公开(公告)号：US08535985B2

公开(公告)日：2013-09-17

申请号：US13052073

申请日：2011-03-20

Applicant: Charles W. C. Lin ,  Chia-Chung Wang

Inventor： Charles W. C. Lin ,  Chia-Chung Wang

IPC: H01L21/00

CPC classification number: H05K1/021 ,  H01L21/486 ,  H01L23/3677 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K3/0061 ,  H05K3/4084 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/2018 ,  H05K2203/049 ,  H05K2203/063 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A method of making a semiconductor chip assembly includes providing a bump and a ledge, mounting an adhesive on the ledge including inserting the bump into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the bump with an aperture in the conductive layer, then flowing the adhesive between the bump and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, then mounting a semiconductor device on the bump opposite a cavity in the bump, wherein a heat spreader includes the bump and a base that includes a portion of the ledge adjacent to the bump, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 一种制造半导体芯片组件的方法包括提供凸块和凸缘，将粘合剂安装在凸缘上，包括将凸块插入粘合剂中的开口中，将导电层安装在粘合剂上，包括将凸块与导电 然后使粘合剂在凸起和导电层之间流动，使粘合剂固化，然后提供包括导电层的焊盘，端子和选定部分的导电迹线，然后将半导体器件安装在与空腔相对的凸块上 在凸块中，其中散热器包括凸块和包括邻近凸块的凸缘的一部分的基座，将半导体器件电连接到导电迹线并将半导体器件热连接到散热器。

公开(公告)号：US08378372B2

公开(公告)日：2013-02-19

申请号：US12557540

申请日：2009-09-11

Applicant: Chia-Chung Wang ,  Charles W. C. Lin

Inventor： Chia-Chung Wang ,  Charles W. C. Lin

IPC: H01L33/00

CPC classification number: H05K1/0204 ,  H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a substrate and an adhesive. The semiconductor device is electrically connected to the substrate and thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly through an opening in the adhesive into an aperture in the substrate, and the base extends laterally from the post. The adhesive extends between the post and the substrate and between the base and the substrate. The substrate includes first and second conductive layers and a dielectric layer therebetween and provides horizontal signal routing between a pad and a terminal at the first conductive layer.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，衬底和粘合剂。 半导体器件电连接到衬底并热连接到散热器。 散热器包括一个柱子和一个底座。 该柱向上延伸穿过粘合剂中的开口到基底中的孔中，并且基部从柱延伸。 粘合剂在柱和基底之间以及基底和基底之间延伸。 衬底包括第一和第二导电层以及它们之间的电介质层，并且在第一导电层处提供衬垫和端子之间的水平信号路由。

公开(公告)号：US08343808B2

公开(公告)日：2013-01-01

申请号：US13299495

申请日：2011-11-18

Applicant: Charles W. C. Lin ,  Chia-Chung Wang

Inventor： Charles W. C. Lin ,  Chia-Chung Wang

IPC: H01L21/00

CPC classification number: H01L24/82 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/19 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2224/221 ,  H01L2224/24101 ,  H01L2224/24221 ,  H01L2224/24227 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/82106 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2224/92244 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of making a stackable semiconductor assembly that includes a semiconductor device, a heat spreader, an adhesive, a terminal, a plated through-hole and build-up circuitry is disclosed. The heat spreader includes a bump, a base and a flange. The bump defines a cavity. The semiconductor device is mounted on the bump at the cavity, electrically connected to the build-up circuitry and thermally connected to the bump. The bump extends from the base into an opening in the adhesive, the base extends vertically from the bump opposite the cavity and the flange extends laterally from the bump at the cavity entrance. The build-up circuitry provides signal routing for the semiconductor device. The plated through-hole provides signal routing between the build-up circuitry and the terminal. The heat spreader provides heat dissipation for the semiconductor device.

