公开(公告)号：US08889996B2

公开(公告)日：2014-11-18

申请号：US13402021

申请日：2012-02-22

Applicant: Junya Yamada

Inventor： Junya Yamada

IPC: H05K1/00

CPC classification number: H05K1/111 ,  H05K3/34 ,  H05K2201/0367 ,  H05K2201/0379 ,  H05K2201/10287 ,  H05K2201/10356 ,  Y02P70/611

Abstract: A cable connection structure includes a cable and a substrate that includes a connection electrode to which the cable is connected. The substrate includes two or more protrusions that form a groove in which a conductor part of the cable is arranged. The height of the protrusions is greater than the diameter of the conductor part of the cable.

Abstract translation: 电缆连接结构包括电缆和包括连接电缆的连接电极的基板。 基板包括形成凹槽的两个或多个突起，其中电缆的导体部分布置在凹槽中。 突起的高度大于电缆的导体部分的直径。

公开(公告)号：US20140307394A1

公开(公告)日：2014-10-16

申请号：US14252719

申请日：2014-04-14

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Anthony James LOBIANCO ,  Howard E. CHEN ,  Robert Francis DARVEAUX ,  Hoang Mong NGUYEN ,  Matthew Sean READ ,  Lori Ann DEORIO

IPC: H05K9/00 ,  B23K26/36

CPC classification number: H05K1/0218 ,  B23K26/361 ,  B23K26/362 ,  B23K26/386 ,  B23K26/389 ,  B23K26/40 ,  B23K2103/172 ,  H01L21/565 ,  H01L21/76802 ,  H01L21/76877 ,  H01L23/3121 ,  H01L23/481 ,  H01L23/49838 ,  H01L23/552 ,  H01L23/66 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/6611 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/05554 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H03H9/64 ,  H04B1/3833 ,  H04B1/3838 ,  H04B1/40 ,  H05K1/0216 ,  H05K1/0243 ,  H05K1/181 ,  H05K1/183 ,  H05K3/288 ,  H05K3/30 ,  H05K3/303 ,  H05K9/0022 ,  H05K2201/1006 ,  H05K2201/10083 ,  H05K2201/10098 ,  H05K2201/10287 ,  H05K2201/1056 ,  H05K2203/107 ,  H05K2203/1327 ,  Y10T29/49002 ,  Y10T29/49016 ,  H01L2924/00 ,  H01L2224/45099

Abstract: Disclosed are apparatus and methods related to conformal coating of radio-frequency (RF) modules. In some embodiments, a module can include an overmold formed over an RF component mounted on a packaging substrate. The overmold can also cover a surface-mount device (SMD) such as an RF filter implemented as a chip size surface acoustic wave (SAW) device (CSSD). The module can further include a conductive layer formed over the overmold and configured to provide RF shielding functionality for the module. The conductive layer can be electrically connected to a ground plane of the packaging substrate through the SMD. An opening can be formed in the overmold over the SMD; and the conductive layer can conform to the opening to electrically connect the conductive layer with an upper surface of the SMD and thereby facilitate the grounding connection.

Abstract translation: 公开了与射频（RF）模块的适形涂层相关的装置和方法。 在一些实施例中，模块可以包括形成在安装在包装衬底上的RF部件上的包覆模制件。 包覆模具还可以覆盖实现为芯片尺寸表面声波（SAW）器件（CSSD）的RF滤波器的表面贴装器件（SMD）。 模块还可以包括形成在包覆模制上的导电层，并且被配置为为模块提供RF屏蔽功能。 导电层可以通过SMD电连接到封装衬底的接地平面。 可以在SMD上的包覆模制中形成一个开口; 并且导电层可以符合开口以将导电层与SMD的上表面电连接，从而便于接地连接。

公开(公告)号：US08835228B2

公开(公告)日：2014-09-16

申请号：US13477532

申请日：2012-05-22

Applicant: Ilyas Mohammed

Inventor： Ilyas Mohammed

IPC: H01L23/48

CPC classification number: H01L23/5226 ,  H01L21/563 ,  H01L21/568 ,  H01L21/76877 ,  H01L21/76892 ,  H01L23/5389 ,  H01L24/06 ,  H01L24/18 ,  H01L24/19 ,  H01L24/20 ,  H01L24/45 ,  H01L24/49 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45101 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/4569 ,  H01L2224/48 ,  H01L2224/49 ,  H01L2224/73267 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2225/06558 ,  H01L2225/1035 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/182 ,  H01L2924/191 ,  H01L2924/19107 ,  H05K3/4046 ,  H05K2201/10287 ,  H05K2203/1461 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/01049

Abstract: A method for making a microelectronic unit includes forming a plurality of wire bonds on a first surface in the form of a conductive bonding surface of a structure comprising a patternable metallic element. The wire bonds are formed having bases joined to the first surface and end surfaces remote from the first surface. The wire bonds have edge surfaces extending between the bases and the end surfaces. The method also includes forming a dielectric encapsulation layer over a portion of the first surface of the conductive layer and over portions of the wire bonds such that unencapsulated portions of the wire bonds are defined by end surfaces or portions of the edge surfaces that are uncovered by the encapsulation layer. The metallic element is patterned to form first conductive elements beneath the wire bonds and insulated from one another by portions of the encapsulation layer.

