公开(公告)号：US09559061B2

公开(公告)日：2017-01-31

申请号：US15143077

申请日：2016-04-29

Applicant: Invensas Corporation

Inventor： Belgacem Haba ,  Ilyas Mohammed

IPC: H01L21/20 ,  H01L23/538 ,  H01L21/683 ,  H01L23/522 ,  H01L23/31 ,  H01L25/065

CPC classification number: H01L23/5384 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/3114 ,  H01L23/5226 ,  H01L23/5383 ,  H01L23/5386 ,  H01L25/0652 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/11 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06544 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/00

Abstract: Wafer to carrier adhesion without mechanical adhesion for formation of an IC. In such formation, an apparatus has a bottom surface of a substrate abutting a top surface of a support platform without adhesive therebetween. A material is disposed around the substrate and on the top surface of the support platform. The material is in contact with a side surface of the substrate to completely seal an interface as between the bottom surface of the substrate and the top surface of the support platform to retain abutment of the top surface and the bottom surface.

Abstract translation: 晶片与载体粘合无机械粘合形成IC。 在这种形成中，装置具有基板的底表面邻接支撑平台的顶表面而没有粘合剂。 材料围绕衬底设置在支撑平台的顶表面上。 该材料与衬底的侧表面接触以完全密封基底的底表面和支撑平台的顶表面之间的界面，以保持顶表面和底表面的邻接。

公开(公告)号：US20160247764A1

公开(公告)日：2016-08-25

申请号：US15143077

申请日：2016-04-29

Applicant: Invensas Corporation

Inventor： Belgacem Haba ,  Ilyas Mohammed

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/31

CPC classification number: H01L23/5384 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/3114 ,  H01L23/5226 ,  H01L23/5383 ,  H01L23/5386 ,  H01L25/0652 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/11 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06544 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/00

Abstract: Wafer to carrier adhesion without mechanical adhesion for formation of an IC. In such formation, an apparatus has a bottom surface of a substrate abutting a top surface of a support platform without adhesive therebetween. A material is disposed around the substrate and on the top surface of the support platform. The material is in contact with a side surface of the substrate to completely seal an interface as between the bottom surface of the substrate and the top surface of the support platform to retain abutment of the top surface and the bottom surface.

公开(公告)号：US09356006B2

公开(公告)日：2016-05-31

申请号：US14953565

申请日：2015-11-30

Applicant: Invensas Corporation

Inventor： Belgacem Haba ,  Ilyas Mohammed ,  Liang Wang

IPC: H01L21/44 ,  H01L25/10 ,  H01L25/00 ,  H01L21/56

CPC classification number: H01L25/50 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L23/13 ,  H01L23/3157 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81805 ,  H01L2224/92125 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06544 ,  H01L2225/06582 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/15333 ,  H01L2924/014 ,  H01L2924/00

Abstract: A microelectronic assembly can be made by joining first and second subassemblies by electrically conductive masses to connect electrically conductive elements on support elements of each subassembly. A patterned layer of photo-imageable material may overlie a surface of one of the support elements and have openings with cross-sectional dimensions which are constant or monotonically increasing with height from the surface of that support element, where the masses extend through the openings and have dimensions defined thereby. An encapsulation can be formed by flowing an encapsulant into a space between the joined first and second subassemblies.

公开(公告)号：US20160079214A1

公开(公告)日：2016-03-17

申请号：US14952064

申请日：2015-11-25

Applicant: Invensas Corporation

Inventor： Terrence Caskey ,  Ilyas Mohammed ,  Cyprian Uzoh ,  Charles G. Woychik ,  Michael Newman ,  Pezhman Monadgemi ,  Reynaldo Co ,  Ellis Chau ,  Belgacem Haba

IPC: H01L25/10 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L25/105 ,  H01L21/486 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/02379 ,  H01L2224/04042 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48108 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73257 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/381 ,  H05K1/0298 ,  H05K3/46 ,  Y10T29/49126 ,  Y10T29/49162 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A method for making an interposer includes forming a plurality of wire bonds bonded to one or more first surfaces of a first element. A dielectric encapsulation is formed contacting an edge surface of the wire bonds which separates adjacent wire bonds from one another. Further processing comprises removing at least portions of the first element, wherein the interposer has first and second opposite sides separated from one another by at least the encapsulation, and the interposer having first contacts and second contacts at the first and second opposite sides, respectively, for electrical connection with first and second components, respectively, the first contacts being electrically connected with the second contacts through the wire bonds.

