公开(公告)号：US20100224986A1

公开(公告)日：2010-09-09

申请号：US12728615

申请日：2010-03-22

申请人： Toshiyuki Kojima ,  Seiichi Nakatani ,  Yoshihisa Yamashita ,  Takashi Kitae ,  Shingo Komatsu

发明人： Toshiyuki Kojima ,  Seiichi Nakatani ,  Yoshihisa Yamashita ,  Takashi Kitae ,  Shingo Komatsu

IPC分类号： H01L23/498

CPC分类号： H01L24/81 ,  H01L21/6835 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/17 ,  H01L24/24 ,  H01L24/25 ,  H01L24/45 ,  H01L24/48 ,  H01L24/82 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16058 ,  H01L2224/16059 ,  H01L2224/16105 ,  H01L2224/16106 ,  H01L2224/16238 ,  H01L2224/17051 ,  H01L2224/171 ,  H01L2224/24011 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/82001 ,  H01L2224/83385 ,  H01L2224/83886 ,  H01L2224/83888 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/00015 ,  H01L2224/81805 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A mounted body (100) of the present invention includes: a semiconductor element (10) having a surface (10a) on which element electrodes (12) are formed and a rear surface (10b) opposing the surface (10a); and a mounting board (30) on which wiring patterns (35) each having an electrode terminal (32) are formed. The rear surface (10b) of the semiconductor element (10) is in contact with the mounting board (30), and the element electrodes (12) of the semiconductor element (10) are connected electrically to the electrode terminals (32) of the wiring pattern (35) formed on the mounting board (30) via solder connectors (20) formed of solder particles assembled into a bridge shape. With this configuration, fine pitch connection between the element electrodes of the semiconductor element and the electrode terminals of the mounting board becomes possible.

摘要翻译： 本发明的安装体（100）包括：具有形成元件电极（12）的表面（10a）和与表面（10a）相对的后表面（10b）的半导体元件（10）。 以及安装板（30），在其上形成有各自具有电极端子（32）的布线图案（35）。 半导体元件（10）的后表面（10b）与安装板（30）接触，并且半导体元件（10）的元件电极（12）与电极端子（32）电连接 通过由组装成桥形的焊料颗粒形成的焊料连接器（20）在安装板（30）上形成的布线图案（35）。 利用这种结构，半导体元件的元件电极和安装板的电极端子之间的细间距连接成为可能。

公开(公告)号：US20090230546A1

公开(公告)日：2009-09-17

申请号：US11908087

申请日：2006-02-28

申请人： Shingo Komatsu ,  Seiichi Nakatani ,  Seiji Karashima ,  Toshiyuki Kojima ,  Takashi Kitae ,  Yoshihisa Yamashita

发明人： Shingo Komatsu ,  Seiichi Nakatani ,  Seiji Karashima ,  Toshiyuki Kojima ,  Takashi Kitae ,  Yoshihisa Yamashita

IPC分类号： H01L23/498 ,  B23K31/02

CPC分类号： H01L24/81 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83886 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06582 ,  H01L2225/06593 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2924/00

摘要： A mounted body of the present invention includes: a multilayer semiconductor chip 20 including a plurality of semiconductor chips 10 (10a, 10b) that are stacked; and a mounting board 13 on which the multilayer semiconductor chip 20 is mounted. In this mounted body, each of the semiconductor chips 10 (10a, 10b) in the multilayer semiconductor chip 20 has a plurality of element electrodes 12 (12a, 12b) on a chip surface 21 (21a, 21b) facing toward the mounting board 13. On the mounting board 13, electrode terminals 14 are formed so as to correspond to the plurality of element electrodes (12a, 12b), respectively, and the electrode terminals 14 of the mounting board and the element electrodes (12a, 12b) are connected electrically to each other via solder bump formed as a result of assembly of solder particles. With this configuration, a mounted body on which a stacked package is mounted can be manufactured easily.

