 ,  H01L23/525 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00

摘要： A compliant structure is provided on a semiconductor wafer. The compliant structure includes cavities. The compliant structure and the wafer seal the cavities during process steps used to form conductive elements on the compliant structure. After processing, vents are opened to connect the cavities to the exterior of the assembly. The vents may be formed by severing the wafer and compliant structure to form individual units, so that the severance planes intersect channels or other voids communicating with the cavities. Alternatively, the vents may be formed by forming holes in the compliant structure, or by opening bores extending through the wafer.

摘要翻译： 在半导体晶片上提供柔性结构。 顺应结构包括腔。 顺应结构和晶片在用于在柔性结构上形成导电元件的工艺步骤期间密封空腔。 处理后，通风口打开，将空腔连接到组件的外部。 通孔可以通过切断晶片和柔顺结构以形成单独的单元而形成，使得分离平面与通道或与空腔连通的其它空隙相交。 或者，可以通过在柔性结构中形成孔或通过打开延伸穿过晶片的孔而形成通气口。

公开(公告)号：US20080185705A1

公开(公告)日：2008-08-07

申请号：US11895191

申请日：2007-08-23

申请人： Philip R. Osborn ,  Belgacem Haba ,  Ellis Chau ,  Giles Humpston ,  Masud Beroz ,  Teck-Gyu Kang ,  Dat Nghe Duong ,  Jae M. Park ,  Jesse Burl Thompson ,  Richard Dewitt Crisp

发明人： Philip R. Osborn ,  Belgacem Haba ,  Ellis Chau ,  Giles Humpston ,  Masud Beroz ,  Teck-Gyu Kang ,  Dat Nghe Duong ,  Jae M. Park ,  Jesse Burl Thompson ,  Richard Dewitt Crisp

IPC分类号： H01L23/48

CPC分类号： H01L23/4985 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/31 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/1357 ,  H01L2224/13582 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/83194 ,  H01L2224/83365 ,  H01L2224/83385 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A microelectronic package includes a microelectronic element having a first face including contacts, and a flexible substrate having a first surface and a second surface, conductive posts projecting from the first surface and conductive terminals accessible at the second surface, at least some of the conductive terminals and the conductive posts being electrically interconnected and at least some of the conductive terminals being offset from the conductive posts. The first surface of the flexible substrate is juxtaposed with the first face of the microelectronic element so that the conductive posts project from the flexible substrate toward the first face of the microelectronic element. The conductive posts are electrically interconnected with the contacts of the microelectronic element and at least some of the conductive terminals are movable relative to the microelectronic element.

摘要翻译： 微电子封装包括具有包括触点的第一面的微电子元件和具有第一表面和第二表面的柔性基板，从第一表面突出的导电柱和在第二表面可接触的导电端子，至少一些导电端子 并且所述导电柱电互连，并且所述导电端子中的至少一些偏离所述导电柱。 柔性基板的第一表面与微电子元件的第一面并置，使得导电柱从柔性基板朝向微电子元件的第一面突出。 导电柱与微电子元件的触点电互连，并且至少一些导电端子可相对于微电子元件移动。