Abstract translation: 制造插入件的方法包括形成结合到第一元件的一个或多个第一表面的多个引线键合。 形成电介质封装，其接触将引线接合部彼此分隔开的引线接合的边缘表面。 进一步的处理包括去除第一元件的至少一部分，其中插入件具有通过至少封装相互隔开的第一和第二相对侧，并且插入件分别在第一和第二相对侧具有第一接触和第二接触， 分别与第一和第二部件电连接，第一触点通过引线键与第二触点电连接。

公开(公告)号：US20160044781A1

公开(公告)日：2016-02-11

申请号：US14887674

申请日：2015-10-20

Applicant: Invensas Corporation

Inventor： Rajesh Katkar ,  Cyprian Emeka Uzoh ,  Belgacem Haba ,  Ilyas Mohammed

IPC: H05K1/03 ,  H05K3/40 ,  H05K1/11 ,  H05K3/42 ,  H01L23/13 ,  H01L21/48

CPC classification number: H05K1/0306 ,  H01L21/481 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/13 ,  H01L23/3731 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5381 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5386 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/16113 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H05K1/09 ,  H05K1/112 ,  H05K1/115 ,  H05K3/4007 ,  H05K3/42 ,  H05K2201/09545 ,  H05K2201/10378 ,  H05K2203/0323

Abstract: Interposers and methods of making the same are disclosed herein. In one embodiment, an interposer includes a region having first and second oppositely facing surfaces and a plurality of pores, each pore extending in a first direction from the first surface towards the second surface, wherein alumina extends along a wall of each pore; a plurality of electrically conductive connection elements extending in the first direction, consisting essentially of aluminum and being electrically isolated from one another by at least the alumina; a first conductive path provided at the first surface for connection with a first component external to the interposer; and a second conductive path provided at the second surface for connection with a second component external to the interposer, wherein the first and second conductive paths are electrically connected through at least some of the connection elements.

Abstract translation: 中间体及其制备方法在本文中公开。 在一个实施例中，插入件包括具有第一和第二相对面的表面和多个孔的区域，每个孔从第一表面朝向第二表面沿第一方向延伸，其中氧化铝沿每个孔的壁延伸; 多个导电连接元件，其沿第一方向延伸，主要由铝构成，并通过至少氧化铝彼此电隔离; 第一导电路径，设置在第一表面处，用于与插入件外部的第一部件连接; 以及设置在所述第二表面处用于与所述插入件外部的第二部件连接的第二导电路径，其中所述第一和第二导电路径通过至少一些所述连接元件电连接。

公开(公告)号：US09214454B2

公开(公告)日：2015-12-15

申请号：US14230388

申请日：2014-03-31

Applicant: Invensas Corporation

Inventor： Belgacem Haba ,  Ilyas Mohammed ,  Liang Wang

IPC: H01L23/48 ,  H01L23/52 ,  H01L25/10 ,  H01L25/00 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L25/50 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L23/13 ,  H01L23/3157 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81805 ,  H01L2224/92125 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06544 ,  H01L2225/06582 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/15333 ,  H01L2924/014 ,  H01L2924/00

Abstract: A microelectronic assembly can be made by joining first and second subassemblies by electrically conductive masses to connect electrically conductive elements on support elements of each subassembly. A patterned layer of photo-imageable material may overlie a surface of one of the support elements and have openings with cross-sectional dimensions which are constant or monotonically increasing with height from the surface of that support element, where the masses extend through the openings and have dimensions defined thereby. An encapsulation can be formed by flowing an encapsulant into a space between the joined first and second subassemblies.

Abstract translation: 微电子组件可以通过用导电块连接第一和第二子组件来连接每个子组件的支撑元件上的导电元件来制造。 可光成像材料的图案层可以覆盖在一个支撑元件的表面上，并且具有开口，其横截面尺寸与该支撑元件的表面的高度不变或单调地增加，其中质量延伸穿过开口和 具有由此定义的尺寸。 可以通过将密封剂流入连接的第一和第二子组件之间的空间来形成封装。

公开(公告)号：US20150334831A1

公开(公告)日：2015-11-19

申请号：US14809570

申请日：2015-07-27

Applicant: Invensas Corporation

Inventor： Belgacem Haba ,  Ilyas Mohammed ,  Terrence Caskey ,  Reynaldo Co ,  Ellis Chau

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K1/11 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/528 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/10126 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1191 ,  H01L2224/13017 ,  H01L2224/13022 ,  H01L2224/13076 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13101 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14135 ,  H01L2224/16105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/32225 ,  H01L2224/45012 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45101 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45624 ,  H01L2224/45655 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15322 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/0298 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/10515 ,  H05K2201/10977 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/014

Abstract: A structure may include bond elements having bases joined to conductive elements at a first portion of a first surface and end surfaces remote from the substrate. A dielectric encapsulation element may overlie and extend from the first portion and fill spaces between the bond elements to separate the bond elements from one another. The encapsulation element has a third surface facing away from the first surface. Unencapsulated portions of the bond elements are defined by at least portions of the end surfaces uncovered by the encapsulation element at the third surface. The encapsulation element at least partially defines a second portion of the first surface that is other than the first portion and has an area sized to accommodate an entire area of a microelectronic element. Some conductive elements are at the second portion and configured for connection with such microelectronic element.