摘要翻译： 本发明的安装体包括：层叠半导体芯片10（10a，10b）的多层半导体芯片20， 以及安装基板13，其上安装有多层半导体芯片20。 在该安装体中，多层半导体芯片20中的各半导体芯片10（10a，10b）在与安装基板13相对的芯片面21（21a，21b）上具有多个元件电极12（12a，12b） 在安装基板13上分别形成有与多个元件电极（12a，12b）对应的电极端子14，并且安装基板的电极端子14和元件电极（12a，12b）被连接 通过焊料颗粒的组装形成的焊锡凸块彼此电连接。 利用这种结构，可以容易地制造安装有堆叠的包装的安装体。

公开(公告)号：US20090223705A1

公开(公告)日：2009-09-10

申请号：US11886747

申请日：2006-03-23

申请人： Yoshihisa Yamashita ,  Seiji Karashima ,  Takashi Kitae ,  Seiichi Nakatani ,  Toshiyuki Kojima ,  Shingo Komatsu

发明人： Yoshihisa Yamashita ,  Seiji Karashima ,  Takashi Kitae ,  Seiichi Nakatani ,  Toshiyuki Kojima ,  Shingo Komatsu

IPC分类号： H05K1/16 ,  B23K31/02

CPC分类号： H01L21/6835 ,  B30B5/02 ,  B30B15/065 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0655 ,  H01L25/16 ,  H01L25/50 ,  H01L2221/68354 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75314 ,  H01L2224/7598 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/83224 ,  H01L2224/83886 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15724 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H05K3/303 ,  H05K3/305 ,  H05K3/323 ,  H05K3/341 ,  H05K3/3442 ,  H05K3/3484 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0173 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/0665 ,  H01L2224/05599

摘要： An electronic component mounting method includes a step of applying a resin composition (3) including solder powder, convective additive and resin having fluidity at the melting temperature of the solder powder on a main surface of a wiring substrate (1) provided with conductive wirings and connecting terminals, a step of preparing a group of electronic components consisting of a plurality of electronic components (7, 8 and 9) including at least a passive component, the respective electronic components comprising electrode terminals, position-aligning connecting terminals with the electrode terminals, and making the group of electronic components abut a surface of the resin composition, a step of heating at least the resin composition so as to melt solder powder and make the solder powder self-assembled between the connecting terminals and the electrode terminals by the convective additive, and thereby connecting the connecting terminals and the electrode terminals by soldering, and a step of fixedly adhering the group of electronic components to the wiring substrate using the resin by hardening the resin in the resin composition. Accordingly, a mounting process can be remarkably simplified without forming bumps in advance.

摘要翻译： 电子部件安装方法包括以下步骤：将包含焊料粉末，对流添加剂和流动性的树脂组合物（3）在焊料粉末的熔融温度下涂覆在具有导电布线的布线基板（1）的主表面上，以及 连接端子，准备由至少包括无源部件的多个电子部件（7,8,9）组成的一组电子部件的步骤，所述各个电子部件包括电极端子，位置对准连接端子与电极端子 并且使电子部件组与该树脂组合物的表面接触，至少加热该树脂组合物以熔化焊料粉末并通过对流使焊料粉末自组装在连接端子与电极端子之间的步骤 通过焊接连接端子和电极端子，a 通过使树脂组合物中的树脂硬化，使用树脂将电子部件组固定地粘合到布线基板的步骤。 因此，无需预先形成凸块，可以显着地简化安装工艺。

公开(公告)号：US20090115071A1

公开(公告)日：2009-05-07

申请号：US11887331

申请日：2006-03-16

申请人： Seiji Karashima ,  Takashi Kitae ,  Siichi Nakatani

发明人： Seiji Karashima ,  Takashi Kitae ,  Siichi Nakatani

IPC分类号： H01L21/02 ,  H01L23/498

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/165 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/83047 ,  H01L2224/83091 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/83204 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2224/83887 ,  H01L2225/06513 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/1579 ,  H01L2924/30105 ,  H01L2924/381 ,  H05K3/323 ,  H05K2201/10674 ,  H05K2203/087 ,  Y10T156/1744 ,  H01L2924/00011 ,  H01L2924/066 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/00014

摘要： A flip chip mounting method which is applicable to the flip chip mounting of a next-generation LSI and high in productivity and reliability as well as a method for connecting substrates are provided. A circuit board 10 having a plurality of connecting terminals 11 and a semiconductor chip 20 having a plurality of electrode terminals 21 are disposed in mutually facing relation and a resin 13 containing conductive particles 12 and a gas bubble generating agent is supplied into the space therebetween. In this state, the resin 13 is heated to generate gas bubbles 30 from the gas bubble generating agent contained in the resin 13. The resin 13 is pushed toward the outside of the generated gas bubbles 30 by the growth thereof. The resin 13 pushed to the outside is self-assembled in the form of columns between the respective terminals of the circuit board 10 and the semiconductor chip 20. In this state, by pressing the semiconductor chip 20 against the circuit board 10, the conductive particles 12 contained in the resin 13 self-assembled between the facing terminals are brought into contact with each other to provide electrical connection between the terminals.

