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    Remote Test Facility With Wireless Interface To Local Test Facilities
    32.
    发明申请
    Remote Test Facility With Wireless Interface To Local Test Facilities 失效
    具有无线接口的远程测试设备到本地测试设施

    公开(公告)号：US20070271071A1

    公开(公告)日：2007-11-22

    申请号：US11835151

    申请日：2007-08-07

    申请人： Igor Khandros ,  Benjamin Eldridge

    发明人： Igor Khandros ,  Benjamin Eldridge

    IPC分类号： G06F11/00 ,  G06F15/00

    CPC分类号： G01R31/2884 ,  G01R31/3025 ,  G01R31/31907

    摘要： A central test facility transmits wirelessly test data to a local test facility, which tests electronic devices using the test data. The local test facility transmits wirelessly response data generated by the electronic devices back to the central test facility, which analyzes the response data to determine which electronic devices passed the testing. The central test facility may provide the results of the testing to other entities, such as a design facility where the electronic devices were designed or a manufacturing facility where the electronic devices where manufactured. The central test facility may accept requests for test resources from any of a number of local test facilities, schedule test times corresponding to each test request, and at a scheduled test time, wirelessly transmits test data to a corresponding local test facility.

    摘要翻译： 中央测试设备将无线测试数据传输到本地测试设备，该测试设备使用测试数据测试电子设备。 本地测试设备将由电子设备生成的无线响应数据发送回中央测试设备，分析响应数据以确定哪些电子设备通过测试。 中央测试设备可以向其他实体提供测试结果，例如设计电子设备的设计设施或其中制造的电子设备的制造设施。 中央测试设备可以接受来自任何本地测试设施的测试资源的请求，对应于每个测试请求的调度测试时间，并且在预定的测试时间，将测试数据无线地传输到相应的本地测试设施。

    Wireless test cassette
    33.
    发明申请
    Wireless test cassette 有权
    无线测试盒

    公开(公告)号：US20050225347A1

    公开(公告)日：2005-10-13

    申请号：US10820319

    申请日：2004-04-08

    申请人： Igor Khandros ,  Benjamin Eldridge ,  Charles Miller ,  A. Sporck

    发明人： Igor Khandros ,  Benjamin Eldridge ,  Charles Miller ,  A. Sporck

    IPC分类号： G01R1/073 ,  G01R31/02 ,  G01R31/26

    CPC分类号： G01R1/0491 ,  G01R1/073 ,  G01R31/3025

    摘要： A base controller disposed in a test cassette receives test data for testing a plurality of electronic devices. The base controller wirelessly transmits the test data to a plurality of wireless test control chips, which write the test data to each of the electronic devices. The wireless test control chips then read response data generated by the electronic devices, and the wireless test control chips wirelessly transmit the response data to the base controller.

    摘要翻译： 设置在测试盒中的基本控制器接收用于测试多个电子设备的测试数据。 基站控制器将测试数据无线传输到多个无线测试控制芯片，其将测试数据写入每个电子设备。 然后，无线测试控制芯片读取由电子设备产生的响应数据，无线测试控制芯片将响应数据无线发送到基本控制器。

    WAFER-LEVEL BURN-IN AND TEST
    34.
    发明申请
    WAFER-LEVEL BURN-IN AND TEST 失效
    WAFER-LEVEL BURN-IN和TEST

    公开(公告)号：US20070013401A1

    公开(公告)日：2007-01-18

    申请号：US11458375

    申请日：2006-07-18

    申请人： Igor Khandros ,  David Pedersen

    发明人： Igor Khandros ,  David Pedersen

    IPC分类号： G01R31/26

    CPC分类号： G01R31/2886 ,  G01R31/287 ,  G01R31/2874 ,  G01R31/318511 ,  H01L2924/01078 ,  H01L2924/01079

    摘要： Techniques for performing wafer-level burn-in and test of semiconductor devices include a test substrate having active electronic components such as ASICs mounted to an interconnection substrate or incorporated therein, metallic spring contact elements effecting interconnections between the ASICs and a plurality of devices-under-test (DUTs) on a wafer-under-test (WUT), all disposed in a vacuum vessel so that the ASICs can be operated at temperatures independent from and significantly lower than the burn-in temperature of the DUTs. The spring contact elements may be mounted to either the DUTs or to the ASICs, and may fan out to relax tolerance constraints on aligning and interconnecting the ASICs and the DUTs. Physical alignment techniques are also described.

    摘要翻译： 用于执行半导体器件的晶片级老化和测试的技术包括具有有源电子部件的测试基板，例如安装到互连基板或并入其中的ASIC，实现ASIC和多个器件之间的互连的金属弹簧接触元件 在测试晶片（WUT）上的测试（DUT）都被置于真空容器中，使得ASIC可以在与DUT的老化温度无关并且显着低于DUT的老化温度的温度下工作。 弹簧接触元件可以被安装到DUT或ASIC上，并且可以扇出来放松对ASIC和DUT的对准和互连的容限约束。 还描述了物理对准技术。

    Wafer-level burn-in and test
    35.
    发明申请
    Wafer-level burn-in and test 失效
    晶圆级老化和测试

    公开(公告)号：US20050017750A1

    公开(公告)日：2005-01-27

    申请号：US10924141

    申请日：2004-08-23

    申请人： Igor Khandros ,  David Pedersen

    发明人： Igor Khandros ,  David Pedersen

    IPC分类号： G01R31/02 ,  G01R31/26

    CPC分类号： G01R31/2886 ,  G01R31/287 ,  G01R31/2874 ,  G01R31/318511 ,  H01L2924/01078 ,  H01L2924/01079

    摘要： Techniques for performing wafer-level burn-in and test of semiconductor devices include a test substrate having active electronic components such as ASICs mounted to an interconnection substrate or incorporated therein, metallic spring contact elements effecting interconnections between the ASICs and a plurality of devices-under-test (DUTs) on a wafer-under-test (WUT), all disposed in a vacuum vessel so that the ASICs can be operated at temperatures independent from and significantly lower than the burn-in temperature of the DUTs. The spring contact elements may be mounted to either the DUTs or to the ASICs, and may fan out to relax tolerance constraints on aligning and interconnecting the ASICs and the DUTs. Physical alignment techniques are also described.

    摘要翻译： 用于执行半导体器件的晶片级老化和测试的技术包括具有有源电子部件的测试基板，例如安装到互连基板或并入其中的ASIC，实现ASIC和多个器件之间的互连的金属弹簧接触元件 在测试晶片（WUT）上的测试（DUT）都被置于真空容器中，使得ASIC可以在与DUT的老化温度无关并且显着低于DUT的老化温度的温度下工作。 弹簧接触元件可以被安装到DUT或ASIC上，并且可以扇出来放松对ASIC和DUT的对准和互连的容限约束。 还描述了物理对准技术。