公开(公告)号：US5880925A

公开(公告)日：1999-03-09

申请号：US884597

申请日：1997-06-27

申请人： David A. DuPre ,  John L. Galvagni ,  Andrew P. Ritter

发明人： David A. DuPre ,  John L. Galvagni ,  Andrew P. Ritter

IPC分类号： H01G4/12 ,  H01G2/06 ,  H01G4/252 ,  H01G4/30 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34 ,  H01G4/005 ,  H01G4/06 ,  H01G4/228

CPC分类号： H01G2/065 ,  H01G4/30 ,  H05K3/3442 ,  H05K1/0216 ,  H05K1/0231 ,  H05K1/112 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/0979 ,  H05K2201/10045 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

摘要： A multilayer ceramic device suitable for use in surface mount decoupling applications may have a single capacitor or a capacitor array. The device has a capacitor body defining a plurality of electrical terminals on an outer surface thereof. The terminals are interdigitated such that a respective first polarity terminal will be adjacent to a respective second polarity terminal (and vice versa). The capacitor body contains a plurality of interleaved capacitor plates in opposed and spaced apart relation. Capacitor plates of the first polarity are electrically connected to respective first polarity terminals via a plurality of lead structures. Likewise, a plurality of lead structures electrically connect capacitor plates of the second polarity to respective second polarity terminals.

摘要翻译： 适用于表面贴装去耦应用的多层陶瓷器件可以具有单个电容器或电容器阵列。 该装置具有在其外表面上限定多个电端子的电容器主体。 端子相互交错，使得相应的第一极性端子将与相应的第二极性端子相邻（反之亦然）。 电容器主体包含相互间隔开的多个交错电容器板。 第一极性的电容器板经由多个引线结构电连接到相应的第一极性端子。 同样地，多个引线结构将第二极性的电容器板电连接到相应的第二极性端子。

公开(公告)号：US4954089A

公开(公告)日：1990-09-04

申请号：US404694

申请日：1989-09-08

申请人： William T. Jensen ,  Vincent B. Brown ,  Cathy J. Edgerton ,  Robert W. Masterson

发明人： William T. Jensen ,  Vincent B. Brown ,  Cathy J. Edgerton ,  Robert W. Masterson

IPC分类号： H01R12/58 ,  H01R12/70 ,  H05K1/09 ,  H05K1/14 ,  H05K1/16 ,  H05K3/34 ,  H05K3/42

CPC分类号： H05K1/167 ,  H01R12/7082 ,  H01R12/585 ,  H05K1/095 ,  H05K1/141 ,  H05K2201/10045 ,  H05K2201/10189 ,  H05K3/3447 ,  H05K3/42

摘要： A compact terminator for interconnecting computer devices with each other and with peripheral equipment having contact ends to be interconnected with connectors. The contacts are interconnected on a circuit board employing thick film circuitry mounted thereon. The contacts are press fitted in plated through holes on the circuit board and form male or female connectors at one end. The device may be differential or single ended type.

摘要翻译： 一种紧凑的终端器，用于将计算机设备彼此互连，并且具有外围设备，其具有与连接器互连的接触端。 触点在使用安装在其上的厚膜电路的电路板上互连。 触点压配在电路板的电镀通孔中，并在一端形成阳或阴连接器。 该器件可以是差分或单端型。

公开(公告)号：US4365284A

公开(公告)日：1982-12-21

申请号：US139167

申请日：1980-04-11

申请人： Katsuo Tanaka

发明人： Katsuo Tanaka

IPC分类号： H01C1/14 ,  H01C1/04 ,  H01C1/16 ,  H01C13/02 ,  H01C17/00 ,  H01G4/40 ,  H01L27/01 ,  H05K1/02 ,  H05K1/14 ,  H05K1/16 ,  H05K3/22 ,  H05K3/34 ,  H05K3/36

CPC分类号： H05K1/141 ,  H01C1/04 ,  H01C1/16 ,  H01C13/02 ,  H01C17/006 ,  H05K1/167 ,  H05K1/0263 ,  H05K2201/10015 ,  H05K2201/10045 ,  H05K2201/10272 ,  H05K2201/10386 ,  H05K2201/10477 ,  H05K2201/10636 ,  H05K2201/10946 ,  H05K3/222 ,  H05K3/3421 ,  H05K3/368 ,  Y02P70/611

摘要： A resistor module which is small in size and easy to probe for measuring and in which a plurality of resistors are formed on the surface of an insulated substrate, an insulating layer is provided to extend over the resistors and conductor patterns for connection of the resistors, and a conductor bar to be connected with a power source pattern or grounding pattern of a printed circuit board is mounted on the insulating layer.

