公开(公告)号：US5656863A

公开(公告)日：1997-08-12

申请号：US198078

申请日：1994-02-17

Applicant: Masatoshi Yasunaga ,  Shin Nakao ,  Shinji Baba ,  Mitsuyasu Matsuo ,  Hironori Matsushima

Inventor： Masatoshi Yasunaga ,  Shin Nakao ,  Shinji Baba ,  Mitsuyasu Matsuo ,  Hironori Matsushima

IPC: H01L21/60 ,  H01L21/56 ,  H01L21/68 ,  H01L23/12 ,  H01L23/28 ,  H01L23/31 ,  H01L23/32 ,  H01L23/485 ,  H01L25/10 ,  H05K3/30 ,  H05K3/34 ,  H01L23/48

CPC classification number: H01L21/568 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L25/10 ,  H01L25/105 ,  H05K3/303 ,  H01L2224/0231 ,  H01L2224/0233 ,  H01L2224/02333 ,  H01L2224/02335 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/1131 ,  H01L2224/11332 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/1191 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16105 ,  H01L2224/16108 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4813 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/83104 ,  H01L2225/1005 ,  H01L2225/1035 ,  H01L2225/107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K2201/09909 ,  H05K2201/10454 ,  H05K2201/10484 ,  H05K2201/2036 ,  H05K3/3442 ,  Y02P70/613

Abstract: Bonding pads are formed on a main surface of a semiconductor chip. An insulating layer having openings located on the bonding pads is formed on the main surface of the semiconductor chip. Base metal layers are formed on the bonding pads. A buffer coat film having a portion laid on a periphery of the base metal layer is formed on the insulating layer. Connection layers are formed on the base metal layers. First conductors are formed on the connection layers. A seal resin exposing only top surfaces of the first conductors is formed. Lumpish second conductors are formed on the top surfaces of the first conductor. Thereby, a resin seal semiconductor package can be made compact and it has improved electrical characteristics and high reliability.

Abstract translation: 接合焊盘形成在半导体芯片的主表面上。 在半导体芯片的主表面上形成具有位于接合焊盘上的开口的绝缘层。 在接合焊盘上形成基底金属层。 在绝缘层上形成具有放置在基底金属层周围的部分的缓冲涂膜。 连接层形成在基底金属层上。 第一导体形成在连接层上。 形成仅露出第一导体的顶表面的密封树脂。 在第一导体的顶表面上形成笨重的第二导体。 因此，可以使树脂密封半导体封装紧凑并且具有改善的电特性和高可靠性。

公开(公告)号：US5103247A

公开(公告)日：1992-04-07

申请号：US606292

申请日：1990-10-31

Applicant: Toshio Sugano ,  Seiichirou Tsukui ,  Shigeru Suzuki

Inventor： Toshio Sugano ,  Seiichirou Tsukui ,  Shigeru Suzuki

IPC: H01L27/10 ,  H01L23/04 ,  H01L23/32 ,  H01L23/50 ,  H01L25/10 ,  H05K1/00 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36 ,  H05K7/14

CPC classification number: H05K1/141 ,  H01L23/50 ,  H01L25/105 ,  H01R12/721 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H05K1/0289 ,  H05K1/181 ,  H05K2201/09336 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10484 ,  H05K2201/10689 ,  H05K2203/1572 ,  H05K3/366

Abstract: In an SIP module of the type wherein memory ICs are mounted to both surfaces of a substrate, the present invention provides a face package type memory module wherein packaging is made in an inclined direction in place of vertical packaging of the prior art technique and only the memory ICs mounted to the upper surface side of the substrate are deviated to the positions closer to the end portion of the substrate in order to drastically reduce the packaging height.

公开(公告)号：US4227238A

公开(公告)日：1980-10-07

申请号：US942969

申请日：1978-09-18

Applicant: Masashi Saito

Inventor： Masashi Saito

IPC: H05K1/14 ,  H05K3/00 ,  H05K7/12 ,  H05K7/18

CPC classification number: H05K7/12 ,  H05K1/148 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09145 ,  H05K2201/10287 ,  H05K2201/10484 ,  H05K3/0052

Abstract: A number of electric operation components such as tone volume controls of an electric musical instrument are collectively carried by a common chassis preferably manufactured by press stamping which is accompanied by one or more printed circuit base blocks and easily incorporated in a front panel of an electric device. Assembly of the front panel construction on the electric device is remarkably simplified with enhanced precision in said position of the electric operation components on the front panel and reduced use of electric lead wires.