摘要翻译： 提供了一种适用于下一代LSI的倒装芯片安装并且生产率和可靠性高的倒装芯片安装方法以及用于连接基板的方法。 具有多个连接端子11的电路板10和具有多个电极端子21的半导体芯片20以相互面对的关系设置，并且将含有导电粒子12和气泡发生剂的树脂13供给到它们之间的空间中。 在这种状态下，树脂13被加热，从包含在树脂13中的气泡产生剂产生气泡30.树脂13通过其生长被推向产生的气泡30的外部。 被推到外面的树脂13以电路板10的各个端子和半导体芯片20之间的列的形式自组装。在这种状态下，通过将半导体芯片20压靠在电路板10上，导电颗粒 包含在自组装在相对端子之间的树脂13中的12彼此接触以提供端子之间的电连接。

公开(公告)号：US20090008776A1

公开(公告)日：2009-01-08

申请号：US12281195

申请日：2007-02-23

申请人： Takashi Kitae ,  Seiichi Nakatani ,  Seiji Karashima ,  Susumu Sawada ,  Kenichi Hotehama

发明人： Takashi Kitae ,  Seiichi Nakatani ,  Seiji Karashima ,  Susumu Sawada ,  Kenichi Hotehama

IPC分类号： H01L23/488 ,  H05K3/30 ,  H05K1/02 ,  H01L21/56

CPC分类号： H05K3/3484 ,  B23K1/0016 ,  B23K2101/40 ,  B23K2103/10 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11522 ,  H01L2224/1181 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/133 ,  H01L2224/16 ,  H01L2224/293 ,  H01L2224/8101 ,  H01L2224/81801 ,  H01L2224/83886 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/0209 ,  H05K2201/10977 ,  H05K2203/083 ,  H05K2203/087 ,  Y10T29/49144 ,  H01L2224/05599

摘要： In an electronic component mounted body, an electrode of a first electronic component and an electrode of a second electronic component are electrically connected by a solder connecter, and the solder connecter contains solder and insulation filler. Alternatively, a solder bump is formed on the electrode of the electronic component, and the solder bump includes the insulation filler.

摘要翻译： 在电子部件安装体中，第一电子部件的电极和第二电子部件的电极通过焊料连接器电连接，焊料连接器包含焊料和绝缘填料。 或者，在电子部件的电极上形成焊料凸块，焊料凸块包括绝缘填料。

公开(公告)号：US20080011402A1

公开(公告)日：2008-01-17

申请号：US11783750

申请日：2007-04-11

申请人： Tsukasa Shiraishi ,  Seiichi Nakatani

发明人： Tsukasa Shiraishi ,  Seiichi Nakatani

IPC分类号： H01B13/00 ,  G10K11/36

CPC分类号： H05K3/3484 ,  B01D21/283 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/28 ,  H01L24/31 ,  H01L24/742 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/1152 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81903 ,  H01L2224/83886 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H05K3/323 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0285 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A liquid resin in which conductive particles are dispersed is supplied to between a circuit substrate and a semiconductor chip disposed so as to face each other and an ultrasonic wave having an amplitude in a perpendicular direction to a surface of the circuit substrate to generate a standing wave in a resin. Then, the conductive particles dispersed in the resin are captured at nodes of the standing wave to form connection bodies of aggregation of the conductive particles between connection terminals of the semiconductor chip and terminals of the circuit substrate. Thus, the semiconductor chip is mounted on the circuit substrate via the connection bodies. The terminals are arrayed so as to be spaced apart from one another by half a wavelength of the standing wave and each of the nodes of the standing wave are generated at a position between the terminals in the resin.