公开(公告)号：US09165911B2

公开(公告)日：2015-10-20

申请号：US14243994

申请日：2014-04-03

Applicant: Invensas Corporation

Inventor： Terrence Caskey ,  Ilyas Mohammed

IPC: H01L21/56 ,  H01L25/11 ,  H01L25/065 ,  H01L25/10 ,  H01L23/13 ,  H01L23/538 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L25/18 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/76802 ,  H01L21/76877 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3185 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/117 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/05554 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/06155 ,  H01L2224/12105 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/14131 ,  H01L2224/27334 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48108 ,  H01L2224/48145 ,  H01L2224/4824 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73217 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/82031 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/852 ,  H01L2224/92144 ,  H01L2224/92147 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2225/06596 ,  H01L2225/1035 ,  H01L2225/1052 ,  H01L2225/1076 ,  H01L2225/1082 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/186 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/05552

Abstract: A microelectronic package may include a first microelectronic unit including a semiconductor chip having first chip contacts, an encapsulant contacting an edge of the semiconductor chip, and first unit contacts exposed at a surface of the encapsulant and electrically connected with the first chip contacts. The package may include a second microelectronic unit including a semiconductor chip having second chip contacts at a surface thereof, and an encapsulant contacting an edge of the chip of the second unit and having a surface extending away from the edge. The surfaces of the chip and the encapsulant of the second unit define a face of the second unit. Package terminals at the face may be electrically connected with the first unit contacts through bond wires electrically connected with the first unit contacts, and the second chip contacts through metalized vias and traces formed in contact with the second chip contacts.

Abstract translation: 微电子封装可以包括第一微电子单元，其包括具有第一芯片触点的半导体芯片，与半导体芯片的边缘接触的密封剂以及暴露在密封剂的表面处并与第一芯片触点电连接的第一单元触点。 封装可以包括第二微电子单元，其包括在其表面具有第二芯片触点的半导体芯片，以及与第二单元的芯片的边缘接触并且具有远离边缘延伸的表面的密封剂。 芯片的表面和第二单元的密封剂的表面限定了第二单元的面。 表面处的封装端子可以通过与第一单元触点电连接的接合线与第一单元触点电连接，并且第二芯片通过金属化通孔和与第二芯片触点接触形成的迹线接触。

公开(公告)号：US20150263252A1

公开(公告)日：2015-09-17

申请号：US14727810

申请日：2015-06-01

Applicant: Invensas Corporation

Inventor： Liang Wang ,  Masud Beroz ,  Ilyas Mohammed

IPC: H01L33/58 ,  H01L51/52 ,  H01L33/44

CPC classification number: H01L33/58 ,  H01L33/44 ,  H01L51/5262 ,  H01L51/5268 ,  H01L51/5275 ,  H01L2251/5369 ,  H01L2933/0083 ,  H01L2933/0091

Abstract: Optical enhancement of light emitting devices. In accordance with an embodiment of the present invention, an apparatus includes an optical enhancement layer comprising nanoparticles. Each of the nanoparticles includes an electrically conductive core surrounded by an electrically insulating shell. The optical enhancement layer is disposed on a top semiconductor layer in a preferred path of optical emission of a light emitting device. The nanoparticles may enhance the light emission of the light emitting device due to emitter-surface plasmon coupling.

Abstract translation: 发光器件的光学增强。 根据本发明的实施例，一种装置包括包含纳米颗粒的光学增强层。 每个纳米颗粒包括由电绝缘壳包围的导电芯。 光学增强层设置在发光器件的光发射的优选路径中的顶部半导体层上。 纳米颗粒可以由于发射体 - 表面等离子体耦合而增强发光器件的发光。

公开(公告)号：US20150171027A1

公开(公告)日：2015-06-18

申请号：US14466992

申请日：2014-08-23

Applicant: Invensas Corporation

Inventor： Liang Wang ,  Ilyas Mohammed ,  Masud Beroz

IPC: H01L23/00 ,  H01L27/02

CPC classification number: H01L23/562 ,  H01L21/02002 ,  H01L21/02035 ,  H01L21/02378 ,  H01L21/02381 ,  H01L21/02389 ,  H01L21/02392 ,  H01L21/02395 ,  H01L21/02414 ,  H01L21/6835 ,  H01L23/544 ,  H01L24/19 ,  H01L24/32 ,  H01L24/83 ,  H01L25/50 ,  H01L27/0207 ,  H01L33/005 ,  H01L33/0062 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/351 ,  H01L2924/00

Abstract: High yield substrate assembly. In accordance with a first method embodiment, a plurality of piggyback substrates are attached to a carrier substrate. The edges of the plurality of the piggyback substrates are bonded to one another. The plurality of piggyback substrates are removed from the carrier substrate to form a substrate assembly. The substrate assembly is processed to produce a plurality of integrated circuit devices on the substrate assembly. The processing may use manufacturing equipment designed to process wafers larger than individual instances of the plurality of piggyback substrates.

Abstract translation: 高产量基板组件。 根据第一方法实施例，将多个搭载基板附接到载体基板。 多个搭载基板的边缘彼此接合。 将多个搭载基板从载体基板上移除以形成基板组件。 处理衬底组件以在衬底组件上产生多个集成电路器件。 处理可以使用设计成处理大于多个背负式基板的单独实例的晶片的制造设备。