Abstract translation: 公开了一种制造包括半导体器件，散热器，粘合剂，端子，电镀通孔和积聚电路的可堆叠半导体组件的方法。 散热器包括凸块，底座和凸缘。 凸块限定一个空腔。 半导体器件安装在空腔处的凸块上，电连接到积聚电路并热连接到凸块。 凸起从基部延伸到粘合剂中的开口中，基部从与腔相对的凸起垂直延伸，并且凸缘从腔入口处的凸起横向延伸。 积聚电路为半导体器件提供信号路由。 电镀通孔在积聚电路和终端之间提供信号路由。 散热器为半导体器件提供散热。

公开(公告)号：US08269336B2

公开(公告)日：2012-09-18

申请号：US12642795

申请日：2009-12-19

Applicant: Charles W. C. Lin ,  Chia-Chung Wang

Inventor： Charles W. C. Lin ,  Chia-Chung Wang

IPC: H01L23/34

CPC classification number: H01L21/486 ,  H01L23/3677 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/32013 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a thermal post and a base. The thermal post extends upwardly from the base into a first opening in the adhesive, and the base extends laterally from the thermal post. The conductive trace includes a pad, a terminal and a signal post. The signal post extends upwardly from the terminal into a second opening in the adhesive.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线和粘合剂。 半导体器件电连接到导电迹线并热连接到散热器。 散热器包括热柱和基座。 热柱从基部向上延伸到粘合剂中的第一开口中，并且基部从热柱横向延伸。 导电迹线包括垫，端子和信号柱。 信号柱从端子向上延伸到粘合剂中的第二开口中。

公开(公告)号：US08212279B2

公开(公告)日：2012-07-03

申请号：US12833947

申请日：2010-07-10

Applicant: Charles W. C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

Inventor： Charles W. C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

IPC: H01L33/62 ,  H01L23/36 ,  H01L23/48 ,  H01L33/64

CPC classification number: H01L33/486 ,  H01L21/486 ,  H01L23/3677 ,  H01L23/5389 ,  H01L33/642 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a thermal post and a base. The conductive trace includes a pad, a terminal and a signal post. The semiconductor device extends into a cavity in the thermal post, is electrically connected to the conductive trace and is thermally connected to the heat spreader. The thermal post extends upwardly from the base into a first opening in the adhesive, and the signal post extends upwardly from the terminal into a second opening in the adhesive. The conductive trace is located outside the cavity and provides signal routing between the pad and the terminal.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线和粘合剂。 散热器包括热柱和基座。 导电迹线包括垫，端子和信号柱。 半导体器件延伸到热柱中的空腔中，电连接到导电迹线并且热连接到散热器。 热柱从基部向上延伸到粘合剂中的第一开口中，并且信号柱从端子向上延伸到粘合剂中的第二开口中。 导电迹线位于腔体外部，并在焊盘和端子之间提供信号路由。

公开(公告)号：US08148207B2

公开(公告)日：2012-04-03

申请号：US12626940

申请日：2009-11-30

Applicant: Charles W. C. Lin ,  Chia-Chung Wang ,  David M. Sigmond

Inventor： Charles W. C. Lin ,  Chia-Chung Wang ,  David M. Sigmond

IPC: H01L21/00

CPC classification number: H01L21/486 ,  H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive into and upward in a gap located in the aperture between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, providing a cap on the post, mounting a semiconductor device on a heat spreader that includes the post, the base and the cap, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 一种制造半导体芯片组件的方法包括提供柱和基座，在基底上安装粘合剂，包括将柱插入粘合剂中的开口中，将导电层安装在粘合剂上，包括使导柱与导电 层，然后使粘合剂在位于柱和导电层之间的孔中的间隙中向上流动，固化粘合剂，然后提供包括导电层的焊盘，端子和选定部分的导电迹线，提供 在支柱上的盖子，将半导体器件安装在包括柱，基座和盖子的散热器上，将半导体器件电连接到导电迹线并将半导体器件热连接到散热器。

公开(公告)号：US08067784B2

公开(公告)日：2011-11-29

申请号：US12616773

申请日：2009-11-11

Applicant: Charles W. C. Lin ,  Chia-Chung Wang

Inventor： Charles W. C. Lin ,  Chia-Chung Wang

IPC: H01L33/00 ,  H01L23/34

CPC classification number: H05K1/0204 ,  F21K9/00 ,  H01L21/486 ,  H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a substrate and an adhesive. The semiconductor device is electrically connected to the substrate and thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly from the base into an opening in the adhesive and an aperture in the substrate, and the base extends laterally from the post. The adhesive extends between the post and the substrate and between the base and the substrate. The assembly provides signal routing between a pad and a terminal.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，衬底和粘合剂。 半导体器件电连接到衬底并热连接到散热器。 散热器包括一个柱子和一个底座。 柱从基部向上延伸到粘合剂中的开口和基底中的孔，并且基部从柱横向延伸。 粘合剂在柱和基底之间以及基底和基底之间延伸。 组件提供垫和终端之间的信号路由。