摘要翻译： 一种电阻器模块，其尺寸小且易于测量，并且在绝缘基板的表面上形成多个电阻器，提供绝缘层以延伸到用于连接电阻器的电阻器和导体图案上， 并且将与印刷电路板的电源图案或接地图形连接的导体条安装在绝缘层上。

公开(公告)号：US4187529A

公开(公告)日：1980-02-05

申请号：US828788

申请日：1977-08-29

申请人： John E. Bartley ,  Orville R. Penrod ,  Lawrence D. Radosevich

发明人： John E. Bartley ,  Orville R. Penrod ,  Lawrence D. Radosevich

IPC分类号： H01L21/48 ,  H01L23/498 ,  H05K1/03 ,  H05K1/09 ,  H05K1/14 ,  H05K1/16 ,  H05K3/34 ,  H05K3/40 ,  H05K1/04

CPC分类号： H05K1/167 ,  H01L21/4867 ,  H01L23/49811 ,  H05K3/3405 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/141 ,  H05K1/162 ,  H05K2201/09163 ,  H05K2201/10045 ,  H05K2201/1034 ,  H05K2201/10924 ,  H05K3/403

摘要： An electrical circuit device having a substrate including circuit components on at least one side thereof and a plurality of through openings in the substrate. Terminal leads are positioned in the openings each with a deformation intermediate the ends of the leads and spaced internally of the opening from a soldered area at the juncture of the exposed portion of the leads and the termination edge of the substrate. Two methods of assembly of leads to the substrate are also disclosed.

摘要翻译： 一种电路装置，其具有在至少一个侧面上包括电路元件的基板和该基板中的多个通孔。 端子引线定位在开口中，每个开口具有在引线的端部之间的中心的变形，并且在引线的暴露部分和基板的终端边缘的接合处的焊接区域处与开口的内部隔开。 还公开了将引线组装到衬底的两种方法。

公开(公告)号：US20180191091A1

公开(公告)日：2018-07-05

申请号：US15855676

申请日：2017-12-27

申请人： LSIS CO., LTD.

发明人： Youngkook KIM

IPC分类号： H01R12/71 ,  H01H9/54 ,  H05K1/18 ,  H01R13/04 ,  H01R13/10

CPC分类号： H01R12/716 ,  H01H9/54 ,  H01H71/0228 ,  H01H71/08 ,  H01H71/123 ,  H01H71/128 ,  H01H71/7409 ,  H01H2071/086 ,  H01R13/04 ,  H01R13/10 ,  H01R29/00 ,  H05K1/18 ,  H05K2201/10045 ,  H05K2201/10189

摘要： The present invention relates to an isolation mechanism of a controller for a direct current circuit breaker, which has a simple structure for isolation and connection manipulation. The isolation mechanism of a controller for a circuit breaker comprises a first connector that has a plurality of output terminals electrically connected to the controller and a plurality of input terminals detached from the output terminals for connecting an input electric power source; and a second connector that has a first connection position connected to the first connector and a second connection position rotated at 180° from the first connection position and connected to the first connector, and has a conductor wiring portion electrically connecting the output terminals with the input terminals at the first connection position and electrically disconnecting the output terminals from the input terminals at the second connection position.

公开(公告)号：US09686865B2

公开(公告)日：2017-06-20

申请号：US14745673

申请日：2015-06-22

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Yun-Han Lee ,  Mark Shane Peng ,  Shyh-An Chi

IPC分类号： H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H01L25/18 ,  H01L23/00 ,  H01L25/065 ,  H01L23/14 ,  H01L23/538

CPC分类号： H05K1/181 ,  H01L23/147 ,  H01L23/538 ,  H01L24/16 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2225/06565 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/14335 ,  H01L2924/1434 ,  H01L2924/1438 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/111 ,  H05K1/115 ,  H05K1/141 ,  H05K2201/10045 ,  H05K2201/10053 ,  H05K2201/10378 ,  H01L2924/00

摘要： A package structure includes a networking unit including a plurality of switches/routers and a plurality of network interface units coupled to the plurality of switches/routers, and an interposer including a plurality of metal connections. The interposer is substantially free from functional elements built therein. A functional element is outside of, and bonded onto, the interposer, wherein the functional element is electrically coupled to the networking unit through the plurality of metal connections.

公开(公告)号：US20160179732A1

公开(公告)日：2016-06-23

申请号：US14581852

申请日：2014-12-23

申请人： BELIMO Holding AG

发明人： Peter Schmidlin ,  Silvio Grogg

IPC分类号： G06F13/40 ,  G06F13/364 ,  G06F13/42

CPC分类号： G06F13/4068 ,  G05B2219/1204 ,  G05B2219/2208 ,  G06F13/364 ,  G06F13/4282 ,  H05K1/16 ,  H05K1/182 ,  H05K2201/10045

摘要： A connecting device comprises housing, a board with electrical components, including at least one digital bus connection and an input/output section. It allows outsourcing of analogue and digital I/O from a connected device, e.g. an HVAC actuator control unit by decentralizing inputs and outputs.