Abstract translation: 许多电气操作部件如电气乐器的音量控制由公共底盘共同承载，优选地通过冲压机制成，该冲压机伴随着一个或多个印刷电路基座并且容易地结合在电气设备的前面板中 。 电气装置上的前面板结构的组装被显着简化，并且在前面板上的电气操作部件的所述位置的精度提高，并且减少了使用电线。

公开(公告)号：US4171855A

公开(公告)日：1979-10-23

申请号：US803879

申请日：1977-06-06

Applicant: Jef Raskin

Inventor： Jef Raskin

IPC: H01R12/70 ,  H05K3/30 ,  H05K3/34 ,  H05K1/08

CPC classification number: H01R12/7076 ,  H05K3/308 ,  H05K2201/09954 ,  H05K2201/10128 ,  H05K2201/10484 ,  H05K2201/10787 ,  H05K2201/10871 ,  H05K3/3447

Abstract: An electronic component is provided having mounting leads configured as concentric arcs centered about a desired axis of rotation. The leads may therefore be inserted into a mounting board, and the component rotated to a desired angle with respect to the surface of the mounting board. In some embodiments, one or more of the mounting leads is provided with tabs or other positioning elements to facilitate the positioning of the component at any of a number of selected angles relative to the mounting board.

Abstract translation: 提供了一种电子部件，其具有被构造成围绕期望的旋转轴线居中的同心圆弧的安装引线。 因此，引线可以插入到安装板中，并且部件相对于安装板的表面旋转到期望的角度。 在一些实施例中，一个或多个安装引线设置有突片或其它定位元件，以便于相对于安装板以多个选定角度的任何一个定位元件。

公开(公告)号：US3524108A

公开(公告)日：1970-08-11

申请号：US3524108D

申请日：1967-12-26

Applicant: CTS CORP

Inventor： ENGLISH JACK A

IPC: H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K7/06 ,  H05K7/12

CPC classification number: H05K3/306 ,  H05K3/308 ,  H05K3/32 ,  H05K3/3447 ,  H05K2201/09827 ,  H05K2201/10454 ,  H05K2201/10484 ,  H05K2201/10568 ,  H05K2201/10696 ,  H05K2201/10757 ,  H05K2201/10863 ,  H05K2201/10878 ,  H05K2201/2036

公开(公告)号：US20190195448A1

公开(公告)日：2019-06-27

申请号：US16331678

申请日：2017-08-22

Applicant: ZKW GROUP GMBH

Inventor： Daniel PETSCH

IPC: F21S41/147 ,  F21S41/19 ,  H05K3/34 ,  F21S41/25 ,  F21S41/32 ,  H01L33/62

CPC classification number: F21S41/147 ,  F21S41/19 ,  F21S41/25 ,  F21S41/321 ,  F21Y2107/50 ,  F21Y2115/10 ,  H01L33/62 ,  H05K3/3436 ,  H05K3/3478 ,  H05K3/3484 ,  H05K2201/10106 ,  H05K2201/10113 ,  H05K2201/10484 ,  H05K2203/042 ,  H05K2203/0465 ,  H05K2203/048

Abstract: The invention relates to a motor-vehicle headlamp (1), comprising at least one LED (4; 4a, 4d), which is attached by soldering, as an SMD, to metal surfaces (3-1, 3-2) of a printed circuit board (3) at connection points of said LED, and comprising an optical unit (2; 8), which emits the light emitted by the at least one LED into the traffic space, wherein, in order to set the emission direction of the at least one LED in a specific manner, said LED is attached by soldering with different solder thicknesses (d1, d2) between the connection points (4-1, 4-2) of said LED and the metal surfaces of the printed circuit board.

公开(公告)号：US20180027657A1

公开(公告)日：2018-01-25

申请号：US15491921

申请日：2017-04-19

Applicant: MACOM Technology Solutions Holdings, Inc.

Inventor： Jessica Aldrich ,  Paul Hogan

IPC: H05K1/18 ,  H05K3/32 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K1/11 ,  H05K3/301 ,  H05K3/32 ,  H05K2201/1003 ,  H05K2201/10227 ,  H05K2201/10265 ,  H05K2201/10484

Abstract: A system and method for placing an inductor on a circuit board. This method includes providing a circuit board, a pedestal, and an inductor, the pedestal has a top surface and a bottom surface and the circuit board has one or more electrical conductors, the inductor having a first inductor terminal and a second inductor terminal. Adhesive is placed on the circuit board and the bottom surface of the pedestal is placed on the adhesive located on the circuit board to secure the pedestal to the circuit board. Next, adhesive is placed on the top surface of the pedestal and the inductor is placed on the adhesive located on the top surface of the pedestal to secure the inductor to the pedestal. The inductor is electrically connected to the circuit board.