公开(公告)号：US07811863B1

公开(公告)日：2010-10-12

申请号：US12363765

申请日：2009-02-01

Applicant: Charles W. C. Lin ,  Chia-Chung Wang ,  David M. Sigmond

Inventor： Charles W. C. Lin ,  Chia-Chung Wang ,  David M. Sigmond

IPC: H01L21/44

CPC classification number: H01L24/20 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/42 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2221/68327 ,  H01L2221/68345 ,  H01L2221/68377 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/051 ,  H01L2224/05118 ,  H01L2224/056 ,  H01L2224/05655 ,  H01L2224/11001 ,  H01L2224/11011 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/116 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/1301 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/19 ,  H01L2224/2101 ,  H01L2224/2105 ,  H01L2224/215 ,  H01L2224/24227 ,  H01L2224/27001 ,  H01L2224/27011 ,  H01L2224/2901 ,  H01L2224/2902 ,  H01L2224/29082 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/3001 ,  H01L2224/301 ,  H01L2224/3205 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48655 ,  H01L2224/48799 ,  H01L2224/48855 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/8388 ,  H01L2224/85207 ,  H01L2224/92144 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15724 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/2076 ,  H01L2924/00015 ,  H01L2221/68304

Abstract: A method of making a semiconductor chip assembly includes mechanically attaching a semiconductor chip to a routing line, forming a metal pillar on the routing line, forming an encapsulant that covers the chip and the metal pillar, grinding the encapsulant without grinding the metal pillar, then grinding the encapsulant and the metal pillar such that the encapsulant and the metal pillar are laterally aligned, and then attaching a heat sink to the metal pillar.

Abstract translation: 制造半导体芯片组件的方法包括将半导体芯片机械地附接到布线线，在布线线上形成金属柱，形成覆盖芯片和金属柱的密封剂，研磨密封剂而不研磨金属柱，然后 研磨密封剂和金属柱，使得密封剂和金属柱横向对齐，然后将散热器附接到金属支柱。

公开(公告)号：US07396703B1

公开(公告)日：2008-07-08

申请号：US11603805

申请日：2006-11-22

Applicant: Charles W. C. Lin ,  Cheng-Chung Chen

Inventor： Charles W. C. Lin ,  Cheng-Chung Chen

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L23/3128 ,  H01L21/4832 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/49827 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/056 ,  H01L2224/13008 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/32245 ,  H01L2224/48247

Abstract: A method of making a semiconductor chip assembly includes providing a metal base, a routing line, a bumped terminal and a filler, wherein the routing line contacts the bumped terminal and the filler, then mechanically attaching a semiconductor chip to the metal base, the routing line, the bumped terminal and the filler, then forming an encapsulant, then etching the metal base to expose the bumped terminal, and then grinding the bumped terminal to expose the filler.

Abstract translation: 制造半导体芯片组件的方法包括提供金属基座，布线线，凸起端子和填充物，其中布线线接触凸起端子和填充物，然后机械地将半导体芯片附接到金属基底，布线 线，凸起端子和填料，然后形成密封剂，然后蚀刻金属基底以暴露凸起的端子，然后研磨凸起端子以暴露填料。

公开(公告)号：US07268421B1

公开(公告)日：2007-09-11

申请号：US11472703

申请日：2006-06-22

Applicant: Charles W. C. Lin

Inventor： Charles W. C. Lin

IPC: H01L23/48

CPC classification number: H01L23/3128 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/85 ,  H01L24/90 ,  H01L25/0657 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2224/05001 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/05554 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/18 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48511 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/85 ,  H01L2225/0651 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2924/01004

Abstract: A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The chip and the metal pillar are embedded in the encapsulant, the routing line extends laterally beyond the metal pillar towards the chip, and the metal pillar is welded to the routing line.

Abstract translation: 半导体芯片组件包括：半导体芯片，其包括导电焊盘，包括布线线和金属柱的导电迹线，电连接布线线和焊盘的连接接头以及密封剂。 芯片和金属柱嵌入密封剂中，路由线横向延伸超过金属柱朝向芯片，金属柱焊接到路由线。