摘要翻译： 将分散有导电粒子的液态树脂供给到电路基板与设置为彼此相对的半导体芯片之间，并且具有与电路基板的表面垂直的振幅的超声波，以产生驻波 在树脂中。 然后，分散在树脂中的导电颗粒在驻波的节点处被捕获，以在半导体芯片的连接端子和电路基板的端子之间形成导电颗粒的聚集的连接体。 因此，半导体芯片经由连接体安装在电路基板上。 端子排列成彼此间隔开驻波的一半波长，并且在树脂中的端子之间的位置处产生驻波的每个节点。

公开(公告)号：US12119321B2

公开(公告)日：2024-10-15

申请号：US17947536

申请日：2022-09-19

申请人： EPISTAR CORPORATION

发明人： Shih-An Liao ,  Shau-Yi Chen ,  Ming-Chi Hsu ,  Chun-Hung Liu ,  Min-Hsun Hsieh

IPC分类号： H01L23/48 ,  H01L23/00 ,  H01L33/62 ,  H01L33/30 ,  H01L33/64

CPC分类号： H01L24/16 ,  H01L24/06 ,  H01L24/13 ,  H01L24/29 ,  H01L24/73 ,  H01L24/83 ,  H01L33/62 ,  H01L24/20 ,  H01L24/32 ,  H01L24/48 ,  H01L33/30 ,  H01L33/647 ,  H01L2224/04105 ,  H01L2224/0612 ,  H01L2224/13309 ,  H01L2224/13311 ,  H01L2224/13313 ,  H01L2224/13339 ,  H01L2224/13499 ,  H01L2224/16058 ,  H01L2224/16105 ,  H01L2224/16227 ,  H01L2224/165 ,  H01L2224/2929 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/83121 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/10331 ,  H01L2924/12041 ,  H01L2924/15156 ,  H01L2224/29344 ,  H01L2924/00014 ,  H01L2224/29347 ,  H01L2924/00014 ,  H01L2224/29324 ,  H01L2924/00014 ,  H01L2224/29355 ,  H01L2924/00014 ,  H01L2224/29339 ,  H01L2924/00014 ,  H01L2224/29313 ,  H01L2924/00014 ,  H01L2224/29309 ,  H01L2924/00014 ,  H01L2224/29311 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2224/29311 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2224/2939 ,  H01L2924/00014 ,  H01L2224/294 ,  H01L2924/00014 ,  H01L2224/83203 ,  H01L2924/00012

摘要： A semiconductor device comprises a semiconductor die, comprising a stacking structure, a first bonding pad with a first bonding surface positioned away from the stack structure, and a second bonding pad; a carrier comprising a connecting surface; a third bonding pad which comprises a second bonding surface and is arranged on the connecting surface, and a fourth bonding pad arranged on the connecting surface of the carrier; and a conductive connecting layer comprising a first conductive part, comprising a first outer contour, and formed between and directly contacting the first bonding pad and the third bonding pad; a second conductive part formed between the second bonding pad and the fourth bonding pad; and a blocking part covering the first conductive part to form a covering area, wherein the first bonding surface comprises a first position which is the closest to the carrier within the covering area and a second position which is the farthest from the carrier within the covering area in a cross section view, and a distance from the first position to the first out contour is greater than that from the second position to the first outer contour.

公开(公告)号：US09237686B2

公开(公告)日：2016-01-12

申请号：US14119148

申请日：2013-02-26

申请人： PANASONIC CORPORATION

发明人： Koji Motomura ,  Arata Kishi ,  Hiroki Maruo ,  Yasuhiro Suzuki ,  Hironori Munakata

IPC分类号： H05K13/04 ,  H05K3/34 ,  H01L23/00 ,  H01L21/48

CPC分类号： H05K13/0465 ,  H01L21/4867 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/98 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/0556 ,  H01L2224/06181 ,  H01L2224/06187 ,  H01L2224/16235 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/81192 ,  H01L2224/8159 ,  H01L2224/816 ,  H01L2224/81815 ,  H01L2224/81862 ,  H01L2224/81885 ,  H01L2224/83886 ,  H01L2924/01322 ,  H05K3/3442 ,  H05K3/3452 ,  H05K3/3463 ,  H05K2201/099 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A wiring board on which an electronic component is to be mounted includes a resist having an opening exposing a joint face which is part of the surface of a wiring layer and to which a terminal of the electronic component is to be joined. In the placing step, the electronic component is placed on the wiring board such that the terminal covers the opening entirely and contacts the solder paste applied onto the joint face. Next, the solder paste applied onto the joint face is heated to melt solder and soften thermosetting resin. This allows the solder to gather in a first space within the opening closed with the wiring layer and the electronic component, while allowing the thermosetting resin to gather in a second space formed between a top side of the resist and a lateral side of the electronic component.