公开(公告)号：US20140321804A1

公开(公告)日：2014-10-30

申请号：US14047978

申请日：2013-10-07

Applicant: Oracle International Corporation

Inventor： Hiren D. Thacker ,  Ashok V. Krishnamoorthy ,  Robert David Hopkins, II ,  Jon Lexau ,  Xuezhe Zheng ,  Ronald Ho ,  Ivan Shubin ,  John E. Cunningham

IPC: G02B6/12

CPC classification number: G02B6/4274 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/72 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/141 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/32225 ,  H01L2224/72 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06534 ,  H01L2225/06589 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/37001 ,  H05K3/36 ,  H05K2201/10484 ,  H01L2924/00

Abstract: A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are proximate to each other in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a top surface of an interposer, and this top surface is in turn electrically coupled to a front surface of an input/output (I/O) integrated circuit that faces the top surface. Furthermore, the front surface of the I/O integrated circuit is electrically coupled to a top surface of the optical integrated circuit, where the top surface of the optical integrated circuit faces the front surface of the I/O integrated circuit.

Abstract translation: 芯片封装包括在芯片封装中彼此靠近的光学集成电路（例如混合集成电路）和集成电路。 集成电路包括诸如存储器或处理器的电路，并且光学集成电路传送具有非常高带宽的光信号。 此外，集成电路的前表面电耦合到插入件的顶表面，并且该顶表面又电耦合到面向顶表面的输入/输出（I / O）集成电路的前表面 。 此外，I / O集成电路的前表面电耦合到光集成电路的顶表面，其中光集成电路的顶表面面向I / O集成电路的前表面。

公开(公告)号：US08618423B2

公开(公告)日：2013-12-31

申请号：US12056854

申请日：2008-03-27

Applicant: Hirotoshi Ozaki ,  Akiko Morimoto ,  Tetsuya Yamashita

Inventor： Hirotoshi Ozaki ,  Akiko Morimoto ,  Tetsuya Yamashita

IPC: H05K1/00

CPC classification number: H01R12/7082 ,  H05K1/182 ,  H05K3/3421 ,  H05K2201/09836 ,  H05K2201/10037 ,  H05K2201/10484 ,  H05K2201/10651 ,  H05K2201/10856 ,  H05K2203/0195 ,  H05K2203/082

Abstract: A lead-attached electrical element and a mounting board to which the lead-attached electrical element is mounted both contribute to a reduction in the size of the mounting board as well as facilitate rework. The lead-attached electrical element is constituted from an electrical element and two leads. Each lead includes a main portion which is bonded to a respective electrode face of the electrical element, and a bent portion which is inclined with respect to the main portion. The mounting board is constituted from a PC (printed circuit) board and the lead-attached electrical element. Two conductive lands are provided on a surface of the PC board. The lead-attached electrical element has been inserted into an aperture in the PC board, and bent portions of the leads attached to the electrical element are bonded to the conductive lands so that the electrical element is suspended in the aperture by the leads.

Abstract translation: 安装有引线的电气元件的引线附接电气元件和安装板都有助于减小安装板的尺寸并且便于返工。 引线连接的电气元件由电气元件和两个引线构成。 每个引线包括结合到电气元件的相应电极面的主要部分和相对于主要部分倾斜的弯曲部分。 安装板由PC（印刷电路板）和带引线的电气元件构成。 在PC板的表面上设置两个导电焊盘。 引线连接的电气元件已经插入到PC板的孔中，并且附接到电气元件的引线的弯曲部分被接合到导电焊盘，使得电气元件通过引线悬挂在孔中。

公开(公告)号：US20130201637A1

公开(公告)日：2013-08-08

申请号：US13574789

申请日：2011-01-31

Applicant: Margaretha Maria De Kok ,  Jeroen Van Den Brand ,  Gerardus Titus Van Heck

Inventor： Margaretha Maria De Kok ,  Jeroen Van Den Brand ,  Gerardus Titus Van Heck

IPC: H05K1/02 ,  H05K13/04 ,  H05B33/08

CPC classification number: H05K1/0277 ,  G09F9/00 ,  G09F19/22 ,  H01L27/3293 ,  H01L31/0392 ,  H01L31/042 ,  H01L51/5203 ,  H01L2251/5338 ,  H01L2251/5361 ,  H01R4/04 ,  H01R4/70 ,  H01R12/7076 ,  H05B33/0896 ,  H05B33/10 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/147 ,  H05K1/189 ,  H05K3/321 ,  H05K3/325 ,  H05K3/365 ,  H05K13/04 ,  H05K2201/029 ,  H05K2201/0311 ,  H05K2201/046 ,  H05K2201/083 ,  H05K2201/09081 ,  H05K2201/09281 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10484 ,  Y02E10/50 ,  Y10T29/4913

Abstract: An assembly of a plurality of tiles (1) with a carrier (40), wherein the tiles (1) comprise a foil (20) with an electro-physical transducer (10) and electrical connectors (24, 28) to said transducer. The tiles are mechanically and electrically coupled to the carrier, and the tiles overlay according to a fish scale pattern.

Abstract translation: 具有载体（40）的多个瓦片（1）的组件，其中瓦片（1）包括具有电 - 物理换能器（10）的箔（20）和到所述换能器的电连接器（24,28）。 瓦片机械地和电耦合到载体上，并且瓦片根据鱼鳞图案覆盖。