Abstract translation: 制造微电子单元的方法包括在包括可图案化金属元件的结构的导电接合表面的形式的第一表面上形成多个引线接合。 线接合形成有与第一表面和远离第一表面的端表面接合的基底。 线接合具有在基部和端面之间延伸的边缘表面。 该方法还包括在导电层的第一表面的一部分上方并且在引线接合部分之上形成电介质封装层，使得引线接合的未封装部分由未被所述边缘表面覆盖的端面或边缘表面的部分限定 封装层。 金属元件被图案化以在引线键合下形成第一导电元件，并且通过封装层的一部分彼此绝缘。

公开(公告)号：US08701966B2

公开(公告)日：2014-04-22

申请号：US13749645

申请日：2013-01-24

Applicant: Apple Inc.

Inventor： Michael Nikkhoo ,  Amir Salehi

IPC: B23K37/04 ,  B23K13/01

CPC classification number: H01R43/0242 ,  B23K1/0016 ,  B23K3/00 ,  B23K3/0475 ,  H01R12/53 ,  H01R43/0207 ,  H01R43/0249 ,  H05K3/3405 ,  H05K3/3494 ,  H05K13/0015 ,  H05K2201/094 ,  H05K2201/10287 ,  H05K2201/10356 ,  H05K2203/101 ,  Y10T29/49179

Abstract: The described embodiment relates generally to the field of inductive bonding. More specifically an inductive heater designed for use in assembling electronics is disclosed. A number of methods for shaping a magnetic field are disclosed for the purpose of completing an inductive bonding process without causing harm to unshielded adjacent electrical components.

Abstract translation: 所描述的实施例一般涉及感性接合领域。 更具体地，公开了一种设计用于组装电子设备的感应加热器。 公开了用于成形磁场的多种方法，用于完成感应接合工艺而不对非屏蔽的相邻电气部件造成伤害。

公开(公告)号：US20140021640A1

公开(公告)日：2014-01-23

申请号：US13937546

申请日：2013-07-09

Applicant: ABB Technology AG

Inventor： Gontran PÂQUES ,  Dominik Trüssel ,  Waldemar Groot ,  Stefan Ellenbroek ,  David Hajas

IPC: H01L23/00

CPC classification number: H01L24/83 ,  H01L23/13 ,  H01L23/49811 ,  H01L24/32 ,  H01L25/071 ,  H01L25/074 ,  H01L25/162 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/19107 ,  H05K1/0254 ,  H05K1/117 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/09081 ,  H05K2201/09163 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/2045 ,  H01L2924/00

Abstract: A method and arrangement are disclosed for electrically connecting a contact of a first substrate to a contact of a second substrate, whereby the first substrate is positioned relative the second substrate. The method includes providing the first substrate with its contact facing towards the second substrate, providing the second substrate with its contact facing away from the first substrate, bonding a bonding medium to the contact of the first substrate, bonding the bonding medium to the first substrate thereby forming a loop, electrically connecting the contact of the second substrate to the bonding medium, and providing the second substrate with the contact on a nose or tongue extending from an edge of the second substrate. The first substrate can be positioned below the second substrate, with a contact of the first substrate connected to a contact of the second substrate.

Abstract translation: 公开了一种用于将第一基板的触点电连接到第二基板的触点的方法和装置，由此第一基板相对于第二基板定位。 该方法包括提供其第一基底的接触面朝向第二基底，使第二基底的接触面远离第一基底，将接合介质粘合到第一基底的接触面上，将接合介质粘合到第一基底 从而形成环路，将第二基板的接触电连接到接合介质，以及将第二基板提供在从第二基板的边缘延伸的鼻或舌上的接触。 第一基板可以位于第二基板的下方，第一基板的接触连接到第二基板的接触。

公开(公告)号：US20130250603A1

公开(公告)日：2013-09-26

申请号：US13799579

申请日：2013-03-13

Applicant: JOANEL INC.