摘要翻译： 要安装电子部件的布线板包括具有露出作为布线层的表面的一部分的接合面的开口的抗蚀剂，并且电子部件的端子要被接合。 在放置步骤中，将电子部件放置在布线板上，使得端子完全覆盖开口并且接触施加到接合面上的焊膏。 接下来，将涂覆在接合面上的焊膏加热熔化焊料并软化热固性树脂。 这允许焊料在布线层和电子部件闭合的开口内的第一空间中聚集，同时允许热固性树脂聚集在形成在抗蚀剂的顶侧和电子部件的侧面之间的第二空间中 。

公开(公告)号：US20150155186A1

公开(公告)日：2015-06-04

申请号：US14616983

申请日：2015-02-09

申请人： International Business Machines Corporation

发明人： Thomas J. Brunschwiler ,  Javier V. Goicochea ,  Cyrill Kuemin ,  Walter H. Riess ,  Heiko Wolf

IPC分类号： H01L21/56

CPC分类号： H01L21/56 ,  H01L21/563 ,  H01L23/295 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29294 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/3201 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83102 ,  H01L2224/83886 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06589 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2924/053 ,  H01L2924/01006 ,  H01L2924/014 ,  H01L2924/3512

摘要： A bridging arrangement for coupling a first terminal to a second terminal includes a plurality of particles of a first type forming at least one path between the first terminal and the second terminal, wherein the particles of the first type are attached to each other; a plurality of particles of a second type arranged in a vicinity of a contact region between a first particle of the first type and a second particle of the first type, wherein at least a portion of the plurality of particles of the second type is attached to the first particle of the first type and the second particle of the first type.

摘要翻译： 用于将第一端子耦合到第二端子的桥接装置包括多个第一类型的颗粒，其形成在第一端子和第二端子之间的至少一个路径，其中第一类型的颗粒彼此附接; 多个第二类型的颗粒布置在第一类型的第一颗粒和第一类型的第二颗粒之间的接触区域附近，其中第二类型的多个颗粒的至少一部分附着到 第一类型的第一颗粒和第一类型的第二颗粒。

公开(公告)号：US20140158751A1

公开(公告)日：2014-06-12

申请号：US14119148

申请日：2013-02-26

申请人： PANASONIC CORPORATION

发明人： Koji Motomura ,  Arata Kishi ,  Hiroki Maruo ,  Yasuhiro Suzuki ,  Hironori Munakata

IPC分类号： H05K13/04

CPC分类号： H05K13/0465 ,  H01L21/4867 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/98 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/0556 ,  H01L2224/06181 ,  H01L2224/06187 ,  H01L2224/16235 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/81192 ,  H01L2224/8159 ,  H01L2224/816 ,  H01L2224/81815 ,  H01L2224/81862 ,  H01L2224/81885 ,  H01L2224/83886 ,  H01L2924/01322 ,  H05K3/3442 ,  H05K3/3452 ,  H05K3/3463 ,  H05K2201/099 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A wiring board on which an electronic component is to be mounted includes a resist having an opening exposing a joint face which is part of the surface of a wiring layer and to which a terminal of the electronic component is to be joined. In the placing step, the electronic component is placed on the wiring board such that the terminal covers the opening entirely and contacts the solder paste applied onto the joint face. Next, the solder paste applied onto the joint face is heated to melt solder and soften thermosetting resin. This allows the solder to gather in a first space within the opening closed with the wiring layer and the electronic component, while allowing the thermosetting resin to gather in a second space formed between a top side of the resist and a lateral side of the electronic component.

摘要翻译： 要安装电子部件的布线板包括具有露出作为布线层的表面的一部分的接合面的开口的抗蚀剂，并且电子部件的端子要被接合。 在放置步骤中，将电子部件放置在布线板上，使得端子完全覆盖开口并且接触施加到接合面上的焊膏。 接下来，将涂覆在接合面上的焊膏加热熔化焊料并软化热固性树脂。 这允许焊料在布线层和电子部件闭合的开口内的第一空间中聚集，同时允许热固性树脂聚集在形成在抗蚀剂的顶侧和电子部件的侧面之间的第二空间中 。