摘要翻译： 连接装置包括壳体，具有电气部件的板，包括至少一个数字总线连接和输入/输出部分。 它允许从连接的设备外包模拟和数字I / O，例如。 通过分散输入和输出的HVAC执行器控制单元。

公开(公告)号：US20160125981A1

公开(公告)日：2016-05-05

申请号：US14931684

申请日：2015-11-03

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Hae In KIM ,  Jung Min NAM ,  Jea Hoon LEE ,  Young Key KIM

IPC分类号： H01C1/14 ,  H01C17/065 ,  H01C17/28

CPC分类号： H01C1/14 ,  H01C1/01 ,  H01C7/003 ,  H01C17/281 ,  H05K1/181 ,  H05K3/3431 ,  H05K2201/10022 ,  H05K2201/10045 ,  Y02P70/611

摘要： A resistor includes: a base substrate; a resistance layer disposed on one surface of the base substrate; first and second electrode layers disposed to be spaced apart from each other and covering portions of the resistance layer; and a third electrode layer disposed between the first and second electrode layers to be spaced apart from the first and second electrode layers and covering a portion of the resistance layer.

摘要翻译： 电阻器包括：基底; 电阻层，设置在所述基底基板的一个表面上; 第一和第二电极层设置成彼此间隔开并覆盖电阻层的部分; 以及第三电极层，设置在第一和第二电极层之间，与第一和第二电极层间隔开并覆盖电阻层的一部分。

公开(公告)号：US20160021753A1

公开(公告)日：2016-01-21

申请号：US14802139

申请日：2015-07-17

申请人： IBIDEN CO., LTD.

发明人： Mitsuhiro TOMIKAWA ,  Koji ASANO

IPC分类号： H05K1/18 ,  H05K3/00 ,  H05K3/30 ,  H05K3/46 ,  H05K1/02 ,  H05K1/11

CPC分类号： H05K3/4697 ,  H01L21/568 ,  H01L2224/04105 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/15311 ,  H01L2924/15331 ,  H05K1/0206 ,  H05K1/162 ,  H05K1/185 ,  H05K3/3436 ,  H05K3/4644 ,  H05K2201/10 ,  H05K2201/10045 ,  H05K2201/10416 ,  H01L2924/00014

摘要： A circuit substrate includes a core substrate having a cavity penetrating through the substrate, a combined component accommodated in the cavity of the substrate, a first build-up layer laminated on first surface of the substrate and including an insulating layer such that the insulating layer is covering the cavity, a second build-up layer laminated on second surface of the substrate and including an insulating layer such that the insulating layer is covering the cavity, and a filling resin filling gap formed between the cavity and combined component accommodated in the cavity of the substrate. The combined component includes an electronic component and a metal block, the electronic component has terminal surface on side facing the first surface of the substrate, and the metal block is superposed to surface of the electronic component on the opposite side of the electronic component with respect to the terminal surface.

摘要翻译： 电路基板包括具有穿透基板的空腔的芯基板，容纳在基板的空腔中的组合部件，层叠在基板的第一表面上并且包括绝缘层的第一累积层，使得绝缘层为 覆盖空腔，层叠在基板的第二表面上的第二堆叠层，并且包括绝缘层，使得绝缘层覆盖空腔;以及填充树脂填充间隙，其形成在容纳在空腔中的空腔和组合部件之间 底物。 组合部件包括电子部件和金属块，电子部件具有面向基板的第一表面的端面，并且金属块与电子部件的相对侧的电子部件的表面重叠 到终端表面。

公开(公告)号：US20150305159A1

公开(公告)日：2015-10-22

申请号：US14440016

申请日：2013-10-25

申请人： ROHM CO., LTD.

发明人： Hiroki YAMAMOTO ,  Keishi WATANABE ,  Hiroshi TAMAGAWA

IPC分类号： H05K1/18 ,  H05K1/11 ,  H05K1/16

CPC分类号： H01G4/30 ,  H01G2/06 ,  H01G4/005 ,  H01G4/228 ,  H01G4/232 ,  H01G4/40 ,  H01L22/14 ,  H01L22/20 ,  H01L23/5223 ,  H01L24/48 ,  H01L24/49 ,  H01L27/0629 ,  H01L27/0676 ,  H01L27/101 ,  H01L27/2409 ,  H01L28/40 ,  H01L29/66189 ,  H01L29/94 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/0002 ,  H05K1/111 ,  H05K1/162 ,  H05K1/18 ,  H05K1/181 ,  H05K3/3436 ,  H05K2201/10015 ,  H05K2201/10045 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/85399

摘要： A chip capacitor according to the present invention includes a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. Also, a circuit assembly according to the present invention includes the chip capacitor according to the present invention and a mounting substrate having lands, soldered to the external electrodes, on a mounting surface facing a front surface of the substrate.

摘要翻译： 根据本发明的片状电容器包括衬底，形成在衬底上的一对外部电极，连接在一对外部电极之间的电容器元件和连接在该对外部电极之间并与电容器并联的双向二极管 元件。 此外，根据本发明的电路组件包括根据本发明的片状电容器和具有焊盘焊接到外部电极的焊盘的安装基板，在与衬底的前表面相对的安装表面上。