Inventor： Aldjia BEGRICHE ,  Olivier VERMEERSCH

IPC: F21V33/00 ,  F21V21/14 ,  F21V8/00

CPC classification number: F21V33/0004 ,  A45C15/06 ,  F21V21/14 ,  F21Y2115/10 ,  G02B6/0005 ,  H05K1/038 ,  H05K1/0393 ,  H05K1/16 ,  H05K1/189 ,  H05K3/0067 ,  H05K3/4015 ,  H05K2201/0281 ,  H05K2201/10053 ,  H05K2201/10106 ,  H05K2201/10287

Abstract: A method and a system for illumination of a personal item, the system comprising at least one light source activated by a textile switch, the light source and the textile switch being secured to a textile substrate and connected by conductors on the textile substrate, the textile substrate being secured on the personal item. The method comprises securing at least one light source and a textile switch on a substrate, connecting the light source and the textile switch by conductors on the substrate, connecting the light source and the textile switch to a powering unit, securing the substrate to the personal item and operating the textile switch.

Abstract translation: 一种用于照明个人物品的方法和系统，所述系统包括由纺织开关激活的至少一个光源，所述光源和所述纺织品开关固定到纺织品基底并通过所述织物基底上的导体连接，所述纺织品 底物被固定在个人物品上。 该方法包括将至少一个光源和织物开关固定在基板上，通过基板上的导体连接光源和纺织开关，将光源和纺织开关连接到供电单元，将基板固定到个人 项目并操作纺织品开关。

公开(公告)号：US20130236995A1

公开(公告)日：2013-09-12

申请号：US13450097

申请日：2012-04-18

Applicant: Daniel Sekowski ,  Frederick Lloyd Carpenter ,  Mark Anthony Hand ,  Bernhard Bachl ,  Bernd Bienek ,  Olaf Cladders ,  Henning Dicker ,  Christian Miesner ,  Lothar Schopmann ,  Herfried Zimmer

Inventor： Daniel Sekowski ,  Frederick Lloyd Carpenter ,  Mark Anthony Hand ,  Bernhard Bachl ,  Bernd Bienek ,  Olaf Cladders ,  Henning Dicker ,  Christian Miesner ,  Lothar Schopmann ,  Herfried Zimmer

IPC: H01L33/52

CPC classification number: H01L33/52 ,  H01L2924/0002 ,  H05K1/0256 ,  H05K3/0061 ,  H05K3/284 ,  H05K2201/0715 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/2018 ,  H05K2203/1316 ,  Y10T29/49172 ,  H01L2924/00

Abstract: In an electronic apparatus comprising a circuit board supporting semiconductor components and traces or conductors for supplying electrical energy to the semiconductor components, and a connection arrangement by which the conductors are connected to a power supply cable, the circuit board being covered by an electrically insulating encapsulating layer, a molded frame part is mounted on the circuit board so as to cover the connection arrangement, the molded frame part having a circumferential edge structure which extends on one end into the encapsulating layer and at the other end projects above the encapsulating layer so as to create an interior space which, when the encapsulating layer is at least partially cured, is filled with additional encapsulating compound to form, after curing, a relatively thick protective layer over the wire or cable and conductor connecting area.

Abstract translation: 在包括支撑半导体部件的电路板和用于向半导体部件供电的迹线或导体的电子设备中，以及将导体连接到电源电缆的连接装置，电路板被电绝缘封装 层，模制框架部分安装在电路板上以覆盖连接装置，模制框架部分具有在一端延伸到封装层中的周边边缘结构，而另一端在封装层上方突出，以便 以产生内部空间，当封装层至少部分地固化时，内部空间填充有另外的封装化合物，以在固化之后在导线或电缆和导体连接区域上形成相对较厚的保护层。

公开(公告)号：US20130215610A1

公开(公告)日：2013-08-22

申请号：US13688983

申请日：2012-11-29

Applicant: LEXTAR ELECTRONICS CORPORATION

Inventor： Ming-Hua TSAI ,  Chen-I LU

IPC: F21V21/00

CPC classification number: F21V21/00 ,  F21K9/00 ,  F21V23/06 ,  F21V31/00 ,  F21Y2103/10 ,  F21Y2113/00 ,  F21Y2115/10 ,  H05K1/117 ,  H05K1/142 ,  H05K3/3405 ,  H05K2201/09709 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10363 ,  Y10S362/80

Abstract: A first substrate of a light bar assembly includes a first edge and a second edge parallel to each other along a first direction. A first connecting end includes a first connecting portion protruding further outward than a second connecting portion. A first bonding pad and a second bonding pad are disposed on the first substrate. First solid-state semiconductor light sources are disposed along the first edge and the second edge. A second substrate, disposed corresponding to the first substrate, includes a third edge, a fourth edge, a second connecting portion, a third bonding pad, a fourth bonding pad, and second solid-state semiconductor light sources. A first connecting device is electrically connected to the first bonding pad and the fourth bonding pad; a second connecting device is electrically connected to the second bonding pad and the third bonding pad to fix the first substrate and the second substrate.

Abstract translation: 光棒组件的第一基板包括沿着第一方向彼此平行的第一边缘和第二边缘。 第一连接端包括比第二连接部更向外突出的第一连接部。 第一接合焊盘和第二接合焊盘设置在第一基板上。 第一固态半导体光源沿着第一边缘和第二边缘设置。 对应于第一基板设置的第二基板包括第三边缘，第四边缘，第二连接部分，第三焊盘，第四焊盘和第二固态半导体光源。 第一连接装置电连接到第一焊盘和第四接合焊盘; 第二连接装置电连接到第二接合焊盘和第三接合焊盘以固定第一基板和第二基板。

公开(公告)号：US08513536B2

公开(公告)日：2013-08-20

申请号：US12957962

申请日：2010-12-01

Applicant: Nau Negishi ,  Mikio Nakamura

Inventor： Nau Negishi ,  Mikio Nakamura

IPC: H05K1/16

CPC classification number: H01R9/0515 ,  H05K1/181 ,  H05K3/32 ,  H05K3/3442 ,  H05K2201/10287 ,  H05K2201/10636 ,  H05K2201/10962 ,  Y02P70/611 ,  Y10T29/49169

Abstract: An electronic circuit module is mounted on an electronic circuit board. The electronic circuit module includes an electronic component that has a first electrode and a second electrode that form a facing surface. The electronic circuit module also includes a coaxial cable with a core wire and a shielded wire being exposed in stages. The core wire and the shielded wire of the coaxial cable are directly connected to the first electrode and the second electrode that are exposed at a predetermined cable connecting surface of the electronic component.

Abstract translation: 电子电路模块安装在电子电路板上。 电子电路模块包括具有形成面对表面的第一电极和第二电极的电子部件。 电子电路模块还包括具有芯线的同轴电缆和屏蔽线分阶段地暴露。 同轴电缆的芯线和屏蔽线直接连接到暴露在电子部件的预定电缆连接表面处的第一电极和第二电极。

公开(公告)号：US20130200783A1

公开(公告)日：2013-08-08

申请号：US13575036

申请日：2011-01-31

Applicant: Gerardus Titus Van Heck ,  Margaretha Maria De Kok ,  Jeroen Van Den Brand

Inventor： Gerardus Titus Van Heck ,  Margaretha Maria De Kok ,  Jeroen Van Den Brand

IPC: H05K1/02 ,  H05B33/10 ,  H05B33/08

CPC classification number: H05K1/0277 ,  G09F9/00 ,  G09F19/22 ,  H01L27/3293 ,  H01L31/0392 ,  H01L31/042 ,  H01L51/5203 ,  H01L2251/5338 ,  H01L2251/5361 ,  H01R4/04 ,  H01R4/70 ,  H01R12/7076 ,  H05B33/0896 ,  H05B33/10 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/147 ,  H05K1/189 ,  H05K3/321 ,  H05K3/325 ,  H05K3/365 ,  H05K13/04 ,  H05K2201/029 ,  H05K2201/0311 ,  H05K2201/046 ,  H05K2201/083 ,  H05K2201/09081 ,  H05K2201/09281 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10484 ,  Y02E10/50 ,  Y10T29/4913

Abstract: An assembly is provided of an electro-physical transducer (10) on a flexible foil (20) with a carrier (40). The flexible foil (20) has a first main surface (22) provided with at least a first electrically conductive track (24) connected to the electro-physical transducer and opposite said first main surface a second main surface (23) facing towards the carrier. At least a first incision (25a) extends through the flexible foil alongside said at least a first electrically conductive track, therewith defining a strip shaped portion (27) of the flexible foil that carries a portion of the at least a first electrically conductive track. The at least a first electrically conductive track is electrically connected to an electrical conductor (421) of the carrier, and the flexible foil is attached to the carrier with its strip shaped portion.

Abstract translation: 在具有载体（40）的柔性箔（20）上提供由电 - 物理传感器（10）组成的组件。 柔性箔（20）具有第一主表面（22），第一主表面（22）设置有至少第一导电轨道（24），第一导电轨道（24）连接到电物理换能器并与所述第一主表面相对，第二主表面（23）面向载体 。 至少第一切口（25a）沿着所述至少第一导电轨道延伸穿过柔性箔片，从而限定柔性箔片的带状部分（27），其承载至少第一导电轨道的一部分。 至少第一导电轨道电连接到载体的电导体（421），并且柔性箔片与其带状部分连接到载体上。